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Part Manufacturer Description Last Check Distributor Ordering
SOP8-DIP8 PRO Batronix Elektronik ADAPTOR, SOIC8-DIP8 8 from $136.64 (Sep 2016) element14 Asia-Pacific Buy
SOP8-DIP8 PRO Batronix Elektronik ADAPTOR, SOIC8-DIP8 10 from £100.82 (Sep 2016) Farnell element14 Buy
SOP8-DIP8 PRO Batronix Elektronik ADAPTOR, SOIC8-DIP8; Convert From:8-DIP; Convert To:8-SOIC; Pitch Spacing:-; Row Pitch:-; Product Range:-; Supported Devices:24AA164, AK6002A, 93AA66 and more ;RoHS Compliant: Yes 8 from $134.45 (Sep 2016) Newark element14 Buy
SOP8501-TL-E ON Semiconductor Bipolar transistor 135 from $0.3370 (Sep 2016) Chip1Stop Buy

sop-8 smd type

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: response. High common mode rejection voltage. Standard dual-inline package. 8-pin DIP SMD H 25 , transfer ratio. High isolation voltage. Compact dual-in-line package. 8-pin DIP SMD H 50 5000 , voltage. Compact dual-in-line package. 8-pin DIP SMD H 50 5000 300 600 1 60 100 , 0.83 2.50 0.4 0.8 5-50 5 1 100 550 3750 8-pin SMD ±60 0.83 2.50 , 5 1 100 550 3750 8-pin SMD 350 20 30 0.13 6 5-50 5 1 100 ... World Products
Original
datasheet

9 pages,
256.39 Kb

SMD ZC 4pin relay WPPCT-N1044 WPPCT-N564 wppctn546 WPPM-0626A 4068D D4106 Solenoid valve 100 SMD DIP triac mw 137 valve controls "AC Motor" APPLICATIONS WPPC-D11064 WPPM-0688A Z566 WPPM-3588A WPPM-2026S WPPC-A11064 "AC Motor" TEXT
datasheet frame
Abstract: 1 Form B 2A: 2 Form A / 2B: 2 Form B Load type 0: DC / 1: AC&DC Type 2: DIP / 3: SMD / 4: SOP , / 200VAC 200VAC&DC SMD / 200VAC 200VAC&DC SMD / 200VAC 200VAC&DC SOP / 200VAC 200VAC&DC SOP / 200VAC 200VAC&DC PAGE 8/20 A31061 A31061 , ) DATE. (4) TESTER NO. 6. MARKING SYSTEM EPR 8 2A 06 T X Special number Type & Package : T: Through hole type M: SMD type S: SOP type F: DC output & through hole N: DC output & , diagram (8 PIN) Load type Application AC&DC DC ZET TLER electronics GmbH ... Excel Cell Electronic
Original
datasheet

20 pages,
485.4 Kb

EPR212A408000 EPR312A408000 EPR81C20S EPR81C20T EPR81C40M EPR82A20S smd marking vl EPR312A208100 100 SMD DIP EPR82A20M EPR82A06T EPR82A EPR82A06S EPR82B40M epr82a40 EPR81C40T EPR82A40m EPR82A06M EPR82A40s EPR82A40T TEXT
datasheet frame
Abstract: POWER MOSFET 20V MOSFET series SOP-8 N-Channel, Enhancement type Absolute Maximum , STO-220 STO-220 (SMD 74-3) 78-4 E-pack (SMD 77-4) STO-220 STO-220 *1 SOP-8 92 D: Dual; C , series SOP-8 N-Channel, Enhancement type Absolute Maximum Ratings Electrical Characteristics , 30 2 4 150 600 ±30 8 16 *1 : Leaded package - Fig. 76-2; SMD package - Fig. 74-3 , 1.4 2150 50 140 440 *2: Leaded package - Fig. 76-2; SMD package - Fig. 74-3 1 · 8 0 ... Shindengen America
Original
datasheet

3 pages,
86.06 Kb

2SJ487 2SK2818 2SK2819 F10H3N F4H3C 2SJ488 2SK2817 F7H3P F9H4N 2SK2821 2SK2816 2SJ489 2SK2820 FTO-220 2sk2333 STO-220 SMD 743 TEXT
datasheet frame
Abstract: Packing 0: IC Tube 1: Tape & Reel Pin out 4: 4pin / 6: 6pin / 8: 8pin Load Voltage 06: 60V / 10: 100V / 20: 200V / 35: 350V / 40: 400V / 60: 600V Contact type 1A: 1 Form A / 1B: 1 Form B / 1C: 1 Form A + 1 Form B 2A: 2 Form A / 2B: 2 Form B Load type 0: DC / 1: AC&DC Type 2: DIP / 3: SMD / 4: SOP , SYSTEM EPR 6 1A 06 T X Special number Type & Package : T: Through hole type M: SMD type S: SOP type F: DC output & through hole N: DC output & SMD K: DC output & SOP Load ... Excel Cell Electronic
Original
datasheet

11 pages,
406.42 Kb

MARK B 6PIN F MARKING 6PIN EXCEL SMD E155181 ci 6pin smd EPR61A06T smd marking vl 1B SMD MARKING Zettler Electronics EPR311A406100 smd 1C top mark smd mos relay zettler EPR61A40S EPR61B40T epr61a40 EPR61A20T D-82178 EPR61A40M EPR61A40T TEXT
datasheet frame
Abstract: : 6pin / 8: 8pin - Load voltage: 06: 60V, 20: 200V, 35: 350V, 40: 400V, 60: 600V Contact type: 1A: 1 , & DC - Type: 2: DIP / 3: SMD / 4: SOP Series name: EPR: MOS RELAY MARKING SYSTEM R 6 1A 40 T Packing: T: Through hole, M: SMD type, S: SOP type, F: DC output & through hole, N: DC output , Package Per Reel 1000 pcs for SMD Type TYPE B 0 ± 0 .1 F 0 ± 0 .1 W 0 ± 0 .3 4P 5 , TYPE) (SMD TYPE) 6 6 5 5 Ö C M C o M t£ > o o 2 4 U0 -2 3 ... OCR Scan
datasheet

5 pages,
281 Kb

TEXT
datasheet frame
Abstract: 1 Form B 2A: 2 Form A / 2B: 2 Form B Load type 0: DC / 1: AC&DC Type 2: DIP / 3: SMD / 4: SOP , / 200VDC 200VDC SMD / 200VDC 200VDC SOP / 200VDC 200VDC SOP / 200VDC 200VDC PAGE 8/16 A31060 A31060 97 pcs/Tube 97 pcs/Tube 1A , T X Special number Type & Package : T: Through hole type F: DC output & through hole M: SMD type N: DC output & SMD S: SOP type K: DC output & SOP Load voltage 06: 60V / 10: 100V / 20: 200V , Packing 0: IC Tube 1: Tape & Reel Pin out 4: 4pin / 6: 6pin / 8: 8pin Load Voltage 06: 60V / 10: 100V ... Excel Cell Electronic
Original
datasheet

16 pages,
429.34 Kb

41A40S 41A20S EPR411A204100 1b.1 smd transistor ECE relay 41A06M EPR401A404000 EPR311A404000 smd 1C EPR311A064000 41B40S EPR411A064100 41A06T 41A20T EPR411A064000 EPR411A064 41A40T 41A06 41A06S TEXT
datasheet frame
Abstract: :AC&DC Package type: 2:DIP, 3:SMD, 4:SOP Series name: EPR:MOS RELAY For the latest product , ! MARKING SYSTEM EPR 6 1A 40 T Packing: T:through hole, M:SMD type, S:SOP type Load voltage: 06:60V , 's Relays, and You Always Relax! DIP Part Number (8 PIN) SMD 211C208 211C208 Contact form 311C358 311C358 , Rely on ECE's Relays, and You Always Relax! MOS RELAY EPR SERIES E155181 E155181(R) DIP SMD , Pin out: 4:4pin, 6:6pin, 8:8pin Load voltage: 06:60V, 20:200V 35:350V, 40:400V 60:600V Contact ... ECE
Original
datasheet

8 pages,
177.73 Kb

211A rely 1B 3 SMD MARKING 311C3 1B SMD MARKING 411A064 smd marking 1b 1A smd 211b2 212A608 2a smd 411c4 E155181 smd 1C smd marking 1C 6 PIN 311C2 ECE relay 211C4 1B smd TEXT
datasheet frame
Abstract: , unbalanced Output, balanced Case ground Type B7725 B7725 Ordering code B39162-B7725-K910 B39162-B7725-K910 Marking and , 10 positive pulses 2 Jan 18, 2005 2,0 0,8 0,5 0,1 SAW Components Low-Loss , MHz Phase linearity deviation 1574,42MHz . 1576,42 MHz - - 1,3 1,3 1,8 dB 1,7*) dB - , - 1,4 1,8 3 Jan 18, 2005 SAW Components Low-Loss Filter Data Sheet Transfer , type in question please also contact one of our Sales Offices. 5 Jan 18, 2005 RoHS and ... EPCOS
Original
datasheet

23 pages,
191.98 Kb

B82116 b41784 B43586 b41875 B82747-C1-A1 b43481 b43407 B43406 b41876 B43465 B43471 B82727-C1-A1 B43405 B41684 B43875 B7725 B7725 B43991 B7725 B7725 B43876 B7725 B7725 B7725 B7725 B7725 TEXT
datasheet frame
Abstract: MOSFET: 400pF to 3,000pF MIC1426 MIC1426 see MIC4426 MIC4426 Low-Side Driver Dual Inverting 1.2A 8 , MIC4427 MIC4427 Low-Side Driver Dual Noninverting 1.2A 8 38ns into 1000pF 4.75V to 16V , Inverting + Noninverting 1.2A 8 38ns into 1,000 pF 4.75V to 16V Drives hex 0­hex 3 size , Low-Side Driver Single Noninverting 6A 2.5 20ns into 2,500pF 4.5V to 18V SOP-8 MSOP-8 PDIP-8 TO-220-5 CerDIP-8(1) Drives hex 6­hex 7 size MOSFET: 1,500pF to 16,000pF; Latch-up ... Micrel Semiconductor
Original
datasheet

3 pages,
24.45 Kb

5962-8877003PA MIC1426 MIC1427 MIC426 MIC427 MIC428 MIC4416 MIC5020 MIC4428 MIC4426 MIC4417 MOSFET dual SOP-8 mic4427 5962-9459403MCA sop-8 smd type 5962-8850307PA 5962-8850305PA mosfet driver 5v to 30v 5962-8850308PA TEXT
datasheet frame
Abstract: 7500 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz 2.0 0.8 27 10 40 30 25 20 8 27 30 unit , Soldering type Reflow Maximum soldering temperature 235 (max. 2 sec.) (measuring point on top surface of the , Pb free terminals Plating of terminals of RoHS compatible component Product Family Product Type , Duplexer b) Plastic packages c) SMD Ceramic packages CSSP CSSP CSSP CSSP CSSP CSSP CSSP CSSP CSSP Duplexer , n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a c) except Metal packages d) except SMD ceramic ... EPCOS
Original
datasheet

24 pages,
509.86 Kb

B41875 Siemens B43507 b43407 B43465 B43471 DDS2004 m1 250c fuse B43875 B43405 B43876 B41684 B43991 SIEMENS b43471 SIEMENS b43405 Fuse m1 250C B69893K2457C101 B69893K2457C101 B69893K2457C101 TEXT
datasheet frame

Archived Files

Abstract Saved from Date Saved File Size Type Download
current limit(mA) Output voltage(V) Package Part type Power dissipation(mW) Power monitor Regulator type Reset output pin Short-circuit protection Thermal protection SA57022-18D SA57022-18D 2.0 mA LDO with ON/OFF control and Vref bypass 03-okt-01 Product Specification 8 73.2 * Reel Dry Pack, SMD, 13" SOP-7B RFS SA57022-25D SA57022-25D SA57022-25D-T SA57022-25D-T 9352 704 79518 Standard Marking * Reel Dry Pack, SMD, 13" SOP-7B RFS SA57022-28D SA57022-28D SA57022-28D-T SA57022-28D-T 9352 704 80518
/datasheets/files/philips/pip/sa57022-xx_1.html
Philips 23/04/2003 8.06 Kb HTML sa57022-xx_1.html
) Output voltage(V) Package Part type Power dissipation(mW) Power monitor Regulator type Reset regulators 150@50 mA 0.01 0.02 no yes -40~85 3.4~8 500 3.3 SOP-7B (SO7) Voltage 150@50 mA 0.01 0.02 no yes -40~85 3.4~8 500 3.3 SOP-7B (SO7) Voltage Regulator independent delayed RESET function 03-okt-01 Product Specification 8 79.5 Products and , SMD, 13" SOP-7B RFS SA57026FD SA57026FD SA57026FD-T SA57026FD-T 9352 704 85518 Standard Marking * Reel Dry
/datasheets/files/philips/pip/sa57026_1.html
Philips 23/04/2003 5.56 Kb HTML sa57026_1.html
GLUABILITY 8/12 4 SMD GLUABILITY We strongly recommend our customers to follow glue application characteristics. Figure 8. Dry Pack according to SMD Package SMD products are contained in tubes , on trays or on mounting technology (SMD or Throughhole), the choice is often driven by technical and economical concerns. Carrier VR02104A VR02104A 1 PACKAGE TYPES 2/12 The different packages available at ST (for 8 Bits MCU Devices) are PQFP (14x20) w w PLCC w w w DIP (300) w w DIP (600) w w w SDIP w w 3/12 SMD PRESENTATION 2 SMD
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/5037-v2.htm
STMicroelectronics 14/06/1999 13.14 Kb HTM 5037-v2.htm
yC 80 yC TIME (seconds) yC 0 SMD GLUABILITY 8/12 4 SMD GLUABILITY We strongly recommend our customers , package structure and molding compound characteristics. Figure 8. Dry Pack according to SMD Package SMD customer re- quirements. Beside the available mounting technology (SMD or Throughhole), the choice is often at SGS-THOMSON (for 8 Bits MCU Devices) are detailed in the following table: T hrough H ole T DIP (600) w w w SDIP w w 3/12 SMD PRESENTATION 2 SMD PRESENTATION Unlike throughhole technology that
/datasheets/files/stmicroelectronics/stonline/books/ascii/an/5037.htm
STMicroelectronics 17/09/1999 15.06 Kb HTM 5037.htm
GLUABILITY 8/12 4 SMD GLUABILITY We strongly recommend our customers to follow glue application characteristics. Figure 8. Dry Pack according to SMD Package SMD products are contained in tubes , on trays or on mounting technology (SMD or Throughhole), the choice is often driven by technical and economical concerns. Carrier VR02104A VR02104A 1 PACKAGE TYPES 2/12 The different packages available at ST (for 8 Bits MCU Devices) are PQFP (14x20) w w PLCC w w w DIP (300) w w DIP (600) w w w SDIP w w 3/12 SMD PRESENTATION 2 SMD
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/5037.htm
STMicroelectronics 02/04/1999 13.18 Kb HTM 5037.htm
(seconds) yC 0 SMD GLUABILITY 8/12 4 SMD GLUABILITY We strongly recommend our customers to follow molding compound characteristics. Figure 8. Dry Pack according to SMD Package SMD products are contained package types to adapt MCUs to customer re- quirements. Beside the available mounting technology (SMD or Carrier VR02104A VR02104A 1 PACKAGE TYPES 2/12 The different packages available at SGS-THOMSON (for 8 Bits MCU (600) w w w SDIP w w 3/12 SMD PRESENTATION 2 SMD PRESENTATION Unlike throughhole technology that
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/5037-v3.htm
STMicroelectronics 25/05/2000 14.95 Kb HTM 5037-v3.htm
yC 80 yC TIME (seconds) yC 0 SMD GLUABILITY 8/12 4 SMD GLUABILITY We strongly recommend our customers , package structure and molding compound characteristics. Figure 8. Dry Pack according to SMD Package SMD customer re- quirements. Beside the available mounting technology (SMD or Throughhole), the choice is often at SGS-THOMSON (for 8 Bits MCU Devices) are detailed in the following table: T hrough H ole T DIP (600) w w w SDIP w w 3/12 SMD PRESENTATION 2 SMD PRESENTATION Unlike throughhole technology that
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/5037-v1.htm
STMicroelectronics 20/10/2000 15.47 Kb HTM 5037-v1.htm
yC 80 yC TIME (seconds) yC 0 SMD GLUABILITY 8/12 4 SMD GLUABILITY We strongly recommend our customers , package structure and molding compound characteristics. Figure 8. Dry Pack according to SMD Package SMD customer re- quirements. Beside the available mounting technology (SMD or Throughhole), the choice is often at SGS-THOMSON (for 8 Bits MCU Devices) are detailed in the following table: T hrough H ole T DIP (600) w w w SDIP w w 3/12 SMD PRESENTATION 2 SMD PRESENTATION Unlike throughhole technology that
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/5037-v4.htm
STMicroelectronics 16/01/2001 15.33 Kb HTM 5037-v4.htm
the SO-8 package as well as an 5-Bump micro SMD package please refer to LM74 data sheet for detailed available in a 5-Bump micro SMD and 8-pin SOP Key Specification Supply Voltage   () -  Interface Type SPI/Microwire  Resolution (bit) 13  Resolution Package Marking Type Pins MSL/Lead-Free Availability Lead Time Qty SPICE
/datasheets/files/national/lm74a.htm
National 27/02/2004 11.13 Kb HTM lm74a.htm
LM74 is available in the SO-8 package as well as an 5-Bump micro SMD package please refer to LM74 data interface LM74 is available in a 5-Bump micro SMD and 8-pin SOP Key Specification Budgetary Pricing Std Pack Size Package Marking Type Pins MSL SPICE IBIS Qty $US each
/datasheets/files/national/htm/nsc03484-v1.htm
National 16/08/2002 13.63 Kb HTM nsc03484-v1.htm