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TPS61131PW
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Texas Instruments
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3.3V, 90% Efficient SEPIC Converter with 3.3V, 200-mA LDO for 1-Cell LiIon or Dual-Cell Applications 16-TSSOP -40 to 85 |
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10136656-1131LF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 11 Positions, Black Color, GW Compatible LCP, Tray packing. |
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10126113-115HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Shrouded vertical header ,Through Hole ,Single row , 15 Positions ,2.54mm (0.100in) Pitch. |
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10136656-1131NLF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 11 Positions, Natural Color, GW Compatible LCP, Tray packing. |
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L17H2661131
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 25/25 (Socket/Socket), 0.38m (15 in) Gold, Bright Tin Shell, 4-40 Removable Front Screwlock, 4*Arrowhead Boardlock |
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89006-1131LF
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Amphenol Communications Solutions
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Metral® Board Connectors, Backplane Connectors 5 Row Signal Header, Straight, 1 Mod, Press Fit. |
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