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sn63pb37 solder wire

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: Materials Table of Contents Table of Contents Products Solder Paste Fluxes Solder Wire Bar , designed to be a low splattering core flux. "275" is classified as ROL0 per J-STD-004B. Solder Wire , 24-6337-7614 Sn63Pb37 24-6337-0053 .050 .062 .050 50 50 66 24-6337-0061 Kester Solid Wire Kesterâ'™s solid wire solder, without flux core, is manufactured to strict quality control standards , Alloy Diameter Kester's solid wire solder, without flux core, is manufac24-6337-0010 tured using Kester
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ROSIN FLUX TYPE ROL0 SN63PB37 IPC/J-STD-004B 800-2-KESTER
Abstract: Products Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products , designed to be a low splattering core flux. "275" is classified as ROL0 per J-STD-004B. Solder Wire , 24-6337-7614 Sn63Pb37 24-6337-0053 .050 .062 .050 50 50 66 24-6337-0061 Kester Solid Wire Kesterâ'™s solid wire solder, without flux core, is manufactured to strict quality control standards , Alloy Diameter Kester's solid wire solder, without flux core, is manufac24-6337-0010 tured using Kester
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24-6337-8817 24-7068-1407 24-6337-0027 2460400010 GR-63-CORE Zone 4 test
Abstract: Solder Paste for Syringe Dispensing Applications Formula Type R276 R500 Alloy Sn63Pb37 , Ultra Low Dross Sn63Pb37 10 lbs. 50 lbs. #5744 Solder Saver® A chloride-free, inorganic white , Solder Saver 25 lb. Page 10 Solder Wire "245" No-Clean "275" No-Clean "245" is a , . Kester's solid wire solder, without flux core, is manufactured using virgin metals and strict quality , .015 Sn63Pb37 .031 14-6337-0062 Solid Wire 5 lbs. Alloy 14-6337-0031 â'285â' RMA Kester
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EM907 EM828 GR-78-CORE IPC/J-STD-004 RF743 RF773
Abstract: formation on the solder pot. Kester Part # Alloy Sn63Pb37 Each Bar 1 2/3 lbs. Sold As 25 lbs , Sn63Pb37 Sn60Pb40 Each Bar 1 2/3 lbs. 1 2/3 lbs. Sold As 25 lbs. 25 lbs. 04-6337-0030 Kester Solder , Low Dross grade solder. Kester Part # 07-6337-1950 07-6337-0050 Alloy Ultrapure® Sn63Pb37 Ultrapure , Low Dross Sn63Pb37 #5744 Solder Saver® A chloride-free, inorganic white powder formulated to , 16-6337-0125 16-6040-0031 16-6040-0050 16-6040-0125 Page 10 Solder Wire "275" No-Clean "275" provides Kester
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Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sac305 kester TC-527 2220-VF
Abstract: prior to adding Kester 245 cored wire. Apply the solder wire to the land area or component lead. Do not , . This is a surface phenomena and is not detrimental to product functionality. Flux cored solder wire , No-clean Cored Wire was developed to complement low residue liquid fluxes being used by the electronics , mildly activated rosin fluxes. The use of 245 No-clean Cored Wire results in visually acceptable , -004, IPC-TM-650, Method 2.4.46 Area of Spread mm2 (in2) Flux Core Solder Plastic Rosin Core 285 Mildly Kester
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GR-78 J-STD-004 kester 245 solder wire kester 245 sn63pb37 solder wire shelf life Kester MIL-F-14256 D-82216
Abstract: (in2) Flux Core Solder Plastic Rosin Core 285 Mildly Activated Rosin 245 No-Clean Sn63Pb37 194 , wide variety of alloys, wire diameters and flux percentages. For most applications, Sn63Pb37 is used , . Apply the solder wire to the land area or component lead. Do not apply the wire directly to the , . This is a surface phenomena and is not detrimental to product functionality. Flux cored solder wire has , ® 245 No-Clean Cored W ire Product Description Kester 245 No-clean Cored Wire was developed Kester
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Sn62Pb36Ag02 245 Rosin Flux Cored Solder 952-D6 sn63pb37 solder wire 245 IPC-TM650 Sn63-Pb37
Abstract: Rosin Flux is an activated rosin formula for use in flux-cored solder wire. Kester 44 Rosin Flux has , component lead to be soldered with the iron prior to adding Kester 44 cored wire. Apply the solder wire to , phenomena and is not detrimental to product functionality. Flux cored solder wire has a limited shelf life , '¢ Industry standard RA cored wire for decades â'¢ Classified as ROM1 per J-STD-004 Tested to J-STD , Availability: Kester 44 is available in a wide variety of alloys, wire diameters and flux percentages. For Kester
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kester 44 rosin
Abstract: 275 No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand , Solder Sn96.5Ag3.0Cu0.5 Sn63Pb37 285 Mildly Activated Rosin 213 (0.33) 335 (0.52) 245 No-Clean 200 (0.31 , Considerations: Solder iron tip temperatures are most commonly between 315-371°C (600-700°F) for Sn63Pb37 and , to be soldered with the iron prior to adding Kester 275 cored wire. Apply the solder wire to the land , . Flux cored solder wire has a limited shelf life determined by the alloy used in the wire. For alloys Kester
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959T Kester 275 kester Sn63pB37
Abstract: Reliability Properties Kester 275 No-Clean Flux for cored solder wire was developed to provide superior , Considerations: Solder iron tip temperatures should range between 260-370°C (500-700°F) for Sn63Pb37 and , lead to be soldered with the iron prior to adding Kester 275 cored wire. Apply the solder wire to the , J-STD-004, IPC-TM-650, Method 2.4.46 Area of Spread mm2 (in2) Flux Core Solder Sn96.5Ag3.0Cu0.5 Sn63Pb37 285 Mildly Activated Rosin 213 (0.33) 335 (0.52) 245 No-Clean 200 (0.31) 348 (0.54) 275 Kester
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2002/95/EC
Abstract: : Solder iron tip temperatures are most commonly between 315-371°C (600-700°F) for Sn63Pb37 and , lead to be soldered with the iron prior to adding Kester 285 cored wire. Apply the solder wire to the , 2.3.35.1 SIR, IPC (typical): Pass Performance Characteristics: â'¢ Industry standard RMA cored wire â , Core Solder 285 Mildly Activated Rosin 282 Mildly Activated Rosin 44 Fully Activated Rosin Cu , Notes Availability: Kester 285 is available in a wide variety of alloys, wire diameters and flux Kester
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kester 186 285 solder wire shelf life ROSIN
Abstract: 331 Organic Flux is a water soluble formula for use in flux-cored solder wire. This cored solder , alloys, wire diameters and flux percentages. For most applications, Sn63Pb37 or Sn96.5Ag3.0Cu0.5 is used , . Apply the solder wire to the land area or component lead. Do not apply the wire directly to the , functionality. Flux cored solder wire has a limited shelf life determined by the alloy used in the wire. For , standard wire diameter for most applications is 1.00mm (0.031in). Wire diameters range from 0.25 - 6.00mm Kester
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2331-ZX Kester LIQUID FLUX ZX 650
Abstract: Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable , Core Solder Sn96.5Ag3.0Cu0.5 Sn63Pb37 285 Mildly Activated Rosin 213 (0.33) 335 (0.52) 275 No-Clean 219 , cored wire. Apply the solder wire to the land area or component lead. Do not apply the wire directly to , detrimental to product functionality. Flux cored solder wire has a limited shelf life determined by the alloy , fast and reliable solder joints. Reliability Properties Copper Mirror Corrosion: Low Tested to Kester
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J-STD-004 solder wire rom1 kester 285 solder wire Kester* 1544 kester Sn62Pb36Ag02 1544 Rosin Solder FLUX
Abstract: Reliability Properties Kester 275 No-Clean Flux for cored solder wire was developed to provide superior , (in2) Flux Core Solder Sn96.5Ag3.0Cu0.5 Sn63Pb37 285 Mildly Activated Rosin 213 (0.33) 335 (0.52 , cored wire. Apply the solder wire to the land area or component lead. Do not apply the wire directly to , functionality. Flux cored solder wire has a limited shelf life determined by the alloy used in the wire. For , Notes Availability: Kester 275 is available in a wide variety of alloys, wire diameters and flux Kester
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J-STD-004 solder wire Sn63 kester 952-d6 Flux-pen
Abstract: ® 44 Activated Rosin Cored Wire Product Description Kester 44 Rosin Flux is an activated rosin formula for use in flux-cored solder wire. Kester 44 Rosin Flux has virtually dominated the field , lead to be soldered with the iron prior to adding Kester 44 cored wire. Apply the solder wire to the , phenomena and is not detrimental to product functionality. Flux cored solder wire has a limited shelf life , Industry standard RA cored wire for decades · Classified as ROM1 per J-STD-004 Fluorides by Spot Test Kester
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Rosin Activated Core Wire Sn63Pb Kester 44 315-371
Abstract: 331 Organic Flux is a water soluble formula for use in flux-cored solder wire. This cored solder , alloys, wire diameters and flux percentages. For most applications, Sn63Pb37 or Sn96.5Ag3.0Cu0.5 is used , . Apply the solder wire to the land area or component lead. Do not apply the wire directly to the , functionality. Flux cored solder wire has a limited shelf life determined by the alloy used in the wire. For , standard wire diameter for most applications is 1.00mm (0.031in). Wire diameters range from 0.25 - 6.00mm Kester
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Abstract: Terminal 0.64 (0.025) Maximum Solder Buildup Positive Terminal Wire Hookup Standard 2-Wire , Frequency Response Sensitivity Tolerance DC Supply Current Drain Output Impedance (in 2-wire circuit , Soldering Fixture Mechanical Weight Dimensions Case Material Solder Content 0.28 grams (nominal) See outline drawings 80Ni20Fe Sn63Pb37 Standard Case ET-3042 ET-802 ET-900 Base Nest Plate , ) maximum 1.35 (0.053) Negative Terminal 0.64 (0.025) Maximum Solder Buildup Positive Knowles
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FET 4900 sn63pb37 solder datasheet bu series 3042 80Ni20Fe preamplifier 1000H ET-811
Abstract: wraparound matte tin Sn99.9 on nickel barrier, RoHS B Solderable wraparound Sn63Pb37 solder over nickel , Sn63Pb37, flip-chip G Wire bondable gold, Au, RoHS Packaging BU Bulk TR Tape & Reel FP Flat Pack Rev , 150 % of Rated Power Tin over nickel barrier, lead solder over nickel barrier, or gold Ohmcraft
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100K-10G HVC resistors 1M-10M 100K-10M 10K-10M 1M-100M 100K-100M 10K-100M
Abstract: tin Sn99.9 on nickel barrier, RoHS B Solderable wraparound Sn63Pb37 solder over nickel barrier Z Solderable single surface tin Sn99.9 on nickel barrier, RoHS S Solderable single surface Sn63Pb37, flip-chip G Wire bondable gold, Au, RoHS BU Bulk Custom case sizes are available. Please consult , Termination Tin over nickel barrier, lead solder over nickel barrier, or gold Power Derating Curve Ohmcraft
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10K-500M 10K-1G 10K-10G 10K-50G 1M-10 EIA-481
Abstract: Solder Reflow Requirement Sn63Pb37 Pb-Free Ramp Rate 4qC/sec. Max 4qC/sec. Max , semiconductor is connected to the adjacent leads using wire bond. The construction of both wire bond pads and , . recommended land pattern. PCB substrate material deficiency, insufficient solder reflow, different chemistry or viscosity of solder paste flux matrix, solder void percentage, or different land pattern designs , 0.32 0.42 !200 !200 2 Solder Mask Guideline Since the Printed Circuit Board (PCB Fairchild Semiconductor
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AN-5067 IPC-7525 MO-229 footprint jedec package MO-220 MO-229 MO-226 JEDEC Drawing MO-220 7mm MLP56A MO-220 MLP64A MLP64B
Abstract: circuits. Pre-Tinned PC Tails are coated with Sn63Pb37 tin-lead for excellent solderability. Choose , Polymer (LCP),30% Glass-Filled Gold Alloy, Unplated 300 Series Stainless Steel #30 (.010 Dia.) Copper Wire, Solder Dipped Liquid Crystal Polymer (LCP) or Epoxy Epoxy Durability specifications 200 Cycles , Wire 1.0% Max TML, 0.1% Max. Current Rating Voltage Rating (DWV) Insulation Resistance Operating Glenair
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NANO PLUG CONNECTORS MIL-DTL-32139 06324/0CA77
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