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outline of the heat sink for JEDEC

Catalog Datasheet Results Type PDF Document Tags
Abstract: of ascending pin count. Altera package outlines meet the requirements of JEDEC Publication No. 95. , package outline for the 484-pin FineLine BGA packaging. Figure 14­1. 484-Pin FBGA Package Outline TOP , show the package information and package outline figure references, respectively, for the 780-pin FBGA , 14­2 shows a package outline for the 780-pin FineLine BGA packaging. Figure 14­2. 780-Pin FBGA , package information and package outline figure references, respectively, for the 1,152-pin FBGA ... Original
datasheet

8 pages,
197.69 Kb

MS-034 MS 034 aaj led flip-chip 84 FBGA outline AGX52014-1 altera cross reference bt 146 1152 FBGA-484 FBGA 152 84 FBGA thermal FBGA-484 datasheet MS-034 1152 BGA AGX52014-1 abstract
datasheet frame
Abstract: ascending pin count. Altera package outlines meet the requirements of JEDEC Publication No. 95. 14­2 , Device Handbook, Volume 2 Package Outlines Figure 14­1 shows a package outline for the 484-pin , information and package outline figure references, respectively, for the 780-pin FBGA packaging. Table , package outline for the 780-pin FineLine BGA packaging. Figure 14­2. 780-Pin FBGA Package Outline TOP , information and package outline figure references, respectively, for the 1,152-pin FBGA packaging. Table ... Original
datasheet

8 pages,
167.49 Kb

MS-034 AGX52014-1 bt 146 FBGA PACKAGE thermal resistance MS 034 asme y14.5m 84 FBGA outline FBGA-484 datasheet AGX52014-1 abstract
datasheet frame
Abstract: INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION SHALL NOT EXCEED 0.25mm PER SIDE. 3. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM OF PACKAGE BY 0.15mm. 4. THIS OUTLINE CONFORMS TO JEDEC PUBLICATION 95 REGISTRATION MS-026-BFB MS-026-BFB A THE SAME PACKAGE DIMENSIONS APPLY FOR THERMALLY ENHANCED PRODUCTS. HEAT SINK IS ADDED. THE PACKAGE CODE IS "Hf. 144-PIN 144-PIN TQFP (TQ144 TQ144) 144-PIN 144-PIN HEAT SINK TQFP (HT144 HT144) ... OCR Scan
datasheet

1 pages,
78.29 Kb

TQ144 MS-026-Bfb datasheet abstract
datasheet frame
Abstract: PROTRUSION. ALLOWABLE MOLD PROTRUSION SHALL NOT EXCEED 0.25mm PER SIDE. 3. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM OF PACKAGE BY 0.15mm. 4. THIS OUTLINE CONFORMS TO JEDEC PUBLICATION 95 REGISTRATION MS-026-BGA MS-026-BGA A THE SAME PACKAGE DIMESIONS APPLY FOR THERMALLY ENHANCED PRODUCTS. HEAT SINK IS ADDED. THE PACKAGE CODE IS "Hf. 176-PIN 176-PIN TQFP (TQ176 TQ176) 176-PIN 176-PIN HEAT SINK TQFP (HT176 HT176 ... OCR Scan
datasheet

1 pages,
84.24 Kb

TQ176 outline of the heat sink for JEDEC MS-026-BGA JEDEC Package Code MS-026-BGA HT176 datasheet abstract
datasheet frame
Abstract: MOLD PROTRUSION IS 0.25mm PER SIDE. 3. THE TOP OF PACKAGE MAY BE EQUAL TO OR SMALLER THAN THE BOTTOM OF PACKAGE BY 0.15 MILLIMETERS. 4. PACKAGE CONFORMS TO JEDEC OUTLINE MO-108-CC1 MO-108-CC1 THE SAME PACKAGE DIMENSIONS APPLY FOR THERMALLY ENHANCED PRODUCTS. HEAT SINK IS ADDED. THE PACKAGE CODE IS "HQ". 100-PIN 100-PIN PQPP (PQ100 PQ100) 100-PIN 100-PIN HEAT SINK PQFP (HQ100 HQ100) ... OCR Scan
datasheet

1 pages,
80.38 Kb

PQ100 100-PIN datasheet abstract
datasheet frame
Abstract: Marketing Outline and conforms to Jedec Option AA. Effect of Change: This change will have no impact on , change are listed below in the "Affected FSIDs" section. Description of Change: Fairchild , Semiconductor's ongoing effort to increase manufacturing capacity for our various products assembled in the , Industrial Park Suzhou, Jiangsu P. R. of China. The following are the package dimensional, process and , Site DPAK (TO-252) Package Dimensional Review Figure 1. DPAK Package Outline (JEDEC) (All ... Original
datasheet

7 pages,
56.16 Kb

TO-251 fairchild eme-6600cs 5U36 FDD5614P -5E36 TO-251 Outline HUF76129D3ST ISL9N327AD3ST hplr3103 a104 FDD8870 TAMAC-4 90Pb10Sn eme6600cs datasheet abstract
datasheet frame
Abstract: package (Moisture Sensitive) with Material heat sink. This conversion should not require any board layout changes since the package outline for MQUAD Testing Manufacturing Site and ED QUAD is identical (JEDEC , Lead Finish Assembly Location Thermal Characteristics Heat Sink Moisture Sensitive Package Outline , require written notification of this change. Please use the acknowledgement below or E-Mail to grant , Sensitive) with heat sink. IPD Execute Planned Electrical Data sheet: No change Package Moisture Level ... Original
datasheet

3 pages,
11.33 Kb

I0008-05 I0008-05 abstract
datasheet frame
Abstract: package (Moisture Sensitive) with Material heat sink. This conversion should not require any board layout changes since the package outline for MQUAD Testing Manufacturing Site and ED QUAD is identical (JEDEC , Lead Finish Assembly Location Thermal Characteristics Heat Sink Moisture Sensitive Package Outline , require written notification of this change. Please use the acknowledgement below or E-Mail to grant , Sensitive) with heat sink. IPD Execute Planned Electrical Data sheet: No change Package Moisture Level ... Original
datasheet

3 pages,
11.33 Kb

I0008-05 I0008-05 abstract
datasheet frame
Abstract: of ascending pin count. Altera package outlines meet the requirements of JEDEC Publication No. 95. , for the 484-pin FineLine BGA packaging. Figure 14� 484-Pin FBGA Package Outline TOP VIEW , information and package outline figure references, respectively, for the 780-pin FBGA packaging. Table 14� , Handbook, Volume 2 Document Revision History Figure 14�shows a package outline for the 1,152-pin , provided for a board that meets JDEC specifications and for a typical board. The following values are ... Original
datasheet

10 pages,
200.77 Kb

MS-034 moisture sensitivity JEDEC FBGA AGX52014-1 484-pin BGA MS-034 1152 BGA FBGA-484 datasheet datasheet abstract
datasheet frame
Abstract: information and package outline figure references, respectively, for the 484-pin FBGA packaging. Table 14� , package outline for the 484-pin FineLine BGA packaging. Figure 14� 484-Pin FBGA Package Outline TOP , the package information and package outline figure references, respectively, for the 780-pin FBGA , package outline for the 780-pin FineLine BGA packaging. Figure 14� 780-Pin FBGA Package Outline TOP , package outline figure references, respectively, for the 1,152-pin FBGA packaging. Table 14� 1,152-Pin ... Original
datasheet

10 pages,
193.66 Kb

MS-034 arria AGX52014-1 FBGA-484 datasheet datasheet abstract
datasheet frame

Datasheet Content (non pdf)

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Over 1.1 million files (1986-2014): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer.
 
conducting simultaneously. The ISL6596 ISL6596 ISL6596 ISL6596 features 4A typical sink current for the lower gate driver, enhancing Pad for Heat Spreading Dual Flat No-Lead (DFN) Package Compliant to JEDEC PUB95 PUB95 PUB95 PUB95 MO-220 MO-220 MO-220 MO-220 QFN-Quad efficiency performance at high switching frequency for advanced microprocessors. The IC is biased by a rise/fall time. Bootstrapping of the upper gate driver is implemented via an internal low forward drop diode, reducing implementation cost, complexity, and allowing the use of higher performance, cost
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depending on the chip size. For large dissipation, an external heat sink is ap- plied to the IMS by means of Evolution of SMT drove the development of sev- eral new packages for discrete and IC devices: SOT23, SOT194 late 70s. Data presented here demonstrates that PowerSO-20 is the real successor of Multiwatt for However, the experience of SGS THOMSON with above solutions is not totally satisfactory, for a number of as traditional insertion packages. In view of the larger pin count needed for smart power products, a
www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/1732-v2.htm
STMicroelectronics 14/06/1999 36.87 Kb HTM 1732-v2.htm
depending on the chip size. For large dissipation, an external heat sink is ap- plied to the IMS by means of Evolution of SMT drove the development of sev- eral new packages for discrete and IC devices: SOT23, SOT194 late 70s. Data presented here demonstrates that PowerSO-20 is the real successor of Multiwatt for However, the experience of SGS THOMSON with above solutions is not totally satisfactory, for a number of as traditional insertion packages. In view of the larger pin count needed for smart power products, a
www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/1732-v1.htm
STMicroelectronics 02/04/1999 36.9 Kb HTM 1732-v1.htm
to sink different amounts of heat. Utilization of IMS is considered for several appli- cations large dissipation, an external heat sink is ap- plied to the IMS by means of screws, bolts or riv- presented here demonstrates that PowerSO-20 is the real successor of Multiwatt for surface mount time. However, the experience of SGS THOMSON with above solutions is not totally satisfactory, for a , which is no longer able to cover the require- ments of advanced smart power, needing more I/Os for
www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/1732-v3.htm
STMicroelectronics 25/05/2000 38.78 Kb HTM 1732-v3.htm
to sink different amounts of heat. Utilization of IMS is considered for several appli- cations heat sink is ap- plied to the IMS by means of screws, bolts or riv- ets. The total thermal resistance SMT drove the development of sev- eral new packages for discrete and IC devices: SOT23, SOT194 that PowerSO-20 is the real successor of Multiwatt for surface mount applications and can become a ther- mal impedance as traditional insertion packages. In view of the larger pin count needed for
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STMicroelectronics 20/10/2000 40.14 Kb HTM 1732.htm
3 The price listed is the manufacturer's suggested retail price for quantities between 100 and Sensitivity Level - per IPC/JEDEC J-STD-020 J-STD-020 J-STD-020 J-STD-020 SMD = Standard Microcircuit Drawing Description The ISL6614B ISL6614B ISL6614B ISL6614B threshold, at which the PHASE node is connected to the gate of the low side MOSFET (LGATE). The output voltage of the converter is then limited by the threshold of the low side MOSFET, which provides some the Schottky diode that is used in some systems for protecting the load from reversed output voltage
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Intersil 13/10/2005 38 Kb HTML device_isl6614b-v1.html
complete core-voltage regulator solutions for advanced microprocessors. The ISL6614B ISL6614B ISL6614B ISL6614B features 7V rising to the gate of the low side MOSFET (LGATE). The output voltage of the converter is then limited by the threshold of the low side MOSFET, which provides some protection to the microprocessor if the systems for protecting the load from reversed output voltage events. Key Features Pin-to-pin VCC Undervoltage Protection Expandable Bottom Copper Pad for Enhanced Heat Sinking QFN Package
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Intersil 07/09/2006 40.01 Kb HTML device_isl6614b.html
Expandable Bottom Copper Pad for Enhanced Heat Sinking QFN Package: Compliant to JEDEC PUB95 PUB95 PUB95 PUB95 MO-220 MO-220 MO-220 MO-220 QFN - 3 2.60 The price listed is the manufacturer's suggested retail price for quantities between 100 regulator solutions for advanced microprocessors. The ISL6614 ISL6614 ISL6614 ISL6614 drives both the upper and lower gates before VCC exceeds its turn-on threshold, at which the PHASE node is connected to the gate of the low side MOSFET (LGATE). The output voltage of the converter is then limited by the threshold of the low
www.datasheetarchive.com/files/intersil/device_pages/device_isl6614-v1.html
Intersil 13/10/2005 41.22 Kb HTML device_isl6614-v1.html
Expandable Bottom Copper Pad for Enhanced Heat Sinking QFN Package: Compliant to JEDEC PUB95 PUB95 PUB95 PUB95 MO-220 MO-220 MO-220 MO-220 QFN - 3 2.60 The price listed is the manufacturer's suggested retail price for quantities between 100 regulator solutions for advanced microprocessors. The ISL6614 ISL6614 ISL6614 ISL6614 drives both the upper and lower gates before VCC exceeds its turn-on threshold, at which the PHASE node is connected to the gate of the low side MOSFET (LGATE). The output voltage of the converter is then limited by the threshold of the low
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Intersil 07/09/2006 44 Kb HTML device_isl6614.html
Copper Pad for Enhanced Heat Sinking QFN Package: Compliant to JEDEC PUB95 PUB95 PUB95 PUB95 MO-220 MO-220 MO-220 MO-220 QFN - Quad Flat No the manufacturer's suggested retail price for quantities between 100 and 999 units. However, prices in N-Channel MOSFETs form complete corevoltage regulator solutions for advanced microprocessors. The ISL6614A ISL6614A ISL6614A ISL6614A PHASE node is connected to the gate of the low side MOSFET (LGATE). The output voltage of the converter is then limited by the threshold of the low side MOSFET, which provides some protection to the
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