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LM9740CCVS/NOPB Texas Instruments 100-TQFP visit Texas Instruments
LM9740CCVS Texas Instruments 100-TQFP visit Texas Instruments
PMP2187 Texas Instruments Flyback, Linear Regulator for Medical Pack visit Texas Instruments
X98014L128-3.3 Intersil Corporation SPECIALTY CONSUMER CIRCUIT, PQFP128, MQFP-128 visit Intersil
TAS5015PFBR Texas Instruments SPECIALTY CONSUMER CIRCUIT, PQFP48, PLASTIC, TQFP-48 visit Texas Instruments
VCA2614 Texas Instruments SPECIALTY ANALOG CIRCUIT, PQFP32, TQFP-32 visit Texas Instruments

ti packing label

Catalog Datasheet MFG & Type PDF Document Tags

TI Wafermap format

Abstract: laser barcode reader circuit Anti-Static Moisture Bag Fill With Bubble Foam Carton Box Label on Carton Box Figure 3-6. Packing of , figure shows the barcode label that is placed on the packing box, the wafer container and the CD with , . Barcode Label 3.8 Storage Conditions The wafers should be kept in the original packing during , . 16 Shipping, Packing and Further Handling , . Packing for Wafers
Texas Instruments
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TI Wafermap format

Abstract: laser barcode reader circuit Bag Fill With Bubble Foam Carton Box Label on Carton Box Figure 3-6. Packing of Sawn Wafers , barcode label that is placed on the packing box, the wafer container and the CD with the map file. Note , . 16 Shipping, Packing and Further Handling , . Packing for Wafers . Packing for Sawn Wafers
Texas Instruments
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laser barcode reader circuit

Abstract: TI Wafermap format , Packing & Further Handling 21 www.ti.com Packing for Sawn Wafers CD Taped on Foam Label Up , Spacer Carton Box Label on Carton Box Figure 3-5. Packing of Wafers 3.6 Packing for Sawn , Label on Carton Box Figure 3-6. Packing of Sawn Wafers (Multi) Packing in Single Wafer Box Sawn , barcode label that is placed on the packing box, the wafer container and the CD with the map file. Note , . 10 Electrical Specification Shipping, Packing & Further Handling
Texas Instruments
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TI Wafermap format

Abstract: , Packing & Further Handling 21 www.ti.com Packing for Sawn Wafers CD Taped on Foam Label Up , Spacer Carton Box Label on Carton Box Figure 3-5. Packing of Wafers 3.6 Packing for Sawn , Carton Box Label on Carton Box Figure 3-6. Packing of Sawn Wafers (Multi) Packing in Single Wafer , the barcode label that is placed on the packing box, the wafer container and the CD with the map file , . 10 Electrical Specification Shipping, Packing & Further Handling
Texas Instruments
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TI Wafermap format

Abstract: laser barcode reader circuit Spacer Carton Box Label on Carton Box Figure 3-5. Packing of Wafers SCBU046 (11-09-21-063) ­ , . Packing of Sawn Wafers (Single) 3.7 Barcode Label The following figure shows the barcode label that , . 11 Electrical Specification Shipping, Packing & Further Handling , . Packing for Wafers . Packing for Sawn Wafers
Texas Instruments
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TI Wafermap format laser barcode reader circuit ISO15693 1 out of 4 inventory request texas instruments packing label TI Assembly Factory Code RF-HDT-SJLC

EIA and EIAJ standards 783

Abstract: EIA standards 783 . . . . . . . . . . . . . 15 Typical TI Component Orientations for Tape-and-Reel Packing . . . . . , Tape Embossed Cavity Bar-Code Label Area Figure 7. Tape-and-Reel Packing 10 Semiconductor , Direction of Feed Figure 12. Typical TI Component Orientations for Tape-and-Reel Packing 16 , , dry-pack caution label] · Humidity-indicator card Semiconductor Packing Methodology 21 , container near the TI barcode label. This label indicates that moisture-sensitive packages are inside. The
Texas Instruments
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SZZA021B EIA and EIAJ standards 783 EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray

EIA and EIAJ standards 783

Abstract: JEDEC tray standard dimension Tape Carrier Tape Embossed Cavity Bar-Code Label Area Figure 7. Tape-and-Reel Packing 10 , intermediate container near the TI barcode label. The presence of this label indicates that moisture-sensitive , . Moisture-Sensitivity Caution Label (Levels 2a Through 5a) 24 Semiconductor Packing Methodology SZZA021A , 20. Humidity-Indicator Card Environmental TI strives to optimize the packing density of each , N/A Drypack bag Boxes Semiconductor Packing Methodology 25 SZZA021A Conclusion TI
Texas Instruments
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JEDEC tray standard dimension abstract for water level indicator EIA-481-x JEDEC Matrix Tray outlines QFP Shipping Trays BGA and QFP Package

JEDEC Matrix Tray outlines

Abstract: ti packing label Tape Embossed Cavity Bar-Code Label Area Figure 7. Tape-and-Reel Packing 10 Semiconductor , Figure 13. Typical TI Component Orientations for Tape-and-Reel Packing Semiconductor Packing , , dry-pack caution label] · Humidity-indicator card Semiconductor Packing Methodology 21 , container near the TI barcode label. This label indicates that moisture-sensitive packages are inside. The , Label (Levels 2a Through 5a) 24 Semiconductor Packing Methodology SZZA021C The
Texas Instruments
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ti packing label dck3 tray bga 64 EIA-468 label location dbv4 ti dck3
Abstract: . 19 Shipping, Packing, and Further Handling , . 24 3.2 Packing . 24 3.3 Barcode Label , -114A-S1) . Packing . Barcode Label Texas Instruments
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SCBU009B

Solder bar of Senju M705

Abstract: senju M31 GRN360 Material Specifications TI offers tape-and-reel packing for 14-, 16-, and 20-pin logic QFN packages in , and Lance Wright SLL Package Development ABSTRACT Texas Instruments (TI) Quad Flatpack No-lead , accordance with TI standards. 1 2 3 4 5 6 7 8 9 10 Contents Introduction , . 34 Tape-and-Reel Packing , . 38 Figure 38. Regular Shipping-Box Label Placement
Texas Instruments
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SCBA017D Solder bar of Senju M705 senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile MO-241

ti packing label

Abstract: TEXAS INSTRUMENTS packing materials from our customers are increasing in frequency. Additionally, we understand through , for product identification on the container can be met with our bar code label. Both the Texas , label as well as the shipping container packet label. Removal of the Texas Instruments' name and logo , . Customers may expect to begin receiving boxes without the TI name and TI logo immediately. You may however, continue to receive product with TI name and TI logo pre-printed on the box through the year 2000. In all
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TEXAS INSTRUMENTS Texas Instruments 10-496 44256 Texas Instruments, PCN tape AP 1531

ATMEL 740

Abstract: atmel 830 Packaging and Packing Information Packaging according to IEC 60286-3 for Tape and Reel, and IEC 60286-4 for tube packing. 1. Labels In general, on products coming out of Atmel ®'s Heilbronn Germany location, two labels are on the inner cardboard: Atmel's standard bar code label and a customer specific bar code label. Pb-free shipments will be identified on the bar code packaging label according to JESD97. 1.1 Atmel's Standard Bar Code Label Atmel's standard barcode labels are printed at final
Atmel
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ATMEL 740 atmel 830 ATMEL Tape and Reel drawing LQFP-44 ATMEL shipping label atmel 0635 4845C
Abstract: position 8. /^v^y^^Tâ'"X ( â^ft3t ) /Packing Case ( Outside Packing Case ) ^"^ui y frittes Label sticks , dimensions, refer to sheet No. 5. 2) =iâ'">-?"CDlfi£/Structure of taping 7V)I-/Label W-j-y /Cover Tape _¿S nnODDBOBOE^SaGOG" + + 'J 7 f - 7 * /Carr ier Tape !Ml/Reel IP/Label Htm LÃ"lil Pul I out di recti on D O O ( â¡ â , , + 400mmiy.±t-r-So Z ti b , SSMini4-F1 Diode (TX)/L 2) tt ti/Specif ¡cations When the mounted tape is bent at a radius of 15mm, no -
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WNF008

Abstract: code res pack 8 Chapter 10 Packing Methods and Labels CHAPTER 10 PACKING METHODS AND LABELS Introduction Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Box Labeling Packages and Packing Methodologies Handbook 1 March 2008 10-1 Chapter 10 Packing Methods and Labels , moisture, temperature changes, and rough handling. Special care is taken to design packing containers and packing methods for Spansion products that ensure the preservation of product quality from
Spansion
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WNF008 code res pack 8 SO3016 UNE008 spansion tray

Date Code wolfson

Abstract: WM8725ED Figure 4 Inner Product Label ­ Drybag (for tubes or trays) PA R BO TI X AL INNER SHIPPING CARTON (FOR TUBES) Figure 5 Inner Product Label ­ Inner Shipping Carton (for tubes) PA R BO TI A X L , . PACKING SPECIFICATION The position of the outer shipping label on an outer shipping carton is shown below , w WTN_0226 Inner Product and Outer Shipping Label Specifications INTRODUCTION This , occur due to manufacturing route variations. INNER PRODUCT LABEL The layout of a standard inner
Wolfson Microelectronics
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Date Code wolfson WM8725ED MH1082 Date Code format wolfson WOLFSON date code WM8199SCDS

N91E-DBFB-24-1

Abstract: Q65110A8697 Transportation Packing and Materials Barcode label MY DE 8 P- 1+ Q- 1 R1 ul LS ti Y , Mo Mo Barcode label N O TI U A C 1. M RA OS Humidity indicator Barcode label , XT R: Barcode label MY DE T6 PL 76 R1 8 M ul LS ti Y TO P1+ Q -1 OU GR , R0 diti 0 C R on PA 77 al RT CK TE VA XT R: in Packing Sealing label Dimensions of , Gruppenbezeichnung auf Etikett Group Name on Label Beispiel: DB-2-3A Example: DB-2-3A Helligkeitsgruppe
OSRAM
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N91E-DBFB-24-1 Q65110A8697 2000/R JESD22-A114-D D-93055

N91E-DBFB-25-1

Abstract: N91E-AADA-35-1 Packing and Materials Barcode label MY DE 8 P- 1+ Q- 1 R1 ul LS ti Y TO T6 PL , label N O TI U A C 1. M RA OS Humidity indicator Barcode label Please check the HIC , R: Barcode label MY DE T6 PL 76 R1 8 M ul LS ti Y TO P1+ Q -1 OU GR , R0 diti 0 C R on PA 77 al RT CK TE VA XT R: in Packing Sealing label Dimensions of , . Individual brightness groups cannot be ordered. Gruppenbezeichnung auf Etikett Group Name on Label
OSRAM
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N91E-DBFB-25-1 N91E-AADA-35-1 OHL02571

N91E-AADA-35-1

Abstract: MP324 Packing and Materials Barcode label MY DE 8 P- 1+ Q- 1 R1 ul LS ti Y TO T6 PL , label N O TI U A C 1. M RA OS Humidity indicator Barcode label Please check the HIC , R: Barcode label MY DE T6 PL 76 R1 8 M ul LS ti Y TO P1+ Q -1 OU GR , R0 diti 0 C R on PA 77 al RT CK TE VA XT R: in Packing Sealing label Dimensions of , . Individual brightness groups cannot be ordered. Gruppenbezeichnung auf Etikett Group Name on Label
OSRAM
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MP324

GT 240

Abstract: dot matrix p2 Trockenverpackung und Materialien Dry Packing Process and Materials Moisture-sensitive label or print L VE LE , re Lev istu Dat re istu re Mo istu Mo istu Mo Mo Barcode label N O TI U A C , label MY DE 8 P- 1+ Q- 1 R1 ul LS ti Y TO T6 PL 76 OU GR 44 D/C , : : Packing Sealing label OHA02044 Dimensions of transportation box in mm (inch) Breite / Width , kV acc. to JESD22-A114-D · method of packing: 500 pcs. per reel = packing unit Anwendungen ·
OSRAM
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GT 240 dot matrix p2 LM 317 LM 317 T and application sheet lm 324 pin diagram ML 317

toshiba packing label

Abstract: toshiba tape and reel ft- C D: Anod« ® : Cathod* If s m Ti Tstg JEDEC EIAJ 3-4E1A TOSHIBA Weight; 0.023 g Note , (V) TOSHIBA 5. Tape Packing and Lead Forming [6 ] Explanations To meet the needs of , Numbers Toshiba Package Number JEDEC No. - - - DO-41 - 5.1 Tape Packing For descriptions of the different types of tape packing, refer to the pages which follow. Tape sizes are standardized , lead-type rectifiers) 89 TOSHIBA # Type [6 ] Explanations Einbossed-tape packing Tape
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LB181 toshiba packing label toshiba tape and reel TOSHIBA ADDC LB1191 TOSHIBA REEL T2 marking M-flat CMS11 0Q0707EAA1 DO-15 DO-15L LC6-15 LC7-15A
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