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samsung roadmap

Catalog Datasheet MFG & Type PDF Document Tags

samsung roadmap

Abstract: rdram A D VA N C E D M E M O RY S O L U T I O N S Samsung's RDRAM is the world's fastest, most efficient memory interface available today, providing 72 controller pins for a single channel. Samsung , . Samsung's memory is being shipped in millions of devices worldwide. Benefits Samsung RDRAM Performance Roadmap · 2.1GB/s of memory bandwidth per device @1066MHz · Available in 128, 256, and 512Mb , technology RDRAM Data Sheet US.p65 1 10/23/2002, 5:46 PM Data Sheet Samsung RDRAM PC1066
Samsung Semiconductor
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samsung roadmap rdram memory bandwidth application of RDRAM 1066MH 800MH PC-1066 RDRAM-01

MX 0541

Abstract: phone 14 pin vga camera pinout Angel (TED) ­ Sample `C' source (Samsung) Product Planning & Application Engineering The Leader in , Support for SmartMedia n Controller Support 1. Samsung (Mass Production : 2000. 2Q) > PC Card ATA/IDE , : 30uA > 144LQFP, 100TQFP 2. Feiya(www.feiya.com/tw), Lexar and Oki in addition to Samsung and , . Samsung : Sample `C' source Product Planning & Application Engineering The Leader in Memory , . Pixels Roadmap SmartMediaTM vs. Pixels Roadmap SmartMedia excels CCD pixel in density race `96 Camera
Samsung Electronics
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MX 0541 phone 14 pin vga camera pinout mx 0541 b nintendo nintendo ds SAMSUNG NAND FLASH TRANSLATION LAYER FTL 128MB 16MB-3 SMA01U HPC-SV03 SMA02U SMA03U

SEM 2006 samsung

Abstract: chrysler ccd LED Product Selections AMERICAN OPTO PLUS AMERICAN OPTO PLUS LED Brightness Product Roadmap , Display Product Roadmap 7-Segments Display Surface Mount Displays Dot Matrix Display Patented , Frigidaire Dacor Whirlpool GE Japan: Nissan Toyota Korea: Samsung LG AMERICAN OPTO PLUS , Lighting QTC Delphi Nissan Electrolux Samsung LG Dacor Kohler Solectron Celestica Flextronics
American OPTO Plus LED
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SEM 2006 samsung chrysler ccd SEM 2006 toyota engineering standard opto 1010 7segments 168HRS

S3c6410

Abstract: Samsung S3C6410 ARM Samsung S3C6410 ARM 1176-based Mobile Application Processor Product Brief From smartphones to personal navigation devices, the Samsung ARM 1176-based S3C6410 Mobile Application Processor supports the , and software design resources already invested. / The S3C6410 Roadmap S3C640G - L9G (90nm) - , ¡80 1024x1024 output: 5-layer PIP 16bit a-blending SAMSUNG ELECTRONICS Semiconductor Business Multimedia , MLC NAND/8-bit ECC, 4KB page mode ( CF 3.0/ATA Controller 1 Samsung S3C6410 ARM 1176
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S3C6430 Samsung S3C6410 ARM samsung S3C6410 S3C64 s3c6400 samsung s3c6400 S3C6400 1176JZF-S 16KB/16KB 533MH

bga nvidia

Abstract: samsung roadmap situation (reflecting the roadmap). SAMSUNG X06 201 - This Document can not be used without Samsung's authorization - 11 REFERENCE 4. CPU type Intel® CPU P4 P4w/HT Prescott Celeron Mobile , - This Document can not be used without Samsung's authorization - 11 REFERENCE 11-1 , & 2nd Gfx. & MS Office or WorksSuite Representation S M K H P T N J Q L V W Y C G 202 SAMSUNG X06 - This Document can not be used without Samsung's authorization - 11 REFERENCE 6
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bga nvidia RJ80536 russian nvidia g86-730 samsung 740 RJ80536GE0412M SX06NH RJ80536NC0251M RJ80536NC0211M RJ80536NC0171M RJ80536NC0131M

Spansion NAND Flash DIE

Abstract: Spansion NAND Flash aggressive roadmap to future cost reductions. MIRRORBIT TM TECHNOLOGY AT-A-GLANCE · Two physically , technology. Reduced Cost through Improved Manufacturing "SAMSUNG Electronics is very pleased with , SAMSUNG Electronics · Intrinsic manufacturing yields as much as 30% higher than multi-level cell (MLC , in development and a clear roadmap for future innovation, customers can continue to benefit from
Spansion
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Spansion NAND Flash DIE Spansion NAND Flash floating-gate Spansion NAND Flash slc SAMSUNG MCP Samsung Electronics. NAND flash memory ISO/TS16949 ISO9001 ISO14001 1-866-SPANSION

S3C6410

Abstract: samsung S3C6410 Samsung S3C6410 ARM 1176-based Mobile Application Processor Product Brief From smartphones to personal navigation devices, the Samsung ARM 1176-based S3C6410 Mobile Application Processor supports the , and software design resources already invested. / ^ The S3C6410 Roadmap S3C640G - L9G (90nm) - , 24/ 18bit or 8bit for Dual ¡80 1024x1024 output: 5-layer PIP 16bit a-blending SAMSUNG ELECTRONICS , Controller DDR ECC, 3_ I )ller I I P Samsung S3C6410 ARIVI 1176-based Mobile Application Processor 3D
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ARM 1176 SAMSUNG MCp nand ddr usb sdhc controller samsung roadmap dram OneNAND mcp Flash Memory SAMSUNG OneNAND mcp 1176JZF-

samsung roadmap

Abstract: USB Flash Memory SAMSUNG such an advanced process, Samsung's product roadmap can also move ahead. Products Having access to , by Samsung Semiconductor, Inc. © 2003 Samsung Semiconductor, Inc. SAMSUNG SEMICONDUCTOR, INC , shape the market. Samsung Semiconductor, the established leader in memory, is such a supplier. Committed to the FLASH memory market since 1992, Samsung is already the world's leading producer of NAND , a supplier? © 2003 Samsung Semiconductor, Inc. CG2020-A 1.15.03 2 of 7 SAMSUNG
Samsung Electronics
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USB Flash Memory SAMSUNG SAMSUNG MCp nand Samsung Nand gb MCP Technology Trend SAMSUNG NAND FLASH NAND Reliability note

OneNAND

Abstract: oneNand flash of OneNAND. Figure 3-8 shows the Roadmap of OneNAND write performance. 24 Samsung Electronics , SEC-ONENAND-AN-001 Samsung OneNANDTM System Requirement Samsung Electronics Copyright 2004 Samsung Electronics Co.,LTD. Revision History Version 0.1 Date NOV-25-2004 Comment Initial , Network Samsung Electronics Co., Ltd Address : San #16, Banwol-Ri, Taean-Eup, Hwasung-City, Gyeonggi-Do, Korea, 445-701 E-mail : flashsw@samsung.com Copyright © 2004 Samsung Electronics Co, Ltd. All
Samsung Electronics
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OneNAND oneNand flash sensing "nor flash memory" samsung samsung 2GB X16 Nand flash NAND FLASH 64MB samsung onenand

intel microsoft PC99 Design

Abstract: ISA BUS spec : Legacy Removal Roadmap l Low hanging fruit is ISA.causing $Billion's of support costs/year u , Develop long term roadmap for "smart" platform evolution u Opportunity: Opportunity: New New Wave Wave , ® `245 SIO Audio ISA Modem Intel's PC Legacy Removal Roadmap Key ISA components transitioning , User-Accessible Slots Roadmap VGA Legacy "Freeness" Floppy IDE Parallel Serial PS/2 Gameport/MIDI Step #1 , ? ® Intel's PC Legacy Removal Roadmap Legacy "Freeness" User-Accessible Slots VGA Floppy IDE Parallel
Intel
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intel microsoft PC99 Design ISA BUS spec AC97/PCI

MP6923

Abstract: samsung roadmap Features Overview Customer: Philips, Osram, BLTC, Samsung LEDâ'¦ Applications Mult GATE COMP , Technology ® AC/DC Easy Power Roadmap Released Sampling Development Isolated Flyback Internal , in 2013 Q3 The Future of Analog IC Technology ® AC/DC Flyback Controller Roadmap Gen 1 , The Future of Analog IC Technology ® Synchronous Rectifier Roadmap Integrate with GEN1 , Controller Roadmap Gen 1 HR1000 Gen 2 Gen 3 HR1000A HR1001 â'¢ Enhanced version Released
Monolithic Power Systems
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MP4050 MP44011 MP6923 MP6930 HFC0500 PAR38 MP4028 MP4034 MP4032 MP4053

S3F8285XZZ-TW85

Abstract: S3F84K4 2/4/2014 Microcontroller Product Catalogue | Samsung Semiconductor Global Website C , SEAR CH MCU ROADMAP S3F8285 For more details about product specifications or technical files , the driver when temperatures reach abnormally high levels. Samsung is a worldwide leader in , Microcontroller Product Catalogue | Samsung Semiconductor Global Website - 16K x 8 bits program memory , =803&productId=6122 2/5 2/4/2014 Microcontroller Product Catalogue | Samsung Semiconductor Global Website RoHS
Samsung Electronics
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S3F8285XZZ-TW85 S3F84K4

ARM7 set associative

Abstract: KS32C50100 . 1998 Network Group , SYSTEM LSI ELECTRONICS December ` 98 Network Team CPU Roadmap , · 0.6mA/MHz@3.3V · 40MHz ARM7 · 0.5um TLM · 0.8mA/MHz@3.3V Roadmap can be changed without , Dissipation 2.5 V 19mm2 @0.25um 200MHz @2.5V 1999. 2Q S-ARM9T S-ARM920T Roadmap can be changed without notice! ELECTRONICS 3 December ` 98 Network Team Products Roadmap , interrupt handling ELECTRONICS 24 December ` 98 Samsung Electronics
Samsung Electronics
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KS32C5000A ARM10TDMI ARM7 set associative KS32C50100 ARM10TDMI block diagram fast sram 200mhz 8k MC68EN302 200MH S-ARM1020T 300MH 150MH

S6B33D1

Abstract: S6B33B6 SAMSUNG ' Mobile Solution Forum 2007 Mobile Solution System LSI ÌCI I I w I c Contents - Application Processor 04 Samsung S3C2413 06 Samsung S3C2412 08 Samsung S3C2443 10 Samsung S3C6400 12 - CMOS , . 38 Application Processor Samsung S3C2413 High-performance, Low-power, Cost-effective Solution for Portable Navigation Devices, Smartphones and Other Handhelds " Product Brief The Samsung S3C2413 is , that include a camera interface and low voltage supported by Samsung's low-power technology. This
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S6B33D1 S6B33B6 S6D0164 LCD TV Samsung regulator S6D0154 S6B33BG S5M8602/S3C4F31 ARM926EJ-S S3C4F31

K6X8016T3B-UF55

Abstract: K6X4008C1F-UF55 SRA SRAM mories RENESAS Low Power SRAM Roadmap Density 2005 2006 2007 256 KB 1MB x8 Status 0.25 µm x8 / x16 2009 0.6 µm 2 MB LOW x8 2008 0.25 µm 4 MB Middle 8 MB 0.18 µm · table support S x8 / x16 0.15 µm Advanced LPSRAM (Vcc = , 256Kx8 512Kx8 4M 256Kx16 1Mx8 8M Samsung M5M5V108DFP-70H 1M RENESAS 512Kx16 , -70LLI [Bit] 32Kx8 1M 128Kx8 4M Samsung 512Kx8 8M 1Mx8 HM28100TTI5SE
Renesas Electronics
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K6X8016T3B-UF55 K6X4008C1F-UF55 HM216514TTI5SE k6x4008c1f uf55 K6X4016T3F-UF70 K6X4008T1F-UF70 256KB 16MB-32MB K6X1008T2D-BB70 M5M5V108DFP-70HI K6X1008T2D-BF70 M5M5V108DVP-70H

teac fd 235hf

Abstract: teac fd-235hf August 2002 Outline · Introduction · AMD AthlonTM MP processor power roadmap · Thermal test , factors 25325B 25325B August 2002 3 AMD AthlonTM Processor Power Roadmap Max Thermal , Delta 460W Quantum Atlas 9GB Elsa Gloria II 1024MB Samsung PC2100 Toshiba SD-M1402 TEAC FD , /flow blowers for cooling the processor is required to support entire roadmap · IMPORTANT: Entire , Samsung PC2100 Toshiba XM-1902B TEAC FD-235HF Computer and Control Solutions 40 AMD Proposed
Advanced Micro Devices
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teac fd 235hf teac fd-235hf ATI Rage 128 A34124-16 floppy drive scsi TEAC FD-235HF ROADM AMD-760TMMP AMD-760

RADEON IGP 216

Abstract: IBM motherboard socket 478 rev 1.6 This Document can not be used without Samsung's authorization. 2 Product Specification 2-1 , 2-1 2 Product Specification This Document can not be used without Samsung's authorization , Wireless LAN Mini-PCI 802.11b Mini-PCI 802.11b/g AGERE SAMSUNG ELECTRICITY PCMCIA 1 Type II , valid for OSCAR - G(P28G) model. 2-2 SENS P27G This Document can not be used without Samsung , only) Electronic Manual Acrobat Reader 6.0 FirstWare(One Click Recovery System, TBD) Samsung Theme
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RC300MD RADEON IGP 216 IBM motherboard socket 478 rev 1.6 wireless TV headphone mini project 9000IGP ATI 216 bga 512KB SB150 PC2700 333MH 256MB/512MB

K9HCG08U5M

Abstract: K9WBG08U1M SAMSUNG " Mobile Solution Forum 2007 SAMSUNG Mobile Memory |C| 11 I m Contents NAND Flash 03 NOR , Samsung's NAND Flash has firmly established itself as the key solution in many popular yet relatively new , Technologies if you have some prominent business plans for small mobile devices, then check out Samsung , CTF NAND process is being applied for the first time ever >16G('05) ->32G('06) 4 Mobile Memory Samsung , . Samsung's NOR flash is widely recognized for its superior features. The company also provides a total
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K9HCG08U5M K9WBG08U1M K9LAG08U0M-PCB0 KMAFN0000M KMBGN0000A K9MDG08U5M-PCB0 120GB 256MB 512MB 256MC99 0-52MH

Thomson-CSF semiconductor

Abstract: nokia tv Instruments Samsung Fujitsu Mitsubishi SGS-THOMSON Philips Matsushita IBM Siemens Sanyo National Semiconductor , Consumer General Instruments Grundig Kenwood Matsushita NEC Pace Philips Samsung Sony Thomson Multimedia , financial position Heading for the Future pre97ver1 - 19 ® SGS-THOMSON : TECHNOLOGY ROAD-MAP
STMicroelectronics
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Thomson-CSF semiconductor nokia tv SGS-Thomson Semiconductor eeprom 2408 3-063 motorola marelli

ATI Radeon 9600

Abstract: wireless TV headphone mini project Samsung's authorization. REMARKS MAX 2GB 30/40/60/80GB SEC TOSHIBA SEC, TOSHIBA TEAC Broadcomm , This Document can not be used without Samsung's authorization. P28 2 Product Specification , FirstWare(One Click Recovery System) Samsung Theme Samsung Screen Manager Easy BOX OS (Option) WinXP , Document can not be used without Samsung's authorization. 2-3 2 Product Specification 2-1-3 , major or minor changes is determined by the market situation (reflecting the roadmap). 2-4 This
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RC300MB ATI Radeon 9600 ATI MOBILITY 9000 ati radeon ixp 150 RADEON IGP bga ati radeon bga 266MH 1024X768 1400X1050 1981B
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