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Part Manufacturer Description Datasheet BUY
UDT020A0X3-SRZ GE Critical Power CONV DIGITAL 5.5V 20A POL SMD visit GE Critical Power
APXS003A0X-SRDZ GE Critical Power CONVER DC/DC 0.59 5.5V @ 3A SMD visit GE Critical Power
HSYE-117RH/PROTO Intersil Corporation 1.2 V-37V ADJUSTABLE POSITIVE REGULATOR, CBCC3, CERAMIC, SMD-5, LCC-3 visit Intersil
HSYE-117RH-Q Intersil Corporation 1.2 V-37V ADJUSTABLE POSITIVE REGULATOR, CBCC3, CERAMIC, SMD-5, LCC-3 visit Intersil
ISYE-1009RH-Q Intersil Corporation 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 2.5V, BCC3, ROHS COMPLIANT, HERMETIC SEALED, SMD-3 visit Intersil
HSYE-117RH-8 Intersil Corporation 1.2 V-37V ADJUSTABLE POSITIVE REGULATOR, CBCC3, CERAMIC, SMD-5, LCC-3 visit Intersil

smd 43e

Catalog Datasheet MFG & Type PDF Document Tags

smd 43e

Abstract: HIRB5-43D-C soldering terminal 1.0 1.2 1.60 20 0.3 0.3 0.5 LED Dice 0.3 SMD 0603 20 1.2 , -150D-4 SMD 0805 Typical 0.5 SMD 1206 3.2 0.6 1.6 View Angle IF(mA) 0.5 lp(nm , -43D-C 940 1.25 30.0 50.0 35 HIRB5-43D-D 940 1.25 20.0 35.0 50 HIRB5-43E-A 880 1.47 35.0 65.0 HIRB5-43E-B 880 1.47 20.0 50.0 20 HIRB5-43E-C 880 1.47 20.0 35.0 40 HIRB5-43E-D 880 1.47 12.5 25.0 50 HIRB5-43G-A 850
Green Lighting Electronics Development
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HIRCL-170C-4 HIRB5-43G smd 43e HIRB5-43D-C HIRB5-43d hirb5 HIRB5-43G-C HIRB5-43Gb-C HIRCL-150E-4 HIRCL-150G-4 HIRCL-170E-4 HIRCL-170G-4 HIRCL-170D-4
Abstract: Machine Model Package 200V Storage Temperature Range LLP-10 43˚C / W micro SMD-12 â , the 12-bump micro SMD and the 10-lead LLP miniature packages. These PCB real estate saving packages , -Bump micro SMD package LLP-10 package, 3x4mm 0.5â"¦ max @ 2.7V 0.8â"¦ max @ 2.7V TA = 25˚C Power , 10-LLP Package 12-Bump micro SMD Package 20136702 20136701 Exposed pad on back of package , -Bump micro SMD Package Marking LMS4684ITLX 10-Pin LLP LMS4684ITL F09A LMS4684LD L4684 National Semiconductor
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LMS4684 LMS46

43e smd code

Abstract: smd 43e MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's). MIL-HDBK-780 - Standard Microcircuit , marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible , clock ( EXT / INT set to logic high ) -H *-iz fâ'" 43-E." CS R/cÃ" â'" t. BUSY X tl7â'"I [â'" _t~ jT , will replace device class M devices. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination
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OCR Scan
AD977ASD 43e smd code F 43 E qml38535 AD977A qml-38535 16-BIT 5962-E348-98 T0Q470 T00470 QML-38535 5962-9861401QR

qml-38535

Abstract: CDFP4-F16 Microcircu'rt Drawings (SMD's). MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated , -103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the , Substitutabilitv. Device class Q devices will replace device class M devices. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual , Electronics Supply Center when a system application requires configuration control and which SMD's are
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OCR Scan
CDFP4-F16 GDIP1-T16 5962-E484-96 5962H9657501VEA UT54ACTS253PVAH 5962H9657501VXA UT54ACTS253UVAH 5962H9657501VEC
Abstract: P-LCC-44-1 (SMD) Functional Description The MSC III is a component of the TV-SAM Featurebox and is , Semiconductor Group 118 â I flE3SbOS D05fl5Cm 43E â  Detailed Circuit Description Picture Formats , â¡â¡Sfib ro 309 ^ST â  Package Outlines SIEM EN S Plastic Package, P-LCC-44-1 (SMD) (Chip Carrier) CL o Dimensions in mm SMD = Surface Mounted Device Semiconductor Group â  310 fl23Sfc.05 OGSflbTl ölb I Package Outlines SIEM EN S SMD = Surface Mounted Device Semiconductor -
OCR Scan
Q67100-H5087 P-DIP-28-1 P-DIP-40-1

ic 67a smd

Abstract: SN65HV230 small size through modern SMD technology and multi-layer design. In accordance with the complexity of the module, 0402-packaged SMD and laser-drilled Microvias components are used on the boards , address latch signal (ALE). 1+2 2+3 X Package Type J2 1+2 2+3 0R in SMD 0402 Selection of , in SMD 0402 CANRX0 signal selection. Software has to initialize this signal routing for the FLEXCAN , in SMD 0402 J3 connects the CANTX0 input of the CAN transceiver U10 to the desired processor CAN
PHYTEC
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ic 67a smd SN65HV230 ADC7828 76d 5d smd PCM-982 smd diode 30D CORE-MCF548 D-55129 L-645 D-55135

44e 938

Abstract: 938-pin functional boards achieve their small size through modern SMD technology and multi-layer design. In accordance with the complexity of the module, 0402-packaged SMD and laser-drilled Microvias components are used on , SMD 0805 J3 connects pin 7 of the serial memory at U4 to 3 V3. On many memory devices pin 7 enables , Package Type 0R in SMD 0805 J5 and J6 define the slave addresses (A1 and A2) of the serial memory U4 , ) 0R in SMD 0805 © PHYTEC Messtechnik GmbH 2006 L-678e_0 19 phyCORE-MPC5200B tiny Jumper
PHYTEC
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44e 938 938-pin functional INTEL FLASH MEMORY 29F intel 29F DS2401 G100 CORE-MPC5200B L-678

PCM-991

Abstract: ic 67a smd small size through modern SMD technology and multi-layer design. In accordance with the complexity of the module, 0402-packaged SMD and laser-drilled Microvias components are used on the boards , the CPLD. The CPLD will drive /CSFL2 dependent on /CS2 0R in SMD 0402 This jumper connects /CS2 to , will drive /CSFL2 dependent on /CS2 Package Type J3 0R in SMD 0402 The JTAG interface of the , present. TDI signal TMS signal. A 1k pull-up to VDD3V3 is present. TDO signal SMD 0402 J4 bypasses
PHYTEC
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PCM-991 MCP565 smd code "67A" pwm Motorola MCP565 optocoupler 68A bidirectional optocoupler toshiba CORE-MPC565 L-635

ic 67a smd

Abstract: EPC2C8 noise environments. phyCORE boards achieve their small size through modern SMD technology and multi-layer design. In accordance with the complexity of the module, 0402-packaged SMD and laser-drilled , Sheet for details. FXEN = 1 FXEN = 0 X 0R in SMD 0402 J2 allows for alternate CAN signal routing of , signal to pin CAN_H1 at X3D21. Routes CAN1_RX signal to pin CAN_L1 at X3D20. X 0R in SMD 0805 J3 , CAN_L2 at X3D18. X 0R in SMD 0805 J4 and J5 disconnect the receive lines (UART3_RXD_TTL and
PHYTEC
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EPC2C8 smd optocoupler cop 200 CB851 altera cyclone 2 PCM-980 CB651 L-672

smd code book

Abstract: transistor SMD P1f The SMD Code Book 1st character of code 0123456789 ABCDEFGHI JKLMNOPQ R STUVWXYZ The SMD , ) diodes Plastic Melf/miniMelf Coloured SOD123/323 diodes SMD Electrolytics SMD Ceramic Capacitors SMD , -223, SOT-89 SOT-143, SOT-363 Diodes http://www.marsport.org.uk/smd/mainframe.htm (1 of 2)27/5/2007 18:18:25 The SMD Code Book back to Wormhole back to marsport Marsport http://www.marsport.org.uk/smd/mainframe.htm (2 of 2)27/5/2007 18:18:25 SMD Codebook Page 0 GM4PMK's SMD Codebook Codes
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smd code book transistor SMD P1f marking code W16 SMD Transistor TRANSISTOR SMD MARKING CODE jg smd transistor WW1 Transistor SMD a7s 2SC3603 PDTA143ET SSTPAD10 SO2369R BST82 MRF5711L

86-89-2

Abstract: Array (GFA Suffix) - 244-Pad JEDEC-Standard TAB Frame · SMD Approval for 27- and 33-MHz Versions , Pack With Nonconductive Tie-Bar (HFG Suffix) - 244-Pad JEDEC Standard TAB Frame · SMD Approval for 28
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86-89-2 SMJ320C3X S014A MIL-STD-883 40/32-B SMJ320C31 SMJ320C31-40

cmo tcon

Abstract: SAB-80C517-16-N-T40/85 Table of Contents SMD THD Table of Contents 2 Bipolar Junction Transistor 4 , Regulator (Positive) 1A SMD Type Low Dropout Voltage Regulator (Positive) 1A Low Dropout Voltage Regulator , Controller Logic LMOS IC Other List of Equivalent Product Pressure Sensor 50~1,000kPa, Low Cost SMD , Bipolar Junction Transistor SMD Type Small Signal General Purpose Transistor Type No. Max , 0.1 SMD Type Bipolar Junction Transistor Small Signal General Purpose Transistor hFE
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80C517 80C51 80C515 cmo tcon SAB-80C517-16-N-T40/85 B158-H6497-X-X-7600 Q67120-C452 marking 80c515 80C517/80C537 80C537 P-LCC-84

MN1280

Abstract: KGT50N60kda boards achieve their small size through modern SMD technology and multi-layer design. In accordance with the complexity of the module, 0402-packaged SMD components and laser-drilled Microvias are used on , : subminiature Single Board Computer (60 x 53 mm) achieved through modern SMD technology populated with the
KEC
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MN1280 KGT50N60kda bc547 smd transistor kia1117af transistor smd zG y6 smd transistor Z02W100V Z02W10V Z02W11V Z02W12V Z02W13V Z02W15V

X200C

Abstract: G100 environments. phyCORE boards achieve their small size through modern SMD technology and multi-layer design. In accordance with the complexity of the module, 0402-packaged SMD components and laser-drilled Microvias are , : · · · Subminiature Single Board Computer (60 x 53 mm) achieved through modern SMD technology
PHYTEC
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X200C J503 J504 J505 U602 J506 CORE-LPC3180 RS-232 JA-002 L-681

ADM3307

Abstract: PCM-989 achieve their small size through modern SMD technology and multi-layer design. In accordance with the complexity of the module, 0402-packaged SMD components and laser-drilled Microvias are used on the boards , following features: · · · subminiature Single Board Computer (60 x 53 mm) achieved through modern SMD
PHYTEC
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ADM3307 PCM-989 J604 U600 U601 PCM976

hynix nand flash

Abstract: 24FC2561 boards even in high noise environments. phyCORE boards achieve their small size through modern SMD technology and multi-layer design. In accordance with the complexity of the module, 0402-packaged SMD , through modern SMD technology · populated with the ST Microelectronics ST10F168 or ST10F269
PHYTEC
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hynix nand flash 24FC2561 d309 "cross reference" 67a smd U408 hynix nand flash 128mb

op107

Abstract: smd transistor rg5 achieve their small size through modern SMD technology and multi-layer design. In accordance with the complexity of the module, 0402-packaged SMD components and laser-drilled Microvias are used on the boards , Single Board Computer (60 x 53 mm) achieved through modern SMD technology · populated with the Infineon
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op107 smd transistor rg5 transistor smd 43e smd ic hhb HHB smd OP104 PD78F4943 16/8-BIT 78K/IV U10905E PD78F4943GC-8BT PD78F4943GC-3B9

ST10F269

Abstract: st10 Bootstrap achieve their small size through modern SMD technology and multi-layer design. In accordance with the complexity of the module, 0402-packaged SMD components and laser-drilled Microvias are used on the boards , following features: · subminiature Single Board Computer (60 x 53 mm) achieved through modern SMD
PHYTEC
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st10 Bootstrap st10f168 date code ST10-F168 ST10F169 JP16 JP35 CORE-ST10F168/ CORE-ST10F269 CORE-ST10F168/ST10F269 L-614
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