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sot355 Datasheet

Part Manufacturer Description PDF Type
SOT355-1 NXP Semiconductors Footprint for reflow soldering Original
SOT355-1 NXP Semiconductors Plastic thin shrink small outline package; 24 leads; body width 4.4 mm Original
SOT355-1 NXP Semiconductors Footprint for reflow soldering SOT355-1 Original
SOT355-1_118 NXP Semiconductors TSSOP24; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 Original

sot355

Catalog Datasheet MFG & Type PDF Document Tags

SOT355-1

Abstract: 12NC SOT355-1 Standard product orientation 12NC ending 118 Rev. 01 - 24 April 2009 Packing , ) SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT355-1 118 330 x 22 2500 1 339 x 335 x 25 SOT355-1 NXP Semiconductors Standard product orientation 12NC , (mm) K0 (mm) T (mm) P1 (mm) W (mm) 6.95 8.30 1.6 - 8.0 16 SOT355-1_1 © NXP B.V. 2006. All rights reserved. Rev. 01 - 24 April 2009 2 of 4 SOT355-1 NXP
NXP Semiconductors
Original
12NC NXP 12NC ending 12NCending

TDA5051AT

Abstract: -1 PCT2202UK SOT1353-1 SOT616-1 SOT662-1 SOT763-1 SOT762-1 SOT616-1 SOT662-1 SOT758-1 SOT629-1 SOT355-1 , -1 SOT1353-1 SOT1354-1 SOT355-1 SOT360-1 SOT361-1 SOT402-1 SOT403-1 SOT505-1 SOT519-1 SOT530 , -1 SOT629-1 Panel E - OM13495 TSSOP24 TSSOP20 TSSOP16 TSSOP14 SOT355-1 SOT360-1 SOT403-1 SOT402 , -1 SOT360-1 SOT402-1 SOT361-1 SOT361-1 SOT361-1 SOT616-1 SOT355-1 SOT505-1 SOT402-1 SOT355-1 , -1 SOT996-2 SOT552-1 SOT763-1 SOT758-1 SOT403-1 SOT764-1 SOT360-1 SOT815-1 SOT616-1 SOT355-1
NXP Semiconductors
Original
TDA5051AT OM13491 OM13492 OM13493 OM13494 OM13496 OM13497
Abstract: SO P2 4 TS SOT355-1 TSSOP24; Reel pack; SMD, 13" Q1/T1 Standard product orientation , 2500 1 341 x 338 x 30 SOT355-1 NXP Semiconductors TSSOP24; Reel pack; SMD, 13" Q1/T1 , ) Packing information K0 (mm) T (mm) P1 (mm) W (mm) 6.95 SOT355-1_118 B0 (mm) 8.3 , . Rev. 4 â'" 15 April 2013 © NXP B.V. 2013. All rights reserved. 2 of 4 SOT355-1 NXP , Schematic view of reel Table 3. Reel dimensions In accordance with IEC 60286-3. D (mm) 330 SOT355-1_118 NXP Semiconductors
Original

74hc

Abstract: SOT27-1 -1 SOT338-1 SOT403-1 74HC/HCT154 24 SOT101-1 SOT137-1 SOT340-1 SOT355-1 74HC , -1 SOT340-1 SOT355-1 74HC/HCT181N3 24 SOT222-1 74HC/HCT182 16 SOT38-4 SOT109 , -1 74HC/HCT646 24 SOT101-1 SOT137-1 SOT340-1 SOT355-1 74HC/HCT646N3 24 SOT222-1 74HC/HCT648 24 SOT101-1 SOT137-1 SOT340-1 SOT355-1 74HC/HCT648N3 24 SOT222-1 74HC/HCT652 24 SOT101-1 SOT137-1 SOT340-1 SOT355-1 74HC/HCT670 16 SOT38
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Original
74hc SOT27-1 sot27 SOT109-1 SOT163-1 SOT38 74HC/HCT00 74HC/HCT02 74HC/HCT03 74HC/HCT04 74HC/HCTU04 74HC/HCT08

74HC154N

Abstract: hct154 SOT101-1 4-to-16 Line 15 Decoder/Demultiplexer (DIP24) SOT355-1 4-to-16 Line 15 (TSSOP24) Decoder , Enabled 4-to-16 Line SOT355-1 Decoder/Demultiplexer; 15 (TSSOP24) TTL Enabled TTL Low 74HCT154N , production online order this - product Full production online order this product SOT355-1 Standard , Standard Marking * SOT355-1 online 74HC154PW-T 9351 825 80118 Reel Pack, SMD, (TSSOP24) Full production , order this Bulk Pack, CECC (DIP24) product SOT355-1 Standard Marking * 74HCT154PW 74HCT154PW 9351 825
Philips Semiconductors
Original
74HC154N hct154 sot355 74HC/HCT/HCU/HCMOS 74HC/HCT/HCMOS

SOT355-1

Abstract: TSSOP24 PDF: 2003 Mar 24 Philips Semiconductors Package outline TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm D SOT355-1 E A X c HE y v M A Z 13 24 Q A2 (A 3) A1 pin 1 index A Lp L 1 12 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 , protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT355-1 REFERENCES IEC
Philips Semiconductors
Original
MO-153

MO-153-AD

Abstract: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1 D E A X c y HE v M A Z 24 13 Q A2 pin 1 index A1 (A 3) A Lp L 1 e bp 12 w M detail X 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.10 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 , VERSION SOT355-1 REFERENCES IEC JEDEC MO-153AD EIAJ EUROPEAN PROJECTION ISSUE DATE 93-06-16 95-02-04
Philips Semiconductors
Original
MO-153-AD

tssop24 datasheet

Abstract: SOT355-1 PDF: 2000 Jan 05 Philips Semiconductors Package outline TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm D SOT355-1 E A X c HE y v M A Z 13 24 Q A2 (A 3) A1 pin 1 index A Lp L 1 12 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 , protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT355-1 REFERENCES IEC
Philips Semiconductors
Original
tssop24 datasheet JEDEC MO-153
Abstract: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP24 package SOT355-1 Hx Gx P2 (0.125) Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 P2 Ay By C D1 D2 Gx Gy Hx , SOT355-1_fp PDF © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 8 October Philips Semiconductors
Original
Abstract: Package outline TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm D SOT355-1 E A X c HE y v M A Z 13 24 Q A2 pin 1 index (A 3) A1 A θ Lp 1 L 12 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2 , included. OUTLINE VERSION REFERENCES IEC SOT355-1 www.nxp.com JEDEC MO-153 © 2008 NXP NXP Semiconductors
Original

LCD 09151

Abstract: HVQFN24 number GTL2002 Type number SOT355-1 (TSSOP24) SOT616-1 (HVQFN24) Voltage Translation , 4-1 1 SOT137-1 (SO24) SOT355-1 (TSSOP24) 1 1 PCA9516 1 1 SOT96-1 (SO8 , 100.0 SOT616-1 (HVQFN24) SOT137-1 (SO24) SOT355-1 (TSSOP24) SOT96-1 (SO8) SOT505-1 (TSSOP8 , -1 (TSSOP16) SOT616-1 (HVQFN24) SOT137-1 (SO24) SOT355-1 (TSSOP24) SOT96-1 (SO8) SOT505-1 (TSSOP8) 8 , PCA9555 SOT616-1 (HVQFN24) SOT137-1 (SO24) SOT340-1 (SSOP24) SOT355-1 (TSSOP24) 16 -40~85
Philips Semiconductors
Original
LCD 09151 PCA9504A philips pcf i2c SO24 HVQFN20 SOT96- 1 PCA9554 HVQFN16 SSOP16 PCA9556 PCA9557 TSSOP28
Abstract: -1 0.8 to 3.6 6.0 DHVQFN24 SOT815-1 0.8 to 3.6 6.0 TSSOP24 SOT355-1 74AVC(H , 5.4 DHVQFN24 SOT815-1 1.2 to 5.5 5.4 TSSOP24 SOT355-1 1.1 to 3.6 5.7 , -pin SOT891 SOT505 SOT109-1 SOT403-1 SOT763-1 SOT355-1 1.00 3.00 6.00 6.40 2.50 NXP Semiconductors
Original

74HC4514d Logic Package Information

Abstract: smd marking 710 24 + Low Power or Battery Applications CMOS Low 4-of-16 Decoder/Demultiplexer SOT355-1 , SOT355-1 with Input Latches; 74HCT4514PW 15 (TSSOP24) Outputs LOW at Data Input HIGH; TTL Enabled 4 , 74HC4514PW 74HC4514PW SOT355-1 (TSSOP24) Full production 74HC4514PW-T Standard Marking SOT355-1 , 74HCT4514PW 74HCT4514PWT 74HCT4514U 9352 624 14112 Standard Marking * Bulk Pack SOT355-1 (TSSOP24) Full production Standard Marking SOT355-1 9352 624 14118 * Reel Pack, SMD, (TSSOP24) Full production
Philips Semiconductors
Original
74HC4514d Logic Package Information smd marking 710 demultiplexer containing latch 74HC4514 74HC/HCT4514 4000B NAU000

SA00215

Abstract: -1 SOT137-1 SOT340-1 SOT355-1 PIN CONFIGURATION T/R 1 24 OE 23 B0 22 B1 21 B2 20 B3 19 GND TOP VIEW 18 , SOT222-1 SOT137-1 SOT340-1 SOT355-1 1995 Dec 11 9 Philips Semiconductors Product , None TTL High Octal Transceiver with Parity SOT355-1 74ABT657PW Generator/Checker; 4~6 , SOT355-1 (TSSOP24) Full production 74ABT657PW 74ABT657PW 74ABT657PWT order this product online , order this - product Standard Marking SOT355-1 online 9351 789 00118 * Reel Pack, SMD, (TSSOP24
Philips Semiconductors
Original
SA00215 74ABT657

MARKING CODE SMD IC 531

Abstract: 74abt374 Philips DB 7ABT646APW DH DWG NUMBER SOT222-1 SOT137-1 SOT340-1 SOT355-1 PIN CONFIGURATION CPAB SAB DIR A0 , outline package; 24 leads; body width 4.4 mm SOT355-1 1998 Feb 17 13 Philips Semiconductors , (SSOP24) (3-State) SOT222-1 Transceiver/Register 4~6 (3-State) (DIP24) SOT355-1 Transceiver/Register 4~6 , production online 74ABT646AN 74ABT646AN 9351 926 50112 order this (DIP24) * Tube product SOT355-1 Standard , Standard Marking SOT355-1 online 74ABT646APW9351 926 60118 * Reel Pack, SMD, (TSSOP24) Full production
Philips Semiconductors
Original
MARKING CODE SMD IC 531 74abt374 Philips 74ABT646A 74ABT245 74ABT374

diode marking code A6 packages

Abstract: SOT355­1 PIN CONFIGURATION PIN DESCRIPTION PIN NUMBER 1 13 SYMBOL OE BIASV A1­A10 B1­B10 GND VCC , shrink small outline package; 24 leads; body width 4.4 mm SOT355-1 1999 Oct 28 6 Philips , Marking * Reel Pack, SMD, 9352 648 24118 13" buy online SOT355 Full production package device status SOT355 Full production - Partnumber CBT6800PW Find similar products: CBT6800 links to the similar
Philips Semiconductors
Original
diode marking code A6 packages JESD78 JESD22-A114 JESD22-A115 JESD22-C101

CBT3384

Abstract: CBT3384D mm SOT556-1 CBT3384PW -40 °C to +85 °C TSSOP24 SOT355-1 [1] Also known as QSOP24 , configuration for SSOP24 (SOT340-1) and TSSOP24 (SOT355-1) CBT3384_6 Product data sheet © NXP B.V , SOT355-1 E A X c HE y v M A Z 13 24 Q A2 (A 3) A1 pin 1 index , . OUTLINE VERSION SOT355-1 REFERENCES IEC JEDEC JEITA MO-153 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 11. Package outline SOT355-1 (TSSOP24) CBT3384_6 Product data sheet
NXP Semiconductors
Original
CBTD3384 JESD22-A114E CBT3384D CBT3384DB CBT3384DK JESD22-C101C
Abstract: shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm Version SOT355-1 SOT556 , . Pin configuration for TSSOP24 (SOT355-1) Fig 3. Pin configuration for SSOP24 (SOT556 , leads; body width 4.4 mm SOT355-1 D E A X c y HE v M A Z 24 13 Q A2 pin 1 , . Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT355-1 , SOT355-1 (TSSOP24) CBT3861 All information provided in this document is subject to legal disclaimers NXP Semiconductors
Original
JESD22-A114F CBT3861PW CBT3861DK CBT3861BQ

TSSOP24

Abstract: Philips Semiconductors Package outlines TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm 1995 Feb 04 631 SOT355-1 Philips Semiconductors
Philips Semiconductors
Original
Abstract: SOT355-1 CBT3861DK ï'­40 ï'°C to +85 ï'°C SSOP24[1] plastic shrink small outline package; 24 , 13 B10 GND 12 13 B10 001aam473 001aam472 Fig 2. Pin configuration for TSSOP24 (SOT355-1 , thin shrink small outline package; 24 leads; body width 4.4 mm D SOT355-1 E A X c HE , . Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT355-1 , 8. Package outline SOT355-1 (TSSOP24) CBT3861 Product data sheet All information provided in NXP Semiconductors
Original
Abstract: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm Version SOT355 , 10 A10 11 GND 12 Fig 2. Pin configuration for TSSOP24 (SOT355-1) Fig 3. Pin configuration , ; body width 4.4 mm SOT355-1 D E A X c y HE v M A Z 24 13 Q A2 pin 1 index A1 , protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT355-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 8. Package outline SOT355-1 (TSSOP24 NXP Semiconductors
Original

CBT3861DK

Abstract: CBT3861 24 pins shrink small outline package; 24 leads; body width 4.4 mm SOT355-1 CBT3861DK 40 C to +85 C , Pin configuration for TSSOP24 (SOT355-1) CBT3861 Product data sheet Fig 3. Pin , thin shrink small outline package; 24 leads; body width 4.4 mm D SOT355-1 E A X c HE , . Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT355 , 8. Package outline SOT355-1 (TSSOP24) CBT3861 Product data sheet All information provided in
NXP Semiconductors
Original
CBT3861 24 pins
Abstract: -pin TSSO P 7.5ns 0 to +70°C Vc c = 5.0V ±5% SOT355-1 P5Z22V10â'" DA 28-pin PLCC , 5.0V ±5% SOT355-1 P5Z22V10IDA 28-pin PLCC 10ns - 4 0 to +85°C VCc = 5.0V  , -1 P5Z22V10IDDH 24-pin TSSO P 10ns - 4 0 to +85°C VCc = 5.0V ±10% SOT355-1 1997 May 02 2 , shrink small outline package; 24 leads; body width 4.4 mm T ïi0 0 V SOT355-1 1/ ]^ - |v , protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT355-1 1997 May 02 -
OCR Scan
XCR22V10 XCR22 22V10 075E05 MS-013AD
Abstract: 0.635 mm SOT556-1 CBT3384PW â'40 °C to +85 °C TSSOP24 SOT355-1 [1] Also known as , configuration for SSOP24 (SOT340-1) and TSSOP24 (SOT355-1) CBT3384_6 Product data sheet © NXP B.V , shrink small outline package; 24 leads; body width 4.4 mm D SOT355-1 E A X c HE y , protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT355-1 REFERENCES IEC , outline SOT355-1 (TSSOP24) CBT3384_6 Product data sheet © NXP B.V. 2009. All rights reserved NXP Semiconductors
Original
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