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TTL-LOGIC-DATABOOK Texas Instruments TTL-LOGIC-DATABOOK visit Texas Instruments

pick*up databook

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Ablebond 8380

Abstract: X3304 be a quality indicator for the reflow process. The pick-up head design can contribute to component alignment control and bond line thickness of the die attach medium. Pick-up contact on the polyimide , . Pick-up tooling design should be verified with your equipment supplier. 12.4.10.5.3 Removal Process , Databook X TCP components are shipped flat in slide carriers to protect the leads. The carriers are , 1998 Packaging Databook Advanced Package Applications: Tape Carrier Package Figure 12-1. One TCP
Intel
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A7647

Abstract: A7647-01 capacitors, or the exposed metal on the side of the package. 2000 Packaging Databook 13-1 Pinned , performance. 13-2 2000 Packaging Databook Pinned Packaging Table 13-3 summarizes the key , solder after insertion into the PCB substrate. 2000 Packaging Databook 13-3 Pinned Packaging , Databook Pinned Packaging Figure 13-3, Table 13-4 and Table 13-5 illustrate the package outline , Slug measurements in mm A5771-01 2000 Packaging Databook 13-5 Pinned Packaging Table
Intel
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A7647 A7647-01 A7190-01 socket s1 REFLOW socket 615-PIN BGA PACKAGE TOP MARK intel A5775-01

Ablebond 8380

Abstract: A5700 be a quality indicator for the reflow process. The pick-up head design can contribute to component alignment control and bond line thickness of the die attach medium. Pick-up contact on the polyimide , . Pick-up tooling design should be verified with your equipment supplier. 12.4.10.5.3 Removal Process , Databook X TCP components are shipped flat in slide carriers to protect the leads. The carriers are , . The detail of the OLB Window area is shown in Figure 12-6. 12-2 1999 Packaging Databook
Intel
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Ablebond 8380 A5700 Ablestik 8380 smema nozzle heater shoulder angle foot length lead solder joint reliability IPC-SM-785 IPC-SM-782A ANSI/J-STD-001

programming smt machine

Abstract: pick and place robot pick-up (removal and replacement) capability becomes available for both passive and active components , 1 240821-1 1999 Packaging Databook 2 3 4 5 6 7 8 9 10 11 12 13 A5660 , components. Figure 7-4 shows an example of an active component in surface 7-2 1999 Packaging Databook , Mount Active Components and its Conventional Equivalent 240821-57 1999 Packaging Databook A5663 , chip components are surface mounted by exposure to solder wave. 7-4 1999 Packaging Databook
Intel
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programming smt machine pick and place robot A5668-01 SURFACE MOUNT RESISTOR tank water level control SMT Process A5660-01 IPC-SM-782

240817

Abstract: /rework with vacuum pick-up (removal and replacement) capability becomes available for both passive and , -Pin 12.11 1.63 1 240821-1 1998 Packaging Databook 2 3 4 5 6 7 8 9 10 11 12 , mount components. Figure 7-4 shows an example of an active component 7-2 1998 Packaging Databook , Packaging Databook A5663-01 7-3 Surface Mount Technology (SMT) Figure 7-5. Surface Mount , Packaging Databook Surface Mount Technology (SMT) The process sequence for Type I SMT is shown in
Intel
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240817

Intel reflow soldering profile BGA

Abstract: A5832 temperatures. b. Dispense liquid, no-clean flux between the package and the board. c. Attach a vacuum pick-up , vacuum pick-up, adding 30 seconds and then not applying the vacuum pick-up during removal until this , since the thermal solution can directly contact the die. 2000 Packaging Databook 14-1 Ball , substrate made of a two-metal layer copper 14-2 2000 Packaging Databook Ball Grid Array (BGA , Packaging Databook 14-3 Ball Grid Array (BGA) Packaging Figure 14-2. HL-PBGA Die Down
Intel
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Intel reflow soldering profile BGA A5832 JEDEC bga 63 tray Intel BGA pcb warpage in ipc standard Intel reflow soldering profile BGA LEAD FREE

PBGA 256 reflow profile

Abstract: Intel reflow soldering profile BGA . Attach a vacuum pick-up tip onto the package and apply hot air (preheat, ramp time, and temperature to , time to release when using the vacuum pick-up, adding 30 seconds and then not applying the vacuum pick-up during removal until this amount of time had passed. d. Lift the package from the board. e , (mm) 1999 Packaging Databook 304 432 HL-PBGA 540 352 S S S S 1.27 , Databook Plastic Ball Grid Array (PBGA) Packaging 14.3 Package Materials The PBGA package
Intel
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PBGA 256 reflow profile bga 196 land pattern BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING

pcb warpage in ipc standard

Abstract: Intel reflow soldering profile BGA temperatures. b. Dispense liquid, no-clean flux between the package and the board. c. Attach a vacuum pick-up , vacuum pick-up, adding 30 seconds and then not applying the vacuum pick-up during removal until this , Comments/Footnotes 1998 Packaging Databook 14-1 Plastic Ball Grid Array (PBGA) Packaging 14.3 , A5765-01 14-2 1998 Packaging Databook Plastic Ball Grid Array (PBGA) Packaging 14.4 , : Millimeter 1998 Packaging Databook 14-3 Plastic Ball Grid Array (PBGA) Packaging Figure 14-3
Intel
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a5764 corner relief carrier tape fine BGA thermal profile fine line bga thermal cycling reliability BGA PROFILING leaded

smps 1000 eltek

Abstract: Eltek smps 250 You are in Databook Vol 2a · Click for Main Menu Product Categories (CLICK ANY ITEM) Return , You are in Databook Vol 2a · Click for Main Menu 1999 CD-ROM Power Supply ICs: LDO Regulators Click for: Product Categories Volume 2a Contents Volume 2a Index You are in Databook Vol 2a · , its safety or effectiveness. You are in Databook Vol 2a · Click for Main Menu A CORPORATE , Semiconductor­your source for High-Performance Analog Power ICs Corporate History You are in Databook Vol 2a ·
Micrel Semiconductor
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smps 1000 eltek Eltek smps 250 eltek smps 1000 UNITRODE applications handbook uc3842 -96 UNITRODE applications handbook uc3843 -96 eltek smps 1500 MIC5158 IRLZ44 CD4093BC 1N914 IRFZ44

SD MOSFET DRIVE 4468 8 PIN

Abstract: eltek rectifier module circuit diagram You are in Databook Vol. 2b · Click for Main Menu Product Categories (CLICK ANY ITEM) Return , You are in Databook Vol. 2b · Click for Main Menu 1999 CD-ROM Power Supply ICs: Switchers , Databook Vol. 2b · Click for Main Menu © 1999 Micrel, Inc. The information furnished by Micrel , its safety or effectiveness. You are in Databook Vol. 2b · Click for Main Menu A CORPORATE , Semiconductor­your source for High-Performance Analog Power ICs Corporate History You are in Databook Vol. 2b
Micrel Semiconductor
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SD MOSFET DRIVE 4468 8 PIN eltek rectifier module circuit diagram IRF830 smps design with TL431 UC3842 smps design with TL431 3842 smps battery charger circuit electronic transformer halogen ret 220c MIC5014/5016 MIC5014 MIC5011 SN54COO IRLZ24 1N754

11 watt cfl circuit diagram of 12 volts

Abstract: 8 watt cfl circuit diagram of 12 volts G ROVE , CA. 92841 1 P AT E N T P E N D I N G PRODUCT DATABOOK 1996/1997 LXM1592 , DATABOOK 1996/1997 P AT E N T P E N D I N G LXM1592/LXM1593 F LOATING O UTPUT D RIVE, C USTOMIZABLE , P AT E N T P E N D I N G PRODUCT DATABOOK 1996/1997 LXM1592/LXM1593 F LOATING O UTPUT DRIVE , DATABOOK 1996/1997 P AT E N T P E N D I N G LXM1592/LXM1593 F LOATING O UTPUT D RIVE, C USTOMIZABLE , SAMPLING PERIOD Copyright © 1996 Rev. 0.3 6/96 5 PRODUCT DATABOOK 1996/1997 P AT E N T P E N
Microsemi
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11 watt cfl circuit diagram of 12 volts 8 watt cfl circuit diagram of 12 volts Design pure sine wave inverter using transformer 12vdc 1200 Watt AC Inverter 50 watts CFL inverter circuit diagram CMOS inverter spice model LXM1592/93 LXM1593 05FMS-1 SM02-

Royer oscillator

Abstract: Royer resonant ARDEN G ROVE , CA. 92841 1 P AT E N T P E N D I N G PRODUCT DATABOOK 1996/1997 LXM1590 , PRODUCT DATABOOK 1996/1997 P AT E N T P E N D I N G LXM1590/LXM1591 C USTOMIZABLE CCFL IN V E RTER , . CN2 Copyright © 1995 Rev. 0.9.3 3/96 3 P AT E N T P E N D I N G PRODUCT DATABOOK 1996 , PRODUCT DATABOOK 1996/1997 P AT E N T P E N D I N G LXM1590/LXM1591 C USTOMIZABLE CCFL IN V E RTER , PRODUCT DATABOOK 1996/1997 P AT E N T P E N D I N G LXM1590/LXM1591 C USTOMIZABLE CCFL IN V E RTER
Microsemi
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Royer oscillator Royer resonant royer inverter Royer Back Light INVERTER MODULE lux meter chip LXM1590- LXM1591-

NJM2711F

Abstract: NJM2711 pickup circuit of CD-R/RW or DVDR/RW, wideband video system, high resolution scanner or FAX, high speed , load capacitance. [CAUTION] The specifications on this databook are only given for information , without any guarantee as regards either mistakes or omissions. The application circuits in this databook
New Japan Radio
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NJM2711 NJM2711F 180MH

NJM2712M

Abstract: NJM2712 PRELIMINARY ULTRA HIGH SPEED SINGLE OPERATIONAL AMPLIFIER n GENERAL DESCRIPTION The NJM2712 is an ultra high speed dual operational amplifier. It can swings 260V/µs high slew rate and 1GHz gain band width product(10MHz typ. at 40dB) at ±2.5V. It is suitable for pickup circuit of CD-R/RW or , on this databook are only given for information , without any guarantee as regards either mistakes or omissions. The application circuits in this databook are described only to show representative usages of the
New Japan Radio
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NJM2712M NJM2712RB1 NJU2712RB1

NJL5902R

Abstract: Photo reflector application 0.25 0.25 0.5 0.5 LED CENTER PT CENTER · Detecting the location of optical pickup , ] The specifications on this databook are only given for information , without any guarantee as regards either mistakes or omissions. The application circuits in this databook are described only to
New Japan Radio
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NJL5902R Photo reflector application

working of fused tube light using diodes

Abstract: TOSHIBA DIODE DATABOOK GLASS MOLD picking up ICs with a vacuum unit, use a conductive rubber fitting on the end of the pick-up wand to , details may differ from device to device, refer also to the relevant individual datasheets or databook , , please follow the instructions given in the relevant individual datasheets or databook. CMOS logic IC , pins of heat sinks, refer to the relevant technical datasheet and databook. 3.3.5 Latch-Up , measures for a particular device, consult the relevant databook. 95 [ 4 ] Handling Precautions
Toshiba
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working of fused tube light using diodes TOSHIBA DIODE DATABOOK GLASS MOLD toshiba OPTICAL PICK-UP IEC825-1 YG6260

NJL5902R

Abstract: optical Pick-Up head location of optical pickup head for CD/DVD LED CENTER 0.85 (0.2) (0.2) 0.7 0.85 0.4 , 180 60 13 Label [CAUTION] The specifications on this databook are only given for , this databook are described only to show representative usages of the product and not intended for
New Japan Radio
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optical Pick-Up head NJL5901AR CD/DVD pickup 902RT

dvd optical pickup

Abstract: PCB Pattern (0.47) 1.6 0.1 APPLICATIONS · Detecting the location of CD/DVD optical pickup , with silica gel (3 bags). Label 8.5 13 [CAUTION] The specifications on this databook are only , circuits in this databook are described only to show representative usages of the product and not intended
New Japan Radio
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dvd optical pickup NJL5901R

IEC825-1

Abstract: TOSHIBA GLASS MOLD of the pick-up wand to protect against electrostatic charge. (b) Minimize friction on IC package , also to the relevant individual datasheets or databook. 72 [6] 3.3 Handling Precautions , pin to pin, please follow the instructions given in the relevant individual datasheets or databook , with the pins of heat sinks, refer to the relevant technical datasheet and databook. 3.3.5 , measures for a particular device, consult the relevant databook. 76 [6] 3.3.12 Handling
Toshiba
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TOSHIBA GLASS MOLD
Abstract: NJM2711 ULTRA HIGH SPEED SINGLE OPERATIONAL AMPLIFIER â  GENERAL DESCRIPTION â  PACKAGR OUTLINE The NJM2711 is an ultra high speed single operational amplifier. It can swings 260V/µs high slew rate and 1GHz gain band width product(10MHz typ. at 40dB) at ±2.5V. It is suitable for pickup , RL CF RG [CAUTION] The specifications on this databook are only given for information , without any guarantee as regards either mistakes or omissions. The application circuits in this databook New Japan Radio
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