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ISL9440BIRZ-T Intersil Corporation Triple Step-Down PWM and Single Linear Controller with Programmable Soft-Start; QFN32; Temp Range: -40° to 85°C visit Intersil Buy
ISL9440BIRZ Intersil Corporation Triple Step-Down PWM and Single Linear Controller with Programmable Soft-Start; QFN32; Temp Range: -40° to 85°C visit Intersil Buy
HS0-26C32RH-Q Intersil Corporation QUAD LINE RECEIVER, UUC16, DIE-16 visit Intersil
HS0-508BRH-Q Intersil Corporation 8-CHANNEL, SGL ENDED MULTIPLEXER, UUC, DIE visit Intersil
HS0-26CLV32RH-Q Intersil Corporation QUAD LINE RECEIVER, UUC16, DIE-16 visit Intersil
HS0-0547RH-Q Intersil Corporation 16-CHANNEL, DIFFERENTIAL MULTIPLEXER, UUC28, DIE-28 visit Intersil

soft solder die bonding

Catalog Datasheet MFG & Type PDF Document Tags

infineon catalog

Abstract: soft solder die bonding nm AlSiCu Cathode metallisation Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 1400 nm Ni Ag ­system suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, 500µm 0.65mm ; max 1.2mm store in original container, in dry nitrogen, < 6 , EMCON technology 120 µm chip · soft, fast switching · low reverse recovery charge · small temperature , power modules and discrete devices C Applications: · SMPS, resonant applications, drives Die
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Abstract: AlSiCu Ni Ag â'"system suitable for epoxy and soft solder die bonding Die bond Electrically conductive glue or solder Wire bond Al, ≤500µm Reject ink dot size Recommended storage , '¢ 600V Emitter Controlled 3 technology 70 µm chip â'¢ soft, fast switching â'¢ low reverse recovery , : â'¢ Drives Chip Type VR IF Die Size Package SIDC26D60C8 600V 100A 6.53 x , mounting technology and can therefore not be specified for a bare die. Edited by INFINEON Technologies Infineon Technologies
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L4028M
Abstract: Die bond Wire bond Reject ink dot size Recommended storage environment 9x9 81 8.046 x 8.046 120 200 315 Photoimide 3200 nm AlSiCu Ni Ag ­system suitable for epoxy and soft solder die bonding Electrically conductive glue or solder Al, 500µm 0.65mm ; max 1.2mm Store in original container, in dry , Emitter Controlled technology 120 µm chip · soft, fast switching · low reverse recovery charge · small , SMPS, resonant applications, drives A C Chip Type SIDC81D120H8 VR IF Die Size 9 x 9 Infineon Technologies
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L4061C

chip diode "sawn on foil"

Abstract: soft solder die bonding Photoimide 3200 nm AlSiCu Ni Ag ­system suitable for epoxy and soft solder die bonding Die bond Electrically conductive glue or solder Wire bond Al, 500µm Reject ink dot size Recommended storage , technology, Emitter Controlled · soft, fast switching · low reverse recovery charge · small temperature , SMPS, resonant applications, drives Chip Type VR IF Die Size Package SIDC42D170E6 , therefore not be specified for a bare die. Edited by INFINEON Technologies, AIM PMD D CID CLS, L4241N
Infineon Technologies
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chip diode "sawn on foil" soft solder die bonding

chip diode "sawn on foil"

Abstract: soft solder die bonding for epoxy and soft solder die bonding Die bond Electrically conductive glue or solder Wire , SIDC112D170H Fast switching diode Features: · 1700V technology, Emitter Controlled Diode 3th generation, 200 µm chip · soft, fast switching · low reverse recovery charge · small temperature , modules C Applications: · resonant applications, drives Die Size Package 11.8 x 9.52 mm2 , therefore not be specified for a bare die. Edited by INFINEON Technologies, IMM PSD, L4502A, Edition 0.9
Infineon Technologies
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infineon 205a

SIDC02D60F6

Abstract: ­system suitable for epoxy and soft solder die bonding Die bond Electrically conductive glue or solder Wire bond Al, 250µm Reject ink dot size Recommended storage environment 0.65mm; max , · soft , fast switching · low reverse recovery charge · small temperature coefficient This chip , applications, drives Chip Type VR IF Die Size Package SIDC02D60F6 600V 3A 1.3 x 1.3 , mounting technology and can therefore not be specified for a bare die. Edited by INFINEON Technologies
Infineon Technologies
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L4314M

chip diode "sawn on foil"

Abstract: SIDC14D60F6 ­system suitable for epoxy and soft solder die bonding Die bond Electrically conductive glue or solder Wire bond Al, 250µm Reject ink dot size Recommended storage environment 0.65mm; max , · soft , fast switching · low reverse recovery charge · small temperature coefficient This chip , applications, drives Chip Type VR IF Die Size Package SIDC14D60F6 600V 45A 3.8 x , strongly on module design and mounting technology and can therefore not be specified for a bare die
Infineon Technologies
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L4174M

L4054C

Abstract: SIDC10D120H Die bond Wire bond Reject ink dot size Recommended storage environment 3.2 x 3.2 10.24 2.48 x 2.48 120 200 2676 Photoimide 3200 nm AlSiCu Ni Ag ­system suitable for epoxy and soft solder die bonding Electrically conductive glue or solder Al, 500µm 0.65mm ; max 1.2mm Store in original container, in dry , Emitter Controlled technology 120 µm chip · soft, fast switching · low reverse recovery charge · small , SMPS, resonant applications, drives A C Chip Type SIDC10D120H8 VR 1200V IF 15A Die
Infineon Technologies
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L4054C SIDC10D120H
Abstract: Die bond Wire bond Reject ink dot size Recommended storage environment 1.75 x 1.85 3.24 1.03 x 1.13 120 200 8702 Photoimide 3200 nm AlSiCu Ni Ag ­system suitable for epoxy and soft solder die bonding Electrically conductive glue or solder Al, 500µm 0.65mm ; max 1.2mm Store in original container, in dry , Emitter Controlled technology 120 µm chip · soft, fast switching · low reverse recovery charge · small , SMPS, resonant applications, drives A C Chip Type SIDC03D120H8 VR 1200V IF 3A Die Infineon Technologies
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L4051C
Abstract: metal Die bond Wire bond Reject ink dot size Recommended storage environment 7.3 x 7.3 53.29 6.346 x 6.346 120 200 496 Photoimide 3200 nm AlSiCu Ni Ag ­system suitable for epoxy and soft solder die bonding Electrically conductive glue or solder Al, 500µm 0.65mm ; max 1.2mm Store in original container, in dry , Emitter Controlled technology 120 µm chip · soft, fast switching · low reverse recovery charge · small , SMPS, resonant applications, drives A C Chip Type SIDC53D120H8 VR IF Die Size 7.3 x Infineon Technologies
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L4059C
Abstract: ­system suitable for epoxy and soft solder die bonding Electrically conductive glue or solder Al, 500µm , Emitter Controlled 3 technology 70 µm chip · soft, fast switching · low reverse recovery charge · small , A C Chip Type SIDC08D60C8 VR 600V IF 30A Die Size 2.3 x 3.46 mm2 Package sawn on , chips per wafer Passivation frontside Pad metal Backside metal Die bond Wire bond Reject ink dot size , die. Edited by INFINEON Technologies, IMM PSD, L4022M, Edition 1.2, 08.07.10 SIDC08D60C8 Chip Infineon Technologies
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Abstract: metal Die bond Wire bond Reject ink dot size Recommended storage environment 1.9 x 2.37 4.5 1.47 x 1.94 70 200 6224 Photoimide 3200 nm AlSiCu Ni Ag ­system suitable for epoxy and soft solder die bonding Electrically conductive glue or solder Al, 500µm 0.65mm; max 1.2mm Store in original container, in dry , Emitter Controlled 3 technology 70 µm chip · soft, fast switching · low reverse recovery charge · small , Die Size 1.9 x 2.37 mm2 Package sawn on foil Mechanical Parameters Raster size Area total Anode Infineon Technologies
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SIDC05D60C8 L4016M

soft solder die bonding

Abstract: metal Die bond Wire bond Reject ink dot size Recommended storage environment 2.34 x 2.42 5.66 1.91 x 1.99 70 200 4923 Photoimide 3200 nm AlSiCu Ni Ag ­system suitable for epoxy and soft solder die bonding Electrically conductive glue or solder Al, 500µm 0.65mm; max 1.2mm Store in original container, in dry , Emitter Controlled 3 technology 70 µm chip · soft, fast switching · low reverse recovery charge · small , Die Size 2.34 x 2.42 mm2 Package sawn on foil Mechanical Parameters Raster size Area total Anode
Infineon Technologies
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SIDC06D60C8 L4017M

soft solder die bonding

Abstract: SIDC06D60F6 ­system suitable for epoxy and soft solder die bonding Die bond Electrically conductive glue or solder Wire bond Al, 250µm Reject ink dot size Recommended storage environment 0.65mm; max , · soft , fast switching · low reverse recovery charge · small temperature coefficient This chip , applications, drives Chip Type VR IF Die Size Package SIDC06D60F6 600V 15A 2.45 x , strongly on module design and mounting technology and can therefore not be specified for a bare die
Infineon Technologies
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L4344M

SIDC07D60F6

Abstract: Ni Ag ­system suitable for epoxy and soft solder die bonding Die bond Electrically conductive glue or solder Wire bond Al, 250µm Reject ink dot size Recommended storage environment , · soft , fast switching · low reverse recovery charge · small temperature coefficient This chip , applications, drives Chip Type VR IF Die Size Package SIDC07D60F6 600V 22.5A 2.12 x , strongly on module design and mounting technology and can therefore not be specified for a bare die
Infineon Technologies
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L4364M
Abstract: soft solder die bonding Die bond Electrically conductive glue or solder Wire bond Al , SIDC42D120H8 Fast switching diode chip in Emitter Controlled -Technology Features: â'¢ 1200V Emitter Controlled technology 120 µm chip â'¢ soft, fast switching â'¢ low reverse recovery charge â , devices C Applications: â'¢ SMPS, resonant applications, drives Chip Type VR IF Die , die. Edited by INFINEON Technologies, IMM PSD, L4058C, Edition 1.1, 08.07.10 SIDC42D120H8 Chip Infineon Technologies
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Abstract: soft solder die bonding Die bond Electrically conductive glue or solder Wire bond Al , SIDC03D60C8 Fast switching diode chip in Emitter Controlled 3 -Technology Features: â'¢ 600V Emitter Controlled 3 technology 70 µm chip â'¢ soft, fast switching â'¢ low reverse recovery charge â , Die Size Package SIDC03D60C8 600V 10A 1.82 x 1.82 mm2 sawn on foil Mechanical , die. Edited by INFINEON Technologies, IMM PSD, L4014M, Edition 1.2, 08.07.10 SIDC03D60C8 Chip Infineon Technologies
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SIDC56D170E6

Abstract: soft solder die bonding Photoimide 3200 nm AlSiCu Ni Ag ­system suitable for epoxy and soft solder die bonding Die bond Electrically conductive glue or solder Wire bond Al, 500µm Reject ink dot size Recommended storage , technology, Emitter Controlled · soft, fast switching · low reverse recovery charge · small temperature , SMPS, resonant applications, drives Chip Type VR IF Die Size Package SIDC56 D170E6 , therefore not be specified for a bare die. Edited by INFINEON Technologies, AIM PMD D CID CLS, L4251N
Infineon Technologies
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SIDC56D170E6 72008
Abstract: Die bond Wire bond Reject ink dot size Recommended storage environment 1.4 x 1.65 2.31 0.97 x 1.22 70 200 12228 Photoimide 3200 nm AlSiCu Ni Ag ­system suitable for epoxy and soft solder die bonding Electrically conductive glue or solder Al, 500µm 0.65mm; max 1.2mm Store in original container, in dry , Emitter Controlled 3 technology 70 µm chip · soft, fast switching · low reverse recovery charge · small , · White goods · Resonant applications A C Chip Type SIDC02D60C8 VR 600V IF 6A Die Infineon Technologies
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L4012M
Abstract: Die bond Wire bond Reject ink dot size Recommended storage environment 6.5 x 3.5 22.75 5.78 x 2.78 120 200 1190 Photoimide 3200 nm AlSiCu Ni Ag ­system suitable for epoxy and soft solder die bonding Electrically conductive glue or solder Al, 500µm 0.65mm ; max 1.2mm Store in original container, in dry , Emitter Controlled technology 120 µm chip · soft, fast switching · low reverse recovery charge · small , SMPS, resonant applications, drives A C Chip Type SIDC23D120H8 VR 1200V IF 35A Die Infineon Technologies
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L4056C
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