10068597-42208LF
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Amphenol Communications Solutions
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DDR3 Memory Module Sockets, Storage and Server System, Through Hole, 240 Positions, Metal Clip, 1mm (0.039inch) Pitch. |
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10114829-11108LF
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Amphenol Communications Solutions
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1.25mm Wire to Board Wafer, Vertical, Through Hole, 8 Positions |
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54776-111-08LF
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Amphenol Communications Solutions
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BergStikĀ®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 8 Positions, 2.54mm (0.100in) Pitch |
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10114830-11108LF
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Amphenol Communications Solutions
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1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 8 Positions |
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10114828-11108LF
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Amphenol Communications Solutions
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1.25mm Wire to Board Wafer,Vertical, Surface Mount, 8 Positions |
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10114831-11108LF
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Amphenol Communications Solutions
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1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 8 POSITIONS, GOLD FLASH PLATING |
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