The Datasheet Archive

Top Results (3)

Part ECAD Model Manufacturer Description Datasheet Download Buy Part
8103610SA 8103610SA ECAD Model Texas Instruments Standard High-Speed PAL Circuits 20-CFP -55 to 125
ADM810SARTZ-REEL7 ADM810SARTZ-REEL7 ECAD Model Analog Devices Microprocessor Supervisory Circuit in 3-Lead SOT-23 & SC70, Active-High Push-Pull Output
ISL71091SEHX10SAMPLE ISL71091SEHX10SAMPLE ECAD Model Renesas Electronics Corporation 10V Radiation Hardened Ultra Low Noise, Precision Voltage Reference, , /Die Waffle Pack

10sA/cm2 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
CDIP2-T14

Abstract: 5962F9670301VCC 5962F9670301VXC ACS03HMSR ACS03MS CDFP3-F14 y2c smd SMD 1Ft Y2612
Text: Thickness: 8kA±1kA WORST CASE CURRENT DENSITY: <2.0 x 10sA/ cm2 BOND PAD SIZE: 110ftm x 110|xm 4.3 mils x


OCR Scan
PDF ACS03MS MIL-PRF-38535 1730mm 2010mm 125kA 125kA 10sA/cm2 110ftm CDIP2-T14 5962F9670301VCC 5962F9670301VXC ACS03HMSR CDFP3-F14 y2c smd SMD 1Ft Y2612
Not Available

Abstract: No abstract text available
Text: : Type: Si02 Thickness: 8kA ±1 kA WORST CASE CURRENT DENSITY: <2.0 x 10sA/ cm2 BOND PAD SIZE: 11Ofim


OCR Scan
PDF ACS03MS MIL-PRF-38535 MIL-STD-1835 CDIP2-T14, 00t4flTS 1730mm 125kA 10sA/cm2
Not Available

Abstract: No abstract text available
Text: / cm2 Metallization Mask Layout DG401/883 S1 02 S2 CMOS ANALOG SWITCHES D1 IN2 , ‚±1k GLASSIVATION: Type: Nitride Thickness: 8k ± 1k WORST CASE CURRENT DENSITY: 1.5 x 105A/ cm2


OCR Scan
PDF DG401/883, DG403/883 DG405/883 DG403/883 DG405/883 150ns) DG401/403/405/883 5V50nm 1720nm
2004 - DFA 10S

Abstract: DFA 08S DFA08S MARKING CODE N df 04 bridge 10SA
Text: No file text available


Original
PDF DF005SA DF10SA E54214 J-STD-020C 50mVp-p 22-Nov-04 DFA 10S DFA 08S DFA08S MARKING CODE N df 04 bridge 10SA
Not Available

Abstract: No abstract text available
Text: No file text available


Original
PDF MKJ1A7W7-10SA MKJ1A7W7-10SA MIL-STD-1344
H11-0548-5

Abstract: H11-0549-5
Text: Nitride Thickness: 3.5kA ± 1kA Silox Thickness: 12kA ± 2kA WORST CASE CURRENT DENSITY: 1.4 x 10sA/ cm2 , : 1.4 x 10sA/ cm2 TRANSISTOR COUNT: HI-548: 253 HI-549: 253 PROCESS: CMOS-OI SUBSTRATE POTENTlALf: -V


OCR Scan
PDF HI-546, HI-547 HIS48, HIS49 HI-547, HI-548 HI-549 10sA/cm2 HI-548: H11-0548-5 H11-0549-5
Not Available

Abstract: No abstract text available
Text: No file text available


Original
PDF MKJ1A6W7-10SA MKJ1A6W7-10SA MIL-STD-1344
ACME THREAD

Abstract: No abstract text available
Text: No file text available


Original
PDF MKJ1A7F7-10SA MKJ1A7F7-10SA MIL-STD-1344 ACME THREAD
2005 - DFA 08S

Abstract: DFA08S DFA 10S DFA+08S
Text: No file text available


Original
PDF DF005SA DF10SA E54214 J-STD-020C UL-94V-0 J-STD-002B JESD22-B102D 08-Apr-05 DFA 08S DFA08S DFA 10S DFA+08S
Not Available

Abstract: No abstract text available
Text: No file text available


Original
PDF MKJ1A6F7-10SA MKJ1A6F7-10SA MIL-STD-1344
2005 - DFA 10S

Abstract: DFA10S DFA 08S DF005SA
Text: No file text available


Original
PDF DF005SA DF10SA E54214 J-STD-020C UL-94V-0 J-STD-002B JESD22-B102D 12-Jul-05 DFA 10S DFA10S DFA 08S
Not Available

Abstract: No abstract text available
Text: No file text available


Original
PDF MKJ4A6W7-10SA MKJ4A6W7-10SA MIL-STD-1344
2005 - DFA 08S

Abstract: DFA 10S
Text: No file text available


Original
PDF DF005SA DF10SA E54214 J-STD-020C UL-94V-0 J-STD-002B JESD22-B102D 12-Jul-05 DFA 08S DFA 10S
2012 - Not Available

Abstract: No abstract text available
Text: No file text available


Original
PDF com/us/produkte/1212045 EC001186
Stereo phone plug

Abstract: WTN-1080
Text: No file text available


OCR Scan
PDF WTN-1080 SJ-208 SJ-209 D4-10SÃ Stereo phone plug WTN-1080
Not Available

Abstract: No abstract text available
Text: CURRENT DENSITY: <2.0 x 10sA/ cm2 BOND PAD SIZE: 100|im x lOO^m 4 x 4 mils 'Metallization Mask Layout


OCR Scan
PDF HCTS283MS 10sA/cm2
Not Available

Abstract: No abstract text available
Text: CURRENT DENSITY: 2.0 x 10sA/ cm2 BOND PAD SIZE: 100nm x 100nm 4 mils x 4 mils Metallization Mask


OCR Scan
PDF 43G2271 HCTS374MS MIL-STD-1835 CDIP2-T20, HCTS374MS 10sA/cm2 100nm 100nm
Not Available

Abstract: No abstract text available
Text: . 6kA DIE ATTACH: Material: Silver Epoxy WORST CASE CURRENT DENSITY: <2.0 x 10sA/ cm2 BOND PAD SIZE


OCR Scan
PDF HCTS112MS MIL-STD-1835, CDIP2-T16, 1010RAD 10sA/cm2
m387

Abstract: No abstract text available
Text: DIP—460°C (Max) Metal Cà n — 420°C (Max) WORST CASE CURRENT DENSITY: 3.9 x 10sA/ cm2 at 30mA This


OCR Scan
PDF HI-387/8Q3 T-51-11 Mit-Std-883 100nA DG387 HI-390 m387
22741

Abstract: No abstract text available
Text: CURRENT DENSITY: <2.0 x 10sA/ cm2 BOND PAD SIZE: 100|im x 100|im 4 x 4 mils Metallization Mask


OCR Scan
PDF HCTS273MS MIL-STD-1835 CDIP2-T20, 10sA/cm2 22741
Not Available

Abstract: No abstract text available
Text: Thickness: 13kA ±2.6kA DIE ATTACH: Material: Silver Epoxy WORST CASE CURRENT DENSITY: <2.0 x 10sA/ cm2


OCR Scan
PDF HCS138MS 10sA/cm2 100nm
Not Available

Abstract: No abstract text available
Text: : Silver Epoxy WORST CASE CURRENT DENSITY: <2.0 x 10sA/ cm2 BOND PAD SIZE: lOO^im x 100nm 4 mils x 4


OCR Scan
PDF HCTS02MS MIL-STD-1835 CDIP2-T14, 87x88 10sA/cm2 100nm
Not Available

Abstract: No abstract text available
Text: IVATION: Type: Nitride Thickness: 8kA ± 1kA WORST CASE CURRENT DENSITY: 1.5 x 10sA/ cm2 Spec


OCR Scan
PDF DG441/883 DG442/883 DG441/883 DG442/883 DG201A/ DG202/883 MIL-STD883 MIL-STD-883 43Q2271 DG441/883,
Not Available

Abstract: No abstract text available
Text: ATTACH: Material: Silver Glass WORST CASE CURRENT DENSITY: < 2.0 x 10sA/ cm2 BOND PAD SIZE: 110jim x 110nm


OCR Scan
PDF ACS245MS ACS245MS 10sA/cm2 110jim 110nm
Not Available

Abstract: No abstract text available
Text: WORST CASE CURRENT DENSITY: <2.0 x 10sA/ cm2 BOND PAD SIZE: 100|im x 100|im 4 x 4 mils


OCR Scan
PDF HCS74MS MIL-STD-1835 CDIP2-T14, 10sA/cm2
Supplyframe Tracking Pixel