NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: Ethernet Media Converter was introduced. The ML6652CM/EM ML6652CM/EM is the QFN/LPCC44 package version of the ML6652 ML6652. , schematic symbol and PCB footprint will have a total of 96 pins. TQFP44 TQFP44 QFN/LPCC44 GND/THERMAL Pins , LinearCorporation 2050 Concourse Drive, San Jose, CA 95131 Page 1 ML6652 ML6652 QFN/LPCC Package 408 , TQFP package is being used. Since the QFN/LPCC44 requires a copper area underneath the package for , in Figure 2 and 3. This connection indicates the QFN/LPCC44 package will be used in the design. ... | Original |
5 pages, |
TQFP44 AD10 AD32 88 qfn TQFP 100 PACKAGE footprint QFN footprint eco solder paste ML6652 QFN 36 footprint ML6652CH qfn 48 PACKAGE footprint qfn 64 pcb layout qfn 76 PACKAGE footprint ML6652CM AN-002 ML6652 AN-002 abstract |
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| Abstract: connecting to subscriber line - Small footprint package - 44-pin QFN - Minimal external discrete components required Compatible with solid state or transformer DAA interfaces Device Package Le88010BQC 44-pin QFN (Green package)* *Green package meets RoHS Directive 2002/95/EC 2002/95/EC of the European , overhead · Small footprint, 44-pin QFN · Reduces board space requirement with small form factor 7x7 mm square QFN package Related Literature and Supporting Collateral 081201-Le88010 VoicePortTM ... | Original |
2 pages, |
zarlink daa VE880 VE88 LE71HK002 28 pins qfn 7x7 footprint 5V RELAY LE88010BQC qfn 44 PACKAGE footprint qfn 44 7x7 PACKAGE footprint qfn 44 PACKAGE footprint 7x7 LE88010 VE880 abstract |
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| Abstract: w WAN-0236 WAN-0236 Recommendations on Soldering a Dual Row QFN Package to a PCB INTRODUCTION The Quad Fine Pitch No Leads (QFN) package is a leadless plastic package, which obtains electrical contact , reasons why the QFN package is chosen for Wolfson Microelectronics devices for portable applications. In , Information SOLDER MASK AND STENCIL DESIGN CONSIDERATIONS The complexity of the QFN footprint due to the , the size, pitch and depth of the stencil apertures for the QFN package it is recommended that type 3 ... | Original |
5 pages, |
QFN PCB Layout guide qfn 44 PACKAGE footprint EH11 81-pin X-RAY INSPECTION WAN-0236 die paddle qfn 32 stencil WAN-0236 abstract |
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| Abstract: that extend outside the EN5394QI EN5394QI QFN package footprint. Recommendation: The PCB layout may include , www.enpirion.com EN5394QI EN5394QI QFN Package Soldering Guidelines 2/3/2010 1.0 INTRODUCTION Enpirion's EN5394QI EN5394QI , leadframes and mold caps with System in Package (SiP) construction to form a Quad Flat No-lead (QFN) package. QFN package technology is ideal for power conversion devices due to the solderable exposed bottom , package footprint and thickness, large lead size and pitch, and excellent lead co-planarity. The EN5394QI EN5394QI ... | Original |
13 pages, |
QFN PACKAGE thermal resistance qfn 44 PACKAGE footprint EN5394 EN5394QI EN5394QI abstract |
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| Abstract: that extend outside the EN5336QI EN5336QI QFN package footprint. Recommendation: The PCB layout may include , 908.575.0755 www.enpirion.com EN5336QI EN5336QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion's , (QFN) package. QFN package technology is ideal for power conversion devices due to the solderable , , the smaller package footprint and thickness, large lead size and pitch, and excellent lead , connection of the EN5336QI EN5336QI QFN package to a PCB, this document provides recommendation guidelines for PCB ... | Original |
13 pages, |
EN5336 EN5336QI EN5336QI abstract |
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| Abstract: that extend outside the EN5365QI EN5365QI QFN package footprint. Recommendation: The PCB layout may include , 908.575.0755 www.enpirion.com EN5365QI EN5365QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion's , (QFN) package. QFN package technology is ideal for power conversion devices due to the solderable , , the smaller package footprint and thickness, large lead size and pitch, and excellent lead , connection of the EN5365QI EN5365QI QFN package to a PCB, this document provides recommendation guidelines for PCB ... | Original |
13 pages, |
gold embrittlement EN5365 EN5365QI EN5365QI abstract |
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| Abstract: that extend outside the EN5336QI EN5336QI QFN package footprint. Recommendation: The PCB layout may include , 908.575.0755 www.enpirion.com EN5336QI EN5336QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion's , (QFN) package. QFN package technology is ideal for power conversion devices due to the solderable , , the smaller package footprint and thickness, large lead size and pitch, and excellent lead , connection of the EN5336QI EN5336QI QFN package to a PCB, this document provides recommendation guidelines for PCB ... | Original |
13 pages, |
stencil EN5336QI EN5336QI abstract |
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| Abstract: that extend outside the EN5364QI EN5364QI QFN package footprint. Recommendation: The PCB layout may include , www.enpirion.com EN5364QI EN5364QI QFN Package Soldering Guidelines 2/3/2010 1.0 INTRODUCTION Enpirion's EN5364QI EN5364QI , leadframes and mold caps with System in Package (SiP) construction to form a Quad Flat No-lead (QFN) package. QFN package technology is ideal for power conversion devices due to the solderable exposed bottom , package footprint and thickness, large lead size and pitch, and excellent lead co-planarity. The EN5364QI EN5364QI ... | Original |
13 pages, |
EN5364QI EN5364QI abstract |
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| Abstract: that extend outside the EN5365QI EN5365QI QFN package footprint. Recommendation: The PCB layout may include , 908.575.0755 www.enpirion.com EN5365QI EN5365QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion's , (QFN) package. QFN package technology is ideal for power conversion devices due to the solderable , , the smaller package footprint and thickness, large lead size and pitch, and excellent lead , connection of the EN5365QI EN5365QI QFN package to a PCB, this document provides recommendation guidelines for PCB ... | Original |
13 pages, |
QFN PACKAGE thermal resistance EN5365 EN5365QI qfn 44 PACKAGE footprint EN5365QI abstract |
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| Abstract: to the design of a PCB footprint for the QFN package and then goes on to describe practical , creating a QFN footprint is the package drawing for the device. Wolfson uses a number of different QFN , INTRODUCTION The Quad Fine Pitch No Leads (QFN) package is a leadless plastic package, which obtains , the QFN package ideal for designs where space considerations are at a premium. This small size is one of the main reasons why the QFN package is chosen for Wolfson Microelectronics devices for portable ... | Original |
13 pages, |
qfn 48 PACKAGE footprint QFN 7X7 VKKD QFN leadframe qfn 48 7x7 stencil QFN PCB Layout guide jedec package MO-220 32 5x5 MO-220 7x7 .4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size jedec package MO-220 QFN 20 20 pins qfn 5x5 footprint jedec package MO-220 for qfn datasheet abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| Comm 32 Ld QFN 3 6.44 ISL5585GCR-T ISL5585GCR-T ISL5585GCR-T ISL5585GCR-T Active Comm 32 Ld QFN T+R 3 6.51 ISL5585GCRZ ISL5585GCRZ ISL5585GCRZ ISL5585GCRZ Active Comm 32 Ld QFN 3 6.44 ISL5585GCRZ ISL5585GCRZ ISL5585GCRZ ISL5585GCRZ Indicator 28 Lead Surface Mount Packaging QFN Package: Compliant to JEDEC PUB95 PUB95 PUB95 PUB95 MO- 220 QFN - Quad Flat No Leads - Package Outline Near Chip Scale Package footprint, which improves PCB efficiency and . Package MSL Price US $ ISL5585AIM ISL5585AIM ISL5585AIM ISL5585AIM Active Ind 28 Ld PLCC 1 9.33 ISL5585AIM ISL5585AIM ISL5585AIM ISL5585AIM www.datasheetarchive.com/files/intersil/device_pages/device_isl5585.html |
Intersil | 07/09/2006 | 49.63 Kb | HTML | device_isl5585.html |
| -T Active Comm 14 Ld SOIC T+R 3 2.44 ISL6614CR ISL6614CR ISL6614CR ISL6614CR Active Comm 16 Ld QFN Bottom Copper Pad for Enhanced Heat Sinking QFN Package: Compliant to JEDEC PUB95 PUB95 PUB95 PUB95 MO-220 MO-220 MO-220 MO-220 QFN - Quad Flat No Leads - Package Outline Near Chip Scale Package footprint, which improves PCB efficiency and Part No. Status Temp. Package MSL Price US $ ISL6614CB ISL6614CB ISL6614CB ISL6614CB Active Comm 14 Ld SOIC 1 2.44 ISL6614CB-T ISL6614CB-T ISL6614CB-T ISL6614CB-T Active Comm 14 Ld SOIC 1 2.44 ISL6614CBZ ISL6614CBZ ISL6614CBZ ISL6614CBZ Active www.datasheetarchive.com/files/intersil/device_pages/device_isl6614.html |
Intersil | 07/09/2006 | 44 Kb | HTML | device_isl6614.html |
| . Status Temp. Package MSL Price US $ ISL6614ACB ISL6614ACB ISL6614ACB ISL6614ACB Active Comm 14 Ld SOIC 1 2.44 ISL6614ACB-T ISL6614ACB-T ISL6614ACB-T ISL6614ACB-T Active Comm 14 Ld SOIC T+R 1 2.44 ISL6614ACBZ ISL6614ACBZ ISL6614ACBZ ISL6614ACBZ Active Comm 14 -T Active Comm 14 Ld SOIC T+R 3 2.44 ISL6614ACR ISL6614ACR ISL6614ACR ISL6614ACR Active Comm 16 Ld QFN QFN Package: Compliant to JEDEC PUB95 PUB95 PUB95 PUB95 MO-220 MO-220 MO-220 MO-220 QFN - Quad Flat No Leads - Package Outline Near Chip Scale Package footprint, which improves PCB efficiency and has a thinner profile Pb-Free Plus Anneal www.datasheetarchive.com/files/intersil/device_pages/device_isl6614a.html |
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| device is supplied in the small footprint (4x5mm) 24-pin QFN package and is specified for operation over Diagrams Related Devices Ordering Information Part No. Status Temp. Package MSL Price US $ EL1526IL EL1526IL EL1526IL EL1526IL Active Ind 24 Ld QFN 1 3.51 EL1526IL-T13 EL1526IL-T13 EL1526IL-T13 EL1526IL-T13 Active Ind 24 Ld QFN T+R 1 3.60 EL1526IL-T7 EL1526IL-T7 EL1526IL-T7 EL1526IL-T7 Active Ind 24 Ld QFN T+R 1 3.60 EL1526ILZ EL1526ILZ EL1526ILZ EL1526ILZ Active Ind 24 Ld QFN 3 3.51 EL1526ILZ-T13 EL1526ILZ-T13 EL1526ILZ-T13 EL1526ILZ-T13 Active Ind 24 Ld QFN T www.datasheetarchive.com/files/intersil/device_pages/device_el1526.html |
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| footprint (4x5mm) 24-pin QFN package and is specified for operation over the full -40 o C to +85 o C Diagrams Related Devices Ordering Information Part No. Status Temp. Package MSL Price US $ EL1529IL EL1529IL EL1529IL EL1529IL Active Ind 24 Ld QFN 1 3.49 EL1529IL-T13 EL1529IL-T13 EL1529IL-T13 EL1529IL-T13 Active Ind 24 Ld QFN T+R 1 3.60 EL1529IL-T7 EL1529IL-T7 EL1529IL-T7 EL1529IL-T7 Active Ind 24 Ld QFN T+R 1 3.60 EL1529ILZ EL1529ILZ EL1529ILZ EL1529ILZ Active Ind 24 Ld QFN 3 3.49 EL1529ILZ-T13 EL1529ILZ-T13 EL1529ILZ-T13 EL1529ILZ-T13 Active Ind 24 Ld QFN T www.datasheetarchive.com/files/intersil/device_pages/device_el1529.html |
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| Ind 16 Ld QFN T+R 3 1.44 ISL6522IRZ-TK ISL6522IRZ-TK ISL6522IRZ-TK ISL6522IRZ-TK Active Ind 16 Ld QFN T -running oscillator programmable from 50kHz to over 1MHz 14-lead SOIC and TSSOP package and 16-lead 5x5mm QFN Package QFN Package Compliant to JEDEC PUB95 PUB95 PUB95 PUB95 MO-220 MO-220 MO-220 MO-220 QFN-Quad Flat No Leads-Product Outline. Near Chip-Scale Package Footprint; Improves PCB Efficiency and Thinner in Profile Pb-Free Available (Ro . Package MSL Price US $ ISL6522CB ISL6522CB ISL6522CB ISL6522CB Active Comm 14 Ld SOIC 1 1.25 ISL6522CB ISL6522CB ISL6522CB ISL6522CB www.datasheetarchive.com/files/intersil/device_pages/device_isl6522.html |
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| -T Active Ind 8 Ld SOIC T+R 1 1.39 ISL6613IR ISL6613IR ISL6613IR ISL6613IR Active Ind 10 Ld QFN 1 1.44 ISL6613IR-T ISL6613IR-T ISL6613IR-T ISL6613IR-T Active Ind 10 Ld QFN T+R 1 1.44 ISL6613IRZ ISL6613IRZ ISL6613IRZ ISL6613IRZ Active Ind 10 Ld QFN 1 1.44 ISL6613IRZ-T ISL6613IRZ-T ISL6613IRZ-T ISL6613IRZ-T Active Ind 10 Ld QFN T -Scale Package Footprint; Improves PCB Efficiency and Thinner in Profile Pb-Free Plus Anneal Available (Ro . Package MSL Price US $ ISL6613CB ISL6613CB ISL6613CB ISL6613CB Active Comm 8 Ld SOIC 1 1.28 ISL6613CB ISL6613CB ISL6613CB ISL6613CB www.datasheetarchive.com/files/intersil/device_pages/device_isl6613.html |
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| Related Devices Ordering Information Part No. Status Temp. Package MSL Price US $ ISL83386EIV ISL83386EIV ISL83386EIV ISL83386EIV Active Ind 20 Ld TSSOP 1 2.44 ISL83386EIV-T ISL83386EIV-T ISL83386EIV-T ISL83386EIV-T Active Ind 20 Ld TSSOP T+R 1 2.44 ISL83386EIVZ ISL83386EIVZ ISL83386EIVZ ISL83386EIVZ Active Ind 20 Ld TSSOP 3 2.44 ISL83386EIVZ-T ISL83386EIVZ-T ISL83386EIVZ-T ISL83386EIVZ-T Active Ind 20 Ld TSSOP T+R 3 2.44 The price listed is the manufacturer's suggested supply current to a 1uA trickle. Small footprint packaging, and the use of small, low value capacitors www.datasheetarchive.com/files/intersil/device_pages/device_isl83386e.html |
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| small footprint (4x5mm) 24-pin QFN packages. The EL1528 EL1528 EL1528 EL1528 is specified for operation over the full -40 o C Diagrams Related Devices Ordering Information Part No. Status Temp. Package MSL Price US $ EL1528CL EL1528CL EL1528CL EL1528CL Active Ind 24 Ld QFN 1 3.48 EL1528CL-EVAL EL1528CL-EVAL EL1528CL-EVAL EL1528CL-EVAL Active Eval Board N/A EL1528CL-T13 EL1528CL-T13 EL1528CL-T13 EL1528CL-T13 Active Ind 24 Ld QFN T+R 1 3.56 EL1528CL-T7 EL1528CL-T7 EL1528CL-T7 EL1528CL-T7 Active Ind 24 Ld QFN T+R 1 3.56 EL1528CLZ EL1528CLZ EL1528CLZ EL1528CLZ Active Ind 24 Ld QFN www.datasheetarchive.com/files/intersil/device_pages/device_el1528.html |
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| T+R 1 1.66 ISL6596CRZ ISL6596CRZ ISL6596CRZ ISL6596CRZ Active Comm 10 Ld QFN 1 1.44 ISL6596CRZ-T ISL6596CRZ-T ISL6596CRZ-T ISL6596CRZ-T Active Comm 10 Ld QFN T+R 1 1.44 ISL6596IBZ ISL6596IBZ ISL6596IBZ ISL6596IBZ Active Dual Flat No-Lead (DFN) Package Compliant to JEDEC PUB95 PUB95 PUB95 PUB95 MO-220 MO-220 MO-220 MO-220 QFN-Quad Flat No Leads-Product Outline Near Chip-Scale Package Footprint; Improves PCB Efficiency and Thinner in Profile Pb-Free Plus Diagrams Related Devices Ordering Information Part No. Status Temp. Package MSL Price US $ ISL www.datasheetarchive.com/files/intersil/device_pages/device_isl6596.html |
Intersil | 07/09/2006 | 35.55 Kb | HTML | device_isl6596.html |