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XDM3730ACBP Texas Instruments Digital Media Processor 515-POP-FCBGA visit Texas Instruments

pop 168

Catalog Datasheet MFG & Type PDF Document Tags

LPDDR2 PoP

Abstract: LPDDR2 1.2V 1.2V 1.2V 1.2V 333­400 MHz 333­533 MHz 333­400 MHz 333­400 MHz 136-ball PoP 168-ball PoP 168-, 200-, 216-ball PoP 216-ball PoP ­40°C to +85°C ­40°C to +85°C ­40°C to +85°C ­40°C , MHz 167­200 MHz 152-ball PoP 152-, 168-ball PoP 152-, 168-ball PoP ­0°C to +70°C, ­40°C to , 1.7V­1.9V 152-ball VFBGA 152-, 168-ball VFBGA 168-ball VFBGA 152-, 168-ball VFBGA Clock Rate , ­40°C to +85°C ­40°C to +85°C Mobile LPDDR2 PoP Density Bus Width RoHS Voltage Clock
Micron Technology
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K9HDG08U1A

Abstract: k4g10325fe-hc04 -FBGA 90-FBGA 168-FBGA, 12x12 PoP, DDP 240-FBGA, 14x14 PoP, DDP 168-FBGA, 12x12 PoP 168-FBGA, 12x12 PoP 216-FBGA, 12x12 PoP 168-FBGA, 12x12 PoP, DDP, 64Mx32*2 134-FBGA, 11x11.5 PoP, DDP, 128x16*2 168-FBGA, 12x12 PoP, MONO, 128Mx32 216-FBGA, 12x12 PoP, QDP, 64Mx32*2 240-FBGA, 14x14 PoP, QDP, 64Mx32*2 134-FBGA, 11x11.5 PoP, QDP, 128x16*4 216-FBGA, 12x12 PoP, QDP, 64Mx32*4 216-FBGA, 12x12 PoP, DDP, 128Mx32*2 240-FBGA, 14x14 PoP, DDP, 128Mx32*2 216-FBGA, 12x12 PoP, QDP, 128Mx32*4 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V
Samsung Electronics
Original
K9HDG08U1A k4g10325fe-hc04 K9LCG08U0A KLM2G1DEHE-B101 K9WAG08U1B-PIB0 Ltn140at BR-11-ALL-001

marking k22 SMD

Abstract: pop 168 Preliminary 168-Ball x16, x32 LPDDR-SDRAM PoP (TI OMAP) Features LPDDR-SDRAM 168 , sheet specifications. Preliminary 168-Ball x16, x32 LPDDR-SDRAM PoP (TI OMAP) Part Numbering Information - 168-Ball PoP Part Numbering Information - 168-Ball PoP Micron® 168-ball packaged LPDDR-SDRAM , rights reserved. Preliminary 168-Ball x16, x32 LPDDR-SDRAM PoP (TI OMAP) General Description , Technology, Inc. All rights reserved. Preliminary 168-Ball x16, x32 LPDDR-SDRAM PoP (TI OMAP
Micron Technology
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marking k22 SMD pop 168 MT46H64M32 AB22-AB23 micron lpddr AC18-AC19 168-B MT46H 128M16 64M32 64M16 32M32

MT29F2G16AB

Abstract: MT29C4G48 Preliminary 168-Ball NAND Flash and LPDRAM PoP (TI OMAP) MCP Features NAND Flash and Mobile LPDRAM 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAPTM) MT29CxGxxMAxxxxx Features , specifications. Preliminary 168-Ball NAND Flash and LPDRAM PoP (TI OMAP) MCP Part Numbering Information , Package Codes A = 1.8V (1.70­1.95V) JG = 168-ball PoP (TI OMAP) (12 x 12 x 0.9mm) JI = 168-ball PoP , . Preliminary 168-Ball NAND Flash and LPDRAM PoP (TI OMAP) MCP Part Numbering Information Table 1
Micron Technology
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MT29F2G16AB MT29C4G48 MT29C2G24MAKLAJG-6 JW256 mt29f4g16ab MT29C2G48MAKLCJI-6 MT29C 137-B

MT29C2G24MAKLAJG-75 IT

Abstract: JW256 Preliminaryâ'¡ 168-Ball NAND Flash and LPDRAM PoP (TI OMAP) MCP Features NAND Flash and Mobile LPDRAM 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAPâ"¢) MT29CxGxxMAxxxxx , ) JG = 168-ball PoP (TI OMAP) JI = 168-ball PoP (Ti OMAP) NAND Flash Configuration Width , Micron Technology, Inc. All rights reserved. Preliminary 168-Ball NAND Flash and LPDRAM PoP (TI , . Preliminary 168-Ball NAND Flash and LPDRAM PoP (TI OMAP) MCP MCP General Description MCP General
Micron Technology
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MT29C2G24MAKLAJG-75 IT

MT29C2G24m

Abstract: SMD MARKING CODE h23 Preliminary 168-Ball NAND Flash and LP-DRAM PoP (TI-OMAP) MCP Features NAND Flash and LP-DRAM 168-Ball Package-on-a-Package (PoP) Combination Memory (TI OMAPTM) Features · · · · · · Figure 1 , . Preliminary 168-Ball NAND Flash and LP-DRAM PoP (TI-OMAP) MCP Part Numbering Information ­ 168-Ball PoP Part Numbering Information ­ 168-Ball PoP Micron NAND Flash and LP-DRAM devices are available in , ) Package Codes JG = 168-ball PoP (TI OMAP) JI = 168-ball PoP (Ti OMAP) NAND Flash Configuration Width
Micron Technology
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MT29C2G24m SMD MARKING CODE h23 MT29C4G48M MT29C2G48 MT29F4G16ABC MCP LPDDR 1Gb 512Mb 83071038/PDF

MT29F4G08ABA

Abstract: MT29C4G48 Micron Confidential and Proprietary 168-Ball NAND Flash and LPDDR PoP (TI OMAP) MCP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP , by Micron without notice. Micron Confidential and Proprietary 168-Ball NAND Flash and LPDDR PoP , 168-Ball NAND Flash and LPDDR PoP (TI OMAP) MCP Features Contents MCP General Description , Figure 1: PoP Block Diagram Features â'¢ â'¢ â'¢ â'¢ Micron NAND Flash and LPDDR components
Micron Technology
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MT29F4G08ABA MT29C4G48MAYBAAKQ-5 MT29C4G48MAZBAAKQ-5 MT29C4G96MAYBACJG-5 MT29C4G96MAZBACJG-5 MT29C8G96MAYBADJV-5 MT29C8G96MAZBADJV-5

MT29F4G08ABA

Abstract: MT29F4G08A Micron Confidential and Proprietary 168-Ball NAND Flash and LPDDR PoP (TI OMAP) MCP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAPâ , Proprietary 168-Ball NAND Flash and LPDDR PoP (TI OMAP) MCP Features Contents MCP General Description , Features Figure 1: PoP Block Diagram Micron® NAND Flash and LPDDR components RoHS-compliant , to change by Micron without notice. Micron Confidential and Proprietary 168-Ball NAND Flash and
Micron Technology
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MT29F4G08A MT29F8G08A MT29F4G08AB MT29F4G08ABAD MT29F16G08A

MT29F4G08ABA

Abstract: MT29F8G08A Micron Confidential and Proprietary Preliminary 168-Ball NAND Flash and LPDDR PoP (TI OMAP) MCP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package (PoP) MCP Combination Memory , . Micron Confidential and Proprietary Preliminary 168-Ball NAND Flash and LPDDR PoP (TI OMAP) MCP , Proprietary Preliminary 168-Ball NAND Flash and LPDDR PoP (TI OMAP) MCP Contents MCP General , Proprietary Preliminary 168-Ball NAND Flash and LPDDR PoP (TI OMAP) MCP Erase Operations
Micron Technology
Original
MT29C4G48MAZAPAKQ-5 MT29C4G96MAZ MT29F4G08ABB MT29C4G96M mt29f4g16aba smd transistor marking BA1 MT29C8G96 MT29C4G48MAYAPAKQ-5 MT29C4G48MAZAPAKQ-6 MT29C4G96MAZAPCJG-5 MT29C4G96MAZAPCJG-6 MT29C8G96MAZAPDJV-5

MT29C4G48MAZBBAKQ-48 IT

Abstract: MT29C4G96MAZBBCJG-48 Micron Confidential and Proprietary 168-Ball NAND Flash with LPDDR PoP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package (PoP) Combination Memory (TI OMAPâ , Proprietary 168-Ball NAND Flash with LPDDR PoP Features Part Numbering Information Micron NAND Flash and , Proprietary 168-Ball NAND Flash with LPDDR PoP Features Contents MCP General Description , (LPDDR) MT29C8G96MAZBBDJV-48 IT: 8Gb x16 (NAND) with 4Gb x32 (LPDDR) Features Figure 1: PoP Block
Micron Technology
Original
MT29C4G96MAZBBCJG-48 MT29C4G48MAZBBAKQ-48 IT MT29C8G96MAZBBDJV-48 IT MT29C4G48MAZBBAKQ-48 MT29C4G48MAZBBAKQ-5

MT29C4G48MAZAPAKQ-5

Abstract: MT29C4G96MAZAPCJG-5 Micron Confidential and Proprietary 168-Ball NAND Flash and LPDDR PoP (TI OMAP) MCP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAPTM , 168-Ball NAND Flash and LPDDR PoP (TI OMAP) MCP Features Part Numbering Information Micron NAND Flash , 168-Ball NAND Flash and LPDDR PoP (TI OMAP) MCP Features Contents MCP General Description , Proprietary 168-Ball NAND Flash and LPDDR PoP (TI OMAP) MCP Features Erase Operations
Micron Technology
Original
MT29C4G96MAZAPCJG-5IT MT29F8G16 MT29C4G48mazapakq lpddr2 mcp lpddr2 nand mcp Micron MT29F8G08 MT29C8G96MAZAPDJV-6 MT29F4G08ABBDAWP MT29F4G16ABBDAWP

smd marking K23

Abstract: lpddr Preliminary 168-Ball x16, x32 Mobile LPDDR PoP (TI OMAP)Mobile DDR SDRAM Addendum Mobile LPDDR 168-Ball Package-on-Package (PoP) TI OMAPTM MT46HxxxMxxLxJG Features Options · Vdd/Vddq , LPDDR PoP (TI OMAP)Mobile DDR SDRAM Addendum Part Numbering Information - 168-Ball PoP Micron® 168 , Technology, Inc. All rights reserved. Preliminary 168-Ball x16, x32 Mobile LPDDR PoP (TI OMAP)Mobile , . ©2008 Micron Technology, Inc. All rights reserved. Preliminary 168-Ball x16, x32 Mobile LPDDR PoP
Micron Technology
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smd marking K23 lpddr SMD transistor MARKING CODE g23 168-ball LPDDR LPDDR Pop smd transistor ab2

CSN-11

Abstract: MT46H64M32L2KQ Preliminary 168-Ball x32 Mobile LPDDR PoP (TI OMAP) Addendum Features Mobile LPDDR Addendum 168-Ball Package-on-Package (PoP) WFBGA TI OMAPTM MT46HxxxMxxL2KQ Features · VDD/VDDQ = 1.70­1.95V , . Preliminary 168-Ball x32 Mobile LPDDR PoP (TI OMAP) Addendum Part Numbering Information Part Numbering , Technology, Inc. All rights reserved. Preliminary 168-Ball x32 Mobile LPDDR PoP (TI OMAP) Addendum , Technology, Inc. All rights reserved. Preliminary 168-Ball x32 Mobile LPDDR PoP (TI OMAP) Addendum
Micron Technology
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CSN-11 MT46H64M32L2KQ Marking Code TI OMAP micron marking code information smd code marking CK 168B SAC105

168-FBGA

Abstract: 168FBGA : Mobile-DDR2-S4 SDRAM Q : Mobile DDR2-S2 SDRAM - Mobile-DDR SDRAM(X) 8 : 90-FBGA(LF, HF) A : 168-FBGA(LF, HF, DDP) F : 60-FBGA(LF, HF) N : 168-FBGA(LF, POP, HF) X : 152-FBGA(POP,HF,LF) 4~5. Density , : x32 (2CS/2CKE) 32 : x32 8. Bank 3 : 4Bank - Mobile DDR2-S2 SDRAM A : 168-FBGA (POP,HF,LF) - Mobile DDR2-S4 SDRAM A : 168-FBGA(POP,HF,LF) C : 136-FBGA(POP,HF,LF) - DRAM COMMON W : WAFER 16 : x16 31 : x32 (2CS) 4 : 8Bank HF : Halogen-Free LF : Lead-Free DDP : Dual Die Package POP
Samsung Electronics
Original
168-FBGA 168FBGA Mobile SDRAM 152FBGA FBGA 9 x 12 package tray marking code hf 54-CSP 4K/64 8K/64 166MH 133MH

samsung K9 flash

Abstract: K4X1G163PC-FGC3 Mobile-DDR SDRAM(X) 8 : 90-FBGA(LF, HF) A : 168-FBGA(LF, HF, DDP) F : 60-FBGA(LF, HF) N : 168-FBGA(LF, POP, HF) X : 152-FBGA(POP,HF,LF) - Mobile DDR2-S2 SDRAM A : 168-FBGA (POP,HF,LF) - Mobile DDR2-S4 SDRAM A : 168-FBGA(POP,HF,LF) C : 136-FBGA(POP,HF,LF) - DRAM COMMON W : WAFER HF : Halogen-Free LF : Lead-Free DDP : Dual Die Package POP : Package on Package 16 : x16 31 : x32 (2CS) 4 : 8Bank 9
Samsung Electronics
Original
K4X1G163PC-FGC3 samsung K9 flash samsung s6 samsung cdram samsung nor flash samsung K4 800MH K4X1G163PC K4X1G163PC-FGC6 111MH TRCD18

JEDEC Jc-11 free

Abstract: PSVFBGA LAMINATE data sheet Package on Package (PoP) Family Bottom PoP Technologies: Features , and applications adopting PoP along with new structures in the PSvfBGA platform. By the end of 2006 , the strong industry adoption of PoP and Amkor's technology leadership. PSvfBGA supports single die , second generation for PoP applications where new memory architectures required in mobile multimedia applications, demand higher density stacked interfaces in combination with PoP mounted area and height
Amkor Technology
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JEDEC Jc-11 free PSVFBGA 0.3mm pitch csp package FCCSP amkor flip Amkor Technology
Abstract: . . . . . . . . . . . . . . . 167 167 168 168 169 169 169 171 181 184 185 189 190 192 192 193 193 , . Table 163. Table 164. Table 165. Table 166. Table 167. Table 168. Table 169. Table 170. Table 171. Table ZiLOG
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F0830 PS025112-1011
Abstract: 166 167 167 168 168 169 169 170 171 181 184 185 188 189 191 191 192 192 193 194 195 196 197 199 202 , 164. Table 165. Table 166. Table 167. Table 168. Table 169. Table 170. Table 171. Table 172. Table 173 ZiLOG
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F083A PS026309-1011
Abstract: Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168 Table 110. Load Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168 Table ZiLOG
Original
PS026310-1212
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