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MPC941AE Integrated Device Technology Inc TQFP-48, Tray visit Integrated Device Technology
MPC940LAC Integrated Device Technology Inc TQFP-32, Tray visit Integrated Device Technology
MPC9447AC Integrated Device Technology Inc TQFP-32, Tray visit Integrated Device Technology
72V235L15TFGI Integrated Device Technology Inc TQFP-64, Tray visit Integrated Device Technology Buy
7006L55PFI Integrated Device Technology Inc TQFP-64, Tray visit Integrated Device Technology Buy
84330CYLN Integrated Device Technology Inc TQFP-32, Tray visit Integrated Device Technology

tqfp 14x14 tray

Catalog Datasheet MFG & Type PDF Document Tags

MD300-10A

Abstract: p20d100 Remarks Tray P8C-100-300B,C-1 P-DIP8-0300-2.54 2.54 300 MIL 0.48 g MD300-2A P8CT , Weight Photo Mount pad Magazine Embossed Tape Remarks Tray P14C-100-300A,C-1 P-DIP14 , Tape Remarks Tray 1.2 g MD300-10A, MD300-2A MD300-10A Wide body 300 MIL 1.2 g , Embossed Tape Remarks Tray P18C-100-300A,C-1 P-DIP18-0300-2.54 2.54 300 MIL 1.3 g , Remarks Tray 1.3 g MD300-09A, MD300-2A MD300-09A Semi-wide body 300 MIL 1.3 g MD300
NEC
Original
p20d100 P32C-100-600A P-TQFP100-14X20-0 LA-0543A tray bga C-PGA176-S15U-2 P22C-100-300A-1 P8CT-100-300B2-1 MD300-1A P8C-100-300A-1 X13769XJ2V0CD00 P-DIP14-0300-2

MM554

Abstract: 21x21 Short lead Packing Embossed Tape Tray Remarks CD-ROM X13769XJ2V0CD00 (Unit: mm) (2) 14 pin , Tray Remarks CD-ROM X13769XJ2V0CD00 (Unit: mm) (3) 16 pin Package NEC Code P16C-100-300A,C , Tray Remarks Wide body Semi-wide body CD-ROM X13769XJ2V0CD00 (Unit: mm) (4) 18 pin Package , Embossed Tape Tray Remarks P18C-100-300WA1-1 P-DIP18-0300-2.54 P18C-100-300SA-1 P18C-100-300B-2 P18C , Magazine MD300-09A, MD300-2A MD300-09A MD300-09A MD300-2A MD400-05A MD400-1A Packing Embossed Tape Tray
NEC
Original
MM554 21x21 LA010 CPGA132 45x45 bga P14DH-100-300A2-1 P22C100300A1 P14C-100-300B1-1 P14C-100-300B2-1 P14CT-100-300B-1 P14C-70-300B-1 P14C-100-400A-1

1f1-1717-a19

Abstract: 153FBGA ,14X14-1.4T,ADS31013,LQFP-14X 6*15 125 BAKE TQFP 14X14 1.4T LB69-00185A ADS31013 52TLGA , Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1(8*12),256M DDR 5G , TQFP-12MM X 12MM 1.0T LA69-00303A ADS03961 32TSOP1,(12*12) 0820 12*12 130 MAX TSOP1 , 1420G-QFP-2.65T-C LA69-00227A ADS05321 100TQFP,1.0T (6*12)1420E 6*12 130 MAX 1420E-TQFP , LA69-00247A ADS05372 160 TQFP,2424 1.4T (4*10) 4*10 130 MAX SAMSUNG TQFP 24MMX24MM 1.4T
Samsung Electronics
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1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA

tqfp 10x10 tray

Abstract: tqfp 14x14 tray N N 14x14 x1.4 128 WL 90/ 10/Tray Tray 8 900 Tray Y Y Y Y , -263 3 TO-252 3 TQFP 44 PT 96/Tray 10/Tray 8 960 Tray Y Y Y Y N N , shielding bag Label on tray Anti-stastic electricity paper in tray Tyvek in tray Aluminum foil paper in tray Packing Materials for Package (Refer to Table 1) · Carton u Inner box for FPG 1/2 u Inner box for tube u Inner box for QFP, LQFP and TQFP usage jointly u Inner box for tape on reel (SOP) u
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tqfp 10x10 tray tqfp 14x14 tray QFN tray Tube 4-400 tray tqfp 14x14 1.4 156 QFN 12X12

K9F2G08U0C

Abstract: K9K8G08U0D 200/250 CuSmpl Oct '09 K4D263238K-UC(1) 100-TQFP 2.5/2.5V 200/250 K4D261638K-LC(1 , (clock cycle - speed bin): Q: TQFP U: TQFP (Lead Free) G: 84/144 FBGA V: 144 FBGA (Lead Free) Z , 64Mx16 MSDR Organization K4X4G303PB-7G(1) 240-FBGA, 14x14 PoP, DDP 1.8V Now LPDDR2 , -FBGA, 14x14 PoP 1.2V Now K4P4G304EC-AG(1) 168-FBGA, 12x12 PoP, DDP 1.2V Now K3PE4E400M-XG , 1.2V Now K3PE4E400A-XG(1) 240-FBGA, 14x14 PoP, DDP 1.2V Now 2Gb LPDDR2 2CH x32
Samsung Semiconductor
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K9F2G08U0C K9K8G08U0D K9ABG08U0A K4X2G323PC K9F4G08U0B-PCB0 K9F1G08U0C BR-10-ALL-001

samsung ddr3 ram MTBF

Abstract: KLMAG2GE4A-A001 1.8V Now x32 (2CS, 2CKE) K4X4G303PC-7G(1) 240-FBGA, 14x14 PoP, DDP 1.8V Now 1CH , Dec) 2CH x32/ch K3PE4E400A-XG(1) 240-FBGA, 14x14 PoP, DDP, 64Mx32*2 1.2V EOL by end of , K3PE4E400D-XGC(2) 220FBGA, 14x14 PoP, DDP, 64Mx32*2 1.2V CS 2CH x32/ch K3PE4E400K-XG(2) 240-FBGA, 14x14 PoP, DDP, 64Mx32*2 1.2V Now 2CH x32/ch K3PE8E400C-XG(2) 240FBGA, 14x14 PoP, TDP 1.2V Now 2CH x32/ch K3PE4E700A-XG(2) 220FBGA, 14x14 PoP, DDP 1.2V Now 1CH x32
Samsung Semiconductor
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samsung ddr3 ram MTBF KLMAG2GE4A-A001 KLMAG KLM4G1FE3B-B001 KLM8G2FE3B-B001 KLM2G1HE3F-B001 BR-12-ALL-001

K9HDG08U1A

Abstract: K9LCG08U0A -FBGA 90-FBGA 168-FBGA, 12x12 PoP, DDP 240-FBGA, 14x14 PoP, DDP 168-FBGA, 12x12 PoP 168-FBGA, 12x12 PoP , -FBGA, 12x12 PoP, MONO, 128Mx32 216-FBGA, 12x12 PoP, QDP, 64Mx32*2 240-FBGA, 14x14 PoP, QDP, 64Mx32*2 134 , -FBGA, 14x14 PoP, DDP, 128Mx32*2 216-FBGA, 12x12 PoP, QDP, 128Mx32*4 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V , ) Graphics Memory Q: TQFP U: TQFP (Lead Free) G: 84/144 FBGA V: 144 FBGA (Lead Free) Z: 84 FBGA(Lead , Number Package Type Org. Vol(V) Tray T/R -xxxx0xx -xxx0Txx Status
Samsung Electronics
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K9HDG08U1A K9LCG08U0A k4g10325fe-hc04 KLM2G1DEHE-B101 K9WAG08U1B-PIB0 Ltn140at BR-11-ALL-001

ST7FAUDIO

Abstract: st7faudioar9 P2PAK PENTAWATT TQFP-44 TQFP-64 (10x10) TQFP-100 Note: Packages not to scale HPAK SO-16L PPAK SO-20 SO-28 SO-34 TO-220 TQFP-48 TQFP-80 DPAK IPAK TQFP-32 TQFP-64 (14x14) VN920PEP-E VN610SP VN5160S-E VN5E160AS-E* VN5E160S-E VN5050J-E VN5E050J-E VN5050AJ-E , (16) 48 (16) 48 (16) 48 (16) 48 (16) 48 (16) LQFP64 (14x14) LQFP64 (10x10) LQFP64 (14x14) LQFP64 (10x10) LQFP64 (14x14) LQFP64 (10x10) LQFP64 (14x14) LQFP64 (10x10) LQFP64 (14x14) 1(2/4/4
STMicroelectronics
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VN820PT ST7FAUDIO st7faudioar9 VN1160 VNH5180 L4969URD VNH3SP30-E SGCAR0508 VN03SP VN02H VN02HSP VN02N VN02NSP

UE-111AJ

Abstract: nitto SWT-20 Leadless Ceramic Chip Carrier MQFP Metric Quad Flat Package EA FA FB FC 10x10 mm 14x14 , 4x4x0.75 mm (QFN-Q) Pb free, RoHS compliant LQFP & TQFP JA JB (TQFP)Thickness 1.0 mm (LQFP , Delivery in tube, tray or canister (without MBB packing or T&R) 09 2.5 Sawn wafer, metal frame 8
Micro Analog Systems
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UE-111AJ nitto SWT-20 transistor marking PB nitto UE111AJ ke marking transistor 2091J QSP0005 MAS1234 MAS1234T39 MAS1025AC MAS1025ACSA MAS9124AACA

K4X2G323PD8GD8

Abstract: K9HFGY8S5A-HCK0 1.2V Now 2CH x32/ch K3PE4E400D-XGC(2) 220FBGA, 14x14 PoP, DDP, 64Mx32*2 1.2V CS 2CH x32/ch K3PE4E400K-XG(2) 240-FBGA, 14x14 PoP, DDP, 64Mx32*2 1.2V Now 1CH x32 , /ch K3PE7E700D-XG(2) 220-FBGA, 14x14 PoP, DDP, 128Mx32*2 1.2V Now 2CH x32/ch K3PE7E700A-XG(2) 240-FBGA, 14x14 PoP, DDP, 128Mx32*2 1.2V Now 2CH x32/ch K3PE7E700P-XG(2) 220-FBGA, 14x14 PoP, DDP, 128Mx32*2 1.2V CS 2CH x32/ch K3PE7E700L-XG(2) 216-FBGA, 12x12 PoP, DDP
Samsung Semiconductor
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K4X2G323PD8GD8 K9HFGY8S5A-HCK0 K4H511638JLCCC KLMBG4GE2A-A001 K9K8G08U0D-SIB0 samsung eMMC 5.0

nitto SWT 10

Abstract: nitto SWT-20 PLCC EA0 10x10 mm 14x14 mm 14x20 mm Metric Quad Flat Package FA FB FC (TQFP)Thickness , & TQFP FA0 FA1 Plastic Dual In-Line Package Plastic Leaded Chip Carrier MQFP F00 F01 , Delivery in tube, tray or canister (without MBB packing or T&R) 09 Reserved 23 Sawn wafer
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nitto SWT 10 W07 sot 23 w04 transistor sot 23 W04 sot 23 transistor w07 transistor marking w08 MAS1234T39T0206 MAS1234AB3 98AA2 MAS9198AA2

sqfp 14x20

Abstract: 74ALSXX (14x20) 80-pin LQFP (12x12) 100-pin TQFP (14x14) 100-pin QFP (14x20) 120-pin QFP (28x28) 128-pin LQFP , unbroken quality seals. Plastic Quad Flat Pack (PQFP) parts are available in single tray packaging. Products available in single tray are identified in the Price Book with a "-S" added to the end of basic , full tray increments and must also meet the order minimums as determined by each device's Price Book , TRAY PER BOX 6 6 4 4 42 210 QUANTITIES SHOWN IN GRAY REQUIRE PURCHASE OF PRODUCT TO BE MADE IN EXACT
Philips Semiconductors
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sqfp 14x20 74ALSXX TDA1308 application notes sQFP 14X14 SG 2368 PC 74 HCT 32 P TDA1308 TDA1308T P51XA 80C51 P51XAG3

K9F2G08U0B

Abstract: K9HCG08U1M-PCB0 K4D263238K 144-FBGA 2.5/2.5V 200/250 K4D263238K 100-TQFP 2.5/2.5V 200/250 K4D261638K , : FBGA (Halogen-free & Lead-free) Graphics Memory Q: TQFP U: TQFP (Lead Free) G: 84/144 FBGA V: 144 , Density Technology Package Type Org. Vol(V) Tray T/R -xxxx0xx -xxx0Txx , MOQ Org. Vol(V) Tray T/R -xxxx0xx -xxx0Txx K9NCG08U5M-PCB0 TSOP1 x8 3.3 , K7A321830C 100-TQFP SPB 3.3, 2.5 3.1 200 3.3, 2.5 Mass Production 2E1D K7B321835C
Samsung Semiconductor
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K9F2G08U0B K9HCG08U1M-PCB0 K9F2G08U0B-PCB0 K9F4G08U0B K9WBG08U1M K9F1G08U0C-PCB0 BR-09-ALL-001

116-Pin

Abstract: Lead Free reflow soldering profile BGA (208pin) 0.13~0.60nH 94.2~84.2% lower lower TQFP(100pin) 2.54~3.79nH *under-fill process , QFP 12x12 FPBGA 175 14x14 FPBGA 10x10 14x20 QFP 27x27 P-BGA 28x28 QFP 20x20 , packing styles of NEC's CSP. Packing Styles of CSP Tape Packing box Packing container Tray , CSPs are removed from the box. If a bag or tray is dropped, the balls or tray can me deformed or , corrosion verified. 18 (c) Handling tray 1) Do not move the tray without being bundled. 2) When
NEC
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116-Pin Lead Free reflow soldering profile BGA PBGA 256 reflow profile semiconductor cross index 224-pin plastic ball grid array 0.8mm tray qfp 14x14 1.4 C13185EJ1V0PF00

LPDSP32

Abstract: Sanyo LPDSP32 . - ROM (264.5KB) ï'· PM 227.5KB (ISOLATED) ï'· DMA 34KB (ISOLATED) TQFP128L(14X14) ï'· DMB 3KB , : 128pin TQFP Application ï'· IC Recorder, Audio Player ï'· Radio Recorder, Home Audio (Mini compo , Package Dimensions unit : mm TQFP128 14x14 / TQFP128L CASE 932BA ISSUE O No.A2171-6/20 , Device LC823430TA-2H Package Shipping (Qty / Packing) TQFP128L(14X14) (Pb-Free / Halogen Free) 3 / Tray JEDEC ON Semiconductor and the ON logo are registered trademarks of Semiconductor
ON Semiconductor
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LPDSP32 Sanyo LPDSP32 ENA2171A LC823430TA 246KB 170KB 154KB

PGA68

Abstract: clcc44 leaded chip carrier (PLCC) Plastic quad flat package (PQFP) Plastic thin quad flat packages (TQFP , relevant data. · The packing quantity is the number of devices packed per unit (tube, box, tray, tape or , PQFP44 (14x14) 1000 14x14x2.7 500 PQFP64 1130 14x14x2.7 500 PQFP80 (14x14 , Sn 85 Pb Wires 15 41 INTEGRATED CIRCUITS PLASTIC THIN QUAD FLAT PACKAGES (TQFP , 10x10x1.4 2400 1000 TQFP64 (10x10) 300 10x10x1.4 1000 TQFP64 (14x14) 645 14x14x1.4
STMicroelectronics
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PGA68 clcc44 FDIP28 material declaration semiconductor package SO53 schottky diode sb 5400 GS-R4840N GS-R51212 GS-R400V GS-R405 GS-R412 GS-D200

IC-3216

Abstract: 78P054GC-3B9 thickness 1.4 mm) /JPD78PD54GK-BE9 80-pin plastic TQFP(fine pitch) (1 2 x 1 2 mm) //PD78P054KK-T 80 , 80~pin plastic TQFP (line pitch) (12 x 12 mm) · 80-pin ceramic WQFN Notes 1. 2. Internal P RO
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OCR Scan
IC-3216 78P054GC-3B9 D78P054 TDK tad 204 78p054 PD78P054 PD78054 78K/0 PD78P054KK-T 78054Y U11747E

philips diode PH 33J

Abstract: UM61256FK-15 In-Line Package TQFP 20X20X1.4MM Small Shrink Outline Package CERDIP - Ceramic Dual In-Line Package Thin , Devices Per Devices Per Devices Per Devices Per Reel Tray Tube Blister Pack N/A N/A 2000 2000 2000 N/A , 3151 N/A 3374 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A Tray 1702 1498 1473 , . Package CERDIP Packages TQFP 20X20X1.4MM PQFP 28X28X3.5MM PQFP 28X28X3.5MM PQFP W HT.SPRD PQFP W , ML 28 PIN CERDIP 300 ML 32 PIN CERDIP 600 ML 40 PIN CERDIP 600 ML 144 PIN TQFP 128 PIN PQFP 208 PIN
Integrated Device Technology
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UM61256FK-15 philips diode PH 33J sem 2106 inverter diagram IDT7024L70GB um61256 UM61256ak sram 10-BIT QS3L384 QS3L2384 AN-13 AN-11 71024S20Y

UM61256FK-15

Abstract: YD 6409 In-Line Package TQFP 20X20X1.4MM Small Shrink Outline Package CERDIP - Ceramic Dual In-Line Package Thin , Devices Per Devices Per Devices Per Devices Per Reel Tray Tube Blister Pack N/A N/A 2000 2000 2000 N/A , 3151 N/A 3374 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A Tray 1702 1498 1473 , . Package CERDIP Packages TQFP 20X20X1.4MM PQFP 28X28X3.5MM PQFP 28X28X3.5MM PQFP W HT.SPRD PQFP W , ML 28 PIN CERDIP 300 ML 32 PIN CERDIP 600 ML 40 PIN CERDIP 600 ML 144 PIN TQFP 128 PIN PQFP 208 PIN
Integrated Device Technology
Original
YD 6409 um61256ak-15 PZ 5805 PHILIPS UM6164 IDT8M624 stk 5490 74F257 74FCT257 74FCT257T QS32257 QS3257 74ALS/AS/LS257
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