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Part Manufacturer Description Datasheet BUY
X5163V14IT1 Intersil Corporation X5163V14IT1, TSOP-14 visit Intersil
X5169V14IT1 Intersil Corporation X5169V14IT1, TSOP-14 visit Intersil
X5328V14-2.7A Intersil Corporation X5328V14-2.7A, TSOP-14 visit Intersil
X9428WV14IT1 Intersil Corporation X9428WV14IT1, TSOP-14 visit Intersil
X5169V14I Intersil Corporation X5169V14I, TSOP-14 visit Intersil
X9428WV14T1 Intersil Corporation X9428WV14T1, TSOP-14 visit Intersil

tsop 66

Catalog Datasheet MFG & Type PDF Document Tags

tsop 66

Abstract: W3E32M72S-XSBX 22.3 66 TSOP 66 TSOP 66 TSOP 66 TSOP 66 TSOP 22 16 S A V I N G S 73% 37% Area I/O Count 5 x 265mm2 = 1325mm2 5 x 66 pins = 330 pins 352mm2 208 Balls CSP Approach (mm , Benefits · 73% space savings vs TSOP - 44% space savings vs FPBGA · 37% I/O reduction vs TSOP - 31% I/O , and ask for applications support. White Electronic Designs Density Comparison TSOP Approach
White Electronic Designs
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TSOP25

Abstract: WEDPND16M72S-XBX 66 TSOP 66 TSOP 66 TSOP 66 TSOP 66 TSOP 25 32 S A V I N G S Area 5 x 265mm2 = 1328mm2 800mm2 40% I/O Count 5 x 66 pins = 330 pins 219 Balls 34
White Electronic Designs
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16M x 16 DDR TSOP-66

Abstract: tsop 66 11.9 11.9 11.9 11.9 66 TSOP 66 TSOP 66 TSOP 66 TSOP 66 TSOP 25 32 S A V I N G S Area 5 x 265mm2 = 1328mm2 800mm2 40% I/O Count 5 x 66 pins =
White Electronic Designs
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W3E2M64S-XSBX

Abstract: Designs Density Comparison TSOP Approach (mm) 11.9 11.9 11.9 11.9 Actual Size W3E32M64S-XSBX 22.3 66 TSOP 66 TSOP 66 TSOP 66 TSOP 22 13 S A V I N G S 73% 21% Area I/O Count 4 x 265mm2 = 1060mm2 4 x 66 pins = 264 pins 286mm2 209 Balls Actual Size W3E32M64S-XSBX , Benefits · 73% space savings vs TSOP - 43% space savings vs FPBGA · 21% I/O reduction vs TSOP - 13% I/O
White Electronic Designs
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W3E2M64S-XSBX W3E32M6GS-XSBX MIF2045
Abstract: Comparison Monolithic Solution 22.3 11.9 22.3 66 TSOP Actual Size 66 TSOP 8.3 11.9 22.3 11.9 11.9 12.6 48 TSOP 66 TSOP 66 TSOP 66 TSOP 12.6 48 TSOP 25 32 S A V I N G S Area 5 x 265mm2 + 2 x 105mm2 = 1536mm2 800mm2 5 x 66 pins + 2 x White Electronic Designs
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W3E16M72SR-XBX 200MH MIF2031
Abstract: applications support. White Electronic Designs Density Comparison TSOP Approach (mm) 11.9 11.9 11.9 11.9 Actual Size W3E32M64S-XSBX 22.3 66 TSOP 66 TSOP 66 TSOP 66 TSOP 22 13 S A V I N G S 73% 21% Area I/O Count 4 x 265mm2 = 1060mm2 4 x 66 pins = 264 pins 286mm2 208 , Benefits · 73% space savings vs TSOP - 43% space savings vs FPBGA · 21% I/O reduction vs TSOP - White Electronic Designs
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q1257

Abstract: Q1129 -D-RAM­hoch17 11.09.2003 15:07 Uhr Seite 5 32Mx4 TSOP-66 (400mil) TSOP-66 (400mil) 8Mx16 TSOP-66 (400mil) 64Mx4 TSOP-66 (400mil) Latency DDR200 2-2-2 DDR266A 2-3-3 DDR266A 2-3-3 2-3-3 DDR333 2.5-3-3 DDR266A 256 Mb DDR266A 2-3-3 DDR266 2-2-2 DDR266A TSOP-66 , - 3-3-3 DDR400 TSOP-66 (400mil) DDR400 DDR333 16Mx16 2.5-3-3 HYB25D128400AT- 2-3-3 , 128Mx4 TSOP-66 (400mil) 256Mx4 TSOP stack (400mil) Speed Latency Ordering Code Speed
Infineon Technologies
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q1257 Q1129 Q4331 TSOP66 DRAM spectrum infineon tsop ddr2 ram 2002791-D-RAM PC3200 B112-H6731-G10-X-7600

TSOP 66 Package

Abstract: W3E16M72SR-XBX 12.6 48 TSOP 25 22.3 66 TSOP 22.3 66 TSOP 22.3 66 TSOP 66 TSOP 66 TSOP 48 12.6 TSOP 32 Area I/O Count S A V I N G S 5 x 265mm2 + 2 x 105mm2 = 1536mm2 800mm2 47% 5 x 66 pins + 2 x 48 = 426 pins 219 Balls 49% System Block Diagram
White Electronic Designs
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TSOP 66 Package ddr 3 tsop TSOP 48 Dqs
Abstract: 8.3 Actual Size 48 TSOP 25 22.3 66 TSOP 22.3 66 TSOP 22.3 66 TSOP 66 TSOP 66 TSOP 48 12.6 TSOP 32 S A V I N G S 47% 49% Area I/O Count 5 x 265mm2 + 2 x 105mm2 = 1536mm2 5 x 66 pins + 2 x 48 = 426 pins 800mm2 219 Balls System Block Diagram PowerPCTM MCP White Electronic Designs
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Abstract: Solution Actual Size 25 11.9 22.3 11.9 11.9 11.9 66 TSOP 66 TSOP 66 TSOP S A V I N G S 66 TSOP 21 Area 4 x 265mm2 = 1060mm2 525mm2 4 x 66 pins = 264 White Electronic Designs
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W3E16M64S-XBX MIF2038

qimonda hyb18h5

Abstract: TSOP66 x 16 TSOP-66 TSOP-66 TSOP-66 2.5 V 2.5 V 2.5 V 200 MHz 250 MHz 200 MHz HYB25D256163CE
Qimonda
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HYB18H512321AF qimonda hyb18h5 FBGA84 HYB25D512161CE FBGA 84 hyb18h256321af HYB18T256161AFL SP000016756 SP000216400 SP000216399 SP000216398 SP000079599 SP000079598
Abstract: Solution 11.9 22.3 11.9 11.9 66 TSOP 66 TSOP 66 TSOP Actual Size 11.9 66 TSOP 25 21 S A V I N G S Area 4 x 265mm2 = 1060mm2 525mm2 50% I/O Count 4 x 66 pins = 264 pins 219 Balls 17% Block Diagram PowerPCâ"¢ MCP* + L2 Cache 255 White Electronic Designs
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W3E32M64S-XSBX

Abstract: TSOP 66 Package Comparison TSOP Approach (mm) 11.9 22.3 11.9 11.9 11.9 66 TSOP 66 TSOP 66 TSOP Actual Size W3E32M64S-XSBX 66 TSOP 13 22 S A V I N G S Area 4 x 265mm2 = 1060mm2 286mm2 73% I/O Count 4 x 66 pins = 264 pins 208 Balls 21% CSP Approach (mm) Actual , max · 21% I/O reduction vs TSOP - 13% I/O reduction vs FPBGA · Reduced part count · , temperature ranges Programmable Burst lengths: 2, 4, or 8 · 73% space savings vs TSOP - 43% space
White Electronic Designs
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Abstract: 22.3 11.9 11.9 66 TSOP 66 TSOP 66 TSOP S A V I N G S 11.9 66 TSOP 21 Area 4 x 265mm2 = 1060mm2 525mm2 4 x 66 pins = 264 pins 219 Balls Suitable for White Electronic Designs
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512m pc133 SDRAM DIMM

Abstract: TSOP 66 Package Speed No. Ordering Code Prod. DDR266A 16 M x 8 TSOP-66 (400 mil) 8 M x 16 TSOP-66 , HYB25D128800CE- 6 Q67100 Q1459 2Q04 DDR266A TSOP-66 (400 mil) DDR333 DDR266A 32 M x 4 , DDR400 TSOP-66 (400 mil) DDR266 DDR333 32 M x 8 2-3-3 DDR266A TSOP-66 (400 mil , DDR333 2.5-3-3 16 M x 16 64 M x 4 TSOP-66 (400 mil) FBGA 60 (8 x 12 mm) HYB25D256160CE , TSOP-66 (400 mil) DDR266A 2-3-3 256 M x 4 TSOP stack (400 mil) DDR266A 2-3-3
Infineon Technologies
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512m pc133 SDRAM DIMM TSOP 54 Package DIMM DDR400 PC3200 1 gb ddr2 ram DDR400 infineon HYF33DS512800ATC B166-H8399-X-X-7600

66 pin tsop package

Abstract: tsop 66 PACKAGING INFORMATION Plastic TSOP 66-pin Package Code: T (Type II) ISSI N/2+1 E1 E Notes: 1. Controlling dimension: millimieters, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be ® N measured from the bottom of the package. 4. Formed leads shall be planar with respect to one another within , Plastic TSOP (T - Type II) Millimeters Inches Symbol Min Max Min Max Ref. Std. No. Leads (N) 66 A A1 A2 b
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66 pin tsop package tsop 66

DDR Modules

Abstract: samsung ddr )B0/B3 66 pin TSOP 66 pin TSOP DDR SDRAM 1U DIMM Modules: Registered Density Org , TSOP 2 512Mx72 (St. 512Mx4)*18 M312L5128MT0 - CB0/B3 Optimized Server Performance with
Samsung Semiconductor
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DDR Modules samsung ddr 4GB RAM 256MX4 DDR 333 K4H1G0438M-TC K4H1G0838M-TC DS-06-DRAM-001

JESD-21C

Abstract: 64MB 8Mx72 C 16Mx64 128MB 16Mx72 32Mx64 256MB 32Mx72 512Mbit 32Mx16 5 66 lead TSOP 1 4 13/10 256Mbit 512Mbit 16Mx16 32Mx16 5 4 66 lead TSOP 66 lead TSOP 1 1 4 4 12/10 13/10 256Mbit 16Mx16 4 66 lead TSOP 1 4 12/10 128Mbit 8Mx16 5 66 lead TSOP 1 4 12/9 64Mbit 128Mbit 4Mx16 8Mx16 5 4 66 lead TSOP 66 lead TSOP 1 1 4 4 12/8 12/9 512Mbit 64Mbit 64Mx8 4Mx16 18 4 66 lead TSOP 66 lead TSOP 2 1 4 4 13/11 12/8 256Mbit 512Mbit 32Mx8 64Mx8 18 16 66 lead TSOP 66 lead TSOP 2 2 4 4 13/10 13/11 256Mbit 32Mx8 16 66 lead
Micron Technology
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JESD-21C PC1600 PC2100 PC1600/PC2100 JC-42

TSOP 66 Package

Abstract: RLDRAM of Ball Count: 144 a standard TSOP 66 package. Dimension 18.5 x 11 mm2 11 mm Height: 1.2
Infineon Technologies
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RLDRAM Infineon technology roadmap Multibank - DRAM 300MH B166-H7931-X-X-7600
Abstract: W3E32M72SR-XSBX 11.9 8.3 11.9 12.6 22.3 66 TSOP 66 TSOP 66 TSOP 66 TSOP 48 TSOP 66 TSOP 16 W3E32M72SR-XBX 12.6 48 TSOP 25 S A V I N G S Area 5 x 265mm2 + 2 x 105mm2 = 1536mm2 400mm2 74% I/O Count 5 x 66 pins + 2 x 48 pins = 426 pins 208 , enhanced performance of bus speeds of 200, 250, 266Mb/s ï'  74% SPACE SAVINGS vs. TSOP ï'  Package: ï'  51% I/O reduction vs TSOP ï'  Reduced part count â'¢ 208 Plastic Ball Grid Microsemi
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250MH 266MH
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