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Part : HGOUTLETCVR Supplier : Tripp Lite Manufacturer : element14 Asia-Pacific Stock : 33 Best Price : $4.3360 Price Each : $4.3360
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Part : SBC1788 WITHOUT LCD Supplier : Element14 Catalog Manufacturer : element14 Asia-Pacific Stock : - Best Price : $331.72 Price Each : $331.72
Part : SBC8018 WIHOUT LCD Supplier : Embest Manufacturer : element14 Asia-Pacific Stock : 2 Best Price : $126.64 Price Each : $126.64
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Part : HGOUTLETCVR Supplier : Tripp Lite Manufacturer : Farnell element14 Stock : 33 Best Price : £3.45 Price Each : £3.45
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Part : JBX0OUTLS09 Supplier : SOURIAU Manufacturer : Farnell element14 Stock : 3 Best Price : £98.60 Price Each : £98.60
Part : JBX2OUTLP07 Supplier : SOURIAU Manufacturer : Farnell element14 Stock : 3 Best Price : £84.12 Price Each : £84.12
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Part : JBX2OUTLS13 Supplier : SOURIAU Manufacturer : Farnell element14 Stock : 3 Best Price : £86.52 Price Each : £86.52
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Part : JBX2OUTLT20 Supplier : SOURIAU Manufacturer : Farnell element14 Stock : 3 Best Price : £247.3200 Price Each : £247.3200
Part : SBC8018 WIHOUT LCD Supplier : Embest Manufacturer : Farnell element14 Stock : 2 Best Price : £58.53 Price Each : £58.53
Part : SBC8118 WITHOUT LCD Supplier : Embest Manufacturer : Farnell element14 Stock : - Best Price : £166.3200 Price Each : £166.3200
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outline of the heat sink for JEDEC

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: ascending pin count. Altera package outlines meet the requirements of JEDEC Publication No. 95. 484 , outline figure references, respectively, for the 484-pin thermally enhanced FineLine BGA packaging , Device Handbook, Volume 2 Package Outlines Figure 10­1 shows a package outline for the 484 , package outline for the 672-pin thermally enhanced FineLine BGA packaging. Altera Corporation October , information and package outline figure references, respectively, for the 1,020-pin thermally enhanced Altera
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EP2S15 EP2S30 EP2S60 EP2S90 EP2S180 MS-034 AAU1 bga package weight SII52010-1 EP2S130
Abstract: are for each of the +V and -V supplies. HEAT SINK - ESOIC PACKAGES Both the 14-pin and 16 , sink located on the bottom surface of the device. This heat sink should be soldered down to the printed circuit board for optimum thermal dissipation. The heat sink is electrically isolated from the chip and , ) Electrically isolated heat sink pad on bottom of package. Connect to any ground or power plane for optimum , series with each output. The HI-318X series of line drivers are intended for use where logic signals must HOLT Integrated Circuits
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124 008r B13W HI-3182 HI-3183 HI-3184 HI-3185 HI-3186 HI-3187
Abstract: are for each of the +V and -V supplies. HEAT SINK - ESOIC PACKAGES Both the 14-pin and 16 , sink located on the bottom surface of the device. This heat sink should be soldered down to the printed circuit board for optimum thermal dissipation. The heat sink is electrically isolated from the chip and , heat sink pad on bottom of package. Connect to any ground or power plane for optimum thermal , for short periods of time (125ms). The Vref pin has an internal pull-up resistor to V+, allowing the HOLT Integrated Circuits
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ESD 138C HI-3188 HI-8382 HI-8383 HS-3182 RM3182 28-PIN
Abstract: listed are for each of the +V and -V supplies. HEAT SINK - ESOIC PACKAGES Both the 14-pin and 16 , sink located on the bottom surface of the device. This heat sink should be soldered down to the printed circuit board for optimum thermal dissipation. The heat sink is electrically isolated from the , alternate sources for the HS-3182 ( Intersil/Harris), the RM3182 (Fairchild /Raytheon) and a variety of , between 800 - 900 mA for short periods of time (125ms). The Vref pin has an internal pull-up resistor to HOLT Integrated Circuits
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k0319 32-PIN
Abstract: package information and package outline figure references, respectively, for the 484-pin FBGA packaging , BSC Figure 14­1 shows a package outline for the 484-pin FineLine BGA packaging. Figure 14­1. 484 , Package Outlines Figure 14­2 shows a package outline for the 780-pin FineLine BGA packaging. Figure , 14­7 and 14­8 show the package information and package outline figure references, respectively, for , , Volume 2 Document Revision History Figure 14­3 shows a package outline for the 1,152-pin FineLine Altera
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AGX52014-1 FBGA-484 datasheet arria EP1AGX35 EP1AGX50 EP1AGX20 EP1AGX90 152-P
Abstract: ascending pin count. Altera package outlines meet the requirements of JEDEC Publication No. 95. 14­2 , Handbook, Volume 2 Package Outlines Figure 14­1 shows a package outline for the 484-pin FineLine BGA , GX Device Handbook, Volume 2 Package Outlines Figure 14­2 shows a package outline for the 780 , Handbook, Volume 2 Document Revision History Figure 14­3 shows a package outline for the 1,152 , that meets JDEC specifications and for a typical board. The following values are provided Altera
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84 FBGA outline asme y14.5m FBGA-484 MS 034 FBGA1152 FBGA PACKAGE thermal resistance EP1AGX60
Abstract: of ascending pin count. Altera package outlines meet the requirements of JEDEC Publication No. 95 , . 0.50 b Nom. 0.60 0.70 e 1.00 BSC Figure 14­1 shows a package outline for the 484 , information and package outline figure references, respectively, for the 780-pin FBGA packaging. Table , for the 780-pin FineLine BGA packaging. Figure 14­2. 780-Pin FBGA Package Outline TOP VIEW , outline for the 1,152-pin FineLine BGA packaging. Figure 14­3. 1,152-Pin FBGA Package Outline TOP VIEW Altera
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MS-034 1152 BGA 484-pin BGA JEDEC FBGA moisture sensitivity
Abstract: Information for Arria GX Devices Package Outlines The package outlines are listed in order of ascending pin count. Altera package outlines meet the requirements of JEDEC Publication No. 95. 484-Pin FBGA , . 0.50 b Nom. 0.60 0.70 e 1.00 BSC Figure 14­1 shows a package outline for the 484 , information and package outline figure references, respectively, for the 780-pin FBGA packaging. Table , for the 780-pin FineLine BGA packaging. Figure 14­2. 780-Pin FBGA Package Outline TOP VIEW Altera
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84 FBGA thermal FBGA 152 1152 bt 146 altera cross reference led flip-chip
Abstract: has a lip designed for a CPGA package to prevent movement of the heat sink relative to the package , capacitors, and exposed pins on the top side of the package. For use on the PPGA package, if the heat sink , . For example, an electrically conductive heat sink should not contact the exposed pins, external , drawings and dimensions for the 296 lead PPGA package. The package meets JEDEC outline spec MO-128 for pin , outline drawings and dimensions for the 370 lead FCPGA package. The package meets JEDEC outline spec MO Intel
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A7647 A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW A7646-01 A5775-01
Abstract: FBGA w/ fin (1) Notes to Table 26: (1) "fin" is an extra heat sink that customers can add to the , outlines meet the requirements of JEDEC Publication No. 95. 25 Altera Device Package Information , dimension is in millimeters. N is the number of leads. Package Information Package Outline Figure , in inches. N is the number of leads. Package Information Package Outline Figure Reference , is the number of leads. Package Information Package Outline Figure Reference Description Altera
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EP1C12 240 pin rqfp drawing 724p BGA sumitomo 192 BGA PACKAGE thermal resistance Altera pdip top mark 7000B 7000AE EP1C20 DS-PKG-11 EP1SGX10D
Abstract: -8586 products. The ESOIC package includes a metal heat sink located on the bottom surface of the device. This heat sink should be soldered down to the printed circuit board for optimum thermal dissipation. The , until one of the inputs becomes a One. If for example TX1IN goes high, a charging path is enabled to , ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink not soldered to the PCB. 6. 8 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink soldered to the PCB. 7 HOLT Integrated Circuits
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HI-8585 HI-8586 HI-8588 HI8585PSIN HI-8586 thermal HI-3282 HI-8585PSI-N
Abstract: contact between the transistor and heat sink: (a) Remove all burrs from the edges of clearance holes in the heat sink. (b) Use a small amount of silicone grease either between the transistor and heat sink , For detail dimensions see Page 6 2704 Dâ'"11 In the interest of improved product design, changes _ _ , . The transistors comply with JEDEC TO-3/TÛ-204 outline. 2. The collector is internally connected to , pins must not be bent. The pins may be dip-soldered at a temperature of 240°C for a maximum of 10 -
OCR Scan
DT5336 DT4335 transistor d333 TRANSISTOR BC 384 mercury wetted relay, double contact npn darlington 6A 400V power darlington 100W G7G13 T4335 DT4336 DT5335 DT4335/6
Abstract: -8586 products. The ESOIC package includes a metal heat sink located on the bottom surface of the device. This heat sink should be soldered down to the printed circuit board for optimum thermal dissipation. The , TXBOUT hold each side of the ARINC bus at Ground until one of the inputs becomes a One. If for example , ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink not soldered to the PCB. 6. 8 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink soldered to the PCB. 7 HOLT Integrated Circuits
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8586 HI-858 HI-8282 HI-6010
Abstract: Registration ED-7300 Recommended practice on standard for the preparation of outline drawing of , Rules for the Preparation of Outline Drawings of Integrated Circuits Number EIAJ Standard , features shall be specified. (Maximum of 3 letters) 1 Outline addition H: Heat sink W: Window A , no responsibility for any losses incurred by the customer or third parties arising from the use of , Industry Association of Japan (EIAJ). In the United States, an organization for semiconductor packages (JC NEC
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smd transistor M7A ED-7304-1 smd m7a uPD4011BG ED730 ED-7417 PD421000LA-10-E1 PD421000LA PD41265L-12-E1 PD41256L PD23C32000AGX- PD23C32000A
Abstract: conduct the heat all the way to the surface of the IC package. For such devices, a much thicker heat sink , , with industry standards established for both the JEDEC package outline and the IPC land pattern for , has been established for both the JEDEC package outline and the IPC land pattern. Figure 2.3 , the topside of the package. Heat Spreader Design-This design includes a heat sink that is attached , advantageous, a thin strip of insulating tape in the B-stage epoxy allows the heat sink to be quite close to Advanced Micro Devices
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footprint jedec MS-026 TQFP footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 TQFP 44 footprint jedec MS-026 LQFP 64 pin MS-026 BED MO-015 MS-011
Abstract: listed below in the "Affected FSIDs" section. Description of Change: Fairchild Semiconductor (Suzhou , Semiconductor's ongoing effort to increase manufacturing capacity for our various products assembled in the TO , Suzhou, Jiangsu P. R. of China. The following are the package dimensional, process and material , Package width Heat sink heigth Package height Total package height Lead pitch Lead shoulder width Lead mounting width Back metal heat sink width Back metal heat sink height Center lead cut length Fairchild Semiconductor
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RF1S640SM9A FDB2532 RF3S49092SM9A FDB2552 HUF76143S3ST HUF76145S3ST 12SnOFC PMC-90 PMC-90 leadframe material 92.5Pb5Sn2.5Ag Tamac4 MKT-TO263A02 FDB6670AL FDB6676S FDB7030BLS FDB7045L FDI3632 HUF75329S3
Abstract: package (Moisture Sensitive) with Material heat sink. This conversion should not require any board layout changes since the package outline for MQUAD Testing Manufacturing Site and ED QUAD is identical (JEDEC MS , Location Thermal Characteristics Heat Sink Moisture Sensitive Package Outline Copper Silver filled epoxy , notification of this change. Please use the acknowledgement below or E-Mail to grant approval or request , Location Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: All 8/22/00 MEANS OF Integrated Device Technology
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MQUAD I0008-05 MS-018 JESD22-A112 79R3511 79R3512 79R3521
Abstract: package (Moisture Sensitive) with Material heat sink. This conversion should not require any board layout changes since the package outline for MQUAD Testing Manufacturing Site and ED QUAD is identical (JEDEC MS , Location Thermal Characteristics Heat Sink Moisture Sensitive Package Outline Copper Silver filled epoxy , notification of this change. Please use the acknowledgement below or E-Mail to grant approval or request , Location Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: All 8/22/00 MEANS OF Integrated Device Technology
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79R3051 79R3051E 79R3052 79R3052E 79R3081 79R3081E
Abstract: ) Registration 1997.05 General Rules for the Preparation of Outline Drawings of Integrated Circuits ED , practice on standard for the preparation of outline drawing of semiconductor packages Manual for the , Outline Package(SOP) Unit Design Guide for the Preparation of Package Outline Drawing of Integrated , Characteristics Through Hole Type V-DIP Terminals are on one side of the package and bent for through , activities for standardization of packages, as shown in the figure below, are developed in Japan, the United NEC
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Datasheet of IC 7432 7415 ic pin details data sheet IC 7432 DATASHEET OF IC 7401 7401 ic configuration draw pin configuration of ic 7402
Abstract: of the device. This heat sink should be soldered down to the printed circuit board for optimum , advantage of the tri-state outputs. For even smaller board footprint, versions are also available in , resistors in series with each ARINC output are available to allow the use of external resistors for lightning protection. SLP 1 The HI-859x series of line drivers are intended for use where logic , -PIN PLASTIC SMALL OUTLINE (ESOIC) NB o The family of parts are available in Industrial -40 C to o o o HOLT Integrated Circuits
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HI-8592 HI-8570 HI-8571 HI-8593PS arinc 429 serial transmitter 8593 HI-8593 HI-8594 HI-8592PS
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