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Part Manufacturer Description Datasheet Download Buy Part
LT1030CS#TR Linear Technology IC LINE DRIVER QUAD LP 14SOIC
LT1236BILS8-5#PBF Linear Technology LT1236LS8 - Precision, Low Noise, Low Profile Hermetic Voltage Reference; Package: LCC; Pins: 8; Temperature Range: -40°C to 85°C
LT1236AILS8-5#PBF Linear Technology LT1236LS8 - Precision, Low Noise, Low Profile Hermetic Voltage Reference; Package: LCC; Pins: 8; Temperature Range: -40°C to 85°C
LTC2246HLX#PBF Linear Technology LTC2246H - 14-Bit, 25Msps 125°C ADC In LQFP; Package: LQFP; Pins: 48; Temperature Range: -40°C to 125°C
LTC2226HLX#PBF Linear Technology LTC2226H - 12-Bit, 25Msps 125°C ADC in LQFP; Package: LQFP; Pins: 48; Temperature Range: -40°C to 125°C
LTC2752BCLX#PBF Linear Technology LTC2752 - Dual 16-Bit SoftSpan IOUT DACs; Package: LQFP; Pins: 48; Temperature Range: 0°C to 70°C

1.7 PC REFLOW PROFILE Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
364A2595

Abstract: CONNECTOR pcb mount square 75 ohm threaded rg6 364M2595 1695a valox 750 310A105A 3M64M2795 361V509E 326a515 BS4271
Text: press-fit center pin locks the connector into the PC board so it is held firmly for reflow or wave , 3M61V704 Mini- BNC Jack W/ Teflon for Reflow Solder 75 Phos./Gold - - Low Profile .270 , BNC Connectors Reduced Size PCB Right Angle Mount The Super LowTM Profile BNC PC jack reduces the , 38 . Fig 35A PC Layout for Super Low Profile Fig. 38 *Denotes that items are not , , Solder .500 Mtg. Hole Centers 22 Figure 19 Figure 20 Figure 21 Figure 22 PC Board


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PDF 365A2795B 365A4595 365A4795 365A4595B 365A4795B Fig38C 364A2595 CONNECTOR pcb mount square 75 ohm threaded rg6 364M2595 1695a valox 750 310A105A 3M64M2795 361V509E 326a515 BS4271
MFZ Series

Abstract: No abstract text available
Text: w Profile M ethod : Air or Infrated Reflow ·R e c o m m e n d e d Solder Land on PC Board Series : M , or lifting up the PC board during reflow soldering : 6 Location of infrared ray lamps : 1R retiow as , prevent the capacitor body Reverse voltage from sliding or lifting up on PC board during reflow soldering , jjg ja j SURFACE MOUNT ALUMINUM ELECTROLYTIC CAPACITORS RECOMMENDED REFLOW SOLDERING CONDITIONS The following conditions are recom m ended for air or infrared reflow soldering o f the surface


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2011 - AYF333135

Abstract: AYF331135 AYF33 AYF330735 AYF333935
Text: recommended reflow temperature profile is given in the figure below Recommended reflow temperature profile , reflow soldering on the back of the PC board after reflow soldering the connector, secure the connector , resistance to solder creepage FEATURES 1. Slim and low profile design (Pitch: 0.3 mm) The use of a back lock mechanism enables a 3.15 mm (with lever) low profile design. 0.9 3.1 5 APPLICATIONS , concentration 3±1 ppm, humidity 75 to 80% R.H. Reflow soldering Soldering iron Repeated insertion and removal


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PDF AYF33 ACCTB13E 201201-T AYF333135 AYF331135 AYF33 AYF330735 AYF333935
2010 - FPC CONNECTOR Front lock

Abstract: AYF33 AYF53 FPC CONNECTOR AYF531235 AYF530265 AYF535035 AYF532435 AYF531035 FFC 0.6mm pitch
Text: . Accordingly, carefully position the terminal with the PC board pattern. · The recommended reflow temperature profile is given in the figure below Recommended reflow temperature profile Y3FT/Y3F/Y3B/Y5B/Y5BW , setting the reflow soldering conditions. · When performing reflow soldering on the back of the PC board , profile and space saving body of 1.0 mm high and 3.20 mm deep (3.70 mm including the lever) Y5B and , profile , space saving back lock type with improved lever operability · Mechanical design freedom


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PDF AYF53 FPC CONNECTOR Front lock AYF33 AYF53 FPC CONNECTOR AYF531235 AYF530265 AYF535035 AYF532435 AYF531035 FFC 0.6mm pitch
2004 - ATMEL reflow temp

Abstract: cason cason 8 pcb pattern ATMEL JEDEC-STD-020 SOIC-8s2 8S2 8-lead SOIC 8 pcb pattern DVD laser pickup assembly 8S2 Soic 8s2 pcb
Text: paste Sn-3%Ag-0.5%Cu lead free paste The reflow profile depends on the thermal mass of the other , actual reflow profile used to produce good board level reliability result is shown in Figure 4 (no clean , °C range. An actual reflow profile used to produce good board level reliability result is shown in Figure , advised. 3 3438B­DFLSH­3/17/2004 Figure 4. PbSn Reflow Profile Note: Time between 150°C - 170°C: 120 sec Time above 183°C: 50 sec Peak Temp: 218°C Figure 5. Pb-Free Reflow Profile Note


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PDF 128-Mbit 3438B ATMEL reflow temp cason cason 8 pcb pattern ATMEL JEDEC-STD-020 SOIC-8s2 8S2 8-lead SOIC 8 pcb pattern DVD laser pickup assembly 8S2 Soic 8s2 pcb
2002 - IPC-7527

Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil QFN 16 CARSEM package outline qfn 44 PACKAGE footprint 7x7 DIe Size metcal VPI-1000 qfn 48 7x7 stencil QFN 8 CARSEM APR-5000
Text: Profile The solder reflow profile will be dependent on PCB design, PCB thickness, type of components, component density, and the recommended profile of the solder paste being used. A reflow profile will need to be developed for each PCB type using various CSP packages. Refer to the reflow profile in the , Reflow After Reflow The reflow profile guidelines are based on the temperature at the actual solder , procedure are as follows: 1234567- Pc board preheat Reflow of component solder Vacuum removal of


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PANEL MOUNT BNC TO BNC 75 OHM

Abstract: f connector rg6 coax 861V509ER6 9659 BNC sbc8241 SBC1855A
Text: design for PC . Edge mounted BNC and F configurations. Lowest profile anywhere, locks into PC board for , Profile , Black 1.44 Standard Profile , Metal 2.44 Low Profile , Metal 2.57 Super-Low Profile PC BNC , Thin-Net Plenum RGB Monitor Cable, Mini RG59 59, 62, 210 PVC 174, 188, 316 (4 Pc .) 179, 187 (4 Pc , Ohm for Reflow V-BiteTM BNC 50 Ohm with Thread Bushing V-BiteTM BNC 75 Ohm V-BiteTM BNC 75 Ohm for Reflow V-BiteTM BNC 75 Ohm with Thread Bushing V-BiteTM BNC F V-BiteTM F for Reflow TM Fig


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PDF Feature505 PANEL MOUNT BNC TO BNC 75 OHM f connector rg6 coax 861V509ER6 9659 BNC sbc8241 SBC1855A
2007 - ASDL-4360

Abstract: ASDL-4360-C22
Text: °C to Peak Temperature The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process , based on Tj ­ 110 °C and thermal resistance at 250 °C/W 2 0.6 0.8 Recommended Reflow Profile MAX 260C T - TEMPERATURE (°C) 255 R3 230 217 200 180 R2 R4 60 sec to 90 , DRY 150 200 P3 SOLDER REFLOW 250 300 t-TIME (SECONDS) P4 COOL DOWN Symbol


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PDF ASDL-4360 885nm) ASDL-4360 885nm. 885nm ASDL-4360-C22
2009 - AYF32

Abstract: AYF323915 AYF321715 AYF321515 AYF323315 AYF323115 AYF322915 AYF322715 AYF322515 TEMPERATURE CONTROL soldering iron
Text: PC board pattern. · The recommended reflow temperature profile is given in the figure below Recommended reflow temperature profile Y3FT/Y3F/Y3B Upper limit (Soldering heat resistance) Lower limit , the back of the PC board after reflow soldering the connector, secure the connector using, for , concentration 3±1 ppm, humidity 75 to 80% R.H. Reflow soldering Soldering iron Repeated insertion and , . Recommended PC board and metal mask patterns Appropriate control of solder amount is required to minimize


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PDF AYF32 AYF32 AYF323915 AYF321715 AYF321515 AYF323315 AYF323115 AYF322915 AYF322715 AYF322515 TEMPERATURE CONTROL soldering iron
2007 - AV02-0274EN

Abstract: ASDL-4360 ASDL-4360-C22
Text: °C to Peak Temperature The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process , based on Tj ­ 110 °C and thermal resistance at 250 °C/W 2 0.6 0.8 Recommended Reflow Profile MAX 260C T - TEMPERATURE (°C) 255 R3 230 217 200 180 R2 R4 60 sec to 90 , DRY 150 200 P3 SOLDER REFLOW 250 300 t-TIME (SECONDS) P4 COOL DOWN Symbol


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PDF ASDL-4360 885nm) ASDL-4360 885nm. 885nm AV02-0274EN ASDL-4360-C22
2012 - Not Available

Abstract: No abstract text available
Text: recommended reflow temperature profile is given in the figure below Recommended reflow temperature profile , reflow soldering on the back of the PC board after reflow soldering the connector, secure the connector , 40±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H. Reflow soldering Soldering iron Repeated , . Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.3 , reference. Recommended PC board pattern (Mount pad arrangement pattern) 0.50±0.03 Connector outline


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PDF AYF32 ACCTB13E 201201-T
2009 - AYF31

Abstract: AYF313315 AYF313115 AYF312915 AYF312715 AYF312515 AYF312315 AYF311715 AYF311515 AYF315115
Text: recommended reflow temperature profile is given in the figure below Recommended reflow temperature profile , . 70 sec. Time Y5S · When performing reflow soldering on the back of the PC board after , 5±1% Bath temperature 40±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H. Reflow soldering , embossed tape feeding direction Type Y3FT Direction of tape progress NOTES 1. Recommended PC , high-density mounting. Refer to the recommended PC board pattern. B±0.05 0.60±0.03 0.30±0.03 0.30±0.03


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PDF AYF31 AYF31 AYF313315 AYF313115 AYF312915 AYF312715 AYF312515 AYF312315 AYF311715 AYF311515 AYF315115
861VH509ER6

Abstract: RG179 BNC termination 364M2595 364A2595 326A515 Y5034 326r515bl edge mount Coaxial Connector SMA Connectors Bulkhead 335R544
Text: Reflow , 50 V-BiteTM Low Profile , 50 V-BiteTM with Flange, 50 , Threaded V-BiteTM with Flange, 75 , (4 GHz), Threaded V-BiteTM Low Profile for Reflow , 75 V-BiteTM with Flange, 75 , Threaded Lock Washer , 10-24 2.89 - 2.89 - 19 20 21 22 23 COAXIAL/RF CONNECTORS F type jacks for bulkhead, inline or PC , Male Terminator PC Board Jack, Right-Angle, Long PC Board Jack, Right-Angle, Short V-BiteTM PC Board Jack, Edge Mount, RG59 V-BiteTM PC Board Jack, Edge Mount, RG6, RG59 V-BiteTM PC Board Jack, Edge Mount


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PDF HBC1505A HBC1694A HBC1855A HBC179DT 179DT RG179) 810PE205G 861VH509ER6 RG179 BNC termination 364M2595 364A2595 326A515 Y5034 326r515bl edge mount Coaxial Connector SMA Connectors Bulkhead 335R544
2010 - SAC387

Abstract: NXR-1400 tamura solder paste SN63 PB37 alpha ekra e5 PowerPAK 1212-8 stencil SAC387 solder MIL-STD-750 method 1037 UP78 ekra
Text: using hot-air BGA rework station using reflow profile shown in figure 12 DOE Reflow Process , SMD125T16L_Ver C Side A Reflow Profile Definitions · Ramp-to-spike: RTS, figure 11 · Ramp-soak-spike: Reg RSS , parameters for successful reflow assembly of PowerPAK 1212-8 package in other PC board designs. However, we , 16-layer PC board assembly for solder joint reliability, passing the temperature cycles, including , the associated assembly costs while utilizing well established reflow processes. As of April 2010


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PDF 1990s AN825 17-May-10 SAC387 NXR-1400 tamura solder paste SN63 PB37 alpha ekra e5 PowerPAK 1212-8 stencil SAC387 solder MIL-STD-750 method 1037 UP78 ekra
2012 - Not Available

Abstract: No abstract text available
Text: recommended reflow temperature profile is given in the figure below Recommended reflow temperature profile , reflow soldering on the back of the PC board after reflow soldering the connector, secure the connector , 40±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H. Reflow soldering Soldering iron Repeated , Direction of tape progress Y3FT NOTES 1. Recommended PC board and metal mask patterns Connectors are , metal mask patterns. Please use them as a reference. Recommended PC board pattern (Mount pad


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PDF AYF31 ACCTB13E 201201-T
2000 - PBGA 256 reflow profile

Abstract: bt 2328 pbga 144 IBM ccga nsmd smd thermocouple WELD 304-pin dimensions bga jedec OSP FLIPCHIP CRACK JESD22-A113 pbga
Text: PBGA Assembly Reflow t Recommended profile : 210-215° C peak, 75 seconds above 183° C. (any standard surface mount reflow profile ) t Follow guidelines recommended by Solder paste vendor t Flux , Six pads, four corners and two across middle. t Solder reflow process t Carefully profile with , Paste Type B PBGA Solder Joint Voids Second Void Study - Reflow Profile Experiments t Three-cell , Information PBGA Solder Joint Voids Second Void Study - Reflow Profile Experiments 6 to 7 3 to 4


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tdk 4.7 uH SMD INDUCTORS

Abstract: SMD MARKING CODE smd code marking 7 SLF7045T-101MR50 SMD MARKING CODE 2A SLF12565T SMD MARKING CODE 24 SLF6025T-101MR33 SMD MARKING CODE 101 tdk slf 6.8
Text: SMD FEATURES · The SLF series are characterized by low profile , low DC resistance, and high current , REFLOW SOLDERING CONDITIONS (6) Rated current 5s 240±5°C Natural cooling 220±5°C 1R5 R88 , Power Line SMD SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN Winding start mark 2.5±0.2 , FEATURES · The SLF series are characterized by low profile , low DC resistance, and high current handling , of products] 4R7 100 4.7µH 10µH (5) Inductance tolerance M ±20% RECOMMENDED REFLOW


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PDF slf6025 VP-2941A model-4275A tdk 4.7 uH SMD INDUCTORS SMD MARKING CODE smd code marking 7 SLF7045T-101MR50 SMD MARKING CODE 2A SLF12565T SMD MARKING CODE 24 SLF6025T-101MR33 SMD MARKING CODE 101 tdk slf 6.8
2002 - Not Available

Abstract: No abstract text available
Text: specific solder being used. The manufacturer's profile or the typical solder reflow profiles table in this , reflow process profile typically undergoes five transitions: 1. Preheat - Brings the assembly from 25 , REFLOW INFORMATION Recommended Solder Reflow Profiles Profile Feature SnPb Eutectic Lead (Pb , APPLICATION NOTE Solder Reflow Information Assembly of a surface mount device depends on many , convection reflow . Skyworks products come in three different termination finishes, depending on the package


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2012 - SI7100DN

Abstract: No abstract text available
Text: at Maximum Temperature Ramp-Down Rate Figure 2. Solder Reflow Temperature Profile 10 s (max , Low 1.07 mm Profile · 100 % Rg Tested RoHS COMPLIANT PowerPAK 1212-8 APPLICATIONS 3.30 mm , Profile (http://www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead , take the advantage of any PC board heat sink capability. Bringing the junction temperature down also , -8. The low 1.05 mm PowerPAK height profile makes both versions an excellent choice for applications with


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PDF Si7100DN Si7100DN-T1-E3 Si7100DN-T1-GE3 11-Mar-11
2002 - AXR30545

Abstract: AXR30444 AXR51228P AXR30345
Text: progress Ultra low profile type Receptacle I/O connector for portable equipment Receptacle Plug ( PC board , AXR(3/5) FOR CELLULAR PHONE; ULTRA LOW PROFILE TYPE FOR PORTABLE EQUIPMENT (0.5mm PITCH) System connector ultra low profile type Receptacle 18, 22 and 24 contacts SYSTEM CONNECTORS ULTRA-LOW PROFILE , equipment Receptacle 22, 24 and 26 contacts Cutting PC board · On board mounting type 50 contacts Ultra low-profile 3mm PC board The key groove is different for every customer. 5. To increase the


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TDK Pulse Transformers

Abstract: TLA-6T127 adm6999 RTL8150 rtl8150l TLA-6T118LF TDK TLA-6T704 BCM1100 adm6999u TLA-6T103LF
Text: .). · 14-pin(1.27mm pitch) SMT package. · Low profile (H)2.2mm max. for note PC application. · 2 , of 8mA. · Low profile (H)2.1mm max. for note PC application. · 2 pulse transformers and 2 , 0.25typ. : Country of origin 0.10max. 0.45typ. Dimensions in mm RECOMMENDED PC BOARD PATTERN , Dimensions in mm W1 W W1 RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING A ø330+0, ­2 B , · This profile is reference data we recommend. Please check in your actual process. · For reliable


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PDF TLA-3T101LF 10BASE-2/5/T TLA-3T108LF TLA-3T106LF 10BASE-T TLA-3T107LF TLA-3T105LF TDK Pulse Transformers TLA-6T127 adm6999 RTL8150 rtl8150l TLA-6T118LF TDK TLA-6T704 BCM1100 adm6999u TLA-6T103LF
SLF12575T-101

Abstract: SLF10165T-220M2R43PF SLF10145T-470M1R4-PF SLF7055T-4R7 slf10145t-101 SLF12565T220M3R5 slf-12555t-152mr SLF12575T-221M SLF6045 SLF6028T-220M
Text: Shielded SLF Series SLF6025 FEATURES · The SLF series are characterized by low profile , low DC resistance , ±20% RECOMMENDED REFLOW SOLDERING CONDITIONS 250 ± 5°C 230°C 30s 5s Natural cooling (6) Rated , /RECOMMENDED PC BOARD PATTERN Winding start mark 6±0.2 2.5±0.2 2±0.1 2.2 1.5 6±0.2 220 Marking , · Magnetic Shielded SLF Series SLF6028 FEATURES · The SLF series are characterized by low profile , ) Inductance tolerance M ±20% RECOMMENDED REFLOW SOLDERING CONDITIONS 250 ± 5°C 230°C 30s 5s Natural


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PDF SLF6025 SLF6028 SLF6045 SLF7032 SLF7045 SLF7055 SLF10145 SLF10165 SLF12555 SLF12565 SLF12575T-101 SLF10165T-220M2R43PF SLF10145T-470M1R4-PF SLF7055T-4R7 slf10145t-101 SLF12565T220M3R5 slf-12555t-152mr SLF12575T-221M SLF6045 SLF6028T-220M
2012 - Not Available

Abstract: No abstract text available
Text: reflow temperature profile could cause product failure which is not immediately evident. Do not make , Assembly Automated Assembly 7 Reflow Temperature Profile 8 Shock During Reflow Transport 8 , the three primary areas where caution must be observed. Reflow Temperature Profile The single most critical stage in the automated assembly process is the reflow stage. The reflow profile in Figure 10 , Reflow Profile – 7 – 240 270 300 330 360 Shock During Reflow Transport Since


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2007 - Not Available

Abstract: No abstract text available
Text: high reliability. Reflow solderable. Slide Applications Rotary ● Encoders ● Power , SPVM110200 With SPVM210100 Without SPVM210200 Without terminal 1 1 For PC board , Two-way Operation Type SPVM Series Dimensions No. Unit:mm Photo PC board mounting hole , 260±5℃, Resistance to soldering heat soldering 5±1s Reflow soldering 350±5℃, 3s max , of Reflow Soldering Condition 1. Heating method: Double heating method with infrared heater. 2


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PDF SPPW81
2012 - Not Available

Abstract: No abstract text available
Text: at Maximum Temperature Ramp-Down Rate Figure 2. Solder Reflow Temperature Profile 10 s (max , and Low 1.07 mm Profile · 100 % Rg Tested RoHS COMPLIANT APPLICATIONS PowerPAK 1212-8 · , Notes: a. Surface Mounted on 1" x 1" FR4 board. b. t = 10 s. c. See Solder Profile (http , packages in the market. It will take the advantage of any PC board heat sink capability. Bringing the , and dual PowerPAK SO-8. The low 1.05 mm PowerPAK height profile makes both versions an excellent


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PDF Si7104DN Si7104DN-T1-E3 Si7104DN-T1-GE3 11-Mar-11
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