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Not Available

Abstract: No abstract text available
Text: Epoxy W O RST C A SE C URR EN T DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 10Oum x 10Oum 4 x 4 mils


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PDF MIL-STD-1835, CDIP2-T14, 05A/cm2 10Oum
Not Available

Abstract: No abstract text available
Text: WORST CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: 10Oum x 10Oum 4 x 4 mils


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PDF HCTS138MS MIL-STD-1835 CDIP2-T16 05A/cm2 10Oum 10Oum HCTS138 TA14461A. 430S271
Not Available

Abstract: No abstract text available
Text: POTENTIAL: Insulated BOND PAD SIZE: 10Oum x 10O^m 4 mils x 4 mils BACKSIDE FINISH: Sapphire


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PDF GP511 5962R9673601VXC GP511 MIL-PRF-58535, 1-800-4-HARRIS M302271 00b76CH
Not Available

Abstract: No abstract text available
Text: Thickness: 13kA ± 2.6 k A WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 10Oum x 10Oum 4


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PDF HCTS139MS MIL-STD-1835 CDIP2-T16 Si2271 00b2707 05A/cm2 10Oum 10Oum
Not Available

Abstract: No abstract text available
Text: : 10Oum x 10Oum 4 mils x 4 mils Metallization Mask Layout HCS193MS Q1 (2) P1 (1) VCC (16


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PDF HCS193MS MIL-STD-1835 CDIP2-T16, 05A/cm2 10Oum 10Oum 0b24S7
PTC t250

Abstract: t250 ptc OMS305 OMS305A OMS405 QMS305 QMS305A QMS405
Text: Recommendations: Maximum Mounting Torque: 3.0 mN. The module must be attached to a flat heat sink (flatness 10Oum


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PDF OMS305 OMS305A 10Oum 7fl1073 000103e] PTC t250 t250 ptc OMS405 QMS305 QMS305A QMS405
ISD 1820

Abstract: No abstract text available
Text: heat sink (flatness 10Oum maximum). Omnirel S 3 205 CmwfoftiSlmet, Leominster, MA 01453 USA (508


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PDF OMS425 OMS525 OMS625 10Oum ISD 1820
Not Available

Abstract: No abstract text available
Text: CASE CURRENT DENSITY: <2.0 x 105A/cm 2 BOND PAD SIZE: 100|im x 10Oum 4 mils x 4 mils


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PDF HCTS08MS MIL-STD-1835 CDIP2-T14, CDFP3-F14, HCTS08MS 05A/cm 10Oum
Not Available

Abstract: No abstract text available
Text: : 10Oum x 100|im 4 mils x 4 mils Metallization Mask Layout HCS373MS (17) D6 Q1 (5) (1 6 )0 6


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PDF HCS373MS MIL-STD-1835 CDIP2-T20, HCS373MS RLs500Q 2693nm 10Oum
Not Available

Abstract: No abstract text available
Text: BOND PAD SIZE: 10Oum x 100|im 4 x 4 mils Metallization Mask Layout HCTS283MS S1 (1) VCC


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PDF HCTS283MS 10sA/cm2 10Oum
Not Available

Abstract: No abstract text available
Text: 2 B O N D P A D S IZ E : 10Oum x 10O^m 4 x 4 m ils Metallization M ask Layout HCS14MS A1 (1


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PDF HCS14MS MIL-STD-183S, CDIP2-T14, 10Oum
Not Available

Abstract: No abstract text available
Text: PAD SIZE: 10Oum x 100|im 4 mils x 4 mils Metallization Mask Layout HCTS190MS o o > â


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PDF HCTS190MS HCTS190MS 10Oum HCTS190 TA14444A.
Not Available

Abstract: No abstract text available
Text: 10Oum 4 x 4mm Metallization Mask Layout HCTS7266MS A1 (1) VCC (14) B4 (13) B1 (2


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PDF HCTS7266MS MIL-STD-1835 CDIP2-T14 05A/cm2 10Oum HCTS7266 TA14436A.
Not Available

Abstract: No abstract text available
Text: Thickness: 13kA ± 2.6kA WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100|xm x 10Oum


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PDF HCS139MS MIL-STD-1835 CDIP2-T16, 00fci2357 05A/cm2 10Oum HCS139 TA14309A.
Not Available

Abstract: No abstract text available
Text: : <2.0 x 105A/cm2 BOND PAD SIZE: 10O^m x 10Oum 4 mils x 4 mils Metallization Mask Layout HCTS112MS


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PDF HCTS112MS MIL-STD-1835 CDIP2-T16 05A/cm2 10Oum HCTS112 TA14441A. 00fci2bfl2
Not Available

Abstract: No abstract text available
Text: SIZE: 10Oum x 100|am 4 x 4 mils Metallization Mask Layout HCS109M S J1 (2) R1 (1) VCC


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PDF HCS109MS IL-STD-1835 CDIP2-T16, M3Q2271 0DbE313 05A/cm2 10Oum HCS109M HCS109
Not Available

Abstract: No abstract text available
Text: CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: 10Oum x 10O^m 4 mils x 4 mils 11kA + kA 1


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PDF HCTS164MS MIL-STD-1835, CDIP2-T14
Not Available

Abstract: No abstract text available
Text: PAD SIZE: 10O^m x 10Oum 4 x 4 mils Metallization Mask Layout HCS195MS J (2) MR (1) VCC


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PDF HCS195MS MIL-STD-1835 CDIP2-T16, Ou8760 05A/cm2 10Oum HCS195 TA14387A.
ED-4701

Abstract: diode mv 5T
Text: 10Oum and the rouphness within 10um. Also keep the tightening torque within the limits of this


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PDF M25LP-160-04 MS5T00207 H04-004-05b H04-004-03a ED-4701 diode mv 5T
Not Available

Abstract: No abstract text available
Text: ‚ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100|am x 10Oum 4 x 4 mils


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PDF HCS74MS MIL-STD-1835 CDIP2-T14, M3D2271 05A/cm2 10Oum 430E271
Not Available

Abstract: No abstract text available
Text: : 100|o,m x 10Oum 4 mils x 4 mils Metallization Mask Layout HCS253MS O O > U l lo 13 1


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PDF HCS253MS MIL-STD-1835 CDIP2-T16, 21IGH 00b2S04 05A/cm2 10Oum 43DE271
JD 1803

Abstract: philips diode PH 33D Schematics bosch AL 1450 DV bosch al 1450 dv JD 1803 52B jd 1803 IC jd 1803 data sheet quartz kds 9j shockley diode application Yokogawa yf 104
Text: No file text available


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PDF
Not Available

Abstract: No abstract text available
Text: - I'Z&MeLe. MFG TEST : . 0* 10OUMS cblOtrxk-kVdcFINAL T E S T :.OSOOHtASS)tOtW^-4V


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PDF PA8b55â 10OUMS
X050

Abstract: No abstract text available
Text: ana, 10Ou"Min.ma-ttt Sn on aoUUrtaU 76jtu30u~OT\ contact arto, 160u~Min.matt* Sn on aaklrriaU BM 1 -


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PDF UL94V-0 1000M 250VDC 07/03/1S 05/IS/OH X050
transistor 30021

Abstract: operational transconductance amplifier BC 104k capacitor U55C TRANSISTOR BC 1366 VA2713J VA2713
Text: 20 40 80 200 800 2 4 8 10Ommho 10Oumho 10umho


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PDF VA2713 75MHz 100MHz VA2713 30MHz 30MHz. 10KHZ 100KHZ 10MHz 100MHz transistor 30021 operational transconductance amplifier BC 104k capacitor U55C TRANSISTOR BC 1366 VA2713J
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