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pinout ac125

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: .5 3. Package pinout/Mechanical Dimension & 3.1 x4 Package Pinout (Top view) : 78ball FBGA Package . 6 3.2 x8 Package Pinout (Top view) : 78ball FBGA Package , datasheet K4B4G0446Q K4B4G0846Q DDR3 SDRAM 3. Package pinout/Mechanical Dimension & Addressing 3.1 x4 Package Pinout (Top view) : 78ball FBGA Package 1 2 3 A VSS VDD B VSS Samsung Electronics
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78FBGA
Abstract: MC74AC125, MC74ACT125 Quad Buffer with 3-State Outputs · Outputs Source/Sink · ACT125 Has TTL Compatible Inputs VCC 14 A2 13 B2 12 O2 11 A3 10 B3 9 O3 8 http://onsemi.com PDIP-14 N SUFFIX CASE 646 14 1 SO-14 D SUFFIX CASE 751A 1 A0 2 B0 3 O0 4 A1 5 B1 6 O1 7 GND 14 1 Figure 1. Pinout: 14-Lead Packages Conductors (Top View) PIN ASSIGNMENT PIN An, Bn On FUNCTION Inputs , -14 MC74AC125N AWLYYWW SO-14 AC125 AWLYWW TSSOP-14 AC 125 ALYW EIAJ-14 74AC12 5 ALYW MC74ACT125N AWLYYWW ON Semiconductor
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ac125 pinout 74ACT125 MC74AC125D MC74AC125DR2 MC74ACT125D MC74ACT125DR2 MC74AC125DT MC74AC125DTR2
Abstract: MC74AC125, MC74ACT125 Quad Buffer with 3-State Outputs · Outputs Source/Sink · ACT125 Has TTL Compatible Inputs VCC 14 A2 13 B2 12 O2 11 A3 10 B3 9 O3 8 http://onsemi.com PDIP­14 N SUFFIX CASE 646 14 1 SO­14 D SUFFIX CASE 751A 1 A0 2 B0 3 O0 4 A1 5 B1 6 O1 7 GND 14 1 Figure 1. Pinout: 14­Lead Packages Conductors (Top View) PIN ASSIGNMENT PIN An, Bn On FUNCTION Inputs , Conditions VCC = 5.0 V VCC = 5.0 V MARKING DIAGRAMS PDIP­14 MC74AC125N AWLYYWW SO­14 AC125 AWLYWW TSSOP ON Semiconductor
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MC74ACT125DT MC74ACT125DTR2 MC74AC125M MC74AC125MEL MC74ACT125M MC74ACT125MEL
Abstract: .5 3. Package pinout/Mechanical Dimension & 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package , pinout/Mechanical Dimension & Addressing 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package 1 A , ,8 VIH.CA(AC125) AC input logic high - - VREF+125 Note 2 mV 1,2,7 VIL.CA(AC125) AC input logic low - - Note 2 VREF-125 mV 1,2,8 0.49*VDD 0.51*VDD 0.49 Samsung Electronics
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k4b2g1646q K4B2G1646Q-BCK0 K4B2G1646Q 96FBGA
Abstract: . 5 3. Package pinout/Mechanical Dimension & Addressing. 6 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package , Rev. 1.11 DDR3 SDRAM K4B1G1646G 3. Package pinout/Mechanical Dimension & Addressing 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package 1 2 3 A VDDQ DQU5 B VSSQ C 4 , AC input logic low VIH.CA(AC125) AC input logic high - - VREF+125 Note 2 mV 1,2 Samsung Electronics
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K4B1G1646G-BCK0 K4B1G1646G-BCH9 K4B1G1646G-BCMA
Abstract: .5 3. Package pinout/Mechanical Dimension & 3.1 x16 DDP Package Pinout (Top view) : 96ball FBGA Package , SDRAM 3. Package pinout/Mechanical Dimension & Addressin 3.1 x16 DDP Package Pinout (Top view , - Note 2 VREF - 135 mV 1,2,8 VIH.CA(AC125) AC input logic high - - VREF+125 Note 2 mV 1,2,7 VIL.CA(AC125) AC input logic low - - Note 2 VREF-125 mV 1,2 Samsung Electronics
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K4B8G1646Q
Abstract: .5 3. Package pinout/Mechanical Dimension & 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package , pinout/Mechanical Dimension & Addressing 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package 1 A , ,8 VIH.CA(AC125) AC input logic high - - VREF+125 Note 2 mV 1,2,7 VIL.CA(AC125) AC input logic low - - Note 2 VREF-125 mV 1,2,8 0.49*VDD 0.51*VDD 0.49 Samsung Electronics
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Abstract: . 5 3. Package pinout/Mechanical Dimension & Addressing. 6 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package , SDRAM K4B2G1646E 3. Package pinout/Mechanical Dimension & Addressing 3.1 x16 Package Pinout (Top , logic high VIL.CA(AC150) AC input logic low AC input logic low VIH.CA(AC125) AC input logic high - - VREF+125 Note 2 mV 1,2,7 VIL.CA(AC125) - - Note 2 VREF Samsung Electronics
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K4B2G1646E- K4B2G1646EBCH9
Abstract: . 5 3. Package pinout/Mechanical Dimension & Addressing. 6 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package , of operation. -5- K4B1G1646G datasheet Rev. 1.0 DDR3 SDRAM 3. Package pinout/Mechanical Dimension & Addressing 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package 1 A B C D E F G , logic low VIH.CA(AC135) AC input logic high VIL.CA(AC135) AC input logic low VIH.CA(AC125) AC input Samsung Electronics
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K4B1G1646G-BCF8 K4B1G1646G-BCNB K4B1G1646G 1600 470 ohm resistance K4B1G16 K4B1G1646GBCH9
Abstract: . 5 3. Package pinout/Mechanical Dimension & Addressing. 6 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package , of operation. -5- K4B4G1646B datasheet Rev. 1.0 DDR3 SDRAM 3. Package pinout/Mechanical Dimension & Addressing 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package 1 A B C D E F G , VIH.CA(AC125) AC input logic high VIL.CA(AC125) VREFCA(DC) AC input logic low Reference Voltage for ADD Samsung Electronics
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K4B4G1646 K4B4G1646B-HCK0 K4B4G1646B-HCMA K4B4G1646B-HCF8 K4B4G1646BHCK0 K4B4G1646B-HIH9
Abstract: . 5 3. Package pinout/Mechanical Dimension & Addressing. 6 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package , datasheet Rev. 1.21 DDR3 SDRAM 3. Package pinout/Mechanical Dimension & Addressing 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package 1 A B C D E F G H J K L M N P R T VDDQ VSSQ VDDQ VSSQ VSS VDDQ , VIH.CA(AC125) AC input logic high VIL.CA(AC125) VREFCA(DC) AC input logic low Reference Voltage for ADD Samsung Electronics
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K4B2G1646E-BCMA K4B2G1646E-BCK0 K4B2G1646E-BIH9 K4B2G1646E-BCH9 samsung k4b2g1646e K4B2G1646E-BPH9
Abstract: . 5 3. Package pinout/Mechanical Dimension & Addressing. 6 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package , operation. -5- Rev. 1.0 DDR3 SDRAM K4B4G1646B 3. Package pinout/Mechanical Dimension & Addressing 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package 1 2 3 A VDDQ DQU5 B , (AC125) AC input logic high - - VREF+125 Note 2 mV 1,2,7 VIL.CA(AC125) - - Samsung Electronics
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Abstract: . 5 3. Package pinout/Mechanical Dimension & Addressing. 6 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package , K4B2G1646C 3. Package pinout/Mechanical Dimension & Addressing 3.1 x16 Package Pinout (Top view) : 96ball , VIH.CA(AC175) AC input logic high VREF + 175 VIL.CA(AC175) AC input logic low VIH.CA(AC125) AC input logic high - - VREF+125 Note 2 mV 1,2,7 VIL.CA(AC125) AC input logic low - Samsung Electronics
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K4B2G16 K4B2G1646C-HCK0 K4B2G1646C-HC
Abstract: . 5 3. Package pinout/Mechanical Dimension & Addressing. 6 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package , DDR3 SDRAM 3. Package pinout/Mechanical Dimension & Addressing 3.1 x16 Package Pinout (Top view , AC input logic low VIH.CA(AC125) AC input logic high - - VREF+125 Note 2 mV 1,2,7 VIL.CA(AC125) - - Note 2 VREF-125 mV 1,2,8 0.49*VDD 0.51*VDD 0.49 Samsung Electronics
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k4b1g1646g-bch K4B1G1646G-BCF DDR3-2133 K4B1G1646G-BCN samsung dimm DDR3 SPD k4b1g1646g DDR3-1333
Abstract: . 5 3. Package pinout/Mechanical Dimension & Addressing. 6 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package , . Package pinout/Mechanical Dimension & Addressing 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package , logic low VIH.CA(AC135) AC input logic high VIL.CA(AC135) AC input logic low VIH.CA(AC125) AC input logic high VIL.CA(AC125) AC input logic low VREFCA(DC) Reference Voltage for ADD, CMD inputs NOTE : 1 Samsung Electronics
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K4B2G1646C-HCH9 K4B2G1646C-HCK 128mx16 ddr3 k4B2G1646 K4B2G1646C-HCNB K4B2G1646C-HCF8 2133M
Abstract: . 7 8. Pinout Comparison Based On Module Type , on some RCs Not used on UDIMMs 8. Pinout Comparison Based On Module Type Pin 48, 49 120, 240 53 , ) AC input logic low VIH.CA(AC135) AC input logic high VIL.CA(AC135) AC input logic low VIH.CA(AC125) AC input logic high VIL.CA(AC125) AC input logic low VREFCA(DC) Reference Voltage for ADD, CMD inputs , (AC125); VIH.CA(AC175) value is used when VREF + 175mV is referenced , VIH.CA(AC150) value is used when Samsung Electronics
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DDR3-1866 RDIMM SPD JEDEC M392B5670GB0-CF8 M392B2873GB0 M392B5673GB0 M392B5670GB0 K4B1G0446G-BC
Abstract: . 5 3. Package pinout/Mechanical Dimension & Addressing. 6 3.1 x4 Package Pinout (Top view) : 78ball FBGA Package . 6 3.2 x8 Package Pinout (Top view) : 78ball FBGA Package , 3. Package pinout/Mechanical Dimension & Addressing 3.1 x4 Package Pinout (Top view) : 78ball FBGA , K4B2G0846E datasheet Rev. 1.0 DDR3 SDRAM 3.2 x8 Package Pinout (Top view) : 78ball FBGA Package Samsung Electronics
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K4B2G0846E-BCH9 K4B2G0446E
Abstract: . 5 3. Package pinout/Mechanical Dimension & Addressing. 6 3.1 x4 Package Pinout (Top view) : 78ball FBGA Package . 6 3.2 x8 Package Pinout (Top view) : 78ball FBGA Package , of operation. -5- Rev. 1.13 K4B2G0446D K4B2G0846D DDR3 SDRAM 3. Package pinout/Mechanical Dimension & Addressing 3.1 x4 Package Pinout (Top view) : 78ball FBGA Package 1 2 3 4 Samsung Electronics
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Abstract: . 5 3. Package pinout/Mechanical Dimension & Addressing. 6 3.1 x4 Package Pinout (Top view) : 78ball FBGA Package . 6 3.2 x8 Package Pinout (Top view) : 78ball FBGA Package , operation. -5- Rev. 1.3 K4B4G0446B K4B4G0846B DDR3 SDRAM 3. Package pinout/Mechanical Dimension & Addressing 3.1 x4 Package Pinout (Top view) : 78ball FBGA Package 1 2 3 A VSS Samsung Electronics
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Abstract: . 5 3. Package pinout/Mechanical Dimension & Addressing. 6 3.1 x4 Package Pinout (Top view) : 78ball FBGA Package . 6 3.2 x8 Package Pinout (Top view) : 78ball FBGA Package , SDRAM 3. Package pinout/Mechanical Dimension & Addressing 3.1 x4 Package Pinout (Top view) : 78ball , K4B1G0446G K4B1G0846G datasheet Rev. 1.01 DDR3 SDRAM 3.2 x8 Package Pinout (Top view) : 78ball Samsung Electronics
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K4B1G0846G-BCK0
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