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Part Manufacturer Description Datasheet BUY
EL6201CW-T7 Intersil Corporation SPECIALTY INTERFACE CIRCUIT, PDSO5, SOT-23, 5 PIN visit Intersil
EL6203CW-T13 Intersil Corporation SPECIALTY INTERFACE CIRCUIT, PDSO5, SOT-23, 5 PIN visit Intersil

sot-227 footprint

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: packages, allowing design engineers the capability to control more power within a smaller footprint , within a smaller footprint 170V-300V GigaMOSTM Power MOSFETs Summary Table Part Number Vdss (max , 1150 PLUS247 IXFN260N17T 170 245 6.5 24 400 200 0.138 1090 SOT-227 , 7.5 28 378 200 0.138 1090 SOT-227 IXFN180N25T 250 155 12.9 28 345 200 0.138 900 SOT-227 IXFK180N25T 250 180 12.9 28 345 200 0.09 IXYS
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300V dc dc boost converter 300V dc to dc boost converter PLUS-247 TO264 footprint ZVS boost converter APT30M19JVR IXFN160N30T PBGIGAMOS170300MOSFET
Abstract: designers the ability to control more power within a smaller footprint. Furthermore, these new devices , -264, PLUS247 (hole-less TO-247 variant) and miniBLOC SOT-227. These devices provide designers the best , current rated MOSFET devices Provides the ability to control more power within a smaller footprint , 100 1250 PLUS247 IXFN520N075T2 75 480 1.90 41000 545 150 940 SOT-227 , 140 1250 TO-264 IXFN240N15T2 150 240 5.20 32000 460 140 830 SOT-227 IXYS
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hybrid car charger inverter dc link capacitor EV Battery ups circuit mosfet for dc to ac inverter dc to dc full-bridge
Abstract: SOT-227 packages. FULL BRIDGE VCES (V) 12 mm 24 45 70 99 99 120 1.5/75 1.5/75 1.5 , SOT-227 parts - Height compatible with SOT-227 - Copper base plate SP3 - Replaces up to 4 SOT-227 parts - Height compatible with SOT-227 - Copper base plate BOOST CHOPPER + FULL BRIDGE VCES (V , Replaces up to 5 SOT-227 parts THREE LEVEL INVERTER VCES (V) Technology TRENCH 600 NPT fast 1200 TRENCH 4 VCES (V) Technology SP6 Same footprint and pinout location as 62mm package Microsemi
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LX2400 IEC61215 SAS1045L/LH SASMS1045L/LH UPS1040 600VBR
Abstract: thermal performance while maintaining the same footprint of an un-isolated standard package. Higher , -220 TO-3P TO-263 TO-247 TO-220 TO-3P TO-263 TO-247 TO-220 TO-3P ISOPLUS247 TO-264 PLUS247 SOT-227 TO-264 PLUS247 SOT-227 ISOPLUS247 TO-264 PLUS247 SOT-227 ISOPLUS247 Application Circuits IXYS
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IXTA52P10P to-247 to-220 to-3p IXTA36P15P IXTQ52P10P ixtq IXTA10P50P FQB34P10 IRF5210S/L
Abstract: TO-263 [SA] TO-247[B] T-MAX®[B2] TO-264[L] 264-MAX TM[L2] ISOTOP®[J] SOT-227 , 13 20 18 40 kHz 8 11 17 19 5 ISOTOP®[J] SOT-227 C APT15GT120BRDQ1 TO-247 G , footprint. . Designed to meet the most advanced SMPS design requirements for higher reliability, power , - Package Style 264-MAX TM[L2] APT5510JFLL APT55M65JFLL APT55M50JFLL ISOTOP®[J] SOT-227 , part number 264-MAX TM[L2] APT14050JVFR - APT40M35JVFR - ISOTOP®[J] SOT-227 Microsemi
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VRF2933 SP6-P APT35GP120JDQ2 DRF1200 ARF1511 ARF521
Abstract: 11.2 12.6 14 15.4 16.8 15.2 16.7 18.7 20.7 22.7 17 19 21.1 23.2 25.5 200 225 225 , 2 0.079 2.0 0.035 0.9 G 0.031 0.8 inches mm C SOT-23 Footprint D H K J CASE 318-07 PLASTIC (Refer to Section 10 for Surface Mount, Thermal Data and Footprint Motorola
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BZX84C2V4LT1 BZX84C2V7LT1 BZX84C3V0LT1 BZX84C3V3LT1 BZX84C3V6LT1 SOT-23 marking 77 SOT-23 marking Z1 zener y21 y13 sot-23 Z13 sot zener y11
Abstract: 85 LBZX84C24LT1G Y9 22.8 24 25.6 70 22.7 25.5 250 22.9 25.7 25 , ) mm SOT-23 Footprint (Refer to Section 10 for Surface Mount, Thermal Data and Footprint Leshan Radio Company
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LBZX84C3V3LT1G LBZX84C5V1LT1G LBZX84C15LT1G LBZX84C75LT1G lbzx84c5v6lt1g LBZX84C3V6LT1G LBZX84XXXXLT1G 236AB 3000/T LBZX84XXXXLT3G 10000/T BZX84C
Abstract: 8 10.2 11.2 12.3 13.7 15.2 16.7 18.7 20.7 22.7 25 27.8 30.8 33.8 36.7 39.7 43.7 47.6 51.5 57.4 , . ANODE NO CONNECTION CATHODE -O ' a CASE 318-07 PLASTIC SOT-23 Footprint (R e fe rto Section 10 fo r Surface Mount, Therm al Data and Footprint Inform ation.) MULTIPLE PACKAGE QUANTITY (MPQ -
OCR Scan
MARKING ZE SOT-23 212 s sot-23 LTA 703 S marking ar sot-23 TVS marking LZ ON Y1 SOT-23 BZX84C3V9LT1 BZX84C4V3LT1 BZX84C4V7LT1 BZX84C5V1LT1 BZX84C5V6LT1 BZX84C6V2LT1
Abstract: 24 20.8 23.3 22.8 25.6 55 70 0.05 15.4 20.7 23.2 0.05 16.8 22.7 25.5 250 250 20.9 , ( inches ) mm SOT-23 Footprint (Refer to Section 10 for Surface Mount, Thermal Data and Footprint Leshan Radio Company
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BZX84C12LT1
Abstract: 22.7 25.5 250 22.9 25.7 25 0.05 16.8 18.4 22.0 80 VZ1 Below @ IZT1 = , K J 0.035 0.9 0.031 0.8 ( inches ) mm SOT-23 Footprint (Refer to Section 10 for Surface Mount, Thermal Data and Footprint Information.) MULTIPLE PACKAGE QUANTITY (MPQ) REQUIREMENTS Leshan Radio Company
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LBZX84C2V4LT1G LBZX84C36LT1G LBZX84C7V5LT1 LBZX84C4V3LT1G LBZX84C6V2LT1G LBZX84C9V1LT1G LBZX84C2V4LT3G
Abstract: LBZX84C24LT1 Y8 Y9 22 24 20.8 23.3 22.8 25.6 55 70 0.05 15.4 20.7 23.2 0.05 16.8 22.7 25.5 , ( inches ) mm SOT-23 Footprint (Refer to Section 10 for Surface Mount, Thermal Data and Footprint Leshan Radio Company
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LBZX84C20LT1 2J225 LBZX84C16LT1 LBZX84C3V0LT1 LBZX84C2V4LT1
Abstract: 22 24 20.8 23.3 22.8 25.6 55 70 0.05 15.4 20.7 23.2 0.05 16.8 22.7 25.5 250 250 , PLASTIC ( inches ) mm SOT-23 Footprint (Refer to Section 10 for Surface Mount, Thermal Data and Footprint Information.) MULTIPLE PACKAGE QUANTITY (MPQ) REQUIREMENTS Package Option Tape and Reel ETL Semiconductor
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Zener diode z12 15 marking y4 sot-23 marking y1 sot-23 BZX84C20LT1 bzx84c30lt1
Abstract: TO-220, TO-247, T-Max®, TO-264, and SOT-227. Customized products are available; contact factory for , ISOTOP®[J] SOT-227 C G E Current @ Frequency Test Conditions: Tj = 125oC, Tc = 100oC except Isotop , 2EDUCED%OFF 1200 ISOTOP®[J] SOT-227 C G Current @ Frequency Test Conditions: Tj = 125 C, Tc = , -264 T-MAX® or TO-264 ISOTOP® T-MAX® or TO-264 ISOTOP® APT53F80J ISOTOP® ISOTOP® ISOTOP®[J] SOT-227 , -264 packages - replace "B2" with "L" in part number ISOTOP®[J] SOT-227 (ISOLATED BASE) Datasheets Microsemi
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N-channel MOSFET 800v 50a to-247 DRF1400 SMPS 1000w IGBT REFERENCE DESIGN semiconductors cross reference APT10026L2FLLG IGBT triple modules 100A 10F-A
Abstract: 20.5 8.8 181 70 LESD5Z7.0T1G ZH 7.0 1.0 7.5 1.0 13.5 22.7 8.8 , SIDE VIEW RECOMMENDED SOLDERING FOOTPRINT* 2X 0.48 1.80 2X 0.40 PACKAGE OUTLINE Leshan Radio Company
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IEC61000 AEC-Q101 30KPCS/I 3000PCS/R 40KPCS/I 4000PCS/R
Abstract: 20.5 8.8 181 70 LESD5Z7.0T1G ZH 7.0 1.0 7.5 1.0 13.5 22.7 8.8 , SIDE VIEW RECOMMENDED SOLDERING FOOTPRINT* 2X 0.48 1.80 2X 0.40 PACKAGE OUTLINE Leshan Radio Company
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80KPCS/I 8000PCS/R 360KPCS/C 960KPCS/C
Abstract: 13.5 22.7 8.8 200 65 LESD5Z12T1G ZM 12 1.0 13.5 1.0 17 25 9.6 , FOOTPRINT* 2X 0.48 1.80 2X 0.40 PACKAGE OUTLINE DIMENSION: MILLIMETERS Rev.O 4/6 Leshan Radio Company
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IEC61000-4-2 IEC61000-4-4
Abstract: 20.5 8.8 181 70 LESD5Z7.0T1G ZH 7.0 1.0 7.5 1.0 13.5 22.7 8.8 , SIDE VIEW RECOMMENDED SOLDERING FOOTPRINT* 2X 0.48 1.80 2X 0.40 PACKAGE OUTLINE Leshan Radio Company
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Abstract: 11.2 12.6 14 15.4 16.8 15.2 16.7 18.7 20.7 22.7 17 19 21.1 23.2 25.5 200 225 225 , -23 Footprint D H K J CASE 318-07 PLASTIC (Refer to Section 10 for Surface Mount, Thermal Data and Footprint Information.) MULTIPLE PACKAGE QUANTITY (MPQ) REQUIREMENTS Package Option Type , 1.5 inches, using the Motorola minimum recommended footprint as shown in Figure 11. [2] Thermal , 14 15.4 16.8 15.2 16.7 18.7 20.7 22.7 17.0 19.0 21.1 23.2 25.5 200 225 225 250 Motorola
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Zener Diode SOT-23 929b 13.8 8w zener diode zener diode t5 MMSZ4V7T1 953b MOTOROLA 929B MMBZ5221BLT1
Abstract: 24 20.8 23.3 22.8 25.6 55 70 0.05 15.4 20.7 23.2 0.05 16.8 22.7 25.5 250 250 20.9 , 0.035 0.9 0.031 0.8 ( inches ) mm SOT-23 Footprint (Refer to Section 10 for Surface Mount, Thermal Data and Footprint Information.) MULTIPLE PACKAGE QUANTITY (MPQ) REQUIREMENTS Package Option Leshan Radio Company
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Abstract: 0.05 15.4 16.4 20.0 85 LBZX84C24LT1G Y9 22.8 24 25.6 70 22.7 25.5 , K J 0.035 0.9 0.031 0.8 ( inches ) mm SOT-23 Footprint (Refer to Section 10 for Surface Mount, Thermal Data and Footprint Information.) MULTIPLE PACKAGE QUANTITY (MPQ) REQUIREMENTS Leshan Radio Company
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LBZX84C LBZX84CXXXLT1G LBZX84CXXXLT3G
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