95615-114TLF
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board to Board, Shrouded Vertical Header- Through Mount - Double row - 14 Positions - 2.00mm (0.079in) Pitch. |
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131-5114-11D
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 5-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate. |
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95615-114TRLF
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board to Board, Shrouded Vertical Header- Through Mount - Double row - 14 Positions - 2.00mm (0.079in) Pitch. |
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131-5114-21D
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 5-Pair, 4 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate. |
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95615-114BLF
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board to Board, Shrouded Vertical Header- Through Mount - Double row - 14 Positions - 2.00mm (0.079in) Pitch. |
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68015-114HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 14 Positions, 2.54 mm (0.100in) Pitch. |
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