SOT117-1 |
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Philips Semiconductors
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Dip28: Plastic Dual In-line Package 28 Leads (600 Mil) |
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Original |
PDF
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SOT1172-1 |
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NXP Semiconductors
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Plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad |
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Original |
PDF
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SOT1172-2 |
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NXP Semiconductors
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Plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad |
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Original |
PDF
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SOT1172-2_118 |
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NXP Semiconductors
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HTSSOP28; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
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Original |
PDF
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SOT1172-3 |
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NXP Semiconductors
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Plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad |
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Original |
PDF
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SOT1173-1 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; resin based |
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Original |
PDF
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SOT1174-1 |
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NXP Semiconductors
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Plastic, extremely thin quad flat package; no leads 12 terminals |
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Original |
PDF
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SOT1174-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT1174-1 |
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Original |
PDF
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SOT1174-1 |
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NXP Semiconductors
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SOT1174 _T1_ packing info 12NC ending 115 |
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Original |
PDF
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SOT1174-1_115 |
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NXP Semiconductors
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Standard product orientation 12NC ending 115 |
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Original |
PDF
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SOT1175-1 |
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NXP Semiconductors
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Plastic small outline package; 7 leads; body width 3.9 mm |
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Original |
PDF
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SOT1176-1 |
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NXP Semiconductors
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Reflow soldering footprint1176-1 |
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Original |
PDF
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SOT1176-1 |
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NXP Semiconductors
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Plastic extremely thin small outline package; no leads; 10 terminals |
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Original |
PDF
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SOT1177-1 |
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NXP Semiconductors
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Plastic extremely thin small outline package; no leads; 10 terminals |
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Original |
PDF
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SOT1178-1 |
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NXP Semiconductors
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Plastic extremely thin small outline package; no leads; 9 terminals |
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Original |
PDF
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SOT1178-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT1178-1 |
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Original |
PDF
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SOT1179-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT1179-1 |
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Original |
PDF
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SOT1179-1 |
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NXP Semiconductors
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Plastic thermal enhanced very thin small outline package; no leads; 12 terminals |
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Original |
PDF
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SOT1179-1_135 |
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NXP Semiconductors
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HVSON12; reel pack; standard product orientation; 12NCending 135 |
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Original |
PDF
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SOT1179-2 |
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NXP Semiconductors
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Plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 4 x 6 x 0.85 mm |
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Original |
PDF
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