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senju m705 solder paste content

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senju m705 solder paste

Abstract: Solder bar of Senju M705 '¢ Recommended solder paste Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD) Temperature [â , -221BM5-42-11 Solder: M705-221BM5-42-11 (SENJU METAL INDUSTRY CO., LTD) 12 Solder joint strength under the , mentioned in Page 23. 11 0 20 11 0 20 11 0 20 M705/ESR-250 Solder/ Flux: M705/ ESR 250 (SENJU METAL INDUSTRY CO., LTD) 11 Solderability (Solder dip) Pretreatment â' High , for screen-printing. Solderability depends on the reflow conditions, solder paste, and materials of
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Senju ESR-250

Abstract: '¢ Recommended solder paste Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD) Temperature [â , -221BM5-42-11 Solder: M705-221BM5-42-11 (SENJU METAL INDUSTRY CO., LTD) 12 Solder joint strength under the , mentioned in Page 23. 11 0 20 11 0 20 11 0 20 M705/ESR-250 Solder/ Flux: M705/ ESR 250 (SENJU METAL INDUSTRY CO., LTD) 11 Solderability (Solder dip) Pretreatment â' High , for screen-printing. Solderability depends on the reflow conditions, solder paste, and materials of
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QT4c

Abstract: '¢ Recommended solder paste Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD) Temperature [â , -221BM5-42-11 Solder: M705-221BM5-42-11 (SENJU METAL INDUSTRY CO., LTD) 12 Solder joint strength under the , mentioned in Page 23. 11 0 20 11 0 20 11 0 20 M705/ESR-250 Solder/ Flux: M705/ ESR 250 (SENJU METAL INDUSTRY CO., LTD) 11 Solderability (Solder dip) Pretreatment â' High , for screen-printing. Solderability depends on the reflow conditions, solder paste, and materials of
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Abstract: '¢ Recommended solder paste Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD) Temperature [â , -221BM5-42-11 Solder: M705-221BM5-42-11 (SENJU METAL INDUSTRY CO., LTD) 12 Solder joint strength under the , mentioned in Page 23. 11 0 20 11 0 20 11 0 20 M705/ESR-250 Solder/ Flux: M705/ ESR 250 (SENJU METAL INDUSTRY CO., LTD) 11 Solderability (Solder dip) Pretreatment â' High , for screen-printing. Solderability depends on the reflow conditions, solder paste, and materials of Sharp
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Abstract: '¢ Recommended solder paste Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD) Temperature [â , -221BM5-42-11 Solder: M705-221BM5-42-11 (SENJU METAL INDUSTRY CO., LTD) 12 Solder joint strength under the , mentioned in Page 23. 11 0 20 11 0 20 11 0 20 M705/ESR-250 Solder/ Flux: M705/ ESR 250 (SENJU METAL INDUSTRY CO., LTD) 11 Solderability (Solder dip) Pretreatment â' High , for screen-printing. Solderability depends on the reflow conditions, solder paste, and materials of Sharp
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Abstract: -221BM5-42-11 Solder: M705-221BM5-42-11 (SENJU METAL INDUSTRY CO., LTD) 12 Solder joint strength under the , box after the first reflow is recommended.) â'¢ Recommended solder paste Solder paste : M705 , mentioned in Page 23. 11 0 20 11 0 20 11 0 20 M705/ESR-250 Solder/ Flux: M705/ ESR 250 (SENJU METAL INDUSTRY CO., LTD) 11 Solderability (Solder dip) Pretreatment â' High , 0.15mm for screen-printing. Solderability depends on the reflow conditions, solder paste, and materials Sharp
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senju m705 solder paste

Abstract: '¢ Recommended solder paste Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD) Temperature [â , -221BM5-42-11 Solder: M705-221BM5-42-11 (SENJU METAL INDUSTRY CO., LTD) 12 Solder joint strength under the , mentioned in Page 23. 11 0 20 11 0 20 11 0 20 M705/ESR-250 Solder/ Flux: M705/ ESR 250 (SENJU METAL INDUSTRY CO., LTD) 11 Solderability (Solder dip) Pretreatment â' High , for screen-printing. Solderability depends on the reflow conditions, solder paste, and materials of
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Abstract: 0 20 11 0 20 M705/ESR-250 Solder/ Flux: M705/ ESR 250 (SENJU METAL INDUSTRY CO , humidity. Dipping flux in 3~5s and soldering) M705-221BM5-42-11 Solder: M705-221BM5-42-11 (SENJU , box after the first reflow is recommended.) â'¢ Recommended solder paste Solder paste : M705 , 0.15mm for screen-printing. Solderability depends on the reflow conditions, solder paste, and materials , seconds (only once). Solder tip temperature: under 350â"ƒ As for the reï¬'ow soldering profile, please Sharp
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Abstract: '¢ Recommended solder paste Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD) Temperature [â , -221BM5-42-11 Solder: M705-221BM5-42-11 (SENJU METAL INDUSTRY CO., LTD) 12 Solder joint strength under the , mentioned in Page 23. 11 0 20 11 0 20 11 0 20 M705/ESR-250 Solder/ Flux: M705/ ESR 250 (SENJU METAL INDUSTRY CO., LTD) 11 Solderability (Solder dip) Pretreatment â' High , for screen-printing. Solderability depends on the reflow conditions, solder paste, and materials of Sharp
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senju m705 solder paste

Abstract: senju M705-221BM5-42-11 Chip Type !Caution/Notice Continued from the preceding page. Solder and Flux 1. Solder and Paste (1) Reflow Soldering : NCP03/15/18/21 Series Use RA/RMA type or equivalent type of solder paste. For your reference, we are using the solder paste below for any internal tests of this product. ·RMA9086 , are using the solder paste below. For any internal tests of this product. ·Sn : Pb=63wt%:37wt% ·Sn , product. Printing Conditions of Solder Paste The amount of solder is critical. Standard height of
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NCP03 NCP15 senju m705 solder paste senju M705-221BM5-42-11 M705-221BM5-42-11 senju solder paste M705 SENJU m705 R44E8 NCP18/21 NCP03/15 NCP18/NCP21

senju m705 solder wire

Abstract: solder wire senju /PRF Series Notice (Soldering and Mounting) Solder and Flux 1. Solder Paste Use solder paste Sn:Pb=63:37wt%. Do not use strong acidic flux (with halide content exceeding 0.2wt%). For your reference, we are using 63Sn/37Pb RMA9086 90-3-M18, manufactured by Alpha Metals Japan Ltd., 96.5Sn/3.0Ag/0.5Cu M705 , soldering. Flow soldering should not be allowed. 1. Printing Conditions of Solder Paste (1) Standard thickness of solder paste printing should be from 0.15 to 0.20 mm. (2) After soldering, the solder fillet
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senju m705 solder wire solder wire senju solder paste 63sn alpha metal 903M18 M705-221BM R90E6
Abstract: reflow is recommended.) Recommended solder paste M705-221BM5-42-11() Solder paste : M705 , condition mentioned in Page 23. 11 0 20 11 () Solderability (Solder dip) 150 1 240±5 5±1 s /M705-221BM5/ ESR-250 Solder temperature: 240±5 , Soldering time: 5±1 s Solder/ Flux: M705 , thickness 0.15mm for screen-printing. Solderability depends on the reflow conditions, solder paste, and , with the soldering iron (under 60W) within 3 seconds (only once). Solder tip temperature: under 350 As Sharp
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GM2BB50QKAC DG-113015

Senju flux

Abstract: .) Recommended solder paste M705-221BM5-42-11() Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD , 23. 11 0 20 12 () Solderability (Solder dip) 150 1 240±5 5±1 s /M705-221BM5/ ESR-250 Solder temperature: 240±5 , Soldering time: 5±1 s Solder/ Flux: M705-221BM5/ ESR 250 (SENJU METAL , screen-printing. Solderability depends on the reflow conditions, solder paste, and materials of the PCBs etc , Solder tip temperature: under 350 As for the reflow soldering profile, please refer to Page 23. Model
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Senju flux GM2BB35BMAC DG-104022A
Abstract: () Solderability (Solder dip) 150 1 240±5 5±1 s /M705-221BM5/ ESR-250 Solder temperature: 240±5 , Soldering time: 5±1 s Solder/ Flux: M705-221BM5/ ESR 250 (SENJU METAL INDUSTRY CO., LTD) After exposed to 150 for , dry box after the first reflow is recommended.) Recommended solder paste M705-221BM5-42-11() Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD) Recommended Temperature Profile Temperature , conditions, solder paste, and materials of the PCBs etc. Please test and verify the solderability under the Sharp
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GM2BB45BMAC DG-104023A
Abstract: () Solderability (Solder dip) 150 1 240±5 5±1 s /M705-221BM5/ ESR-250 Solder temperature: 240±5 , Soldering time: 5±1 s Solder/ Flux: M705-221BM5/ ESR 250 (SENJU METAL INDUSTRY CO., LTD) After exposed to 150 for , dry box after the first reflow is recommended.) Recommended solder paste M705-221BM5-42-11() Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD) Recommended Temperature Profile Temperature , conditions, solder paste, and materials of the PCBs etc. Please test and verify the solderability under the Sharp
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GM2BB35BM0C DG-103003A

Solder bar of Senju M705

Abstract: () Solderability (Solder dip) 150 1 240±5 5±1 s /M705-221BM5/ ESR-250 Solder temperature: 240±5 , Soldering time: 5±1 s Solder/ Flux: M705-221BM5/ ESR 250 (SENJU METAL INDUSTRY CO., LTD) After exposed to 150 for , dry box after the first reflow is recommended.) Recommended solder paste M705-221BM5-42-11() Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD) Recommended Temperature Profile Temperature , conditions, solder paste, and materials of the PCBs etc. Please test and verify the solderability under the
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Solder bar of Senju M705 GM2BB57BM0C DG-09Z031B

Senju M705 safety

Abstract: () Solderability (Solder dip) 150 1 240±5 5±1 s /M705-221BM5/ ESR-250 Solder temperature: 240±5 , Soldering time: 5±1 s Solder/ Flux: M705-221BM5/ ESR 250 (SENJU METAL INDUSTRY CO., LTD) After exposed to 150 for , dry box after the first reflow is recommended.) Recommended solder paste M705-221BM5-42-11() Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD) Recommended Temperature Profile Temperature , conditions, solder paste, and materials of the PCBs etc. Please test and verify the solderability under the
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Senju M705 safety GM2BB57BMAC DG-104024A

senju m705 solder paste

Abstract: Senju M705-221BM5-42-11 Flux (1) Solder and Paste (a) Reflow Soldering: NCP03/15/18/21 Series Use RA/RMA type or equivalent type of solder paste. For your reference, we are using the solder paste below for any internal tests of , .) ·M705-221BM5-42-11 (Sn:Ag:Cu=96.5wt%:3.0wt%:0.5wt%) (Manufactured by Senju Metal Industry Co., Ltd.) (b) Flow Soldering: NCP18/21 Series We are using the solder paste below for any internal tests of this product. ·Sn , /Notice Continued from the preceding page. 7. Printing Conditions of Solder Paste The amount of
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M705 RMA senju

senju M705-221BM5-42-11

Abstract: Solder bar of Senju M705 () Solderability (Solder dip) 150 1 240±5 5±1 s /M705-221BM5/ ESR-250 Solder temperature: 240±5 , Soldering time: 5±1 s Solder/ Flux: M705-221BM5/ ESR 250 (SENJU METAL INDUSTRY CO., LTD) After exposed to 150 for , dry box after the first reflow is recommended.) Recommended solder paste M705-221BM5-42-11() Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD) Recommended Temperature Profile Temperature , conditions, solder paste, and materials of the PCBs etc. Please test and verify the solderability under the
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Senju M705 solder bar solder paste m705 Senju ESR-250 Senju M705 material safety Senju solder core GM2BB30BM0C DG-097017D
Abstract: () Solderability (Solder dip) 150 1 240±5 5±1 s /M705-221BM5/ ESR-250 Solder temperature: 240±5 , Soldering time: 5±1 s Solder/ Flux: M705-221BM5/ ESR 250 (SENJU METAL INDUSTRY CO., LTD) After exposed to 150 for , dry box after the first reflow is recommended.) Recommended solder paste M705-221BM5-42-11() Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD) Recommended Temperature Profile Temperature , conditions, solder paste, and materials of the PCBs etc. Please test and verify the solderability under the Sharp
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GM2BB30BMAC DG-101013B
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