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Part Manufacturer Description Datasheet Download Buy Part
LTM9010CY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9009IY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9009CY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9011CY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9010IY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9011IY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial

152-BALL Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2008 - MT29C1G12

Abstract: mt29c1g12ma MT29C1G12M smd code AA5 MT29C1G SMD MARKING CODE b21 MT29C2G24MAKLACG-6 smd code U21 marking aa5 mt29c1g1
Text: Preliminary 152-Ball NAND Flash and LP-DRAM PoP (TI OMAP) MCP Features NAND Flash and LP-DRAM 152-Ball Package-on-a-Package (PoP) Combination Memory (TI OMAPTM) Features · · · · · · Figure 1 , . Preliminary 152-Ball NAND Flash and LP-DRAM PoP (TI OMAP) MCP Part Numbering Information ­ 152-Ball PoP Part Numbering Information ­ 152-Ball PoP Micron NAND Flash and LP-DRAM devices are available in different configurations and densities. Figure 2: 152-Ball Part Number Chart MT 29C 1G 24M Micron


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PDF 152-Ball 409ng 09005aef8326e5ac 09005aef8326e59a 152ball_ MT29C1G12 mt29c1g12ma MT29C1G12M smd code AA5 MT29C1G SMD MARKING CODE b21 MT29C2G24MAKLACG-6 smd code U21 marking aa5 mt29c1g1
2008 - MT46H64M32

Abstract: MT46H128 MT46H64M32L2CG-6 MT46H128M 152-Ball lpddr MT46H128M32 micron lpddr 128M32 MT46H128M32L4KZ
Text: 152-Ball x32 Mobile LPDDR (only) PoP (TI-OMAP) Features Mobile LPDDR (only) 152-Ball , -die stack, standard addressing L2 ­ 4-die stack, standard addressing L4 · Plastic "green" package ­ 152-ball VFBGA (14 x 14 x 1.0mm) CG ­ 152-ball VFBGA (14 x 14 x 1.2mm) KZ · Timing ­ cycle time ­ 5ns @ CL = , notice. ©2008 Micron Technology, Inc. All rights reserved. 152-Ball x32 Mobile LPDDR (only) PoP (TI-OMAP) Part Numbering Information ­ 152-Ball PoP Part Numbering Information ­ 152-Ball PoP Micron


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PDF 152-Ball MT46HxxxMxxLxCG MT46HxxxMxxLxKZ 09005aef833913f1/Source: 09005aef833913d6 MT46H64M32 MT46H128 MT46H64M32L2CG-6 MT46H128M lpddr MT46H128M32 micron lpddr 128M32 MT46H128M32L4KZ
2008 - MT29F1G08ABCHC

Abstract: mt29c MT29F4G16A mt29f1g08 MT29F1G08ABCHC-ET MT29C1G12 MT29F2G16ABDHC MT29F4G16AB MT29F1G16ABCHC-ET micron lpddr
Text: Preliminary 152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP Features NAND Flash and Mobile LPDRAM 152-Ball Package-on-Package (PoP) Combination Memory (TI OMAPTM) MT29C Family Current , . Preliminary 152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP Part Numbering Information ­ 152-Ball PoP Part Numbering Information ­ 152-Ball PoP Micron NAND Flash and LPDRAM devices are available in different configurations and densities. Figure 2: 152-Ball Part Number Chart MT 29C 1G 24M


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PDF 152-Ball MT29C 152-Ball 09005aef8326e5ac 09005aef8326e59a 152ball_ MT29F1G08ABCHC MT29F4G16A mt29f1g08 MT29F1G08ABCHC-ET MT29C1G12 MT29F2G16ABDHC MT29F4G16AB MT29F1G16ABCHC-ET micron lpddr
2008 - D9KG

Abstract: marking aa5 marking code micron label 152-Ball M2P20 152-Ball PoP SMD marking code B10 AA5 mark diagram smd marking code M21 MT46H32M32LFCG
Text: Preliminary 152-Ball x32 LPDDR-SDRAM PoP (TI-OMAP) Features LPDDR-SDRAM 152-Ball , 2-die stack, standard addressing ­ 2-die stack, reduced page-size · Plastic "green" package ­ 152-ball , . Preliminary 152-Ball x32 LPDDR-SDRAM PoP (TI-OMAP) Part Numbering Information ­ 152-Ball PoP Part Numbering Information ­ 152-Ball PoP Micron® 152-ball packaged LPDDR-SDRAM devices are available in several , , reduced page-size option Package Code CG = 14mm x 14mm VFBGA "green" Table 2: 152-Ball


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PDF 152-Ball MT46HxxxMxxLxCG 09005aef833913f1/Source: 09005aef833913d6 D9KG marking aa5 marking code micron label M2P20 152-Ball PoP SMD marking code B10 AA5 mark diagram smd marking code M21 MT46H32M32LFCG
2009 - LPDDR2 PoP

Abstract: LPDDR2 micron lpddr2 lpddr2 datasheet lpddr2 nand mcp 216-ball LPDDR Micron 512MB nand FLASH 136-Ball Micron NAND 168-ball LPDDR
Text: 1.7V­1.9V 152-ball VFBGA 152-, 168- ball VFBGA 168- ball VFBGA 152-, 168- ball VFBGA Clock Rate , MHz 167­200 MHz 152-ball PoP 152-, 168- ball PoP 152-, 168- ball PoP ­0°C to +70°C, ­40°C to , 1.2V 1.2V 1.2V 1.2V 333­400 MHz 333­533 MHz 333­400 MHz 333­400 MHz 136- ball PoP 168- ball PoP 168-, 200-, 216- ball PoP 216- ball PoP ­40°C to +85°C ­40°C to +85°C ­40°C to +85°C ­40°C


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nitto GE

Abstract: GE-100L nitto GE-100L Nitto GE 100 te2 219 Ablestik 2300 313 pin PBGA MS-034 NITTO GE- pbga 288
Text: LAMINATE data sheet PBGA Features: Plastic Ball Grid Array (PBGA): Amkor's PBGAs , package offerings provide a platform from prototype-to-production. · Custom ball counts up to 1521 · 1.00, 1.27 & 1.50 mm ball pitch available · 13 mm to 40 mm body sizes · Low Profile and lightweight , and full ball arrays · Special packaging for memory available · Multi-layer, ground / power · JEDEC , thickness (max) Bond pad pitch (min) Marking Ball inspection Pack / Ship options Wafer backgrinding


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1998 - 28F160

Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING
Text: The Micro Ball Grid Array (µBGA*) Package 15.1 15 Introduction The Micro Ball Grid Array , are the property of their respective owners. 1998 Packaging Databook 15-1 The Micro Ball , attributes. Table 15-1. µBGA Package Attributes Ball count Product 40 48 28F008S3/S5 28F160 , Thickness (mm) Ball configuration Shipping Media Note: 15.3 Chip size packages are die size , construction of the µBGA package. 15-2 1998 Packaging Databook The Micro Ball Grid Array (µBGA


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footprint jedec MS-026 TQFP AEB

Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
Text: Braze) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 352B 352- ball Ball Grid Array (BGA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 432B 432- ball Ball Grid Array , Package (LAP) . . . . . . . . . . . . .7 14C1 14- ball (3 x 5 array) 1.0 mm Pitch, 4.5 x 7.0 mm Plastic Chip-Scale Ball Grid Array (CBGA) . . . . . . . . . . . . . . . . . . . . . . . . . .8 24C1 24- ball , Plastic Chip-Size Ball Grid Array Package (CBGA). . . . . . . .8 24C2 24- ball , Plastic


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PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 144-lead, 24-lead, 20-lead, footprint jedec MS-026 TQFP AEB footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
1999 - Not Available

Abstract: No abstract text available
Text: -layer metal Package: 25mm, 552- ball Ceramic Ball Grid Array (CBGA) Power (estimated): Less than: 4.0W in , . . . . . . . . . . . . . . . . . . . . . . 5 25mm, 552- Ball CBGA Package . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Signals Listed by Ball Assignment . . . , 13 of 70 PowerPC 440GP Embedded Processor Data Sheet 25mm, 552- Ball CBGA Package Top View A1 , shows the ball (pin) number on which the signal appears. Multiplexed signals are shown with the default


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PDF 440GP 500MHz 10/100Mbps 32/64-bit 133MHz SA14-2561-17
2008 - h07 diode

Abstract: PPC440GP-3FC400C t04 68 3 pin diode PPC440GP-3FC466C 52n15 smt w04 77 PPC440GP PPC440 440GP w04 75
Text: -27E, 0.18m (0.11 Leff) Packages: 25mm, 552- ball Plastic Ball Grid Array (PBGA) Power (estimated): Less , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 25mm, 552- Ball Plastic , . . . 16 Signals Listed by Ball Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . , PC 440GP Embedded Processor Revision 1.11 ­ August 27, 2010 Data Sheet 25mm, 552- Ball , following table lists all the external signals in alphabetical order and shows the ball (pin) number on


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PDF 440GP 440GP 466MHz 32/64-bit 133MHz 133MHz) 10/100Mbps h07 diode PPC440GP-3FC400C t04 68 3 pin diode PPC440GP-3FC466C 52n15 smt w04 77 PPC440GP PPC440 w04 75
1999 - IBM25PPC440GP-3CC400C

Abstract: t04 68 3 pin diode embedded powerpc 440 PPC440GP IBM25PPC440GP-3CC466CZ IBM25PPC440GP-3CC466C IBM25PPC440GP-3CC400EZ IBM25PPC440GP-3CC400E IBM PPC440GP resistor AC03 philips
Text: Leff), 5-layer metal Packages: 25mm, 552- ball Ceramic Ball Grid Array (CBGA) or Plastic Ball Grid , , 552- Ball CBGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 25mm, 552- Ball FC-PBGA Package . . . . . . . . . . . . . . . . , . . . . . . . . . . . 16 Signals Listed by Ball Assignment . . . . . . . . . . . . . . . . . . . . , PowerPC 440GP Embedded Processor Data Sheet 25mm, 552- Ball CBGA Package Top View A1 Corner Chip


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PDF 440GP 500MHz 10/100Mbps 32/64-bit 133MHz SA14-2561-18 IBM25PPC440GP-3CC400C t04 68 3 pin diode embedded powerpc 440 PPC440GP IBM25PPC440GP-3CC466CZ IBM25PPC440GP-3CC466C IBM25PPC440GP-3CC400EZ IBM25PPC440GP-3CC400E IBM PPC440GP resistor AC03 philips
2004 - 078F1

Abstract: PPC440GP ppc440gp-3fc466c PowerPC 440GX instruction set ppc440gx embedded processor user manual
Text: eff ), 5layer metal Packages: 25 mm, 552- ball Ceramic Ball Grid Array (CBGA) or Plastic Ball Grid , . 5 Figure 2. 25mm, 552- Ball CBGA Package . 13 Figure 3. 25mm, 552- Ball FC-PBGA Package , . 15 Table 4. Signals Listed by Ball Assignment , Processor Revision 1.01 ­ July 30, 2004 Preliminary Data Sheet Figure 2. 25mm, 552- Ball CBGA Package


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PDF 440GP 440GP 500MHz 32/64-bit 133MHz 133MHz) 10/100Mbps 078F1 PPC440GP ppc440gp-3fc466c PowerPC 440GX instruction set ppc440gx embedded processor user manual
1998 - 0555B

Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
Text: Array Package (LAP) . . . . . . . . . . . 9-9 24C1 24- Ball , Plastic Chip-Size Ball Grid Array Package (CBGA). . . . . . 9-9 24C2 24- Ball , Plastic Chip-Size Ball Grid Array Package (CBGA). . . . . . 9-9 42C1 42- Ball , Plastic Chip-Size Ball Grid Array Package (CBGA). . . . . . 9-9 42C2 42- Ball , Plastic Chip-Size Ball Grid Array Package (CBGA). . . . . 9-10 48C1 48- Ball , Plastic Chip-Size Ball Grid Array Package (CBGA) . . . . 9-10 48C2 48- Ball , Plastic Chip-Size Ball Grid Array


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PDF 44-Lead, 48-Lead, 64-Lead 100-Lead, 144-Lead, 24-Lead, 20-Lead, 0555B footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
2006 - embedded powerpc 460

Abstract: No abstract text available
Text: . Technology: CMOS Cu-11, 0.13 m. Package: 35mm, 456- ball enhanced plastic ball grid array (E-PBGA). Typical , . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 3. 35mm, 456- Ball E-PBGA Package . . , Sensitivity Level and Ball Composition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 6. Signals Listed by Ball Assignment . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Table 8. Non-Functional Ball


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PDF 440GR 440GR 667MHz 128-bit 133MHz 66MHz. 10/100Mbps embedded powerpc 460
2008 - MN-6186X-001

Abstract: BU-69092 BU-64843T BU648 BU-648 MN-69092SX-002 BU-65863 DS-BU-64843T STANAG 3838 MIL-STD-1553 ACE manual
Text: Ball for MT Only Applications - BC Disable Ball for RT Only Applications - Simple System RT Mode · Small Package: - 312 Ball BGA (1.1 in. x 0.6 in.) (27.9 mm x 15.2 mm) - 0.185" (4.7 mm) Max Height · , range applications where PC board space is at a premium. The Total-ACE is available in a 312- ball (24 x , SIDE VIEW BOTTOM VIEW Triangle denotes Ball A1 1553 Bus Controller (BC) 0.185 (4.7) (MAX) 0.015 (0.38) ± .002 Hi TG-FR4 Board 0.022 (0.56) DIA T / H = Sn/Pb (63/37) BALL U / I = Sn/Ag/Cu


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PDF MIL-STD-1553 MIL-STD-1760 AS9100 A5976 PB-BU-64843T-7 MN-6186X-001 BU-69092 BU-64843T BU648 BU-648 MN-69092SX-002 BU-65863 DS-BU-64843T STANAG 3838 MIL-STD-1553 ACE manual
2006 - embedded powerpc 460

Abstract: 3jb6 PPC440 Y26 DATA SHEET uart 16750 AMCC 460, DATE CODE H06 00E resistor AC03 philips amcc ppc440 440GR
Text: Cu-11, 0.13m. Package: 35mm, 456- ball enhanced plastic ball grid array (E-PBGA). Typical power , . . . . . . . 5 Figure 3. 35mm, 456- Ball E-PBGA Package . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . 17 Table 4. Signals Listed by Ball Assignment . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . 48 Table 6. Non-Functional Ball Connections . . . . . . . . . . . . . . . . , PPC440GR-3pbfffCx 35mm, 456 ball , PBGA A 0x422218D3 0x2A950049 PPC440GR PPC440GR


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PDF 440GR 440GR 667MHz 10/100Mbps 128-bit 16-bit 133MHz embedded powerpc 460 3jb6 PPC440 Y26 DATA SHEET uart 16750 AMCC 460, DATE CODE H06 00E resistor AC03 philips amcc ppc440
2007 - AMCC 460, DATE CODE

Abstract: AMCC DATE CODE MARKING PPC440 embedded powerpc 460 PPC440EP amcc ppc440ep
Text: m. Package: 35mm, 456- ball standard plastic ball grid array (E-PBGA), with and without lead (RoHS , . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 3. 35mm, 456- Ball E-PBGA . . . . . . . . , . JEDEC Moisture Sensitivity Level and Ball Composition . . . . . . . . . . . . . . . . . . . . . . . . . , by Ball Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , (see Notes:) PPC440EP-3pbfffCx Package 35mm, 456 ball , E-PBGA Revision Level C PVR Value


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PDF 440EP 440EP 667MHz 128-bit 133MHz 66MHz. AMCC 460, DATE CODE AMCC DATE CODE MARKING PPC440 embedded powerpc 460 PPC440EP amcc ppc440ep
2007 - AMCC DATE CODE MARKING

Abstract: N2260A ppc440ep3jc amcc part marking PPC440EP-3JC667C PPC440EP t04 MARKING embedded powerpc 460 AMCC 460, DATE CODE F000/01/02/05/06/AMCC DATE CODE MARKING
Text: m. Package: 35mm, 456- ball standard plastic ball grid array (E-PBGA), with and without lead (RoHS , . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 3. 35mm, 456- Ball E-PBGA . . . . . . . . . , . JEDEC Moisture Sensitivity Level and Ball Composition . . . . . . . . . . . . . . . . . . . . . . . . . , by Ball Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , (see Notes:) PPC440EP-3pbfffCx Package 35mm, 456 ball , E-PBGA Revision Level C PVR Value


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PDF 440EP 440EP 667MHz 128-bit 133MHz 66MHz. AMCC DATE CODE MARKING N2260A ppc440ep3jc amcc part marking PPC440EP-3JC667C PPC440EP t04 MARKING embedded powerpc 460 AMCC 460, DATE CODE F000/01/02/05/06/AMCC DATE CODE MARKING
2007 - AMCC DATE CODE MARKING

Abstract: amcc ppc440ep embedded powerpc 460 PPC440EP amcc 440ep 440EP Ethernet Device Driver for 440EP msl amcc EF40 PPC440
Text: . AMCC Proprietary Technology: CMOS Cu-11, 0.13m. Package: 35mm, 456- ball standard plastic ball grid , . 6 Figure 3. 35mm, 456- Ball E-PBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , and Ball Composition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Table 5 , . . . . . . . . . . . . . . . . . . 19 Table 6. Signals Listed by Ball Assignment . . . . . . . . . , Revision Level PVR Value JTAG ID PPC440EP PPC440EP-3pbfffCx 35mm, 456 ball , E-PBGA C


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PDF 440EP 440EP 667MHz 10/100Mbps AMCC DATE CODE MARKING amcc ppc440ep embedded powerpc 460 PPC440EP amcc 440ep Ethernet Device Driver for 440EP msl amcc EF40 PPC440
2006 - AMCC 460, DATE CODE

Abstract: embedded powerpc 460 ecc84 DDR SDRAM Controller paging policy epbga PPC440GR-3JB667CZ PPC440GR PPC440 EF40 E800
Text: Cu-11, 0.13m. Package: 35mm, 456- ball enhanced plastic ball grid array (E-PBGA). Typical power , . . . . . . . 6 Figure 3. 35mm, 456- Ball E-PBGA Package . . . . . . . . . . . . . . . . . . . . . . , and Ball Composition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Table 5 , . . . . . . . . . . . . . . . . . . 19 Table 6. Signals Listed by Ball Assignment . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . 50 Table 8. Non-Functional Ball Connections . . . . .


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PDF 440GR 440GR 667MHz 10/100Mbps 128-bit 16-bit 133MHz AMCC 460, DATE CODE embedded powerpc 460 ecc84 DDR SDRAM Controller paging policy epbga PPC440GR-3JB667CZ PPC440GR PPC440 EF40 E800
2007 - AMCC DATE CODE MARKING

Abstract: AMCC DATE CODE AMCC 460, DATE CODE AMCC PART MARKING ALPha r09 power line carrier communication PPC440EP amcc ppc440ep marking c08 transistor marking w04
Text: . AMCC Proprietary Technology: CMOS Cu-11, 0.13m. Package: 35mm, 456- ball standard plastic ball grid , . . . . . . . . . . . . . 5 Figure 3. 35mm, 456- Ball E-PBGA . . . . . . . . . . . . . . . . . . . . , . . . . . . . 17 Table 4. Signals Listed by Ball Assignment . . . . . . . . . . . . . . . . . . . . , PPC440EP PPC440EP-3pbfffCx 35mm, 456 ball , E-PBGA B 0x422218D3 0x2A950049 PPC440EP PPC440EP-3pbfffCx 35mm, 456 ball , E-PBGA C 0x422218D4 0x2A950049 Notes: 1. p = Module


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PDF 440EP 440EP 667MHz 10/100Mbps AMCC DATE CODE MARKING AMCC DATE CODE AMCC 460, DATE CODE AMCC PART MARKING ALPha r09 power line carrier communication PPC440EP amcc ppc440ep marking c08 transistor marking w04
2006 - ae02 marking

Abstract: AMCC DATE CODE MARKING AMCC 460, DATE CODE PowerPC 440EP PPC440EP MemData16
Text: I/O. Technology: CMOS Cu-11, 0.13 m. Package: 35mm, 456- ball standard and thermally enhanced plastic ball grid array (E-PBGA and TE-PBGA), with and without lead (RoHS compliant). Typical power (measured , . . . . . . . . . . . . . 6 Figure 3. 35mm, 456- Ball E-PBGA and TE-PBGA Packages . . . . . . . . . . , Table 4. Signals Listed by Ball Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , 35mm, 456 ball , PBGA 35mm, 456 ball , PBGA Revision Level B C PVR Value 0x422218D3 0x422218D4


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PDF 440EP 440EP 667MHz 128-bit 133MHz 66MHz. ae02 marking AMCC DATE CODE MARKING AMCC 460, DATE CODE PowerPC 440EP PPC440EP MemData16
2007 - PPC440EP

Abstract: embedded powerpc 460 appliedmicro lot code amcc ppc440ep PPC440EP start epbga 304 AMCC PART MARKING marking L06 amcc 440ep ab04 marking
Text: m. Package: 35mm, 456- ball standard plastic ball grid array (E-PBGA), with and without lead (RoHS , . . . . . . . . . . . . . . . . . . . 6 Figure 3. 35mm, 456- Ball E-PBGA . . . . . . . . . . . . . . , Moisture Sensitivity Level and Ball Composition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 6. Signals Listed by Ball , :) PPC440EP-3pbfffCx Package 35mm, 456 ball , E-PBGA Revision Level C PVR Value 0x422218D4 JTAG ID


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PDF PPC440EP PPC440EP 440EP 667MHz 128-bit 133MHz 66MHz. embedded powerpc 460 appliedmicro lot code amcc ppc440ep PPC440EP start epbga 304 AMCC PART MARKING marking L06 amcc 440ep ab04 marking
2005 - amcc part marking

Abstract: RISCwatch PPC440EP epbg marking c07 8pin epbga w3515 AMCC 460, DATE CODE embedded powerpc 460 ALPha r09
Text: Package: 35mm, 456- ball standard and thermally enhanced plastic ball grid array (E-PBGA and TEPBGA), with , . . . . . 5 Figure 3. 35mm, 456- Ball E-PBGA and TE_PBGA Packages . . . . . . . . . . . . . . . . . . , . Signals Listed by Ball Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , Part Number (see Notes:) PPC440EP-3pBfffCx Package 35mm, 456 ball , PBGA Revision Level B PVR , Preliminary Data Sheet Package Diagram 440EP ­ PPC440EP Embedded Processor Figure 3. 35mm, 456- Ball


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PDF 440EP 440EP 667MHz 128-bit 133MHz 16-bit amcc part marking RISCwatch PPC440EP epbg marking c07 8pin epbga w3515 AMCC 460, DATE CODE embedded powerpc 460 ALPha r09
2006 - UART NS16550

Abstract: PowerPC 440GR embedded powerpc 460
Text: . Technology: CMOS Cu-11, 0.13 m. Package: 35mm, 456- ball enhanced plastic ball grid array (E-PBGA). Typical , . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 3. 35mm, 456- Ball E-PBGA Package . . . , Sensitivity Level and Ball Composition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 6. Signals Listed by Ball Assignment . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Table 8. Non-Functional Ball


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PDF 440GR 440GR 667MHz 128-bit 133MHz 66MHz. 10/100Mbps UART NS16550 PowerPC 440GR embedded powerpc 460
Supplyframe Tracking Pixel