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sumitomo 6300h mold compound

Catalog Datasheet MFG & Type PDF Document Tags

PCN0702

Abstract: SUMITOMO G700 the supply of EME 6300H and EME 6300HJ mold compound materials. We are standardizing the mold , Appendixes 09/17/07 PCN0702 Appendix 1 Qualification Data for the Sumitomo G700 Series Mold Compound , Sumitomo G600 Series Mold Compound Representative Package Qualification Test Read Out Results , PCN0702 Appendix 3 Material Properties for the Sumitomo EME6300 Series Mold Compound Material , Sumitomo G600 Mold Compound Material Properties Spiral Flow Gel Time Thermal Expansion 1 Thermal
Altera
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G700M 2000HG SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 EME-6300H MP8000CH4 DMC-2000HG X10-5

EME-6300

Abstract: eme 6300h side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead , side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead , : 28-pin, 300-mil CerDIP Die to Package edge clearance: 18 mils per side Mold Compound Name , Passivation Mold Type Compound Assembly Line Location ESD Volt Rating Process Line ID ID , ) Design Rule (µ) µ Fabrication Passivation Mold Type Compound Assembly Line Location
Cypress Semiconductor
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CY7C191 CY7C192 CY7C194 CY7C195 CY7C196 CY7C197 EME-6300 eme 6300h

EME-6300H

Abstract: sumitomo epoxy : 28-pin, 300-mil Plastic DIP Die to Package edge clearance: 76 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition , edge clearance: 96 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Dipped, 63%Sn, 37%Pb Die Attach , Fabrication Passivation Mold Assembly ESD Volt Type Compound Line Rating Location Availability
Cypress Semiconductor
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CY7C408A CY7C409A sumitomo epoxy cypress fifo cy7c408A CY7C408A/CY7C409A 7C408/7C409 7C408WT-PC 7C408WT-VC

sumitomo epoxy 6300h

Abstract: sumitomo epoxy per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper , Package edge clearance: 97 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Dipped, 85%Sn, 15%Pb Die Attach , mil x mil Rule (stepping) (µ) µ Fabrication Passivation Mold Assembly Line Type Compound , Fabrication Passivation Mold Assembly Line Type Compound Location ESD Volt Rating Process Line
Cypress Semiconductor
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CY74FCT16244T sumitomo epoxy 6300h wafer LTO hysol 7C7144A CT16244TPVC CY74FCT16244TPAC CY74FCT16244TPVC
Abstract: compound/die attach change PCN #: 1134 TITLE Conversion of Sumitomo mold compound EME-6300H (being discontinued by manufacturer) to Sumitomo equivalent mold compound EME6600CSP and additional die attach , that Diodes is currently in the process of qualifying EME-6300CSP mold compound. The mold compound supplier for the current mold compound is discontinuing manufacturing of EME-63000H. EME-6600CSP will , Print Date: 4/30/09 9:41 AM Mold Compound Part Number Package AP34063N8L-U AP358NL-U AP393NL-U Diodes
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DCS/PCN-1134 84-1LMISR4 841LMISR4 263-3L AP1184T5-15L-U AP1184T5-18L-U

86171

Abstract: EME-6300H Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish , Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish , -mil CerDIP Die to Package edge clearance: 92 mils per side Mold Compound Name/Manufacturer: Lead , : 190 mils per side Mold Compound Name/Manufacturer: Lead Frame material: N/A None Lead , Fabrication Passivation Mold Assembly ESD Volt Type Compound Line Rating Location Availability
Cypress Semiconductor
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CY7C150 86171 CY7C123 UL-94V0 EME6300H 94v-0 dynamic RAM 7C150A

sumitomo epoxy 6300h

Abstract: sumitomo epoxy eme6300h clearance: 30 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H , -mil Plastic DIP Die to Package edge clearance: 33 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Dipped, 63 , : 41 mils per side Mold Compound Name/Manufacturer: Lead Frame material: N/A Alloy 42 Lead , (stepping) Design Rule (µ) µ Fabrication Passivation Mold Assembly ESD Volt Type Compound
Cypress Semiconductor
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sumitomo epoxy eme6300h prime p27 mos die Sumitomo 1000 7C258 7C259 CY7C258/259 7C258/9A PLD20DJ

EME-6300H

Abstract: 7c42x /ASSEMBLY DESCRIPTION (7C425) Package Outline, Type, or Name: 28-pin,300-mil PDIP Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder , DESCRIPTION (7C425) Package Outline, Type, or Name: 32-pin PLCC Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Plate, 85%Sn, 15 , , Type, or Name: 28-pin, 300-mil CerDIP (7C425) Mold Compound Name/Manufacturer: Lead Frame
Cypress Semiconductor
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CY7C419 CY7C425 7c42x sumitomo EME-6300H CY7C420/CY7C421 CY7C424/CY7C425 7C425D 150C/5

EME-6300H

Abstract: sumitomo epoxy 6300h : 148 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H , Die to Package edge clearance: 136 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H Copper Lead Finish, composition: Solder Plated, 85%Sn, 15%Pb Die , Mold Compound Name/Manufacturer: Lead Frame material:q N/A Alloy 42 Lead Finish, composition , mil (stepping) Design Rule (µ) µ Fabrication Process ID Passivation Type Mold
Cypress Semiconductor
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J28S D284 yc 504 CY10E484/CY10E484L CY100E484/CY100E484L CY101E484/CY101E484L CY10E484 CY10E484L 10E484A/10EL484A

EME-6300H

Abstract: 28-pin SOJ SRAM , Type, or Name: 28-pin, 300-mil SOJ Die to Package edge clearance: 112 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish , Package edge clearance: 72 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Die Attach Area Plating: Solder Plated, 85 , . Die Size mil x mil (stepping) Design Rule (µ) µ Fabrication Mold Compound Assembly
Cypress Semiconductor
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CY7C199 28-pin SOJ SRAM Omedata 7C199C 2KA/10KA/150A 3/R28 CY7C199-VC CY7C199-PC

solder paste 63sn alpha metal

Abstract: EME-6300H Die to Package edge clearance: 65 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Dipped, 63%Sn, 37 , /SOJ Die to Package edge clearance: 65 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Dipped, 63 , CerDIP Die to Package edge clearance: 62 mils per side Mold Compound Name/Manufacturer: Lead
Cypress Semiconductor
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CY7C245A CY7C291A CY7C293A solder paste 63sn alpha metal sumitomo silver epoxy 7C245E 7C291E CY7C245A/CY7C291A/CY7C293A

sumitomo silver epoxy

Abstract: EME-6300H mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R , Leaded Chip Carrier Die to Package edge clearance: 66 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Die Attach , edge clearance: 115 mils per side Mold Compound Name/Manufacturer: Lead Frame material: N/A , -pin Rectangular Leadless Chip Carrier Die to Package edge clearance: 83 mils per side Mold Compound Name
Cypress Semiconductor
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CY7C460 CY7C462 CY7C464 CY7C470 CY7C472 CY7C474 mold compound P2868 CY7C46X/47X

sumitomo 6300h mold compound

Abstract: 93191 Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish , ) Die to Package edge clearance: 99 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Plated, 85%Sn, 15 , : 78 mils per side Mold Compound Name/Manufacturer: Lead Frame material: N/A Alloy 42 Lead , (stepping) Design Rule (µ) µ Fabrication Passivation Mold Type Compound Assembly Line
Cypress Semiconductor
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CY7C198 93191 7C199A 500AT PLTO/15 CY7C199-DC CY7C199-DMB

Ablestik 84-1

Abstract: Ablestik RoHS Die attach RoHS Mold compound RoHS terminal finish Standard Die attach Standard Mold compound , BSC 0.014 to 0.019 0.005 to 0.0098 25um Au Ablestik 84-1 LMISR4 Sumitomo 6300H 100% Matte Sn , 0.054 to 0.068 0.05 BSC 0.014 to 0.019 0.004 to 0.0098 25um Au Ablestik 84-1 LMISR4 Sumitomo G600 100% Matte Sn Ablestik 84-1 LMISR4 Sumitomo G600 85/15 Sn/Pb Laser Change Schedule Customers
Mindspeed Technologies
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MP8000AN Ablestik 84-1 Ablestik Ablestik LMISR4 Ablestik 84-1 lmis-r4 LMISR4 G600 mold compound CN-102609 M02045-2Y04-T M02045G-2Y04-T

cmos SRAM 35ns 8k X 8 dip

Abstract: 7C166 side (600-mil) Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R , clearance: 48 mils per side (300-mil) Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Plate, 80%Sn, 20%Pb Die Attach Area , ) Design Rule (µ) µ Fabrication Passivation Mold Primary ESD Volt Type Compound Assembly Rating , (PlasticP Alloy 42 (Ceramic) Plastic DIP,SO,PLCC CerDIP,LCC,FPACK Mold Compound: Die Attach Mat
Cypress Semiconductor
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CY7C161 CY7C162 CY7C164 CY7C166 CY7C185 CY7C186 cmos SRAM 35ns 8k X 8 dip 7C166

data retention eprom Cypress

Abstract: p20d side (32-lead Rectangular PLCC) Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo , clearance: 77 mils per side (300-mil) 217 mils per side (600-mil) Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Dipped , edge clearance: 75 mils per side (300-mil) 139 mils per side (600-mil) Mold Compound Name , mils per side (28-lead Square) 156 mils per side (32-lead Rectangular) Mold Compound Name
Cypress Semiconductor
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CY7C261 CY7C263 CY7C264 CY7C266 CY7C269 data retention eprom Cypress p20d CERPAK Cypress Semiconductor Qualification Report 8k x 8 cy7c261 7c26 600-MIL

PAL16L8

Abstract: Epoxy Sumitomo 1085 per side (PAL16L8) 325 mils per side (CY7B145) Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper (Olin 194) Lead Finish, composition: Solder Plated, 85 , Package edge clearance: 95 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper (Olin 194) Lead Finish, composition: Solder Plated, 85%Sn, 15
Cypress Semiconductor
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PAL20 CY7B185-VC Epoxy Sumitomo 1085 cy7b185 CY7B145/CY7B185/PAL16L8 CY7B185 7B145A 6A185A/B 6A310C

CDA194

Abstract: 9731 : Qualification Vehicle: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead , CPS (ChipPac, China) 16 PDIP 300 Sumitomo 6300H Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 , : Qualification Vehicle: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead , Range: FAILS 0 0 DS2404 ATK (Amkor, K) 16 SOIC 300x2.3 Sumitomo 6300H Stamped Copper , Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire
Maxim Integrated Products
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9731 94-V0 J-STD-020 MIL-STD-883-2009

LMISR4

Abstract: J-STD20A Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Theta JA: Theta JC , 175 Å DS1685 ATEC 24 PDIP 600 Sumitomo 6300H Stamped Alloy 42 SnPb Dip 84-1 LMISR4 Epoxy , Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Theta JA: Theta JC , Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Theta JA , SOIC 300x2.3 Sumitomo 6300H Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled
Dallas Semiconductor
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J-STD20A J-STD-20A copper bond wire amkor ti 9841 copper bond wire ablebond MIL-STD-883-2012 MIL-STD-883-2016 MIL-STD-883-2015 MIL-STD-883-2004

CY7B185

Abstract: CY7B922 Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish , side; y= 195 mils per side Mold Compound Name/Manufacturer: Lead Frame material: N/A N/A , Passivation Mold Assembly Type Compound Line Location ESD Volt Availabilit Rating y (mm/yy , : Mold Compound: Silver Epoxy Cypress Test No. Stress/Test Package Loc: Reference Method BiCMOS Process Loc: Round Rock, TX Sumitomo EME-6300H(R) Lead Frame: Copper Omedata
Cypress Semiconductor
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CY7B991 CY7B992 SM23B CY7B922 clock buffer FITS CY7B991-LMB 7B991A/7B992A 6A166 JEDEC22
Showing first 20 results.