The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTM9009CY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9009IY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9010CY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9010IY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9011IY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9011CY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial

17X17* BGA 289 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2004 - SG-BGA-6046

Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 SG-BGA-6094 1mm pitch BGA socket BGA Solder Ball compressive force SG-MLF-7003 SG-BGA-6033 17X17* BGA 289
Text: 196 14x14 196 22x22 228 16x16 256 16x16 256 16x16 256 16x16 256 26x26 276 17x17 289 17x17 289 18x18 324 20x20 400 26x26 420 26x26 420 22x22 484 22x22 484 22x22 484 24x24 , Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent , BGA High Density Sockets . . . . . . . . . . . . . . . . . . . . . . . . . page SG.5 Ghz MLF High Density Sockets . . . . . . . . . . . . . . . . . . . . . . . . . page SG.6 SMT Adapters for GHz BGA


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PDF 025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 SG-BGA-6094 1mm pitch BGA socket BGA Solder Ball compressive force SG-MLF-7003 SG-BGA-6033 17X17* BGA 289
2005 - 17X17* BGA 289

Abstract: BGA289 LS-BGA289D-61
Text: (min.). Description: Giga-snaP BGA SMT Land Socket 289 position BGA surface mount land pattern to terminal pins (0.8mm centers, 17x17 array) Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm


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PDF FR4/G10 17x17 LS-BGA289D-61 17X17* BGA 289 BGA289
2005 - 17X17* BGA 289

Abstract: LS-BGA289A-31
Text: (min.). Description: Giga-snaP BGA SMT Land Socket 289 position BGA surface mount land pattern to terminal pins (1.27mm [0.050"] centers, 17x17 array) Tolerances: diameters ±0.03mm [±0.001"], PCB


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PDF FR4/G10 17x17 13mm0µ LS-BGA289A-31 17X17* BGA 289
sony IMX 161

Abstract: STMP3780 toshiba 16GB Nand flash emmc Cortex-A8 MIPI Toshiba emmc Sony IMX283 OV56 sony cmos sensor imx 17 MC9S08GP32 i.mx258
Text: x6 PWM* x8 x8 x8 x8 S/PDIF Tx - - Y Y Package 14x14 0.8mm 289 BGA 14x14 0.8mm 289 BGA 14x14 0.8mm 289 BGA 14x14 0.8mm 289 BGA * Represents maximum available â , various feature sets Battery Charger Audio S/PDIF Tx 289 BGA 14x14mm 0.8mm pitch -40C to +85C , 13x13 0.5mm 17x17 0.8 mm Features and Advantages − High Performance CPU : Cortex-A8 â , /GP Core Voltage: 0.85V-1.3V Package: 19x19 0.8mm 529 ball BGA 12x12 0.4mm PoP (Consumer) Case


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Not Available

Abstract: No abstract text available
Text: ] 14 , 5 0 [ . 5 7 1] 16 4 0 2 4 0 - 2 289 17X17 24.50 [ .964] 18 , 50 [.728] 16 , 3-1640240-7 289 17X17 25,50 [ 1.004] 19 , 50 [.768] 16 , 0 0 [.630] 38, 10 [ 1.500 , MATRIX BGA SOCKET TYPE 1 (1 MM) NO. OF CONTACTS GRID DIM 16 4 0 2 4 0 - 1 256 , I C A T I O N P/ N 1 6 4 0 9 0 5 ( BGA ) . 1- 1 6 4 0 2 4 0 - 5 900 30X30 37,50 [ 1 , TYPE 1 BGA PACKAGE SPEC SCALE = I0X CUSTOMER SPECIFICATIONS ARE SUBJECT DRAWING TO


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PDF 16X16 17X17
2010 - APPLE AUTHENTICATION COPROCESSOR 2.0C

Abstract: AR6102 AUTHENTICATION COPROCESSOR 2.0C emmc roadmap i.MX53 emmc nokia x6 camera module Apple Authentication emmc spi bridge M6425
Text: , SSP, SDIO, SPI, I2C, I2S) Family of products supporting various feature sets 289 BGA 14x14mm .8mm , , TV-Out, DDR1, Small package ( BGA and QFP) Power Management, 1588 Dual Ethernet & L2 Switch, DDR2 , MCIMX257CJM4: $7.37 MCIMX258CJM4: $8.11 Package / Qual. 17x17 0.8 MAPBGA AECQ100-G3 17x17 0.8 MAPBGA AECQ100-G3 17x17 0.8 MAPBGA 17x17 0.8 MAPBGA 17x17 0.8 MAPBGA Freescale, the , 128LQFP 14x14mm -10 to +70C (Consumer) -40C to +85C (Industrial) 128 LQFP 169 BGA UART 2 2 3


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PDF CON-F0960 MX233 APPLE AUTHENTICATION COPROCESSOR 2.0C AR6102 AUTHENTICATION COPROCESSOR 2.0C emmc roadmap i.MX53 emmc nokia x6 camera module Apple Authentication emmc spi bridge M6425
2004 - 1.27mm pitch zif socket 3M 21X21

Abstract: 1155 lga socket pins 1155 lga socket 17X17* BGA 289 PGA zif socket 289 TEXTOOL 15x15 pga BGA169C amp bga 25x25 Am29040 BGA432
Text: array of high quality sockets and receptacles for BGA , MGA, PGA, QIP, and QFP packages. We also offer , . . . . . . . . . . . . . . . page SK.3 BGA chip carriers (SMT land sockets) Male . . . page SK.5 BGA chip carriers (SMT land sockets) Female . page SK.10 QFP chip carriers (SMT land sockets) . . . . . . . page SK.15 BGA Testing and Probing . . . . . . . . . . . . . . . .page SK.16 0.1" pitch PGA , .28 Sockets and Receptacles Product Overview · BGA and QFP Chip Carriers (SMT Land Sockets) Our BGA and QFP


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PDF SK-MGAxx/xxxx-03 SK-MGAxx/xxxx-01 SK-MGAxx/xxxx-02 MGA10/100A- 1.27mm pitch zif socket 3M 21X21 1155 lga socket pins 1155 lga socket 17X17* BGA 289 PGA zif socket 289 TEXTOOL 15x15 pga BGA169C amp bga 25x25 Am29040 BGA432
2004 - PA-PGA181-02W

Abstract: PA-SO42-S-01 PA-PGA68-01 BGA169C actel 14100 ax 6001 mp3 PA-PLCC84-02 PA-QIP90-01 PA-PGA109-01W 80386ex footprint
Text: prototyping adapter designs, supporting CSP, BGA , QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most , .6 DUT (Device Under Test) PGA . . . . page PA.7 BGA with Surface Mount Lands . . . . page PA.8 BGA , Adapters PA.2 · BGA with Surface Mount Lands These adapters provide surface mount lands for attaching the BGA device. They employ high temperature FR4/G10 substrate which allows package soldering , in mechanical and electrical connections. · BGA with ZIF Sockets These adapters provide ZIF


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PDF 12X12mm. FR4/G10 PA-PGA181-02W PA-SO42-S-01 PA-PGA68-01 BGA169C actel 14100 ax 6001 mp3 PA-PLCC84-02 PA-QIP90-01 PA-PGA109-01W 80386ex footprint
ALP 102 B4

Abstract: an35 cu hen ma
Text: 484 208-Pin PQFP 0.50 936 240-Pin PQFP RQFP 0.50 1,197 256-Pin FineLine BGA 1.0 289 17x17 , 102 102 102 Notes (1), (2), (3) 484-Pin 599-Pin PGA FineLine BGA 220 220 220 274 274 254 254 208-Pin PQFP 147 147 147 147 147 240-Pin PQFP RQFP 256-Pin 356-Pin BGA FineLine BGA 176 600-Pin BGA 672-Pin FineLine BGA 220 (4) 254 (4) 254 (4) 338 (4) EPF10K30E EPF10K50E EPF10K50S , ball-grid arra y ( BGA ) packages. Devices in the sam e package are pin-com patible, alth o u g h som e


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PDF 16-bit 256-Pin 484-Pin 672-Pin EPF10K30E EPF10K50E EPF10K50S EPF10K100B EPF10K100E EPF10K130E ALP 102 B4 an35 cu hen ma
2011 - Not Available

Abstract: No abstract text available
Text: possible states to every other possible state. Therefore, 17X17 = 289 unique transitions. Test levels: (A , Components Small Package: BGA 13x13mm The TX517 is a complete transmitter solution with low-voltage , . The TX517 also incorporates a CW output stage. The TX517 is available in a BGA package that is , PACKAGE TYPE PACKAGE MARKING TRANSPORT MEDIA, QUANTITY ECO STATUS (2) TX517IZCQ BGA , soldered, suitable for use in specified lead-free soldering processes. DEVICE INFORMATION BGA -144 PINS


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PDF TX517 SLOS725A TX517 200Vpp
2011 - Not Available

Abstract: No abstract text available
Text: Components Small Package: BGA 13x13mm The TX517 is a complete transmitter solution with low-voltage , . The TX517 also incorporates a CW output stage. The TX517 is available in a BGA package that is , PACKAGE TYPE PACKAGE MARKING TRANSPORT MEDIA, QUANTITY ECO STATUS (2) TX517IZCQ BGA , soldered, suitable for use in specified lead-free soldering processes. DEVICE INFORMATION BGA -144 PINS , of the device. THERMAL INFORMATION THERMAL METRIC (1) TX517 BGA (144) (ZCQ) PINS JA


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PDF TX517 SLOS725A TX517 200Vpp
2011 - VAA23

Abstract: nFBGA ultrasound transducer circuit driver 1mhz
Text: state. Therefore, 17X17 = 289 unique transitions. Test levels: (A) 100% tested at 25°C. Over temperature , Stages ­ CW output TX Output Update Rate ­ Up to 100MSPS Minimal External Components Small Package: BGA , CW output stage. The TX517 is available in a BGA package that is Lead-Free (RoHS compliant) and Green , ) PACKAGED DEVICES TX517IZCQ (1) (2) PACKAGE TYPE BGA -144 PACKAGE MARKING TX517 TRANSPORT MEDIA, QUANTITY , lead-free soldering processes. DEVICE INFORMATION BGA -144 PINS TOP VIEW 1 A HV2B 2 GND 3 HV1B


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PDF TX517 SLOS725A 200Vpp 100MSPS 13x13mm TX517 VAA23 nFBGA ultrasound transducer circuit driver 1mhz
2011 - 611V

Abstract: ultrasound transducer transformer ultrasound TRANSFORMER 1mhz ultrasound transducer circuit driver VAA23
Text: possible state. Therefore, 17X17 = 289 unique transitions. Test levels: (A) 100% tested at 25°C. Over , Rate ­ Up to 100MSPS Minimal External Components Small Package: BGA 13x13mm DESCRIPTION The TX517 , available in a BGA package that is Lead-Free (RoHS compliant) and Green. It is specified for operation from , ) PACKAGED DEVICES TX517IZCQ (1) (2) PACKAGE TYPE BGA -144 PACKAGE MARKING TX517 TRANSPORT MEDIA, QUANTITY , lead-free soldering processes. DEVICE INFORMATION BGA -144 PINS TOP VIEW 1 A HV2B 2 GND 3 HV1B


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PDF TX517 SLOS725 200Vpp 100MSPS 13x13mm TX517 611V ultrasound transducer transformer ultrasound TRANSFORMER 1mhz ultrasound transducer circuit driver VAA23
1991 - on digital code lock using vhdl mini pr

Abstract: XC2V3000-BG728 TRANSISTOR 841 XC2V6000-ff1152 ternary content addressable memory VHDL BT 342 project land pattern BGA 0,50 Catalog Toshiba XC2V3000-FG676 Z034
Text: . 289 Configuration Details . 289 Readback , .304 FG256 Fine-Pitch BGA Package , .313 CS144 Chip-Scale BGA Composite Pinout Diagram .314 FG256 Fine-Pitch BGA Composite Pinout Diagram


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PDF XC2064, XC3090, XC4005, XC5210, XC-DS501 on digital code lock using vhdl mini pr XC2V3000-BG728 TRANSISTOR 841 XC2V6000-ff1152 ternary content addressable memory VHDL BT 342 project land pattern BGA 0,50 Catalog Toshiba XC2V3000-FG676 Z034
2001 - verilog/verilog code for lvds driver

Abstract: RAM16X8 verilog hdl code for triple modular redundancy 37101 dual transistor 6 pin SMD 327 fpga JTAG Programmer Schematics XC2V3000FF1152 xc2v250cs144 BT 342 project xilinx vhdl code for 555 timer
Text: ) . 289 Introduction . 289 Xilinx DCI . 289 Software Support , .402 FG256 Fine-Pitch BGA Package , . 411 CS144 Chip-Scale BGA Composite Pinout Diagram


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PDF XC2064, XC3090, XC4005, XC5210 verilog/verilog code for lvds driver RAM16X8 verilog hdl code for triple modular redundancy 37101 dual transistor 6 pin SMD 327 fpga JTAG Programmer Schematics XC2V3000FF1152 xc2v250cs144 BT 342 project xilinx vhdl code for 555 timer
2004 - STMicroelectronics smd marking code

Abstract: BGA and QFP Package 14x14 STMICROELECTRONICS MSL ST TSSOP Marking TQFP 14X20 STMicroelectronics pentawatt date code STMicroelectronics date code tssop-14 infineon msl HiQuad package opto mold compound
Text: FPN 2X3 BGA 15x15 MELF FPN 3.3X3.3 BGA 17x17 MINIMELF FPN 3X3 BGA 13.5x5.5 BGA , meet the higher soldering temperature constraints required by Lead-free soldering. c. BGA packages , will implement its conversion schedule, as per the attached roadmap. For SnAgCu finishing ( BGA ) the , (by package family) Package family BGA Big BGA Small CDIP Diodes DPAK HiQuad Metal Cans , Family Macro Package Package Family Macro Package Package Family Macro Package BGA


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PDF CRP/04/744 2002/95/EC) STMicroelectronics smd marking code BGA and QFP Package 14x14 STMICROELECTRONICS MSL ST TSSOP Marking TQFP 14X20 STMicroelectronics pentawatt date code STMicroelectronics date code tssop-14 infineon msl HiQuad package opto mold compound
2004 - STMicroelectronics smd marking code

Abstract: smd marking code stmicroelectronics BGA bga 10x13 BGA 23X23 BGA 15X15 INFINEON package tqfp PART MARKING HEPTAWATT SMD PLCC Part Marking STMicroelectronics Marking STMicroelectronics tqfp Date Code Marking STMicroelectronics PACKAGE DPAK
Text: 15x15 MELF FPN 3.3X3.3 BGA 17x17 MINIMELF FPN 3X3 BGA 13.5x5.5 BGA 19x19 BGA 21X21 , temperature constraints required by Lead-free soldering. c. BGA packages and Flip-Chip For the products , the attached roadmap. For SnAgCu finishing ( BGA ) the compatibility is not fully guaranteed (soldering , family) Package family BGA Big BGA Small CDIP Diodes DPAK HiQuad Metal Cans PDIPs PLCCs PSO , Package Package Family Macro Package Package Family Macro Package BGA 27x27 BGA big


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PDF MLD-MIC/05/943 MLD-MIC/05/943 STMicroelectronics smd marking code smd marking code stmicroelectronics BGA bga 10x13 BGA 23X23 BGA 15X15 INFINEON package tqfp PART MARKING HEPTAWATT SMD PLCC Part Marking STMicroelectronics Marking STMicroelectronics tqfp Date Code Marking STMicroelectronics PACKAGE DPAK
2000 - BGA 256 PACKAGE power dissipation

Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance BGA-1156 BGA and CSP cte table flip chip substrate BG560 fine BGA thermal profile FG676 35x35 bga
Text: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction , for Virtex Series FPGAs with up to 200,000 system gates. Xilinx Fine-Pitch BGA and CSP , discussed. Table 1: BGA / Fine-Pitch BGA / CSP Features Comparison Feature/Package BGA FG CSP , , 676, 680, 860, 900, and 1156 solder ball arrays. · The Xilinx fine-pitch BGA packages are based on the original Motorola BGA technology, which has a well-established worldwide supply base and


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PDF 00-mm 27-mm XC9500 BGA 256 PACKAGE power dissipation BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance BGA-1156 BGA and CSP cte table flip chip substrate BG560 fine BGA thermal profile FG676 35x35 bga
2004 - XC4VLX25-10FF668C

Abstract: transistor equivalent table chart ba26 xc4vfx60 AM2170 viterbi N38 transistor Virtex-4 XC4VLX160 X17240 M39AB39
Text: No file text available


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PDF DS112 UG075 XC4VLX25-10FF668C transistor equivalent table chart ba26 xc4vfx60 AM2170 viterbi N38 transistor Virtex-4 XC4VLX160 X17240 M39AB39
2010 - pcb warpage in ipc standard

Abstract: IPC-9701A SAC405 IPC-9702 BGA PACKAGE thermal resistance Freescale ipc 9702 945 motherboard circuit "IPC 1752" gold semiconductor cross reference SAC387
Text: offers Flip-Chip PBGA product in body sizes ranging from 17x17 mm to 37.5x37.5 mm · BGA sphere pitch , the performance advantages of a flip chip Ball Grid Array ( BGA ) package. Flip chip packages are , Package Substrate BGA Solder Ball Package Substrate Freescale and the Freescale logo are , BGA Solder Ball Lid Adhesive BGA Solder Ball TM 4 Freescale FC-PBGA Solder Bump , I/O Count Sphere Pitch (mm) Sphere Array Pkg Pad Diam (mm) 17x17 20x20 21x21 25x25


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1993 - XC2V6000-ff1152

Abstract: 12x12 bga thermal resistance Printed Circuit Boards PCB UG002 IO-L93N XC2V80 xc2v500fg456 XC2V3000-BG728 smd transistor J6 pin XC2V3000-FG676
Text: : wire-bond chip-scale ball grid array ( BGA ) of 0.80 mm pitch FG256, FG456, and FG676: wire-bond fine-pitch BGA of 1.00 mm pitch FF896, FF1152, FF1517: flip-chip fine-pitch BGA of 1.00 mm pitch BG575 and BG728: wire-bond BGA of 1.27 mm pitch BF957: flip-chip BGA of 1.27 mm pitch All of the devices supported in a , Virtex-II Platform FPGA Handbook www.xilinx.com 1-800-255-7778 403 R FG256 Fine-Pitch BGA Package As , the FG256 fine-pitch BGA package. Pins in the XC2V250, XC2V500, and XC2V1000 devices are the same. The


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PDF UG002 CS144: FG256, FG456, FG676: FF896, FF115XC2V40 CS144 XC2V40 FG256 XC2V6000-ff1152 12x12 bga thermal resistance Printed Circuit Boards PCB UG002 IO-L93N XC2V80 xc2v500fg456 XC2V3000-BG728 smd transistor J6 pin XC2V3000-FG676
2002 - tec driver peltier

Abstract: No abstract text available
Text: Pro devices in the following packages: · · · FG256 and FG456: wire-bond fine-pitch BGA of 1.00 mm pitch FF672, FF896, FF1152, and FF1517: flip-chip fine-pitch BGA of 1.00 mm pitch BF957: flip-chip BGA of 1.27 mm pitch All of the devices supported in a particular package are pinout compatible and , Virtex-II Pro Platform FPGA Handbook Pinout Information R FG256 Fine-Pitch BGA Package As shown in Table 4-3, XC2VP2 and XC2VP4 Virtex-II Pro devices are available in the FG256 fine-pitch BGA


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PDF FG256 FG456: FF672, FF896, FF1152, FF1517: BF957: FG456 FF672 tec driver peltier
2005 - SG-BGA-7041

Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling , thickness 2 8 6 7 10 Side View (Section AA) 11 10 11 Customer's BGA IC SG-BGA , Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. Orientation , PAGE 2 of 4 Compatible BGA Spec. X D Detail Y 5 DETAIL 0.10 Z A E A1 Z


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PDF 475mm. SG-BGA-7041 725mm 025mm 125mm.
2004 - Preci-Dip Durtal SA

Abstract: CH-2800 C17200 SMD 2.54 90 Header Durtal 94vo fr4 CuSn4Pb4Zn4 pga 132 packaging 510-91-168-17 514-PP-NNNMXX-XXX148
Text: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm , 136 139 PGA / BGA / PLCC BGA pin-adapter 127 124 Due to technical progress, all the , / Switzerland Phone +41 32 421 04 00 Fax +41 32 421 04 01 sales@precidip.com PGA / BGA / PLCC General , 0.05-0.2 µm Packaging - Standard packaging for PGA, BGA and PLCC sockets is tube packaging - SMD mount , availability, size of tape, size of reel, number of components per reel and packing units. 125 PGA / BGA


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PDF CH-2800 540-PP-020-24-000-1 540-PP-028-24-000-1 540-PP-032-24-000-1 540-PP-044-24-000-1 540-PP-052-24-000-1 540-PP-068-24-000-1 540-PP-084-24-000-1 Preci-Dip Durtal SA C17200 SMD 2.54 90 Header Durtal 94vo fr4 CuSn4Pb4Zn4 pga 132 packaging 510-91-168-17 514-PP-NNNMXX-XXX148
2004 - SG-BGA-6112

Abstract: 17X17
Text: Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB , thickness. 2 8 7 6 10 5 Customer's BGA IC SG-BGA-6112 Drawing © 2004 IRONWOOD , : BGA pattern is not symmetrical with respect to the mounting holes. Recommended PCB Layout Top View Note: Maximum BGA pattern shown. Please adjust pattern according to individual requirements , Modified: 6/2/09 PAGE 2 of 3 Compatible BGA Spec TOP VIEW SIDE VIEW X DETAIL D Y


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PDF 225mm 5M-1994. SG-BGA-6112 17x17 17X17
Supplyframe Tracking Pixel