NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: T04339B Figure 2. Functional Block Diagram The processor board contains the central processing unit ... | Original |
8 pages, |
810E 514.4 46D1 foundation field bus t0433 FIO-100 TC03112A FIO-100 abstract |
|
|||
| Abstract: Next Previous Surface Mount Fuses Thin-Film Surface Mount SlimLineTM 1206 Very Fast-Acting Fuse 433 Series ® · The SlimLine 1206 fuse is an extremely small, low profile design (1206 chip size) utilizing thin-film technology to achieve precise control of electrical characteristics. · The lower height profile produces a flat surface for improved performance in pick-and-place operations and an alternate solution for height critical application. · Mounting pad and electrical sp ... | Original |
1 pages, |
marking code PB K 286 Datasheet eia marking code 24 marking code transistor transistor A2 Transistor AC 125 transistor marking 6A K V 63 Marking 8A marking code 8A marking code diode 14 transistor MARKING CODE 2T MIL-STD-202f datasheet abstract |
|
|||
| Abstract: Cable Ties and Fixings C a b l e Ti e s Application Tool Registration Numbers MK3SP 1 MK3PNSP2, MK7P 2 MK7 3 MK7HT 4 MK20 5 MK6 6 MK9P, MK6PN 7 MK9 T18S T150XL T150XL 1.1 8 MK9HT 9 MK21 10 Autotool 2000 11 For more information please turn to page 389. Technical Table Length (L) Width (W) 111-91819 T18R 100 2.5 22 111-02043 T18L 205 2.5 55 111-93019 T30R 150 3.5 111-95019 ... | Original |
3 pages, |
T30MR T04 83 T150R T50SOS T250M PA66 6 A201L A106A IT50L cable ties t18s t50-l T50I PA66V0 T18R MK3PNSP2 datasheet abstract |
|
|||
| Abstract: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS 128X3 128X3 2CV3/D PS 128X3 128X3 2 BV3 DESCRIPTION: The DPS128X32CV3/DPS128X32BV3 DPS128X32CV3/DPS128X32BV3 "VERSA-STACK" module isa revolutionary new high speed memory subsystem using Derise-Pac Microsystems' ceramic Stackable Leadless Chip Carriers (SLCQ mounted on a co-fired ceramic substrate. It offers 4 Megabits of SRAM in a package envelope of 1.090 x 1.090 x 0.252 inches. The DPS128X32CV3/DPS128X32BV3 DPS128X32CV3/DPS128X32BV3 contains four individual 128K x 8 SRAMs, packaged in their ow ... | OCR Scan |
6 pages, |
DPS128X32CV3 128X3 DPS128X32CV3/DPS128X32BV3 128X32BV3 128X3 abstract |
|
|||