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Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LT1397CDE#TRPBF Linear Technology LT1397 - Quad 400MHz Current Feedback Amplifier; Package: DFN; Pins: 14; Temperature Range: 0°C to 70°C
LT1397CGN#PBF Linear Technology LT1397 - Quad 400MHz Current Feedback Amplifier; Package: SSOP; Pins: 16; Temperature Range: 0°C to 70°C
LT1397CGN#TRPBF Linear Technology LT1397 - Quad 400MHz Current Feedback Amplifier; Package: SSOP; Pins: 16; Temperature Range: 0°C to 70°C
LT1397CS#PBF Linear Technology LT1397 - Quad 400MHz Current Feedback Amplifier; Package: SO; Pins: 14; Temperature Range: 0°C to 70°C
LT1397CDE Linear Technology IC 1 CHANNEL, VIDEO AMPLIFIER, PDSO14, 4 X 3 MM, PLASTIC, MO-229, DFN-14, Audio/Video Amplifier
LT1397CDE#TR Linear Technology IC 1 CHANNEL, VIDEO AMPLIFIER, PDSO14, 4 X 3 MM, PLASTIC, MO-229, DFN-14, Audio/Video Amplifier

1397-CBGA Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2009 - to48c

Abstract: 1397-CBGA stm-64 to stm-1
Text: Equipment Test Equipment · Ordering Information Part PEB2756AE PEB2757AE Description 1397-CBGA 1397-CBGA


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PDF OC-192/ STM-64 PEB2756AE/57AE STS-192/STM-64 STS-48/STM-16 PEB2756AE PEB2757AE 1397-CBGA FLY1009 to48c stm-64 to stm-1
AD 685

Abstract: No abstract text available
Text: a 452-Lead Ceramic Ball Grid Array [ CBGA ] (BG-452) Dimensions shown in inches and (millimeters) 1.862 (47.295) SQ 1.838 (46.685) 1.795 (45.593) SQ 1.785 (45.339) SOLID COPPER BALL SOLDER COATED 4 PLACES 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 TOP VIEW AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A PIN 1 0.030


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PDF 452-Lead BG-452) 06sions AD 685
4 to 64 demux

Abstract: SFI-4.2 Mux/DeMux GR-253 SFI4 SFI4.2 STM-64 PEB2756AE GR-253-CORE sfi4.1
Text: PEB2756AE 1397 CBGA -40°C to +85°C Exar Corporation 48720 Kato Road, Fremont CA, 94538 · (510


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PDF PEB2756AE STS-192/STM-64 PEB2756AE STS-192/ STM-64 GR-253-CORE 4 to 64 demux SFI-4.2 Mux/DeMux GR-253 SFI4 SFI4.2 GR-253-CORE sfi4.1
XR2206 application notes

Abstract: pin diagram of ic xr2206 IC XR2206 XR2206 XR2206 pin details for function generator XR2206 monolithic function generator xr2206 circuit peb1756ae fsk modulation and demodulation using Xr2206 MXP2
Text: Package(s) 2xOC192 SONET/SDH SFI-4.1 2.5G TFI 3.3V/1.2V CBGA -1397 TethysTM 2x10G , -4.1 Serial 2.5G/ 622M/155M 2.5G TFI 3.3V/1.2V CBGA -1397 PEB2756AE Tethys IITM 4x10G SONET/SDH Framer and Pointer Processor 4xOC192 SONET/SDH SFI-4.1 SFI-4.2 2.5G TFI 3.3V/1.2V CBGA , 16xOC48/12/3 2.5G TFI 3.3V/1.2V CBGA -1397 Part Number Description PEB1756AE TethysTM


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PDF acqui010 350MHz XRT8020 XRT85L61 QFN-16 TSSOP-28 XR2206 application notes pin diagram of ic xr2206 IC XR2206 XR2206 XR2206 pin details for function generator XR2206 monolithic function generator xr2206 circuit peb1756ae fsk modulation and demodulation using Xr2206 MXP2
2004 - 4x2 mux

Abstract: GR-253 PEB1756E STM-16 STS-48 to48c
Text: OPERATING TEMPERATURE RANGE PEB1756E 1397 CBGA -40°C to +85°C PEB1756E BLOCK DIAGRAM #1


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PDF PEB1756E STS-48/STM-16 STS-12/STM-4 STS-48/ STM-16, PEB1756E STS-48 4x2 mux GR-253 STM-16 STS-48 to48c
PEB1757AE

Abstract: GR-253-CORE Exar cross SDH ADM sfi4.1 STM64 multiplex PEB1757E STM-16
Text: OPERATING TEMPERATURE RANGE PEB1757E 1397 CBGA -40°C to +85°C Exar Corporation 48720 Kato Road


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PDF PEB1757E STS-192/STM-64, STS-48/STM-16, PEB1757E STS-192/STM64 STS-48/STM-16 STS-12/ STS-192/STM-64 STS48/ PEB1757AE GR-253-CORE Exar cross SDH ADM sfi4.1 STM64 multiplex STM-16
GR-253

Abstract: PEB1757E GR-253-CORE STS-48 32 line demux T1X13
Text: NUMBER PACKAGE OPERATING TEMPERATURE RANGE PEB1757E 1397 CBGA -40°C to +85°C PEB1757E


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PDF PEB1757E STS-192/STM-64 STS-192/STMreliminary GR-253-CORE PEB1757E GR-253 STS-48 32 line demux T1X13
sfi4.1

Abstract: GR-253 Exar cross PEB1756E GR-253-CORE t 1377 STM-64 SDH ADM PEB1757E STS-192
Text: PACKAGE OPERATING TEMPERATURE RANGE PEB1756E 1397 CBGA -40°C to +85°C FIGURE 1. PEB1757E


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PDF PEB1756E PEB1756E STS-192/STM-64 STS-192/STM-64 a/STM-16 105-2000-193R2 3/93-005RI GR-253-CORE sfi4.1 GR-253 Exar cross t 1377 STM-64 SDH ADM PEB1757E STS-192
SFI4

Abstract: PEB2757AE STM-16 STM-64
Text: PACKAGE OPERATING TEMPERATURE RANGE PEB2757AE 1397 CBGA -40°C to +85°C Exar Corporation


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PDF PEB2757AE STS-192/STM-64, STS-48/STM-16, STS-48/STM-16 PEB2757AE STS-192/STM64 STS-48/STM-16 STS-12/STM-4 STS-192/ SFI4 STM-16 STM-64
2005 - Not Available

Abstract: No abstract text available
Text: NUMBER PACKAGE OPERATING TEMPERATURE RANGE PEB1756E 1397 CBGA -40°C to +85°C FIGURE 1


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PDF PEB1756E PEB1756E STS-192/STM-64 STS-192/STM-64 105-2000-193R2 3/93-005RI GR-253-CORE
2003 - PEB1757E

Abstract: GR-253 GR-253-CORE STS-192 PRBS-32
Text: -1397 CBGA Complies with GR-253, GR-1377, ITU-T G.707, and ANSI T1.105 Provides a standard 5 signal IEEE


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PDF STS-192/STM-64 STS-192/STM-64 PEB1757E GR-253 GR-253-CORE STS-192 PRBS-32
2003 - 2.5G DWDm

Abstract: TO-48C 2.5G GR-253 PEB1756E STM-16 STS-48 to48c
Text: P-FCHBGA-1397 CBGA Specifications OIF TFI-5 Motorola 32-bit synchronous microprocessor


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PDF STS-48/STM-16 STS-12/STM-4 STS-48/ STM-16, 2.5G DWDm TO-48C 2.5G GR-253 PEB1756E STM-16 STS-48 to48c
2004 - 62Sn36Pb2Ag

Abstract: 90Pb10Sn CBGA 255 motorola 480 PBGA pad recommendations Solder Balls 63Sn37Pb cte table epoxy substrate motorola pbga 302
Text: related chips that are currently packaged predominately in ceramic BGA ( CBGA ). This application note is designed to assist both current CBGA and Þrst time BGA users to reliably deploy MotorolaÕs FC PBGA , Package Information The FC PBGA has a similar general conÞguration to the CBGA , but there are several , 62Sn36Pb2Ag solder balls that melt in the solder reßow process, while the CBGA uses 90Pb10Sn solder balls , is no eutectic solder paste volume requirement compared with the CBGA package. For successful FC


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PDF AN1850/D 62Sn36Pb2Ag 90Pb10Sn CBGA 255 motorola 480 PBGA pad recommendations Solder Balls 63Sn37Pb cte table epoxy substrate motorola pbga 302
2002 - IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies

Abstract: senju solder bar Coffin-Manson Equation senju solder paste vps BGA reflow guide BGA PROFILING Senju metal solder paste 06107 entek Cu-56 Cu-56
Text: CBGA Surface Mount Assembly and Rework User's Guide May 23, 2002 ® Copyright , ://www.chips.ibm.com CBGA Surface Mount Assembly and Rework User's Guide May 23, 2002 . CBGA Surface Mount , . 2.4.2.1 1.27 mm Pitch CBGA . 2.4.2.2 1.00 mm Pitch CBGA , . 2.12.2.3 1.27 mm Pitch CBGA


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PDF
2007 - solder paste alpha WS609

Abstract: WS609 Alpha WS609 solder entek Cu-56 Alpha WS609 epoxy adhesive paste cte table ceramic rework solder paste WS609 cte table flip chip substrate Cu-56
Text: Ceramic Ball Grid Array ( CBGA ) is a custom platform supporting a wide variety of performance applications , interconnection to a printed circuit board. CBGA packages are qualified to JEDEC level 3 moisture sensitivity. The CBGA package consists of (see Figure 1): · Multilayer HTCC ceramic, thickness ranging from 1 to , ) DIA. 2. Printed Circuit Design The CBGA packages are qualified for typical printed circuit boards , HOLE 0.178 mm (0.007 INCH) DIA. COPPER PAD 0.61 mm (0.024 INCH) DIA. Figure 1. CBGA


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PDF 5988-6603EN solder paste alpha WS609 WS609 Alpha WS609 solder entek Cu-56 Alpha WS609 epoxy adhesive paste cte table ceramic rework solder paste WS609 cte table flip chip substrate Cu-56
1998 - Coffin-Manson Equation

Abstract: Modified Coffin-Manson Equation Calculations manson solder joint reliability 10-HOUR solder joint predicting solder transistor day CBGA
Text: design of the board that the CBGA is assembled to affects the solder joint reliability as well as , 1000.00 CBGA Size, Thickness 100.00 21 mm, 1.0 mm 25 mm, 1.0 mm 25 mm, 1.2 mm 10.00 35 , Rate Prediction Lifetime in Years 1000.00 CBGA Size, Thickness 100.00 21 mm, 1.0 mm 25 , Thick CBGA Solder Joint Reliability Time to 0.5% Packaging Failure (Years) Norris-Landzberg Predictions from Accelerated Thermal Cycling Data 1000 21mm CBGA 200 work day/yr 21mm CBGA 365 work day/yr


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PDF 21x25 21x25mm Coffin-Manson Equation Modified Coffin-Manson Equation Calculations manson solder joint reliability 10-HOUR solder joint predicting solder transistor day CBGA
1999 - S1998

Abstract: Coffin-Manson Equation CBGA manson N100 110C 100C IBM supports ccga CBGA 304 motorola ccga motorola
Text: CBGA FATIGUE LIFE IMPROVEMENT Marie S. Cole, Gregory B. Martin, Peter J. Brofman and Lewis S , processes. Since 1988, she has led many of the development activities for CBGA and CCGA processes and , of CBGA and CCGA packaging. Environmentally sensitive or `green' computer systems are driving , grid array ( CBGA ) package is used today in a wide range of applications, due to its many advantages , techniques; excellent thermal and electrical performance; and high interconnection capability. Today's CBGA


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97Pb

Abstract: 90Pb 10Sn solder paste BGA OUTLINE DRAWING ceramic rework pcb warpage in ipc standard fine BGA thermal profile bga rework BGA Solder Ball collapse BGA PROFILING CBGA motorola
Text: Outline for Discussion · · · · · · Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability 2 Why BGA , 150 DPPMj* 100 IBM Data on CBGA COMPAQ Data on PBGA (Collapsing Ball) .5 mm Pitch QFP .65 mm Pitch QFP 85 80 1.27 mm Pitch CBGA 85 60 50 20 < 0.5 (COMPAQ ) 1991 30 , 12 5 1994 1 CBGA Construction 97Pb/3Sn C4* Joint Silicon Die Alumina (Al2O3


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PDF 25x25x1 97Pb 90Pb 10Sn solder paste BGA OUTLINE DRAWING ceramic rework pcb warpage in ipc standard fine BGA thermal profile bga rework BGA Solder Ball collapse BGA PROFILING CBGA motorola
2004 - 1P137

Abstract: 0H1075 45db041 3G0334 3H0348 1H0149 0G0035 45DB041B 1E0120 3S03
Text: 300 300 298 190 600 298 300 160 CBGA TSOP CBGA CBGA CBGA CBGA CBGA SOIC TSOP TSOP SOIC TSOP SOIC PLCC SOIC TSOP SOIC TSOP TSOP SOIC SOIC SOIC SOIC SOIC SOIC TSOP CBGA , 3G0334 3R0337 3H0348 14 CBGA 8 SOIC 28 TSOP 28 SOIC 28 TSOP 28 TSOP 28 TSOP 32 PLCC 8 SOIC 28 TSOP 28 TSOP 28 TSOP 8 SOIC 8 SOIC 8 SOIC 8 SOIC 28 SOIC 8 SOIC 28 TSOP 14 CBGA 8 CASON , -45DB041B PLASTIC PACKAGE EXTENDED TEMPERATURE CYCLING -55°C to +125°C CBGA -65°C to +150°C PLCC/TSOP/SOIC/PDIP


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PDF AT-45DB041B AT-45DB041B 0G2808AD 0H1020 0H1075 0H1098 0H3433 0J2701 0J4626 0J4635B 1P137 0H1075 45db041 3G0334 3H0348 1H0149 0G0035 45DB041B 1E0120 3S03
2000 - CBGA 255 motorola

Abstract: 90Pb10Sn cte table epoxy BGA cte pbga package weight cte table epoxy substrate AN-1850 360-Pin
Text: related chips that are currently packaged predominately in ceramic BGA ( CBGA ). This application note is designed to assist both current CBGA and Þrst time BGA users to reliably deploy MotorolaÕs FC PBGA , Package Information The FC PBGA has a similar general conÞguration to the CBGA , but there are several , 62Sn36Pb2Ag solder balls that melt in the solder reßow process, while the CBGA uses 90Pb10Sn solder balls , is no eutectic solder paste volume requirement compared with the CBGA package. For successful FC


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PDF AN1850/D CBGA 255 motorola 90Pb10Sn cte table epoxy BGA cte pbga package weight cte table epoxy substrate AN-1850 360-Pin
1996 - Coffin-Manson Equation

Abstract: Modified Coffin-Manson Equation Calculations mpc 1414 tce 1994 MPC105 thermal analysis on pcb IPC-SM-785
Text: , solder joint fatigue life was calculated for the 21mm ceramic ball-grid-array ( CBGA ), the package for , Controller package, data from both the 21mm and 25mm CBGA , were used for the estimate . At an average on-off T of 20°C, the 21mm CBGA and the 21 x 25mm CBGA have an estimated fatigue life of over 25 years and , in a 21mm array (C4/ CBGA ) (Figure 1). The , packaged in a 21 by 25 mm (16 x 19 ball matrix) C4/ CBGA . Chip w/C4 Encapsulant Ceramic Substrate


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PDF 603TM 604TM MPC105 Coffin-Manson Equation Modified Coffin-Manson Equation Calculations mpc 1414 tce 1994 thermal analysis on pcb IPC-SM-785
2007 - hcte

Abstract: AN3300 MPC7410 MPC7410CE MPC7410EC AN3442 AN2920 freescale LTCC
Text: product family. The original Ceramic Ball Grid Array ( CBGA ) package is scheduled for end-of-life (EOL , . . . . . . . . . . . . Differences Between CBGA and HCTE Packages . . . Package Compatibility . . , -2008; not recommended for new designs. C5 spheres contain lead (Pb). HX 2.1 CBGA : Ceramic Ball , have C5 spheres attached. Package Options for Migrating from the CBGA Package The recommended replacement part for the RX ( CBGA ) is the HX (HCTE_CBGA) which has the same high lead (Pb) spheres as found


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PDF AN3442 MPC7410 mid-2008; hcte AN3300 MPC7410CE MPC7410EC AN3442 AN2920 freescale LTCC
AN1005

Abstract: paste profile C-200 IPC-A-610C X-RAY INSPECTION
Text: Land Pad Design The shape of the CBGA land pads on the PCB should be round. The diameters of the PCB land pads are recommended to be equal to the nominal CBGA solder ball diameter as provided on the product data sheets, see Figure 3. Tolerance for the CBGA land pad diameter is + 0.001 inches (+0.025mm). , respectively. Clea rONE CBGA Sn/Ag/Cu Solder Fille t Copper Solde r Ball PCB Land Pad with HASL finish Solder Mask Printed Circ uit Board (PCB) Figure 3. CBGA Solder Ball and PCB Land Pads are


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PDF AN1005 AN1005 paste profile C-200 IPC-A-610C X-RAY INSPECTION
2005 - Teradyne J971 Digital Test system

Abstract: teradyne J971 CQFP68 J973 teradyne a585 5341B PC603R CI 7447 ATMEL ARINC 7457
Text: Core frequency up to 300 MHz product 255-ball CBGA , CI-CGA and Hi-TCE 240-pin CERQUAD PC745/755 Core frequency up to 400 MHz L2-cache support up to 1 MB 255-ball CBGA , Hi-TCE (74x) 360-ball CBGA , CI-CGA, Hi-TCE (75x) PC7410/7447/7447A/7457/7448 PC106/107 Core frequency up to 1.5 GHz , bus-support up to 100 MHz PCI bus-support up to 66 MHz 303-ball CBGA , CI-CGA (106) 503-ball FC-PBGA,Hi-TCE CBGA (107) On-Chip L2 up to 1MB (744x/745x) L3-cache support up to 2MB (7457) PC108 360


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PDF 5341B-HIREL-01/05 Teradyne J971 Digital Test system teradyne J971 CQFP68 J973 teradyne a585 5341B PC603R CI 7447 ATMEL ARINC 7457
ceramic rework

Abstract: BGA Solder Ball collapse CCGA 304-pin ltcc 90Pb 10Sn solder paste 360-Pin freescale BGA PROFILING MPC106 spray nozzles BGA and QFP Package ibm
Text: Outline for Discussion · · · · · · Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability Freescale , Assembly Yields (As Reported by IBM and Compaq) 200 150 DPPMj* 100 IBM Data on CBGA COMPAQ Data on PBGA (Collapsing Ball) .5 mm Pitch QFP .65 mm Pitch QFP 85 80 1.27 mm Pitch CBGA , CBGA Construction 97Pb/3Sn C4* Joint Silicon Die Alumina (Al2O3) Ceramic Substrate Epoxy


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PDF 25x25x1 ceramic rework BGA Solder Ball collapse CCGA 304-pin ltcc 90Pb 10Sn solder paste 360-Pin freescale BGA PROFILING MPC106 spray nozzles BGA and QFP Package ibm
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