NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Samples | Ordering |
| PA-QFE32SA-P-S-01W | Ironwood Electronics | QFP (w/SMT Lands) Prototyping Adapters; Top Package Code: QFE32SA; Bottom Package Code: Panel Type P; Top Pitch (mm): 0.8; Bottom Pitch (mm): 2.54; Top Pin Count: 32; Bottom Pin Count: 32; Bottom Array Size: 8 x 8; Top Interface: Surface Mount Lands; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (in.): 0.8; Land Pattern InsideX (in.): 0.255; Land Pattern OutsideX (in.): 0.395; Land Pattern InsideY (in.): 0.255; Land Pattern OutsideY (in.): 0.95; Adapter Size Length X Width (in.): 0.8 x 0.8; Part Description: QFP Prototyping Adapter; | 
|
|
|
| PA-QFE32SA-P-S-01 | Ironwood Electronics | QFP (w/SMT Lands) Prototyping Adapters; Top Package Code: QFE32SA; Bottom Package Code: Panel Type P; Top Pitch (mm): 0.8; Bottom Pitch (mm): 2.54; Top Pin Count: 32; Bottom Pin Count: 32; Bottom Array Size: 8 x 8; Top Interface: Surface Mount Lands; Bottom Interface: Male Terminal Pins; IC Package Lead Tip to Tip (in.): 0.8; Land Pattern InsideX (in.): 0.255; Land Pattern OutsideX (in.): 0.395; Land Pattern InsideY (in.): 0.255; Land Pattern OutsideY (in.): 0.95; Adapter Size Length X Width (in.): 0.8 x 0.8; Part Description: QFP Prototyping Adapter; |
|
|
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: Description: Package convertor: 44 position QFP land pattern to PLCC surface mount foot. PC-QFP/PLCC44-01 PC-QFP/PLCC44-01 , 32 33 PLCC 29 30 31 32 33 34 35 36 37 38 39 QFP 34 35 36 37 38 39 40 41 42 , Pin 1 PLCC 0.030" top 2 Pin 1 QFP 40 7 1 0.448" Top View 0.596" 29 0.8mm 18 1 0.297" Side View 0.050" 0.017" 0.636" 0.686" QFP 1 2 3 4 5 6 7 8 9 10 11 PLCC 7 8 9 10 11 12 13 14 15 16 17 QFP 12 13 14 15 16 17 18 19 20 ... | Original |
1 pages, |
44 pin plcc package drawing qfp 32 land pattern datasheet abstract |
|
|||
| Abstract: Body +3.2 mm. 0.872" TOP VIEW 0.050" 0.018" 0.250" 0.063" SIDE VIEW 0.05 mm 0.872" A Surface mountable 144 position (0.5mm. pitch) QFP emulator foot. Leadless design, matches target board leaded QFP land pattern. compatible target board land dimensions A< 0.812" B> 0.932" Substrate: FR4/G10 FR4/G10, 0.0625"±0.007" thick. Pins: Material - Brass Alloy 360, 1/2H ; finish - 10u" Gold over 100/150u" Nickel. SF-QFE144SD-L-01 SF-QFE144SD-L-01 Dwg © 1997 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL ... | Original |
1 pages, |
SF-QFE144SD-L-01 qfp 32 land pattern datasheet abstract |
|
|||
| Abstract: manufacturer. Land size 0.0.0.2 32-pin QFN package dimensions The 32 pin packages used by IDT have the , PCB Decal land dimensions The PCB land pattern dimensions to be generated are referenced in Figure , bridging. 0.0.0.4 Suggested Land Pattern (decal) The suggested land pattern is based on the , guaranteed, therefore voids may exist. (See Figure 6Toe Fillet.) However, since the land pattern is likely to , Figure 5 - Land Pattern dimensions Side Figure 3 Fillets Minimum solder fillet dimensions: · ... | Original |
6 pages, |
vqfn 44 land pattern qfp 32 land pattern MO-220 hakko MO-220 5x5mm qfn 32 land pattern datasheet abstract |
|
|||
| Abstract: specific convertor for 8031, 8051, micro controllers. 44 position QFP land pattern to 0.6" wide 40 , 1 40 2 39 3 38 4 37 5 36 6 35 7 34 8 33 9 32 10 31 11 30 12 29 13 28 14 27 15 0.450" 0.600" 2.000" 26 0.8 mm 16 1 25 17 24 18 23 19 22 20 Top View 0.100" 21 0.600" 0.700" (without test points) 1.100" (with test points) optional test points PC-QFP/DIP-8031 PC-QFP/DIP-8031 ... | Original |
1 pages, |
qfp 32 land pattern 8051 and 8031 8031 8051 dip 40 datasheet abstract |
|
|||
| Abstract: The BGA land pattern footprint plays a key role in solder joint reliability, and the number of PCB layers required to route the balls. 3.1 Land pad design The PCB BGA land pads have to be designed to , Flat Pack (QFP), the (L)(LF)(TF)BGA device has many advantages, such as: · The (L)(LF)(TF)BGA has no , smaller than an equivalently functional QFP. · Resolution and smearing problems with respect to the , When building a BGA footprint the number one consideration is ensuring the ball pattern and outline ... | Original |
14 pages, |
LPC2292 LPC2220 LPC185 LPC178 land pattern for TSOP 2 54 pin JEDEC bga case outline LPC2468 LPC2468 reflow solder profile LPC2470 LPC2478 LPC2880 LPC2888 LPC3130 AN10778 LPC2220 AN10778 abstract |
|
|||
| Abstract: consideration. The BGA land pattern footprint plays a key role in solder joint reliability, and the number of , 2. Solder mask vs non-solder mask defined land pad 3.2 Recommended BGA Footprint The NSMD type , , such as the Quad Flat Pack (QFP), the (LF)(TF)BGA device has many advantages. Such as: · · · · · , is typically 20% to 25% smaller than an equivalently functional QFP. Resolution and smearing , Footprints When building a BGA footprint the number one consideration is ensuring the ball pattern and ... | Original |
13 pages, |
LPC2220 LPC2292 LPC2364 LPC2368 LPC2458 LPC2468 LPC2468 pcb LPC2470 LPC2478 NXP LPC2368 nxp cross MO-275 lpc3250 lpc3154 LPC2888 AN10778 LPC2220 AN10778 abstract |
|
|||
| Abstract: Pin Count TQFP/LQFP QFP SKINNY DIP TCP PGA SHRINK-DIP BGA/LGA CSP Figure 1.1.1 , (SOP, QFP, SOJ, QFJ, BGA) 40 20 Tape carrier (TCP) COB, TCP, etc. 1995 Figure 1.1.2 , pattern (called the mount pad) provided on the PC board, and are used in high-pin-density IC package , , material, and mounting methods. QFP Quad Lead Rows TQFP/LQFP Flat SOP Dual Lead Rows Surface , Skinny DIP Miniature Shrink DIP Single Lead Rows ZIP Flat Quad Lead Rows QFP PGA ... | Original |
25 pages, |
DIP42-P-600-2 HQFP208-P-4040-0 QFP 64 Cavity package S115 land pattern for TSOP 56 pin SOJ 44 PCB land qfp 64 0.4 mm pitch land pattern ED730 land pattern tsop 66 TSOP 66 pin Package thermal resistance TSOP 54 land pattern ic packages datasheet abstract |
|
|||
| Abstract: a leadless QFP foot (solders to the target board's surface mount land pattern) and a DIP or SDIP , piece adapters connect a PGA package to a QFP land pattern. The bottom QFP surface mount base part is , OF THE PART NUMBER. PC-QFP/DIP-8031/51-T-01 PC-QFP/DIP-8031/51-T-01 CONVERTS A 44 PIN QFP LAND PATTERN TO A 40 PIN DIP. , a QFP land pattern on the target board allowing the top to be easily plugged and unplugged via a mini grid socket interface. TARGET PCB WITH QFP LAND PATTERN PACKAGE CONVERTERS DIP/SDIP TO ... | Original |
26 pages, |
R50-E2-Y2-24 68 pin plcc socket view bottom 68hc001 actel 14100 plcc44 pinout numbers TQ2E-24V SOIC40-01 PC-DIP/PLCC-8085-P-01 PLCC32/DIP32 PC-DIP/SOIC40-01 nec a1010 PC-PGA/QFP-68EC020-L-02 pinout PLCC32/DIP32 datasheet abstract |
|
|||
| Abstract: PCB rules FIGURE 17. Via Fan-out for Prototype Testing Solder Mask Defined Land Pattern for , Bits TSSOP TVSOP QVSOP BQSOP 36 to 48 > 66% > 47% > 59% 32 to 40 > 67% , disk drives 5. Camcorders 6. Digital cameras BGA advantages compared to fine pitch QFP or TSSOP , Routing (74LCX16500 74LCX16500) FIGURE 4. 54-Ball 24-Bit BGA Routing (FST16211 FST16211) FIGURE 5. 96-Ball 32-Bit BGA , Package Land Area 3 www.fairchildsemi.com AN-5026 AN-5026 BGA Via Design and Layout Options When ... | Original |
8 pages, |
AN5026 FST32211 FST16211 74LCX16500 74VCX32374 BGA Solder Ball 0.35mm BGA 0.56mm 74VCX32500 AN-5026 0.35mm BGA fanout 1mm pitch BGA micro pitch BGA 1mm pitch BGA socket BGA Solder Ball collapse AN-5026 abstract |
|
|||
| Abstract: Flat type Dual lead SOP TSOP I TSOP II LSSOP TSSOP Quad lead QFP LQFP TQFP UQFP , Small Outline Non-Leaded Package QFP Quad Flat Package (straight lead) Quad Flat L-Leaded Package , Package TQFP Thin Quad Flat L-Leaded Package HQFP QFP with Heat Sink LCC* Leadless Chip , specifications are called "SOL". Standard : 1.27mm QFP The leads on this package extend out from four , SSOP LQFP * These packages are compact versions of the SOP and QFP. (The lead pitch and body size ... | Original |
12 pages, |
TSOP 54 Package TSOP 2E qfp 32 land pattern PGA wire bonding nail ceramic pin grid array package plating CERAMIC PIN GRID ARRAY wire lead frame BGA and QFP Package DB81-10002-2E DB81-10002-2E abstract |
|
|||
| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
|||||
| . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-32 X-BLOX - DS-380 DS-380 DS-380 DS-380. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-32 Xilinx ABEL Design Entry - DS-371 DS-371 DS-371 DS-371 ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-32 XC95108 XC95108 XC95108 XC95108 Global, JTAG and Power Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-32 Ordering Information www.datasheetarchive.com/download/90212243-999460ZC/dbookold.zip (DBOOKOLD.PDF) |
Xilinx | 07/09/1996 | 10340.01 Kb | ZIP | dbookold.zip |