The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTM4615EV#PBF Linear Technology LTM4615 - Triple Output, Low Voltage DC/DC µModule (Power Module) Regulator; Package: LGA; Pins: 144; Temperature Range: -40°C to 85°C
LTM4615IV#PBF Linear Technology LTM4615 - Triple Output, Low Voltage DC/DC µModule (Power Module) Regulator; Package: LGA; Pins: 144; Temperature Range: -40°C to 85°C
LTM4619IV#PBF Linear Technology LTM4619 - Dual, 26VIN, 4A DC/DC µModule (Power Module) Regulator; Package: LGA; Pins: 144; Temperature Range: -40°C to 85°C
LTM4619EV#PBF Linear Technology LTM4619 - Dual, 26VIN, 4A DC/DC µModule (Power Module) Regulator; Package: LGA; Pins: 144; Temperature Range: -40°C to 85°C
LTM4628IY#PBF Linear Technology LTM4628 - Dual 8A or Single 16A DC/DC µModule (Power Module) Regulator; Package: BGA; Pins: 144; Temperature Range: -40°C to 85°C
LTM4628EY#PBF Linear Technology LTM4628 - Dual 8A or Single 16A DC/DC µModule (Power Module) Regulator; Package: BGA; Pins: 144; Temperature Range: -40°C to 85°C

144 QFP body size Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2010 - S1L50552

Abstract: tcon mini-lvds EPSON tcon tcon 17 epson S1X65263 SMART ASIC 197 S1L50062 S1K60000 s1k500 UXGA tcon
Text: department for the latest information Body Size (mm) VFBGA10H- 144 0.8 12 X 12Row Full 10 X 10 1.0 Ball Array Full WCSP Pin Count Body Size (mm) Thickness Max. WCSP , Mold Shape Lead Pitch (mm) Lead Type Body Size (mm) Thickness Max. Pin Count , (mm) Lead Type Body Size (mm) Thickness Max. 24 QFN4-24 0.5 STD 4 X4 1.0 , Mold Shape Ball Pitch (mm) Body Size (mm) Thickness Max. 256 PBGA1UE-256 1.0


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PDF S1L60173F00A000 S1L50552 tcon mini-lvds EPSON tcon tcon 17 epson S1X65263 SMART ASIC 197 S1L50062 S1K60000 s1k500 UXGA tcon
HG62G

Abstract: HG51BS "gate array" HG62G HG71G HG51B HG71C HG62G010 QFP-296 hg51 HG62S
Text: -208 QFP -256 QFP -296 L-BGA-352 () : Available signal pins O Underdevelopment A In planning Body size 28 mmn , = 2mm 969 A S IC s HG62G Series Package Lineup Body size > (mm) - 10x10 14x 14 80 100 136 144 , -80/100/120, QFP -64/80/100/136/168/208/256/296 PLCC-44/68/84, LQFP- 144 /176, · 8 bit DAC'3 -10 bit ADC*3 , , Standard load) QFP -100/136/168/208/256*2/296' 2, TQFP-100/120, LQFP- 144 /176 Shift scan method for user , planning Body size 28 mmG 28 mmG 28 mmD 32m m ° - 052 52 39 3 192 Lead pitch 0.65 mm 0.5 mm 0.4 mm 0.4


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PDF HG51BS HQ51CS HG51D CRAM03A) TQFP-80/100/120, QFP-64/80/100/136/168/208/256/296 PLCC-44/68/84, LQFP-144/176, HG62S 14x20 HG62G "gate array" HG62G HG71G HG51B HG71C HG62G010 QFP-296 hg51
1998 - IC51-0484-806

Abstract: IC51-1284-1788 IC51-0324-1498 IC51-1764-1505-5 IC51-1284-1433 IC51-1844-1148 ic51-0804-795 IC51-2564-1668-10 ic51-0444-825 IC51-1004-809
Text: 44 44 44 44 48 48 Body Size Pitch 5x5 0.5 7x7 0.8 7x7 0.8 10 x 10 0.8 10 x 10 0.8 , 0.8 0.5 0.5 0.7 0.65 0.65 Quad Flat Packages Body Size 12 x 12 14 x 14 14 x 14 10 X , 256 256 272 304 304 Body Size 14 x 20 14 x 20 22 x 22 20 x 20 14 x 14 28 x 28 28 x 28 , QFP , PQFP, TQFP (Clamshell) IC51 Series IC51- 064 4- 038 Insulation Resistance , 15.8 16.5 8.2 14.0 Size (Max) Notes 6.2 Floating Base 8.4 8.4 11.3 11.5 11.7 12.0


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PDF 10mA/20mV IC51-0324-805 IC51-0324-354 IC51-0324-1498 QFP11T044-001* IC51-0444-1195-3 IC51-0444-825 IC51-467-KS11247 IC51-0444-798 IC51-0444-615 IC51-0484-806 IC51-1284-1788 IC51-0324-1498 IC51-1764-1505-5 IC51-1284-1433 IC51-1844-1148 ic51-0804-795 IC51-2564-1668-10 ic51-0444-825 IC51-1004-809
2002 - fcBGA PACKAGE thermal resistance

Abstract: 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array BGA 256 PACKAGE thermal resistance ebga 304 MM1248 Sharp Packages SSOP TSOP 48 thermal resistance TSOP 48 stacked flash bonding
Text: Body Size (mm) 8×8×1.13 10×10×1.33 12×12×1.3 14×14×1.33 Ball Count 112 144 224 , -PIN 1.27mm : 8-PIN 16 8 6 7 CSOP (C-lead Small Outline Package) Body Size (mm) Pin Count , ) Body Size (mm) 8×18.4 10×18.4 12×18.4 12×12.4 14×18.4 12×12.4 Pin Count 40 , Quad Flat L-leaded Package) Body Size (mm) 14×14 16×16 20×20 24×24 28×28 7×7 , (Quad Flat-leaded Package) Body Size (mm) 28×28 32×32 Pin Count 256 296 Lead Pitch


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2009 - 9S12XEQ384

Abstract: 9s12xeq384 144 QFP 9S12XEP100 9S12XET256 9S12XEG128 9S12XEQ512 9S12XEP768 mc9s12 9S12XEG RAM memory 64 KB
Text: -bit, 8-ch. 24 50 112 LQFP 144 LQFP 80 QFP 9S12XEQ384 384 KB 24 KB 4 KB 1 1 Y 4 6 3 2 16-bit, 8-ch. 4-ch. 8-bit, 8-ch. 24 50 80 QFP 112 LQFP 144 , -ch. 8-bit, 8-ch. 24 50 80 QFP 112 LQFP 144 LQFP 9S12XEG128 128 KB 12 KB 2 KB 1 , existing advantages of 16-bit architecture, such as cost effectiveness, code size efficiency and , costs for automotive body and multiplexing applications. Debugger Interface Peripherals Memory


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PDF 16-bit S12XE S12XE 12-bit, 32-ch. 16-bit, 32-bit 9S12XEQ384 9s12xeq384 144 QFP 9S12XEP100 9S12XET256 9S12XEG128 9S12XEQ512 9S12XEP768 mc9s12 9S12XEG RAM memory 64 KB
2005 - 68HC908QT4A

Abstract: M68HC908LB8 HCS08 i2C code example assembly 68HC908QY4A MCS12X interface temperature sensor hcs12 HCS12 processor expert ADC code source 9S08GB60A 68HC908QT2A 9S08QG8
Text: 64-pin QFP (FU) FSICEKITAB32 50 64-pin QFP (FU) 40 C, V, M 64-pin QFP (FU), 52 , 15-CH, 8-bit 5.0 8.4 52 www.freescale.com FSICEKITASAZ 64-pin QFP (FU) Up to 52 , open-drain pins with 25 mA sink 44-pin QFP (FB), 42-pin SDIP (B) M68EM08BD48 www.freescale.com 32-pin LQFP (FA) FSICEKITEY 44-pin QFP (FB), 42-pin DIP (B) FSICEKITGPGT Dual 2-CH, IC , -pin LQFP (FA), 44-pin QFP (FB), 42-pin SDIP (B) 1K 2-CH, IC/OC or PWM 32 I2C, DDC12AB 6


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PDF SG1006Q42005 Q4/2005 SG1006Q42005 68HC908QT4A M68HC908LB8 HCS08 i2C code example assembly 68HC908QY4A MCS12X interface temperature sensor hcs12 HCS12 processor expert ADC code source 9S08GB60A 68HC908QT2A 9S08QG8
QFP-112

Abstract: LQFP144 qfp112 SH7144 Hitachi DSA00208 HD64F7145 HD64F7144F50 HD6437145F50 HD6437144F50 LQFP-144
Text: Name Package Code Body Size Pin Pitch HD64F7144/HD6437144 QFP -112 FP-112B 20.0 ×20.0 mm 0.65 mm HD64F7145/HD6437145 LQFP- 144 FP-144F 20.0 ×20.0 mm 0.5 mm Body Size Pin Pitch (Correct) Model Name Package HD64F7144F50*/HD6437144F50* * HD64F7145F50 /HD6437145F50 * Code QFP -112 FP-112B 20.0 ×20.0 mm 0.65 mm LQFP- 144 FP-144F 20.0 , (Package Code) * QFP -112 (FP-112B) * QFP -112 (FP-112B) * LQFP- 144 (FP-144F) Flash memory


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PDF TN-SH7-397A/E SH7144 QFP-112 LQFP144 qfp112 Hitachi DSA00208 HD64F7145 HD64F7144F50 HD6437145F50 HD6437144F50 LQFP-144
s1l50552

Abstract: encounter conformal equivalence check user guide circuit diagram of mini ips system RTC SL 5500 S1L50062 S1K-7 S1X65263 512M x 8 Bit NAND Flash Memory 1FW transistor BGA and QFP Package
Text: Shape Lead Pitch (mm) Lead Type Material Body Size (mm) Thickness Max. Pin Count , 256 304 QFP10 0.5 S1 Cu 40 X 40 4.5 324 (Under development) Body Size , Material Body Size (mm) QFN4 0.5 STD Cu 4 X4 1.0 32 QFN5 0.5 STD Cu , 23 2.7 VFBGA Thickness Max. 24 Body Size (mm) 484 Pin Count Ball Pitch (mm) 388 QFN Mold Shape (Under development) Body Size Thickness (mm) Max. Pin


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PDF S1L60843F00A000 ARM720T: s1l50552 encounter conformal equivalence check user guide circuit diagram of mini ips system RTC SL 5500 S1L50062 S1K-7 S1X65263 512M x 8 Bit NAND Flash Memory 1FW transistor BGA and QFP Package
2000 - xc912bc32

Abstract: XC68HC705B32 motorola ZP fu 68HC05 mmx16 xcm916 908gp32 MC68HC908jk3 MC68HC05SR3D MC68HC705P6A
Text: Body 160-Lead QFP FT 50 mil/1.27 mm Pitch 0.950 in x 0.950 in Body 144 -Lead LQFP 132-Lead PQFP 112-Lead LQFP TH PV 120-Lead QFP /LQFP PV FC .5 mm Pitch 16 mm x 16 mm Body .5 mm Pitch 20 mm x 20 mm Body 100-Lead LQFP 80-Lead QFP /LQFP PU FU/PU .5 mm Pitch , 64-Lead QFP 52-Lead QFP 44-Lead QFP FU PB FB .65 mm Pitch 10 mm x 10 mm Body .8 mm Pitch 10 mm x 10 mm Body .8 mm Pitch 14 mm x 14 mm Body 32-/48-Lead QFP FA .8 mm/.5 mm


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PDF SG186/D 68HC05, 68HC08, 68HC11 16-Bit 68HC12 68HC16 32-Bit 683XX 68HC908KX xc912bc32 XC68HC705B32 motorola ZP fu 68HC05 mmx16 xcm916 908gp32 MC68HC908jk3 MC68HC05SR3D MC68HC705P6A
2001 - land pattern for TSOP 2 86 PIN

Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin qfp 64 0.4 mm pitch land pattern oki naming ic packages TSOP 54 land pattern TSOP 66 pin Package thermal resistance land pattern tsop 66 ED730
Text: , consisting of 208 leads with a package body size of 40 mm x 40 mm and a normal bending lead pitch of 0.65 mm , package body height of 1.2 mm or less, package body size of 7 mm x 7 mm and a lead pitch of 0.80 mm , Dimensions (Typical Example) Package Name Reference Dimensions Code Example QFP Package body size (mm) 1010, 1420 QFJ Package body size (square or rectangle) S115, R400 ZIP , TSOP(1) Outermost size (mm) 1014, 0820 TSOP(2) Package body width 0300, 0400 SOJ


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1999 - xc68hc912b32

Abstract: XC68HC908AZ60 xcm916 XC68HC705b32 xc68hc08az0 XC68HC912B XC68HC705 xmc2001 XC68HC705JJ7 xcm916x1
Text: mil/1.27 mm Pitch 0.950 in x 0.950 in Body 160-Lead QFP 144 -Lead LQFP 132-Lead PQFP 120 , Options 132 PQFP(FC) 144 LQFP(PV) 132 PQFP(FC) 144 LQFP(PV) 120 QFP (TH) 160 QFP (FT) 160 QFP (FT) 160 QFP (FT , Frequency (MHz) 16, 20, 25 Temp. C,V,M Package Options 132 PQFP 144 LQFP 132 PQFP 144 LQFP 160 QFP Avail , Body .65 mm Pitch 28 mm x 28 mm Body .65 mm Pitch 20 mm x 20 mm Body 64-Lead QFP 52-Lead QFP 44-Lead QFP 32-Lead QFP FA .8 mm Pitch 7 mm x 7 mm Body FU .8 mm Pitch 14 mm x 14 mm Body


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PDF SG186/D 68HC05, 68HC08, 68HC11 16-Bit 68HC12 68HC16 32-Bit 683XX MMC2001, xc68hc912b32 XC68HC908AZ60 xcm916 XC68HC705b32 xc68hc08az0 XC68HC912B XC68HC705 xmc2001 XC68HC705JJ7 xcm916x1
1999 - XC68HC908AZ60

Abstract: xc68hc912b32 XC68HC908GP20 xcm916 XCM916X1 motorola 68hc05 lead selector guide Motorola MC68HC05B16, 52 pin 68HRC908JL3 xc68hc08az0 XMC2001
Text: /1.27 mm Pitch 0.750 in x 0.750 in Body 50 mil/1.27 mm Pitch 1.15 in x 1.15 in Body 160-Lead QFP FT 50 mil/1.27 mm Pitch 0.950 in x 0.950 in Body 144 -Lead LQFP 132-Lead PQFP PV FC , 0.950 in Body (Nominal, w.o. Bumpers) .65 mm Pitch 28 mm x 28 mm Body 64-Lead QFP 52-Lead QFP 44-Lead QFP FU PB FB .65 mm Pitch 10 mm x 10 mm Body .8 mm Pitch 10 mm x 10 mm Body .8 mm Pitch 14 mm x 14 mm Body 112-Lead LQFP TH PV 120-Lead QFP /LQFP 32-Lead QFP FA


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PDF SG186/D 68HC05, 68HC08, 68HC11 16-Bit 68HC12 68HC16 32-Bit 683XX 68HC908GP20. XC68HC908AZ60 xc68hc912b32 XC68HC908GP20 xcm916 XCM916X1 motorola 68hc05 lead selector guide Motorola MC68HC05B16, 52 pin 68HRC908JL3 xc68hc08az0 XMC2001
1999 - IC51-1844-1148

Abstract: IC51-128 IC51-1964-1952 IC201 ic51-0804-795 IC51-1284-1433 IC51-1284-1788 IC51-1014 IC51-0804-711 IC51-1764-1505-5
Text: 44 44 44 44 44 44 44 48 48 Body Size Pitch 5x5 0.5 7x7 0.8 7x7 0.8 10 x 10 0.8 10 x 10 0.8 10 x 10 , 100 100 100 Body Size 12 x 12 14 x 14 14 x 14 10 X 10 10 X 10 10 X 14 16 X 20 10 X 10 14 X 14 14 X 14 , 208 240 240 240 256 256 256 256 256 272 304 304 Body Size 14 x 20 14 x 20 22 x 22 20 x 20 14 x 14 28 x , QFP , PQFP, TQFP (Clamshell) IC51 Series IC51- 064 4- 038 Socket Series No. of Leads No. of , Size (Max) Notes 6.2 Floating Base 8.4 8.4 11.3 11.5 11.7 12.0 IC248-0444-001 12.9 15.8 16.5 8.2


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PDF 10mA/20mV IC51-0324-805 IC51-0324-354 IC51-0324-1498 QFP11T044-001* IC51-0444-1195-3 IC51-0444-825 IC51-467-KS11247 IC51-0444-798 IC51-0444-615 IC51-1844-1148 IC51-128 IC51-1964-1952 IC201 ic51-0804-795 IC51-1284-1433 IC51-1284-1788 IC51-1014 IC51-0804-711 IC51-1764-1505-5
2000 - xc68hc912b32

Abstract: MC68SEC811E2FN Motorola MC68HC05B16, 52 pin xc68hc08az0 XC68HC705B32 xcm916 HC705B OC-32 XCM916Y1 motorola ZP fu
Text: Body 160-Lead QFP FT 50 mil/1.27 mm Pitch 0.950 in x 0.950 in Body 144 -Lead LQFP 132 , -Lead QFP 52-Lead QFP 44-Lead QFP FU PB FB .65 mm Pitch 10 mm x 10 mm Body .8 mm Pitch 10 mm x 10 mm Body .8 mm Pitch 14 mm x 14 mm Body 112-Lead LQFP TH PV 120-Lead QFP /LQFP 32-Lead QFP FA .8 mm Pitch 7 mm x 7 mm Body 28-Lead SOIC 20-Lead SOIC 16-Lead SOIC , mm Body 50 mil/1.27 mm Pitch 10.35 mm x 7.5 mm Body 80-Lead QFP /LQFP PU FU/PU .5 mm


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PDF SG186/D 68HC05, 68HC08, 68HC11 16-Bit 68HC12 68HC16 32-Bit 683XX 68HC908JK1. xc68hc912b32 MC68SEC811E2FN Motorola MC68HC05B16, 52 pin xc68hc08az0 XC68HC705B32 xcm916 HC705B OC-32 XCM916Y1 motorola ZP fu
oki naming format

Abstract: DIP42-P-600-2 HQFP208-P-4040-0 R400 S115 0.65mm pitch BGA PLCC DIMENTIONS oki marking 20 soj
Text: of 208 leads with a package body size of 40mm x 40mm and a normal bending lead pitch of 0.65mm . 2 , DIP PGA SOP TSOPI TSOPII SOJ SSOP BGA SHP Note: Code example Package body size (mm) Package body size (square or rectangle) Maximum package mounting height Spacing between terminal rows Matrix size (cavity up or down) Inter-mount pad center distance Outermost size (mm) Package body width Package body width Package body width Package body / size (mm) Package body / size (mm) 1010, 1420 S115


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PDF ED-7401-2 oki naming format DIP42-P-600-2 HQFP208-P-4040-0 R400 S115 0.65mm pitch BGA PLCC DIMENTIONS oki marking 20 soj
35 x 35 PBGA, 580 100 balls

Abstract: of BGA Staggered Pins package BGA Ball Crack without underfill BGA PACKAGE thermal resistance 60um of BGA Staggered pins
Text: 100 0 7 x 7 10 x10 14 x 22 23 x 23 27 x 27 35 x 35 45 x 45 (mm) 40 x 40 Body size , classified into four types as shown in Table 1. Table 2 lists the available packages. Type Body Size , flexibility for designing Excellent electrical characteristics Body Size (mm) Pin Count Size of , system (system-ona-chip) emerge · Demand for combining multiple devices Pin Count Body Size (mm , record-breaking size reduction each time a new product is released. To kindle consumers' interest


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SOP48

Abstract: SOP38 CF RM sot89 14X14X2 45x45 mm bga 14X14X1 epson QFP 216 14X20X2 14x14x2.7 QFP13
Text: * : Under development Body size (mm) 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7 7X 7X1.4 14X20X2.7 , Count code 100 TQFP15 128 TQFP15 Body size (mm) 14X14X1 14X14X1 Lead type STD STD Plastic HQFP Pin , HQFP8 240 HQFP23* HQFP16* 304 HQFP10* Lead > Body size (tm ) type 10X10X1.4 STD 14X14X1.4 STD 14X20X2.7 , 32X32X3.4 S1 32X32X3.8 S1 40X40X3.8 S1 * : Underdevelopment Body size (mm) 300 300 300 300 300 400 600 600 , Shrink DIP Body size (mm) 400 750 Lead type - - 160 176 184 Plast c Skinn y DIP Pin Package


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PDF QFP12 QFP13 QFP15 QFP14 12X12X1 14X20X2 14X14X1 SOP48 SOP38 CF RM sot89 14X14X2 45x45 mm bga epson QFP 216 14x14x2.7
d431000agw

Abstract: D75304GF AIC6360Q Actel a1280 intel 80386dx HG62G027 AIC-6360Q CL-SH260 L1A9349 aic-6360
Text: c8 nS Minimum Data Set-Up and Data Hold Body Typical -Time EACH No. Fig. Leads Size * Pitch* c100 , . Stock Mfr.’s No. of Body Lead Nom. Critical Typical Fig. EACH No. Type Leads Size * Pitch* Height* Dim , 0.800 3.4 30.3 275.00 body chips and smaller size PLCC. Upper: 0.025" square pins, gold plated phosphor , AM29040, IDT 49C465 285.00 Stock Mfr.’s No. of Lower Body Top Typical 885-6551 6151 3 144 20 ¥20 0.500 , P o m o n a Electronics IC Test Clips Logic Scope Probe JEDEC PQFP Test Clips Pomona’s JEDEC QFP


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PDF ABT16244, ACT16245 FCT16223, FCT162511 d431000agw D75304GF AIC6360Q Actel a1280 intel 80386dx HG62G027 AIC-6360Q CL-SH260 L1A9349 aic-6360
2004 - Not Available

Abstract: No abstract text available
Text: Part No. 96-144M65 - QFP to PGA Adapter for 144 Position, .0256 [.65] Pitch FEATURES: · Convert surface mount QFP packages to a 15 x 15 PGA footprint. · Reduce costs by using less expensive QFP packages , factory for panelized form or for mounting of consigned chips. SPECIFICATIONS: · Adapter body is FR-4 with , Operating temperature=221°F [105°C]. MOUNTING CONSIDERATIONS: · Suggested PCB hole size =.028 ± .003 [.71 ± , form when ordering Specify Part Number 144 -PGM15048-30 for wire wrap PGA socket ALL DIMENSIONS


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PDF 96-144M65 -or96-144M65-P 144-PGM15048-30
2006 - 144 QFP body size

Abstract: No abstract text available
Text: Part No. 96-144M65 - QFP to PGA Adapter for 144 Position, .0256 [.65] Pitch FEATURES: · Convert surface mount QFP packages to a 15 x 15 PGA footprint. · Reduce costs by using less expensive QFP packages , factory for panelized form or for mounting of consigned chips. SPECIFICATIONS: · Adapter body is FR-4 with , Operating temperature=221°F [105°C]. MOUNTING CONSIDERATIONS: · Suggested PCB hole size =.028 ± .003 [.71 ± , form when ordering Specify Part Number 144 -PGM15048-30 for wire wrap PGA socket ALL DIMENSIONS


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PDF 96-144M65 -or96-144M65-P 144-PGM15048-30 144 QFP body size
2001 - xcm916

Abstract: motorola mc68 908 97 mfu DIODE xc912dg128 MC68S711E 908az60 MC908AS60A XC68HC705B32 MC912 MCM916
Text: SDIP (B) 52 PLCC (FN) 64 QFP (FU) 705B16 705B32 Now SCI has synchronous master SPI-like capability MC68HC05B6/D C, V 56 SDIP (B) 52 PLCC (FN) 64 QFP (FU) 705B16 705B32 Now SCI , (FN) 64 QFP (FU) 705B16 705B32 Now SCI has synchronous master SPI-like capability , QFP (FU) 52 CLCC (FS) - Now Use 705B32 as OTP for MC68HC05B6/D SDIP. SCI has synchronous , See comment 8-CH 8-Bit 2-CH 8-Bit Y 3.3, 5.0 2.1 PLCC/ QFP : C, V, M SOIC


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PDF DSP56F807VF80 SPSSG1006/D MC68HC08Aotorola xcm916 motorola mc68 908 97 mfu DIODE xc912dg128 MC68S711E 908az60 MC908AS60A XC68HC705B32 MC912 MCM916
2011 - daewon tray

Abstract: Daewon T0809050 strapack s-669 daewon tray 1F1-1717-AXX DAEWON tray 48 1F1-1717-AXX DAEWON FBGA tray bga KS-88085 240 PIN QFP ALTERA DIMENSION
Text: Supplier Package Type Package Code Lead Count Body Size (mm) 225 27  27 225 27 , ) (Note 1) Primary Supplier Package Type Package Code Lead Count Body Size (mm) Remark , Package Type Package Code Lead Count Body Size (mm) 484 27  27 780 33  33 , Count Body Size (mm) Remark 32 (TQFP only) 77 — 44 10  10 64 (EQFP , Code Lead Count Body Size (mm) Remark 68 11  11 — 84 11x  1 100


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PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 strapack s-669 daewon tray 1F1-1717-AXX DAEWON tray 48 1F1-1717-AXX DAEWON FBGA tray bga KS-88085 240 PIN QFP ALTERA DIMENSION
2003 - Not Available

Abstract: No abstract text available
Text: Part No. 96-144M65 - QFP to PGA Adapter for 144 Position, .0256 [.65] Pitch FEATURES: · Convert surface mount QFP packages to a 15 x 15 PGA footprint. · Reduce costs by using less expensive QFP packages , factory for panelized form or for mounting of consigned chips. SPECIFICATIONS: · Adapter body is FR-4 with , Operating temperature=221°F [105°C]. MOUNTING CONSIDERATIONS: · Suggested PCB hole size =.028 ± .003 [.71 ± , form when ordering Specify Part Number 144 -PGM15048-30 for wire wrap PGA socket ALL DIMENSIONS


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PDF 96-144M65 -or96-144M65-P 144-PGM15048-30
2005 - MC9S12XDT256

Abstract: HC08KX 9s12a256 MCF8013 MCF8014 MC9S12XD* 80 pin package DSP56F803BU80E xc912dg128 MC68376 bdm programming XC68HC08
Text: 8/8/up to 39 144 256 KB Flash. 256-ball MAPBGA 160-pin QFP 196-ball MAPBGA 64K 142 , C, V, M 64-pin QFP (FU) Y 5.0 8.0 C, V, M 52-Pin PLCC (FN) 64-Pin QFP (FU) n/a , (B) 44-pin QFP (FB) 48-pin LQFP (FA) n/a Available 32-kHz PLL, RC oscillator option , -bit 42-pin SDIP (B) 44-pin QFP (FB) Y 5.0 6.0 I 908BD48 42-pin SDIP (B) 44-pin QFP (FB , OTP or Flash Equiv. 8.0 C, V, M 32-pin LQFP (FA) n/a C 40-pin DIP (P) 44-pin QFP


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PDF SG1006Q32005 Q3/2005 SG1006Q32005 MC9S12XDT256 HC08KX 9s12a256 MCF8013 MCF8014 MC9S12XD* 80 pin package DSP56F803BU80E xc912dg128 MC68376 bdm programming XC68HC08
144 QFP body size

Abstract: ASTM-B16-85 96-144M65
Text: Part No. 96-144M65 - QFP to PGA Adapter for 144 Position, .0256 [.65] Pitch FEATURES: · Convert surface mount QFP packages to a 15 x 15 PGA footprint. · Reduce costs by using less expensive QFP , Consult factory for panelized form or for mounting of consigned chips. SPECIFICATIONS: · Adapter body , temperature=221°F [105°C]. MOUNTING CONSIDERATIONS: · Suggested PCB hole size =.028 ± .003 [.71 ± .08] dia , otherwise specified X-RAY VIEW TOP SIDE QFP PAD ASSIGNMENT Note: Aries specializes in custom design


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PDF 96-144M65 96-144M65 -or96-144M65-P 144-PGM15048-30 144 QFP body size ASTM-B16-85
Supplyframe Tracking Pixel