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Part Manufacturer Description Datasheet BUY
TMS320C54V90BPGE Texas Instruments DSP (DSP Only) for Embedded V90 Modem Solution [Not Recommended For New Designs (NRND)] 144-LQFP visit Texas Instruments
TMS320C54V90PGE Texas Instruments DSP (DSP Only) for Embedded V90 Modem Solution [Not Recommended For New Designs (NRND)] 144-LQFP visit Texas Instruments
TMS320C54V90APGE Texas Instruments DSP (DSP Only) for Embedded V90 Modem Solution [Not Recommended For New Designs (NRND)] 144-LQFP visit Texas Instruments
TMS320C54V90BGGU Texas Instruments DSP (DSP Only) for Embedded V90 Modem Solution [Not Recommended For New Designs (NRND)] 144-BGA MICROSTAR visit Texas Instruments
TMS320C54V90GGU Texas Instruments DSP (DSP Only) for Embedded V90 Modem Solution [Not Recommended For New Designs (NRND)] 144-BGA MICROSTAR visit Texas Instruments
TMS320C242PGA Texas Instruments 16-bit, 5V Fixed-Point DSP - ''NRND'' (Not Recommended for New Designs) - Technical Support Limited 64-QFP -40 to 85 visit Texas Instruments

pure tin recommended reflow profile

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: or pure tin plating (Note 3) FH19S Series Recommended Thickness: = 0.3 ± 0.03mm tinned copper or pure tin plating (Note 3) Item Specification Conditions 1. Insulation resistance , Series) UL94V-0 Contacts Phosphor bronze Pure tin plating (Note 3) - Metal fittings Phosphor bronze Pure tin reflow plating - Insulator Remarks sOrdering , soldering heat No deformation of components affecting performance. Reflow: At the recommended Hirose Electric
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Abstract: or pure tin plating (Note 3) FH19S Series Recommended Thickness: = 0.3 ± 0.03mm tinned copper or pure tin plating (Note 3) Item Specification Conditions 1. Insulation resistance , Series) UL94V-0 Contacts Phosphor bronze Pure tin plating (Note 3) - Metal fittings Phosphor bronze Pure tin reflow plating - Insulator Remarks sOrdering , soldering heat No deformation of components affecting performance. Reflow: At the recommended Hirose Electric
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Abstract: Relative humidity 90% max. Thickness: = 0.2 ± 0.03mm tinned copper or pure tin plating (Note 3) Thickness: = 0.3 ± 0.03mm tinned copper or pure tin plating (Note 3) Item 1. Insulation resistance 2 , / +85ç / +15ç to +35ç Time: 30 / 2 to 3 / 30 / 2 to 3(Minutes) 5 cycles Reflow: At the recommended , : Beige Color: Dark brown (FH19 Series) Color: Black (FH19S Series) Pure tin plating (Note 3) Pure tin , type 7 Plating specifications : 4 No. of contacts Blank: Pure tin plating (05): Gold plating Hirose Electric
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FPC-40 LCD connector

Abstract: FPC-40 Series) Color: Black (FH19S Series) Pure tin plating (Note 3) Pure tin reflow plating UL94V , humidity 90% max. Thickness: = 0.2 ± 0.03mm tinned copper or pure tin plating (Note 3) Thickness: = 0.3 ± 0.03mm tinned copper or pure tin plating (Note 3) Item 1. Insulation resistance 2. Withstanding , +35ç / +85ç / +15ç to +35ç Time: 30 / 2 to 3 / 30 / 2 to 3(Minutes) 5 cycles Reflow: At the recommended , Plating specifications : Blank: Pure tin plating (05): Gold plating 39 BConnector Operation
Hirose Electric
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FPC-40 LCD connector FPC-40

FPC-40 LCD connector

Abstract: FH12 % max. FH19 Series FPC, FFC Thickness: = 0.2 ± 0.03mm tinned copper or pure tin plating (Note 3) FH19S Series Recommended Thickness: = 0.3 ± 0.03mm tinned copper or pure tin plating (Note 3 , ) Color: Black (FH19S Series) UL94V-0 Contacts Phosphor bronze Pure tin plating (Note 3) - Metal fittings Phosphor bronze Pure tin reflow plating - Insulator Remarks , : At the recommended temperature profile Manual soldering: 350ç±5ç for 5 seconds Note 1: Includes
Hirose Electric
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FH12

FH1940S05SH

Abstract: fpc 0,5 mm pitch 3 / 30 / 2 to 3 (Minutes) 5 cycles Reflow: At the recommended temperature profile Manual soldering , :Beige Color: Dark brown Pure tin plating (Note 3) Pure tin reflow plating UL94V , copper or pure tin plating (Note 3) Specification Conditions Measured at 100 V DC 150 V AC applied for , /2oz Polyamide 1 mil thick Tinned copper plating or pure tin plating Cu Cu 1/2oz Polyamide Material 1 , devices has created increased demand for a low profile, high density, and high reliability connectors. The
Hirose Electric
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FH1940S05SH fpc 0,5 mm pitch

1206 footprint led

Abstract: pure tin recommended reflow profile -8 RECOMMENDED PRINTED CIRCUIT BOARD PATTERN 0 .0 5 9 (1 .5 ) RECOMMENDED IR REFLOW SOLDERING PROFILE 5 , Temperature - T stg Lead Soldering Time - TS0L Wave Reflow (Ta = 25" C unless otherwise specified) Pure , mm SURFACE MOUNT LED LAMP (1206) Chip Type - Water Clear PURE GREEN ORANGE QTLP650C-5 QTLP650C-8 FEATURES · Ultra-m iniature and extrem ely low profile · Industrial standard footprint · W ide viewing , lamps are designed to fit industry standard profile and footprint for ultra m iniature chip type 1206
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1206 footprint led pure tin recommended reflow profile

MPTS1812L150-24R

Abstract: MPTS1812L010R : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet the , reflow temperatures exceed the recommended profile, devices may not meet the performance requirements , . Storage Environment : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile , . Storage Environment : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile , seconds. Termination pad characteristics Termination pad materials: Pure Tin Product Dimensions
MERITEK
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MPTS1812L150-24R MPTS1812L010R MPTS1812L125R MPTS1812L110-16R E223037 MPTS0805 MPTS0805L010R MPTS0805L020R MPTS0805L035R MPTS0805L050R

PTC 090

Abstract: MPTS1206L012 reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. · , reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. · , pad characteristics Termination pad materials: Pure Tin Product Dimensions (Millimeters) MPTS0805 , 260ºC for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin Rev , temperatures exceed the recommended profile, devices may not meet the performance requirements. · Devices are
MERITEK
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PTC 090 MPTS1206L012 MPTS0805L010 MPTS0805L020 MPTS0805L035 MPTS0805L075R MPTS0805L100R MPTS2920L300
Abstract: reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. · , reflow soldering of 260ºC for 20 seconds. Termination pad characteristics Termination pad materials: Pure , temperatures exceed the recommended profile, devices may not meet the performance requirements. · Devices are , 260ºC for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin Rev , temperatures exceed the recommended profile, devices may not meet the performance requirements. · Devices are MERITEK
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MPTS2920L300R MPTS2920

MPTS1206L012

Abstract: %RH Caution: ï'· If reflow temperatures exceed the recommended profile, devices may not meet the , %RH Caution: ï'· If reflow temperatures exceed the recommended profile, devices may not meet the , '· If reflow temperatures exceed the recommended profile, devices may not meet the performance , : < 30ºC / 60%RH Caution: ï'· If reflow temperatures exceed the recommended profile, devices may not , Termination pad materials: Pure Tin Product Dimensions (Millimeters) MPTS0603 Part Number A B
MERITEK
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MPTS0603L001R MPTS0603L002R R50223766 MPTS0603L003R MPTS0603L004R MPTS0603L005R
Abstract: %RH Caution: ï'· If reflow temperatures exceed the recommended profile, devices may not meet the , : < 30ºC / 60%RH Caution: ï'· If reflow temperatures exceed the recommended profile, devices may not , : < 30ºC / 60%RH Caution: ï'· If reflow temperatures exceed the recommended profile, devices may not , : < 30ºC / 60%RH Caution: ï'· If reflow temperatures exceed the recommended profile, devices may not , : < 30ºC / 60%RH Caution: ï'· If reflow temperatures exceed the recommended profile, devices may not MERITEK
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MPTS0603L010R MPTS0603L012R MPTS0603L016R MPTS0603L020R
Abstract: : < 30ºC / 60%RH Caution: ï'· If reflow temperatures exceed the recommended profile, devices may not , '· If reflow temperatures exceed the recommended profile, devices may not meet the performance , : Pure Tin Product Dimensions (Millimeters) MPTS0603 A B C D E Part Number Max , '· Storage Environment : < 30ºC / 60%RH Caution: ï'· If reflow temperatures exceed the recommended , hour post trip. Termination pad characteristics Termination pad materials: Pure Tin Product MERITEK
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MPTS0603L025RZ MPTS0603L035RZ MPTS0603L050RZ MPTS0603L075RZ MPTS1812
Abstract: %RH Caution: ï'· If reflow temperatures exceed the recommended profile, devices may not meet the , : Pure Tin Product Dimensions (Millimeters) MPTS0603 A B C D E Part Number Max , '· Storage Environment : < 30ºC / 60%RH Caution: ï'· If reflow temperatures exceed the recommended , post trip. Termination pad characteristics Termination pad materials: Pure Tin Product Dimensions , the recommended profile, devices may not meet the performance requirements. ï'· Devices are not MERITEK
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Abstract: / 60%RH Caution: ï'· If reflow temperatures exceed the recommended profile, devices may not meet , : Pure Tin Product Dimensions (Millimeters) MPTS0603 A B C D E Part Number Max , '· Storage Environment : < 30ºC / 60%RH Caution: ï'· If reflow temperatures exceed the recommended , hour post trip. Termination pad characteristics Termination pad materials: Pure Tin Product , temperatures exceed the recommended profile, devices may not meet the performance requirements. ï'· Devices MERITEK
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Sn60Pb40

Abstract: SMD 5AG thermal stress inside the component. The reflow profile below is recommended and tested by AVX for eutectic SnAgCu and SnAgBiCu based lead-free pastes in combination with pure tin finish tantalum , / 60-90 s 2.5ºC/s 240 ± 5ºC 40s max -5ºC/s 160 - 200s Figure 4. Recommended reflow profile , current tin-lead soldering processes. Sn (pure tin), Sn / Ag and Sn / Cu are the leading candidates to , mass production. Based on this, pure tin remains the only readily available solution for a termination
AVX
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Sn60Pb40 SMD 5AG SnBiAg nortel capacitor SMT roadmap metallized paper capacitor, hitachi 5M1002-N
Abstract: . (insertion/ withdrawal) 5. Vibration Thickness: = 0.2±0.03mm tinned copper or pure tin plating (Note 3 , /+85ç/+15ç to +35ç Time: 30/ 2 to 3 / 30 / 2 to 3 (Minutes) 5 cycles Reflow: At the recommended , Color:Beige Color:Black Pure tin plating (Note 3) UL94V-0 -Finish Remarks sOrdering , Recommended temperature profile. The temperature may be slightly changed according to the solder paste type , Temperature Recommended Conditions Reflow system 150 150ç :IR reflow :Paste type Sn/0.3 Ag/0.5 Cu (Flux Hirose Electric
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D-73760 2NA311

SEC E 13007 - 2

Abstract: sec 13007 . (insertion/ withdrawal) 5. Vibration Thickness: = 0.2±0.03mm tinned copper or pure tin plating (Note 3 , /+85ç/+15ç to +35ç Time: 30/ 2 to 3 / 30 / 2 to 3 (Minutes) 5 cycles Reflow: At the recommended , Color:Beige Color:Black Pure tin plating (Note 3) UL94V-0 -Finish Remarks sOrdering , Recommended temperature profile. The temperature may be slightly changed according to the solder paste type , Temperature Recommended Conditions Reflow system 150 150ç :IR reflow :Paste type Sn/0.3 Ag/0.5 Cu (Flux
Hirose Electric
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SEC E 13007 - 2 sec 13007 sec E 13007 E 13007 0

FPC CONNECTOR Front lock

Abstract: affecting performance. Reflow: At the recommended temperature profile Manual soldering: 350 ç±5 ç for 5 , pure tin plating (Note 3) Item Specification Conditions 1. Insulation resistance 50 M ohms , Phosphor bronze Contacts Remarks Color:Beige UL94V-0 Pure tin plating (Note 3) sOrdering , 200 200ç Recommended Conditions Reflow system 150ç :IR reflow Solder 160ç 150 , Metal mask thickness 100 : 0.1 mm Recommended temperature profile. The temperature may be
Hirose Electric
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FPC CONNECTOR Front lock

HI-8586PSIF

Abstract: J-STD-020C Reflow Profile Holt selected matte tin to provide forward and backward compatibility with both the , Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average Ramp-Up Rate (Tsmax , testing has shown that matte tin is backward compatible to standard 215ºC to 225ºC tin/lead (SnPb) reflow processes and compatible with up to 260ºC Pb-free reflow processes. Tin Whisker Mitigation Because of , tin-lead (SnPb) to pure tin (Sn) lead finishes. Pure tin and high-tin content alloys are subject to tin
HOLT Integrated Circuits
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J-STD-020C HI-8586PSIF TL 949 2002/95/EC JSTD-020C
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