The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
PMP8764 Texas Instruments Primary-Side Regulated Flyback with 184-265VAC Input, (12V @ 3W)
SCAN921821TSM Texas Instruments DUAL LINE DRIVER, PBGA100, FBGA-100
DLPC200ZEWT Texas Instruments SPECIALTY CONSUMER CIRCUIT, PBGA780, PLASTIC, FBGA-780
DLPC200 Texas Instruments SPECIALTY MICROPROCESSOR CIRCUIT, PBGA780, PLASTIC, FBGA-780
SN74GTLPH3245GKF Texas Instruments GTLP SERIES, QUAD 8-BIT TRANSCEIVER, TRUE OUTPUT, PBGA114, PLASTIC, FBGA-114
SN74GTLPH32912GKF Texas Instruments GTL/TVC SERIES, DUAL 18-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PBGA114, PLASTIC, FBGA-114

184-FBGA-12 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2006 - DSP-92

Abstract: LQA36A V84A LMV240 LM317AEMP LM431ACM3X LM431ACM3 SPA48A MUA08A LQA28A
Text: : LM2502SMX : FBGA 49 SLH49A 12 1000 4500 49 SLC49A 16 8 1000/4500 , 20016401 20016402 MKTW1 MINI-SOIC 8 Ld MUA08A 12 8 1000/3500 7/13 18/18.4 10 Ld MUB10A 12 8 1000/3500 7/13 18/18.4 1000 / 3500 / : , 'X'. : : LM3351 : LM3351MMX SOIC 8 Ld (Narrow) M08A 12 8 2500 13 18.4 14 Ld (Narrow , Ld (Wide) M14B 16 12 1000 13 22.4 16 Ld (Wide) M16B 16 12 1000 13


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PDF EIA-481-1-A 81-2-A( IEC286-3 MS200164 MUA08A MUB10A LM3351 LM3351MMX LM71CISD LM71CISDX DSP-92 LQA36A V84A LMV240 LM317AEMP LM431ACM3X LM431ACM3 SPA48A MUA08A LQA28A
2002 - DDR RAM 512M

Abstract: ELPIDA mobile DDR ect-ts-1942 TSOP II elpida 512m pc133 SDRAM DIMM 168 elpida TRAC PC2-6400 PC2-5300 Elpida Memory DDR2-667
Text: Density / Bank 25: 256Mb / 4-bank 51: 512Mb / 4-bank 11: 1Gb / 8-bank Package SE: FBGA SK: FBGA * *outline differs from "SE" BG: FBGA Organization 04: x4 08: x8 16: x16 Elpida Memory, Inc , (Stacked FBGA ) S,U: 200-pin SO-DIMM D: 200-pin SO-DIMM (Stacked FBGA ) Note: Only for FB-DIMM ECT-TS , Power TS: WTR (-25°C to +85°C) Product Family D: DDR SDRAM Density / Bank 12 : 128M / 4-bank 25 , BH: FBGA SE: FBGA BG: FBGA FA: LQFP TA: TSOP (II) Die Rev. Speed 5B: DDR400B(3-3-3) 5C


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PDF ECT-TS-1942 1200MHz 184-pin 160-pin 232-pin 1066MHz DDR RAM 512M ELPIDA mobile DDR TSOP II elpida 512m pc133 SDRAM DIMM 168 elpida TRAC PC2-6400 PC2-5300 Elpida Memory DDR2-667
2001 - PC133 registered reference design

Abstract: 16 MB Micron EDO SIMM Module mt1l DS1849 10EF1 10EB2
Text: PRELIMINARY 512MB / 1GB (x72, ECC) 168-PIN REGISTERED FBGA SDRAM DIMM SYNCHRONOUS DRAM MODULE , 8K 4 (BA0, BA1) 8K (A0­A12) 2K (A0­A9,A11) 2 (S0,S2; S1,S3) PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 , Registered FBGA SDRAM DIMM SDF36C64_128X72G_A.p65 ­ Rev. A; Pub. 6/01 1 Micron Technology, Inc , . PRELIMINARY 512MB / 1GB (x72, ECC) 168-PIN REGISTERED FBGA SDRAM DIMM PART NUMBERS PART NUMBER , ), which provide eight unique DIMM/EEPROM addresses. 64, 128 Meg x 72 Registered FBGA SDRAM DIMM


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PDF 512MB 168-PIN 168-pin, PC100 PC133 512MB MT8VR12818AG MT16VR25616AG PC133 registered reference design 16 MB Micron EDO SIMM Module mt1l DS1849 10EF1 10EB2
fbga 12 x 12 thermal resistance

Abstract: FBGA160-P-1212
Text: , enabling the development of high value-added products. !C PACKAGES CSP(Chip Size Package) The FBGA , digital assistants (PDAs), portable phones, camcorders and digital cameras. FBGA (commonly known as C SP , mounted using conventional mounter. Can be mix mounted with SO P and QFP. · Structure of Sharp CSP( FBGA ) 0.5 mm MIN. / / / Mold Resin /- Gold Wire : . Less than T S O P { 1.2 , Conventional package (QFP) C SP ( FBGA ) Reduction ratio QFP176-P-2424 (0.5 mm pin-pitch) FBGA160-P-1212 (0.8 mm


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PDF developme5x24 fbga 12 x 12 thermal resistance FBGA160-P-1212
2003 - q1257

Abstract: Q1129 Q4331 TSOP66 Q4311 TSOP-66 DDR RAM 512M tsop ddr2 ram DRAM spectrum infineon tsop 4021
Text: FBGA 1 1.2 " 1.125" 7-B Q67100 Q67100 Q4673 HYS72D64300GBR- 6-B Q67100 , 1.2 " 256M DDR/DDR2 Modules 128Mx4 64Mx4 FBGA 2 1.2 " 7-B Q67100 Q4752 , " PC2100 PC2100-222 PC2100 SDR Modules 512M 128Mx4 FBGA 1 1.2 " PC2700 PC2100 PC2700 2 GB PC2100 512M 256Mx4 2 1.2 " PC2100 PC2100-222 256Mx72 512M FBGA 2 1.2 " 1G 256Mx4 TSOP 1 1.2 " 1G 256Mx4 FBGA 1 1.2 " 1G 512Mx4 TSOP


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PDF 2002791-D-RAM hoch17 DDR400 PC3200) B112-H6731-G10-X-7600 q1257 Q1129 Q4331 TSOP66 Q4311 TSOP-66 DDR RAM 512M tsop ddr2 ram DRAM spectrum infineon tsop 4021
2002 - SSTL-135

Abstract: ELPIDA DDR3 ELPIDA mobile DDR ddr2 ram ELPIDA FBGA DDR3 x32 ddr3 so dimm 204 pin Elpida Memory tsop ddr2 ram elpida 1gb pc2
Text: 08: x8 16: x16 Package SE: FBGA BG: FBGA Power Supply, Interface B: 1.5V, SSTL_15 E: 1.35V , -bank 11: 1Gb / 8-bank 51: 512Mb / 4-bank 25: 256Mb / 4-bank Package SE: FBGA BG: FBGA , -pin DIMM H: 240-pin DIMM (Stacked FBGA ) S,U: 200-pin SO-DIMM D: 200-pin SO-DIMM (Stacked FBGA ) R: 240 , : 2Gb / 4-bank 10: 1Gb / 4-bank 51: 512Mb / 4-bank 25: 256Mb / 4-bank 12 : 128Mb / 4 , : FBGA TA: TSOP (II) ©Elpida Memory, Inc. 2002-2009 4B: DDR500B (3-3-3) 4C: DDR500C (3-4-4) 5B


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PDF ECT-TS-1984 512Mb x16bit x32bit SSTL-135 ELPIDA DDR3 ELPIDA mobile DDR ddr2 ram ELPIDA FBGA DDR3 x32 ddr3 so dimm 204 pin Elpida Memory tsop ddr2 ram elpida 1gb pc2
2006 - national semiconductor pb-free suffix

Abstract: LMV240 DSP-92 DS90C2501SLB LM431ACM3X M08A M14B M16A MUA08A LM3351MM
Text: `X'. Example: LM4934RLX FBGA 49 Bumps SLH49A 12 8 Single 1000/4500 Ordering , (inches) Reel Width W2 (mm) MINI-SOIC 8 Ld MUA08A 12 8 Single 1000/3500 7/13 18/18.4 10 Ld MUB10A 12 8 Single 1000/3500 7/13 18/18.4 Ordering , : Suffix 'X'. Example: LM3351MMX SOIC 8 Ld (Narrow) M08A 12 8 Single 2500 13 18.4 , 8 Single 2500 13 22.4 14 Ld (Wide) M14B 16 12 Single 1000 13


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PDF EIA-481-1-A EIA-481-2-A CSP-9-111S2) CSP-9-111S2. national semiconductor pb-free suffix LMV240 DSP-92 DS90C2501SLB LM431ACM3X M08A M14B M16A MUA08A LM3351MM
2009 - DDR3 DIMM SPD JEDEC

Abstract: DDR3 DIMM SPD PC3-12800 DDR3 SPD sensor DDR3 SODIMM SPD JEDEC micron ddr3 DDR3 1600 spd 144PIN micron quad die ddr3 DDR2 SODIMM SPD JEDEC DDR3 SPD sensor datasheet
Text: Technology J = 1.5V K= 1.35V Product Family TF = FBGA TS = DDP (dual die in package) TQ = QDP (quad die in package) SF = FBGA with Temp Sensor SS = DDP with Temp Sensor SQ = QDP with Temp Sensor BF = VLP with Temp Sensor BS = VLP DDP with Temp Sensor BQ = VLP QDP with Temp Sensor SZF = FBGA with , FBGA TS = DDP (dual die in package) TZS = Heatspreader DDP VF = VLP (very low profile) VS = VLP DDP , Part Mark -335 -6T -335 -6 -40B -5B Product Family DDF = DDR FBGA DDT = DDR TSOP DVF = DDR


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2010 - PC3-14900

Abstract: pc3-10600 DDR3 DIMM SPD DDR3 DIMM SPD LRDIMM LRDIMM SPD LRDIMM DDR3-1866 DDR3-2133 DDR3-1866 RDIMM SPD JEDEC minidimm
Text: J = 1.5V K = 1.35V Product Family TF = FBGA TS = DDP (dual die in package) TQ = QDP (quad die in package) SF = FBGA with Temp Sensor SS = DDP with Temp Sensor SQ = QDP with Temp Sensor BF = , ) QDP with Temp Sensor SZF = FBGA with Temp Sensor and Heat Spreader SZS = DDP with Temp Sensor and , 1.8V G = 1.5V R = 1.55V Product Family TF = FBGA TS = DDP (dual die in package) TZS = , Part Mark -335 -6T -335 -6 -40B -5B Product Family DDF = DDR FBGA DDT = DDR TSOP DVF = DDR


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2002 - NP351-064-148

Abstract: NP351-18464 NP351-080-128 NP351 NP35 NP351-180-139 400X400 20890 NP351-11230 14422
Text: x 12 10 x 10 NP351 Series (Open Top) Fine Ball Grid Array ( FBGA , 0.80mm Pitch) Base Socket , NP351 Series (Open Top) Fine Ball Grid Array ( FBGA , 0.80mm Pitch) Specifications Part Number , type sockets for FBGA packages í Self contacting structure without upper pressing force (ZIF) í , NOTICE ­ DIMENSIONS IN MILLIMETER NP351 Series (Open Top) Fine Ball Grid Array ( FBGA , 0.80mm Pitch , Test & Burn-In D-45 NP351 Series (Open Top) Fine Ball Grid Array ( FBGA , 0.80mm Pitch


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PDF NP351 10mA/20mV CP351-30413-* NP351-30431-* NP351-43216-* NP351-52009-* NP351-532-83-* NP351-064-148 NP351-18464 NP351-080-128 NP35 NP351-180-139 400X400 20890 NP351-11230 14422
2004 - 512m pc133 SDRAM DIMM

Abstract: TSOP 66 Package TSOP 54 Package DIMM DDR400 PC3200 1 gb ddr2 ram DDR400 infineon 16M x 16 DDR TSOP-66 HYF33DS512800ATC P-TSOPI-48 infineon twinflash
Text: DDR333 2.5-3-3 16 M x 16 64 M x 4 TSOP-66 (400 mil) FBGA 60 (8 x 12 mm) HYB25D256160CE , x 12 mm) 3-3-3 DDR266A 2-3-3 DDR333 2.5-3-3 DDR333 FBGA 60 (8 x 12 mm , (10 x 12 mm) DRAM Modules FBGA 64 M x 8 32 M x 16 FBGA 60 (10 x 12 mm) FBGA 60 (10 x , x 12 mm) PC133 2-2-2 HYB39S256400DC- 7 Q67100 Q4772 FBGA 32 M x 8 FBGA -54 (8 x 12 mm) PC133 2-2-2 HYB39S256800DC- 7 Q67100 Q4774 16 M x 16 FBGA -54 (8 x 12


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PDF DDR400 PC3200) B166-H8399-X-X-7600 512m pc133 SDRAM DIMM TSOP 66 Package TSOP 54 Package DIMM DDR400 PC3200 1 gb ddr2 ram DDR400 infineon 16M x 16 DDR TSOP-66 HYF33DS512800ATC P-TSOPI-48 infineon twinflash
PCN0515

Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
Text: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description , ® FineLine BGA® ( FBGA ) device packages. Devices in FBGA packages currently molded with Nitto HC-100 series , packaged with the Sumitomo G770 series mold compound beginning with FBGA packages carrying a top mark date code of 0613. Altera Corporation 01/ 12 /06 PCN0515 Date Code Marking ® Product Family , customer-quality@altera.com. Altera Corporation 01/ 12 /06 PCN0515 Products Affected: Package Pin 100 144


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PDF PCN0515 HC-100 UL-94 1x1011 PCN0515 sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
2010 - CORE i3 ARCHITECTURE

Abstract: verilog code for aes encryption higig specification dual lvds vhdl pin configuration of i3 processor Altera Arria V FPGA vhdl code for ddr3 JESD204 EP2AGX260 verilog code for 64 bit AES encryption
Text: BGA ( FBGA ) devices. Table 1­2 . Package Options and I/O Information for Arria II GX Devices (Note 1 , Notes to Figure 1­2 : (1) Not available for 780-pin FBGA package. (2) Not available for 780-pin and , (DSP) blocks up to 550 MHz Configurable as 9 × 9-bit, 12 × 12 -bit, 18 × 18-bit, and 36 × 36 , Integration December 2010 Subscribe 1­2 Chapter 1: Overview for the Arria II Device Family Arria II , 8 12 12 16 16 16 or 24 16 or 24 16 or 24 ALMs 18,050 25,300 37,470


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PDF AIIGX51001-4 40-nm CORE i3 ARCHITECTURE verilog code for aes encryption higig specification dual lvds vhdl pin configuration of i3 processor Altera Arria V FPGA vhdl code for ddr3 JESD204 EP2AGX260 verilog code for 64 bit AES encryption
2009 - 1152-pin

Abstract: AGX51001-2 EP1AGX60D
Text: available in space-saving FBGA packages (refer to Table 1­2 ). All Arria GX devices support vertical , GX devices include 4 to 12 high-speed transceiver channels, each incorporating clock data recovery , . The Arria GX FPGA technology offers a 1.2 -V logic array with the right level of performance and , include: Transceiver block features Devices available with 4, 8, or 12 high-speed full-duplex , power-down capability for reduced power consumption during non-operation 1.2 - and 1.5-V pseudo


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PDF AGX51001-2 1152-pin EP1AGX60D
CV-8710

Abstract: EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy
Text: (akihisa.haraguchi@spansion.com) FBGA (one live die, no spacer die), FBD 048, Pb-free Solder Balls 12 mm x 6 mm Weight of , (akihisa.haraguchi@spansion.com) FBGA (one live die, no spacer die), FBD 048, SnPb Solder Balls 12 mm x 6 mm Weight of Unit , ) FBGA (one live die, no spacer die), FBE 063, Pb-free Solder Balls 11 mm x 12 mm Weight of Unit , (akihisa.haraguchi@spansion.com) FBGA (one live die, no spacer die), FBE 063, SnPb Solder Balls 11 mm x 12 mm Weight of Unit , : RoHS: Spansion, Inc. Akihisa Haraguchi (akihisa.haraguchi@spansion.com) FBGA (one live die, no


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PDF JIG-101 CV-8710 EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy
2005 - K8D3216UBC-pi07

Abstract: K5E5658HCM KAD070J00M KBH10PD00M samsung ddr2 ram MTBF K5D1257ACM-D090000 KBB05A500A K801716UBC k5a3281ctm k5d1g13acm
Text: Packing M 11. "-" 12 . Package A: COB C: CHIP BIZ E: TSOP1(LF,1217) G: FBGA J: FBGA (LF) L , ) Lead-free 1Gb NOTES: CC = 400Mbps D5 = 533Mbps E6 = 667Mbps Voltage: 1.8V Package: FBGA , : CC = 400Mbps D5 = 533Mbps C6 = 667Mbps Voltage: 1.8V Package: FBGA (11x13mm) DDR2 DRAM , 667Mbps BR-05-ALL-002 Voltage: 1.8V Package: FBGA (11x13mm) SAMSUNG SEMICONDUCTOR, INC. 3a , Pb-free available 256M 64Mx4 256M 32Mx8 333/400 K4H560438E-GC(L)B3/CCC 60 ball FBGA


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PDF BR-05-ALL-002 K8D3216UBC-pi07 K5E5658HCM KAD070J00M KBH10PD00M samsung ddr2 ram MTBF K5D1257ACM-D090000 KBB05A500A K801716UBC k5a3281ctm k5d1g13acm
Not Available

Abstract: No abstract text available
Text: s 0.8 m m (M IN .) ' ' 1.2 m m {T Y P .} OB UST (Ultra Slim TCP) Film width : W1 C opper foil , film. Features O ther com ponents IC PACKAGES CSP (Chip Size Package) CSP The FBGA , (PDAs), cellular phones, camcorders and digital cameras. FBGA (Commonly known as CSP) Features , -pin (Package size; 16 mm x 16 mm. Pin pitch; 0.8 mm) Structure of SHARP CSP( FBGA ) S tack ed P ackag e S , T ype Package Type Appearance No. of pins 8 14 16 24 24 24 28 32 40 44 8 12 24 40 56 64 70 18 20


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2008 - pin information ep3c10

Abstract: u256 EP2C35-F484 E144 EP3C10 EP3C16 EP3C25 F256 M164
Text: devices available in Ball-Grid Array (BGA), FineLine® BGA ( FBGA ), Micro FineLine BGA® (MBGA), Ultra , 16.9 13.5 11.8 10.5 3.3 F484 17.1 13.7 12 10.7 3.1 F780 EP3C120 , 26.7 24.7 PQFP 4.3 27.2 24.7 22.1 17.8 FBGA 8.8 28.7 24.5 22.3 20.5 240 PQFP 4.0 26.0 23.4 20.8 17.1 FBGA 6.6 24.3 20.2 18.1 , Count 144 Device FBGA 6.1 23.0 19.8 17.7 16.1 DS-CYTHRML-3.0 Altera


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PDF EP3C25 EP3C10 pin information ep3c10 u256 EP2C35-F484 E144 EP3C10 EP3C16 EP3C25 F256 M164
DDR400

Abstract: PC3200 kingston ddr PC3200 ecc dimm ddr pc3200
Text: Memory Module Specification KRX3200K2/1G 1GB (512MB 64M x 72-Bit x 2 pcs.) Registered PC3200 ECC CL3 184-Pin DIMM Kit DESCRIPTION: Kingston's KRX3200K2/1G is a kit of two 64M x 72-bit (512MB) DDR400 CL3 SDRAM (Synchronous DRAM) registered ECC memory modules. Total kit capacity is 1GB. The components on each module include eighteen 64M x 4-bit (16M x 4-bit x 4 Bank) DDR400 SDRAM in FBGA packages , used device is 32Mx8, 64Mx4 DDR SDRAM, FBGA For more information, go to www.kingston.com All


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PDF KRX3200K2/1G 512MB 72-Bit PC3200 184-Pin KRX3200K2/1G 72-bit 512MB) DDR400 kingston ddr PC3200 ecc dimm ddr pc3200
AGX51001-1

Abstract: arria gx
Text: logic array. Arria GX devices include 4 to 12 high-speed transceiver channels, each incorporating , applications. The Arria GX FPGA technology offers a 1.2 -V logic array with the right level of performance and , transceiver channels with clock/data recovery support Devices available with 4, 8, or 12 high-speed , for reduced power consumption during non-operation 1.2 - and 1.5-V pseudo current mode logic (PCML , BGA® ( FBGA ) with flip-chip packages. Table 1­1. Arria GX Device Features (Part 1 of 2) Feature


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PDF AGX51001-1 arria gx
2008 - A3P1000

Abstract: 160 e7 Datasheet A3P125 FBGA A3P250 A3P030 FBGA A3P600
Text: IO06RSB0 10 IO65RSB1 46 IO04RSB0 11 IO64RSB1 47 IO02RSB0 12 IO62RSB1 48 , IO68RSB1 47 IO31RSB0 12 IO67RSB1 48 IO29RSB0 13 IO66RSB1 49 IO28RSB0 14 , VCCIB1 46 VCC 11 IO68RSB1 47 IO31RSB0 12 IO67RSB1 48 IO29RSB0 13 , IO75RSB1 46 IO42RSB1 82 IO18RSB0 11 IO74RSB1 47 TCK 83 IO17RSB0 12 GEC0 , GDA2/IO54RSB1 82 IO18RSB0 11 GFB0/IO86RSB1 47 TCK 83 IO17RSB0 12 VCOMPLF


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PDF 48-Pin A3P030 IO82RSB1 IO24RSB0 GEC0/IO73RSB1 IO22RSB0 GEA0/IO72RSB1 A3P1000 160 e7 Datasheet A3P125 FBGA A3P250 FBGA A3P600
DDR333

Abstract: INTEL 1980
Text: Memory Module Specification KVR333S4R25/1GI 1GB 128M x 72-Bit DDR333 CL2.5 Registered 184-Pin ECC DIMM DESCRIPTION: This document describes ValueRAM's 128M x 72-bit 1GB (1024MB) DDR333 CL2.5 SDRAM (Synchronous DRAM) "single rank" registered ECC "Intel Certified" memory module. The components on this module include eighteen 128M x 4-bit (32M x 4-Bit x 4 Bank) DDR333 SDRAM in FBGA packages , ) 1.2 (30.48) 0.0787 R (2.00) (0.157) (4.00) 0.157 Max (3.99 Max) 0.050 ± 0.0039 (1.270


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PDF KVR333S4R25/1GI 72-Bit DDR333 184-Pin 1024MB) DDR333 KVR333S4R25/1GI INTEL 1980
DDR400

Abstract: No abstract text available
Text: Memory Module Specification KVR400S4R3A/512 512MB 64M x 72-Bit DDR400 Registered CL3 ECC 184-Pin DIMM DESCRIPTION: This document describes ValueRAM's 64M x 72-bit (512MB) DDR400 CL3 SDRAM (Synchronous DRAM) "single rank" Registered ECC memory module. The components on this module include eighteen 64M x 4-bit (16M x 4-Bit x 4 bank) DDR400 SDRAM in FBGA packages. This 184-pin DIMM uses gold contact , Min) (2.30 Min) 0.393 (10.00) 0.78 (19.80) 0.7 (17.80) 1.2 (30.48) 0.0787 R (2.00


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PDF KVR400S4R3A/512 512MB 72-Bit DDR400 184-Pin 72-bit 512MB)
DDR333

Abstract: No abstract text available
Text: Memory Module Specification KVR333S4R25/1G 1GB 128M x 72-Bit DDR333 CL2.5 Registered 184-Pin ECC DIMM DESCRIPTION: This document describes ValueRAM's 128M x 72-bit 1GB (1024MB) DDR333 CL2.5 SDRAM (Synchronous DRAM) "single rank" Registered ECC memory module. The components on this module include eighteen 128M x 4-bit DDR333 SDRAM in FBGA packages. This 184-pin DIMM uses gold contact fingers and requires , (10.00) 0.78 (19.80) 0.7 (17.80) 1.2 (30.48) 0.0787 R (2.00) (0.157) (4.00) 0.157


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PDF KVR333S4R25/1G 72-Bit DDR333 184-Pin 1024MB) DDR333 000ns
QFP 128 lead .5mm

Abstract: csp192 144 QFP body size qfp 0.4mm 8P-10P qfp 0.8mm 648P 15 ball CSP p4m 16 12P4M
Text: 12 12 14 14 20 20 Lead Counts 64 80 100 120 160/184 Body Thickness (mm , Size (mm) Lead Counts lead pitch series 7 7 10 10 12 12 14 14 14 20 20 20 24 , DEVELOPMENT SQFP 0.65mm lead pitch series Body Size (mm) 10 10 12 12 14 14 14 20 20 20 , CSP ( FBGA ) 0.5mm lead pitch series Body Size (mm) 5 5 6 6 7 7 8 8 9 9 Ball , 14P6M 16P8M *:UNDER DEVELOPMENT CSP ( FBGA ) 0.8mm Ball Counts Body Size 7 7 8 8 10


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PDF 12P2M 13P5M 14P6M 16P8M 14P4M 16P6M 17P9M 18P10M 13P3M 17P7M QFP 128 lead .5mm csp192 144 QFP body size qfp 0.4mm 8P-10P qfp 0.8mm 648P 15 ball CSP p4m 16 12P4M
Supplyframe Tracking Pixel