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0804MC 0804MC ECAD Model Texas Instruments 0804MC 8-Pin TO-3 Socket Visit Texas Instruments Buy
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196-Pin Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2000 - 196-pin

Abstract: DSP56300 EB360
Text: Between the 196-pin MAP-BGA and 196-pin PBGA Packages This document describes the differences between the 196-pin Mold Array Process-Ball Grid Array (MAP-BGA) and the 196pin Plastic Ball Grid Array (PBGA , provides the information required to simplify the transition to the 196-pin MAP-BGA package , .7 Summary of Differences 1 Summary of Differences The 196-pin MAP-BGA will be Motorola's production ball grid array (BGA) package and will eventually replace the 196-pin plastic ball grid array


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PDF EB360 196-pin 196-pin 196pin DSP56300 EB360
2000 - DSP56300

Abstract: No abstract text available
Text: Mechanical Differences Between the 196-pin MAP-BGA and 196-pin PBGA Packages Summary of Differences , Die Changes . 7 196-pin MAP-BGA and PBGA Package Differences This document describes the differences between the 196-pin Mold Array Process-Ball Grid Array (MAP-BGA) and the 196-pin Plastic Ball Grid Array (PBGA) packages. The MAP BGA is an identical pinout and , transition to the 196-pin MAP-BGA package. Contents © Motorola, Inc. 2000 Summary of Differences


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PDF EB360/D 196-pin 196-pin DSP56300
2000 - TG-175

Abstract: FREESCALE PACKING DSP56300
Text: Products Sector Engineering Bulletin This document describes the differences between the 196-pin Mold Array Process-Ball Grid Array (MAP-BGA) and the 196-pin Plastic Ball Grid Array (PBGA) packages. The , information required to simplify the transition to the 196-pin MAP-BGA package. Contents Summary of , . 2 Die Changes . 7 196-pin MAP-BGA and PBGA Package Differences Freescale Semiconductor, Inc. Mechanical Differences Between the 196-pin MAP-BGA and 196-pin


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PDF EB360/D 196-pin 196-pin DSP56300 TG-175 FREESCALE PACKING
1998 - motorola DSP563XX architecture

Abstract: XC56303PV80 xc56307 XC56303PV66 XC56307GC100C G.711, G.723.1, G.726, G.728 DSP56002FC40 DSP56002FC66 XC56301PW80 SPAKXC56309PV80
Text: 2 ESSI 1 SCI Triple Timer Module GPIO 8-bit Host (HI08) 144- pin TQFP 196-pin PBGA , RAM 16 - 48K Data RAM 2 ESSI 1 SCI Triple Timer Module GPIO 8-bit Host (HI08) EFCOP 196-pin , (HI08) 144- pin TQFP 196-pin PBGA Applications requiring large internal memory, mainly in , clock-cycle per instruction, barrel shifter, instruction cache, DMA XC56303GC66 126 196-pin PBGA , clock-cycle per instruction, barrel shifter, instruction cache, DMA SPAKXC56303GC66 2 196-pin PBGA


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PDF SG184/D DSP563xx 24-bit motorola DSP563XX architecture XC56303PV80 xc56307 XC56303PV66 XC56307GC100C G.711, G.723.1, G.726, G.728 DSP56002FC40 DSP56002FC66 XC56301PW80 SPAKXC56309PV80
1999 - TFBGA 117-pin

Abstract: No abstract text available
Text: Available in RoHS 6/6 compliant package Manufactured in a 15 x 15 mm 196-Pin TFBGA package The 88E1240 , . 7 1.3 88E1240 196-Pin TFBGA Package , . 26 2.2 88E1240 196-Pin TFBGA Package Drawing , 1.3 88E1240 196-Pin TFBGA Package Due to the large number of pins, the 196-pin TFBGA package is , Description 88E1240 196-Pin TFBGA Package 8 9 10 11 12 13 14 A P2_S_INP


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PDF 88E1240 MV-S103821-00, 88E1240 TFBGA 117-pin
1999 - Technical Product Brief

Abstract: 88E1240 Technical Product Brief 88E1240 Marvell tQFP Package 128-pin marvell 117-pin
Text: Available in RoHS 6/6 compliant package Manufactured in a 15 x 15 mm 196-Pin TFBGA package The 88E1240 , . 7 1.3 88E1240 196-Pin TFBGA Package , . 26 2.2 88E1240 196-Pin TFBGA Package Drawing , 1.3 88E1240 196-Pin TFBGA Package Due to the large number of pins, the 196-pin TFBGA package is , Signal Description 88E1240 196-Pin TFBGA Package 8 9 10 11 12 13 14 A


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PDF 88E1240 MV-S103821-00, 88E1240 Technical Product Brief 88E1240 Technical Product Brief Marvell tQFP Package 128-pin marvell 117-pin
2001 - D2 DIN 6784

Abstract: D3 DIN 6784
Text: RF OUT / VD3 GND GND GND EHT08746 Figure 1 Functional Block Diagram Pin Configuration Pin No. 1 2 3 4 5 6 7 8 Symbol RF IN/VG GND Configuration RF input power + Gate voltage [0 V , Conditions IDD IDD G PO PAE PAE ­ ­ 27 24.0 35 ­ ­ ­ ­ 26.5 30 ­ ­ VD = 3.0 V; PIN = + 0 dBm VD = 3.0 V; PIN = ­ 10 dBm VD = 3.0 V; PIN = ­ 10 dBm VD = 3.0 V; PIN = 0 dBm VD = 3.0 V; PIN = + 0 dBm VD = 3.0 V; PIN = 3 dBm VD = 4.8 V; PIN = ­ 10 dBm VD = 4.8 V; PIN = 0 dBm VD = 4.8 V; PIN = ­ 10 dBm


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PDF ISM900, ISM2400, SCT-598 Q62702-G0080 EHT08766 GPW09182 D2 DIN 6784 D3 DIN 6784
ansoft software

Abstract: IPC-9501 ISM2400 ISM900 Q62702-G0080 smd marking code vd SCT595 D2 DIN 6784
Text: Diagram Pin # Symbol Configuration 1 RFin/Vg RF input power + Gate voltage [0 V internal , Conditions max. Supply current IDD ­ 300 500 mA VD = 3.0 V; Pin = + 0 dBm Supply current IDD ­ 450 700 mA VD = 3.0 V; Pin = ­ 10 dBm Gain G 27 30 33 dB VD = 3.0 V; Pin = ­ 10 dBm Output Power Po 24.0 26.0 27.0 dBm VD = 3.0 V; Pin = 0 dBm Overall Power added Efficiency PAE 35 45 ­ % VD = 3.0 V; Pin = + 0


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PDF ISM900, ISM2400, SCT-598 Q62702-G0080 IPC-9501 IPC-4202) GPW09182 ansoft software IPC-9501 ISM2400 ISM900 Q62702-G0080 smd marking code vd SCT595 D2 DIN 6784
1999 - B39201-B4201-U-310

Abstract: C61157-A7-A56 F61074-V8070-Z000
Text: amplitude ripple Usable passband 300 kHz Inputs of Filter 1 and 2 ( pin 1 and pin 3) externally on pcb , , gold-plated Dimensions in mm, approx. weight 0,10 g Pin configuration 1 7 2 3 5 6 4, 8 Input , 200,0 .1000,0 MHz MHz Isolation between filters ( pin 5 - 7) min 161,05 . 161,35 MHz 196 , . 165,0 . 177,0 . 220,0 .1000,0 MHz MHz MHz MHz Isolation between filters ( pin 5 -


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PDF B4201 D-81617 B39201-B4201-U-310 C61157-A7-A56 F61074-V8070-Z000
2001 - D2 DIN 6784

Abstract: SMD MARKING CODE V75 Ansoft rf marking Y2 ISM2400 ISM900 Q62702-G0080 smd marking code vd GPW09182 v75 smd
Text: EHT08746 Functional Block Diagram Pin Configuration Pin No. Symbol Configuration 1 RF IN , IDD ­ 300 500 mA VD = 3.0 V; PIN = + 0 dBm Supply current IDD ­ 450 700 mA VD = 3.0 V; PIN = ­ 10 dBm Gain G 27 30 33 dB VD = 3.0 V; PIN = ­ 10 dBm Output Power PO 24.0 26.0 27.0 dBm VD = 3.0 V; PIN = 0 dBm Overall Power added Efficiency PAE 35 45 ­ % VD = 3.0 V; PIN = + 0 dBm Overall Power added Efficiency


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PDF ISM900, ISM2400, SCT-598 Q62702-G0080 EHT08766 GPW09182 D2 DIN 6784 SMD MARKING CODE V75 Ansoft rf marking Y2 ISM2400 ISM900 Q62702-G0080 smd marking code vd GPW09182 v75 smd
2002 - IPC-9501

Abstract: SCT595 CGY196 marking D6s Q62702-G0080 SCT-598 soldering voids
Text: VD1 VD2 RFout/Vd3 RFin/Vg GND GND GND Configuration Pin # 1 RFin/Vg , =50 Ohm, unless otherwise specified) Characteristics Supply current VD=3.0V; Pin = +0 dBm Supply current VD=3.0V; Pin = -10 dBm Gain Symbol min typ max Unit IDD - 300 500 , % PAE 30 45 - % VD=3.0V; Pin = -10 dBm Output Power VD=3.0V; Pin = 0 dBm Overall Power added Efficiency VD=3.0V; Pin = +0 dBm Overall Power added Efficiency VD=3.0V; Pin = 3


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PDF Q62702-G0080 SCT598 IPC-9501 SCT595 CGY196 marking D6s Q62702-G0080 SCT-598 soldering voids
information applikation

Abstract: No abstract text available
Text: 196 Functional Block Diagram Pin # Name Configuration 1 RFin/Vg 2 GND RF , ) Characteristics Supply current VD=3.0V; Pin = +0 dBm Supply current VD=3.0V; Pin = -10 dBm Gain VD=3.0V; Pin = -10 dBm Output Power VD=3.0V; Pin = 0 dBm Overall Power added Efficiency VD=3.0V; Pin = +0 dBm Overall Power added Efficiency VD=3.0V; Pin = 3 dBm Supply current VD=4.8V; Pin = -10 dBm Supply current VD=4.8V; Pin = 0 dBm Gain VD=4.8V; Pin = -10 dBm Output Power VD=4.8V; Pin = 0 dBm Overall


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PDF SCT598 information applikation
2000 - SPH-002T-P0.5S

Abstract: motorolla processor DSP56000 DSP56300 DSP56307 DSP56L307
Text: Motorola's 15 mm × 15 mm 196-pin plastic ball grid array (PBGA) package. The DSP56L307 is offered in Motorola's 15 mm × 15 mm 196-pin mold array process-ball grid array (MAP-BGA) package. Contents 1 2 , = 8 °C/W JT = 2 °C/W Packaging 15 mm × 15 mm 196-pin plastic ball grid array (PBGA) package 15 mm × 15 mm 196-pin mold array process-ball grid array (MAP-BGA) package DRAM Access Support , Motorola's 15 mm × 15 mm 196-pin plastic ball grid array (PBGA) package, whereas the DSP56L307 uses


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PDF EB361/D: DSP56307 DSP56L307 DSP56L307, DSP56300 DSP56000 EB361/D SPH-002T-P0.5S motorolla processor DSP56L307
2001 - 40039

Abstract: 1.57 GHz 78359
Text: 1. Dimensions and Pin assignment Feb. 08, 2001 Version (0.3) 5 6 7 4 8 3 2 1 1 - 8 : Pin No. Unit : mm Pin No. 1 2 3 4 5 6 7 8 Pin name IN GND IN GND OUT GND OUT GND Description Filter 1 input pin Ground pin Filter 2 input pin Ground pin Filter 2 output pin Ground pin Filter 1 output pin Ground pin Filter No. 1 2 Passband(MHz) 1850 ~ 1880 1880 ~ 1910 System PCS-Tx lower


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PDF FAR-G6CN-1G8925-L235 1830F 40039 1.57 GHz 78359
1999 - J-STD-013

Abstract: AP-399 pad DIAGRAM for RJ45 on pc board Pulse bob smith termination electrical fast transient testing 82559 printed circuit board AD30 H1012 A5829-01 82559based
Text: . 7 6.0 196-pin Ball Grid Array . 8 7.0 Designing Boards for the 196-pin BGA , .10 196-pin BGA Routing and Pad Size , Terminating Unused Connections on the RJ-45 Connector. 7 196-pin Ball Grade Array , -399) 7 82559 Printed Circuit Board (PCB) Design 6.0 196-pin Ball Grid Array The 196-pin Ball


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PDF AP-399) J-STD-013 AP-399 pad DIAGRAM for RJ45 on pc board Pulse bob smith termination electrical fast transient testing 82559 printed circuit board AD30 H1012 A5829-01 82559based
2001 - 45188

Abstract: L237
Text: 2.0 - - - Max. Remarks CW C C THE POSSIBILITIES ARE INFINITE 1. Dimensions and Pin assignment Preliminary Feb. 08, 2001 Version (0.3) 5 6 7 4 8 3 2 1 1 - 8 : Pin No. Unit : mm Pin No. 1 2 3 4 5 6 7 8 Pin name IN GND IN GND OUT GND OUT GND Description Filter 1 input pin Ground pin Filter 2 input pin Ground pin Filter 2 output pin Ground pin Filter 1 output pin Ground pin Filter No. 1 2 Passband(MHz) 1850 ~ 1880 1880 ~ 1910 System PCS-Tx lower PCS-Tx upper 2


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PDF FAR-G6CN-1G8950-L237 45188 L237
1999 - CGY196

Abstract: ISM2400 ISM900 Q62702-G0080 IPC-9501 infineon reflow
Text: Functional Block Diagram VD1 VD2 RFout/Vd3 RFin/Vg GND Pin # GND GND , Characteristics Supply current VD=3.0V; Pin = +0 dBm Supply current VD=3.0V; Pin = -10 , % 50 - % VD=3.0V; Pin = -10 dBm Output Power VD=3.0V; Pin = 0 dBm Overall Power added Efficiency VD=3.0V; Pin = +0 dBm Overall Power added Efficiency PAE VD=3.0V; Pin = 3 dBm Supply current VD=4.8V; Pin = -10 dBm Supply current VD=4.8V; Pin = 0 dBm Gain IDD - 450


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PDF ISM900 ISM2400 Q62702-G0080 SCT598 D-81541 CGY196 Q62702-G0080 IPC-9501 infineon reflow
2002 - DSP56300

Abstract: DSP56307 DSP56L307 EB360 EB361
Text: the Freescale 15 mm × 15 mm 196-pin plastic ball grid array (PBGA) package. The DSP56L307 is offered in the Freescale 15 mm × 15 mm 196-pin mold array process-ball grid array (MAP-BGA) package , 13.1 °C/W JT = 2.45 °C/W JA = 53 °C/W JC = 8 °C/W JT = 2 °C/W Packaging 15 mm × 15 mm 196-pin plastic ball grid array (PBGA) package 15 mm × 15 mm 196-pin mold array process-ball grid array , pin-compatible, but the DSP56307 uses the Freescale 15 mm × 15 mm 196-pin plastic ball grid array (PBGA) package


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PDF EB361 DSP56307 DSP56L307 DSP56L307, DSP56300 DSP56L307 EB360 EB361
2008 - top261ln

Abstract: ME 4946 ac power adapter for notebook schematic ic HT 8970 DER-196 TOP261EN #26tiw ferroxcube bobbin top261 HZ1206B601R
Text: 115/230 V; ES 2.0 PIN = 1 W at 230 VAC PIN = 1.7 W at 230 VAC PIN = 2.4 W at 230 VAC 10% output , Toroid, 4 Pin , Custom Commonmode Choke - refer to Specification of L2 Ferrite bead 600 , 0.5 A , CONTROL (C) pin . The power supply output voltage is sensed on the secondary side by shunt regulator U10 , , and the 25 µA UV threshold of U11's VOLTAGE MONITOR (V) pin . IC U11 switches once current into the V pin exceeds 25 µA (at a line voltage of 100 VDC or approximately 72 VAC). Transistor Q2 provides a


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PDF OP261LN DER-196 top261ln ME 4946 ac power adapter for notebook schematic ic HT 8970 DER-196 TOP261EN #26tiw ferroxcube bobbin top261 HZ1206B601R
2009 - AGL400

Abstract: TOP MARK E6 T7IO192NPB3
Text: for AGL060-CS/G121. 3 -6 v1.9 IGLOO Packaging 196-Pin CSP A1 Ball Pad Corner 14 13 12 , Assignments 196-Pin CSP 196-Pin CSP 196-Pin CSP Pin Number AGL125 Function Pin Number , Packaging 196-Pin CSP 196-Pin CSP 196-Pin CSP Pin Number AGL125 Function Pin Number , N12 TDI v1.9 3-9 Package Pin Assignments 196-Pin CSP 196-Pin CSP 196-Pin CSP , Packaging 196-Pin CSP 196-Pin CSP 196-Pin CSP Pin Number AGL250 Function Pin Number


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PDF 81-Pin AGL030 IO00RSB0 GEB0/IO71RSB1 IO63RSB1 AGL400 TOP MARK E6 T7IO192NPB3
2001 - FAR-G6CR-1G8950-L24A

Abstract: 45728
Text: Power C C CW THE POSSIBILITIES ARE INFINITE 1. Pin assignment of 2520 dual filter Sep , 6 4 8 3 2 1 1 ~ 8 : Pin No. Unit : mm Pin No. Pin name 1 IN 2 GND 3 IN Description Filter 1 input pin Ground pin Filter 2 input pin Filter No. System 4 GND Ground pin 1 PCS-Tx lower 5 OUT Filter 2 output pin 2 PCS-Tx upper 6 GND Ground pin 7 OUT Filter 1 output pin 8 GND Ground pin 2. Test


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PDF FAR-G6CR-1G8950-L24A FAR-G6CR-1G8950-L24A 45728
2009 - AGL400

Abstract: IO30RSB0 IO127RSB2 AGL1000 ACTEL FBGA 144 qfn 132pin
Text: for AGL060-CS/G121. 3 -6 v2.0 IGLOO Packaging 196-Pin CSP A1 Ball Pad Corner 14 13 12 , Assignments 196-Pin CSP 196-Pin CSP 196-Pin CSP Pin Number AGL125 Function Pin Number , Packaging 196-Pin CSP 196-Pin CSP 196-Pin CSP Pin Number AGL125 Function Pin Number , N12 TDI v2.0 3-9 Package Pin Assignments 196-Pin CSP 196-Pin CSP 196-Pin CSP , Packaging 196-Pin CSP 196-Pin CSP 196-Pin CSP Pin Number AGL250 Function Pin Number


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PDF 81-Pin AGL030 IO00RSB0 GEB0/IO71RSB1 IO63RSB1 AGL400 IO30RSB0 IO127RSB2 AGL1000 ACTEL FBGA 144 qfn 132pin
1996 - RF MODULE CIRCUIT DIAGRAM dect

Abstract: IPC-9501 Siemens temperature sensor pulse load calculation formula Siemens databook MMIC SIEMENS gaas CGY196 DECT siemens zs50
Text: ND G ND Pin # Name 1 RFin/Vg 2 GND RF and DC ground 3 VD2 Pos. drain , specified) Characteristics Symbol min typ max Supply current VD=3.0V; Pin = +0 dBm Supply current VD=3.0V; Pin = -10 dBm Gain VD=3.0V; Pin = -10 dBm Output Power VD=3.0V; Pin = 0 dBm Overall Power added Efficiency VD=3.0V; Pin = +0 dBm Overall Power added Efficiency VD=3.0V; Pin = 3 dBm Supply current VD=4.8V; Pin = -10 dBm Supply current VD=4.8V; Pin = 0 dBm Gain VD=4.8V; Pin = -10


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PDF SCT598 150sses RF MODULE CIRCUIT DIAGRAM dect IPC-9501 Siemens temperature sensor pulse load calculation formula Siemens databook MMIC SIEMENS gaas CGY196 DECT siemens zs50
IPC-9501

Abstract: soldering voids
Text: Pin # 1 2 3 4 5 6 7 8 Name RFin/Vg GND VD2 n.c. n.c. GND VD1 Configuration RF input power + Gate , specified) Characteristics Supply current VD=3.0V; Pin = +0 dBm Supply current VD=3.0V; Pin = -10 dBm Gain VD=3.0V; Pin = -10 dBm Output Power VD=3,0V; Pin = 0 dBm Overall Power added Efficiency VD-3.0V; Pin = +0 dBm Overall Power added Efficiency VD=3.0V; Pin = 3 dBm Supply current VD=4,8V; Pin = -10 dBm Supply current VD=4.8V; Pin = 0 dBm Gain VD=4.8V; Pin = -10 dBm Output Power VD=4.8V; Pin = 0 dBm Overall


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PDF SCT598 IPC-9501 soldering voids
1999 - 324-Pin

Abstract: 400-pin RQFP EP20K100 EP20K100E EP20K160E EP20K200 EP20K200E EP20K300E EP20K400
Text: 100,000 144- Pin TQFP, 196-Pin BGA1, 208- Pin PQFP, 240- Pin PQFP 99, 146, 157, 185, 324- Pin BGA1, 356- Pin BGA EP20K100 RAM 246, 246 144- Pin TQFP, 196-Pin BGA1, 208- Pin PQFP, 240- Pin PQFP 99, 145, 157, 185, 324- Pin BGA1 100,000 2.5 V 4,160 53,248 416 1.8 V 4,160 53,248 416 246 EP20K160E 160,000 144- Pin TQFP, 208- Pin PQFP, 240- Pin PQFP, 400- Pin BGA1 91, 148, 177, 316 1.8 V 6,400 81,920 640 EP20K200 200,000


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PDF 000PLL MegaLAB16 6466MHzPCI 125MHz 20KESB2 10KFLEX 6000LUT 7000FLEX 20KMultiCore 324-Pin 400-pin RQFP EP20K100 EP20K100E EP20K160E EP20K200 EP20K200E EP20K300E EP20K400
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