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Part Manufacturer Description Datasheet BUY
SWT204-UPPN-S01-UU-UU Sullins Connector Solutions Connector Accessory visit Digikey Buy
SWT201-UPPN-S01-UU-UU Sullins Connector Solutions Connector Accessory visit Digikey Buy
SWT201-UPTN-S01-UU-UU Sullins Connector Solutions Connector Accessory visit Digikey Buy
SWT204-UPTN-S01-UU-UU Sullins Connector Solutions Connector Accessory visit Digikey Buy
CLS03,LNITTOQ(O Toshiba America Electronic Components DIODE SCHOTTKY 60V 10A L-FLAT visit Digikey Buy
1-1825059-7 TE Connectivity Ltd ADF04ST04=DIP SWT,FLUSH,SMT-GW visit Digikey

nitto SWT-20

Catalog Datasheet MFG & Type PDF Document Tags

nitto SWT 10

Abstract: nitto SWT-20 Meaning 00 Tested wafer 01 Sawn wafer, Gustav Wirtz ring 6", tape NITTO SWT-20 non UV-tape, tape not expanded 02 Sawn wafer, Gustav Wirtz ring 6", tape NITTO SWT-20 non UVtape, tape is expanded for delivery 03 Sawn wafer, metal frame 8", tape NITTO 2091J UV-tape, tape cannot be expanded 04 Sawn wafer, metal frame 8", tape NITTO UE-111AJ UV-tape, tape can be expanded 05 , , metal frame 8", tape NITTO SWT-20 non UV-tape, tape cannot be expanded PRODUCT CODING SYSTEM
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nitto SWT 10 nitto SWT-20 W07 sot 23 w04 transistor sot 23 W04 sot 23 transistor w07 QSP0005 MAS1234T39T0206 MAS1234AB3 98AA2 MAS9198AA2

UE-111AJ

Abstract: nitto SWT-20 Wirtz ring 6", tape NITTO SWT-20 non UV-tape, tape not expanded 02 Sawn wafer, Gustav Wirtz ring 6", tape NITTO SWT20 non UV-tape, tape is expanded for delivery 03 Sawn wafer, metal frame 8", tape NITTO 2091J UV-tape, tape cannot be expanded PRODUCT CODING SYSTEM QSP0005_WEB.026 04 , ", tape NITTO UE-111AJ UV-tape, tape can be expanded Dice in waffle pack Reserved Examples The
Micro Analog Systems
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transistor marking PB nitto UE111AJ ke marking transistor Nitto marking code transistor HK UE111 MAS1234 MAS1234T39 MAS1025AC MAS1025ACSA MAS9124AACA

PCN0702

Abstract: SUMITOMO G700 0737 (Sept 2007) Package Power Quad Flat Pack Package (RQFP) Sumitomo EME-6300H Nitto , acknowledgement is received within 30 days from this notification. Revision History: Date 03/20/2007 06/22 , heading to "Nitto MP8000CH4" Update to include Qualification data for G600 (Appendix 2) Re-number the , the Nitto MP8000CH4 Mold Compound Material Properties Spiral Flow Gel Time (at 175°C) Thermal , /° C °C cal/cm.sec.° C kg/mm2 kg/mm2 -cm UL-94 % weight gain ppm ppm Nitto MP8000CH4
Altera
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PCN0702 G700M 2000HG SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 6300HJ 6300H DMC-2000HG

Nitto MP8000

Abstract: Sumitomo G700K Nitto MP8000 w/BCB4026 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled , : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1077 ATP (Amkor, PI) 8 uSOP 3x0.85 Nitto , 150x1.4 Nitto MP8000 w/BCB4026 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy , Nitto MP8000 w/Q3-6646 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled , , PI) 8 uSOP 3x0.85 Nitto MP8000 w/BCB4026 Die Coat Stamped Copper C7025 SnPb Plate 84-1 LMISR4
Maxim Integrated Products
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JESD78 Nitto MP8000 Sumitomo G700K ablebond ablestik g700k JESD-78 DS1086 DS1099 MP8000C 94-V0

G700K

Abstract: Sumitomo G600 Nitto MP8000 w/BCB4026 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled , : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1077 ATP (Amkor, PI) 8 uSOP 3x0.85 Nitto , 150x1.4 Nitto MP8000 w/BCB4026 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy , Nitto MP8000 w/Q3-6646 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled , , PI) 8 uSOP 3x0.85 Nitto MP8000 w/BCB4026 Die Coat Stamped Copper C7025 SnPb Plate 84-1 LMISR4
Maxim Integrated Products
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sumitomo 6600h BCB4026 Compound c7025 DS1077L

Sumitomo G700K

Abstract: sumitomo 6600h Nitto MP8000 w/BCB4026 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled , : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1077 ATP (Amkor, PI) 8 uSOP 3x0.85 Nitto , 150x1.4 Nitto MP8000 w/BCB4026 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy , Nitto MP8000 w/Q3-6646 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled , , PI) 8 uSOP 3x0.85 Nitto MP8000 w/BCB4026 Die Coat Stamped Copper C7025 SnPb Plate 84-1 LMISR4
Maxim Integrated Products
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JESD22-B101 epoxy 8290 SUMITOMO g600 UL SUMITOMO-G600 ablebond ablestik 8290

ABLEBOND

Abstract: Nitto MP8000 w/BCB4026 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled , : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1077 ATP (Amkor, PI) 8 uSOP 3x0.85 Nitto , 150x1.4 Nitto MP8000 w/BCB4026 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy , Nitto MP8000 w/Q3-6646 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled , , PI) 8 uSOP 3x0.85 Nitto MP8000 w/BCB4026 Die Coat Stamped Copper C7025 SnPb Plate 84-1 LMISR4
Maxim Integrated Products
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ABLEBOND DS1086L

PCN0515

Abstract: sumitomo G770 ® FineLine BGA® (FBGA) device packages. Devices in FBGA packages currently molded with Nitto HC-100 series , 15.000 4.000 0.005 01/12/06 PCN0515 Appendix 3 ­ Material Properties for Nitto HC-100 series , Corporation Unit Nitto HC-100 series cm sec poise ppm ppm o C kg/mm2 kg/mm2 ohm.cm ohm.cm 135-150 33-36 50-60 8 34-35 140 17 2700 2.01 30 20 01/12/06 PCN0515 Altera
Altera
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sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 AXZ0613T 10-5/C 102N/

Sumitomo G700K

Abstract: sumitomo 6600h DS1077 ATP (Amkor, PI) 8 SOIC 150x1.4 Nitto MP8000 w/BCB4026 Die Coat Stamped Copper CDA194 SnPb , Code Range: DS1077 ATP (Amkor, PI) 8 uSOP 3x0.85 Nitto MP8000 w/BCB4026 Die Coat Stamped , / 0.5% Copper 150 Å DS1077L ATP (Amkor, PI) 8 SOIC 150x1.4 Nitto MP8000 w/BCB4026 Die Coat , (JEDEC J-STD20A) FA# DS1077L ATP (Amkor, PI) 8 SOIC 150x1.4 Nitto MP8000 w/Q3-6646 Die Coat , (JEDEC J-STD20A) Date Code Range: DS1077L ATP (Amkor, PI) 8 uSOP 3x0.85 Nitto MP8000 w/BCB4026
Maxim Integrated Products
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Ablestik 84-1 DS1094L

PCN0119

Abstract: Nitto-HC100 PROCESS CHANGE NOTICE PCN0119 FineLine BGA Package Molding Compound Change Change Description: ASAT Hong Kong will change the FineLine BGA package molding compound from Shin Etsu to Nitto HC-100. This change will not affect the package thickness specification, overall package dimensions, or the , changing from Shin Etsu to Nitto HC-100 to improve package coplanarity during high-temperature reflow , . Altera Corporation 11/20/01 PCN0119 Altera
Altera
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EPF10K100E EPF10K130E EP20K200E EPF10K200S EPF10K200E EP20K300E Nitto-HC100 HC100 shin-etsu nitto hc100 672-BALL Nitto HC 484-B 672-B
Abstract: ±100MHz Output Impedance 50Ω Output VSWR 25dB min. 2.0 Max Typ. 11dBm Min. 5dBm Pout at 1dB , 50Ω Polarization RHCP Output VSWR Max 2.0 Operation Temperature -40°C to + 85 , . Radiation Patterns 6.1 XZ Plane Radiation 0 8 5 0 -5 -10 -15 -20 -25 -30 -35 90 270 -40 , -10 -15 -20 -25 -30 -35 90 270 -40 180 Pattern 1 Model No. AP , 6.3 XY Plane Radiation 0 8 5 0 -5 -10 -15 -20 -25 -30 -35 90 270 -40 180 Taoglas
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SPE-11-8-094/D/SS 023MH

Nitto 5015

Abstract: nitto denko adhesive (0dBi typ.) max. -10 ~ +60° C -20 ~ +85° C 4g DIMENSIONS DAC SERIES 9.7 0.5 max Mounted with , element on PCB using double sided adhesive tape of 0.12mm thickness. (Recommend No. 5015 : NITTO DENKO , Unit: mm Material: Nitto N5015 The information furnished by TOKO, Inc. is believed to be accurate
TOKO
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DAC2450CT1 Nitto 5015 nitto denko adhesive nitto denko 5015 nitto tape CF-162-DACDS297 0397O2

CCL-HL832NX-A

Abstract: Nitto GE100LFCS wire Cu wire: PCC Mold compound: Nitto GE100LFCS* (Au Wire) or Sumitomo G750 (Cu wire) Solder balls: Pb-free Sn 3.5AG TEPBGA-1 (Qualified L2AA/260C) * Nitto GE100LFCS is not suitable , Wafer sort 256 Pin x 20 MHz test system available -55 °C to + 125 °C test available Tape and Reel
Amkor Technology
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CCL-HL832NX-A Nitto GE100LFCS Sumitomo G750 GE-100-LFC CCL-HL832NX GE100LFCS nitto L3/260C L3/245C CO-029

SMD LED 5680

Abstract: LC-1500 Thin BEF II 1 3M 8 THIN BEF II 1 3M 9 PET Protection Film 1 NITTO# 5680 , NITTO# 5680 Rev. 1.0 July 2006 Page 2 American Opto Plus LED BL-S3547LW-F 34.7mm x 46.70mm , *1 IF 20 mA Reverse Voltage *1 VR 20 V Operating Temperature Range TOPR -20~+70 °C Storage Temperature Range TSTG -20~+80 °C OPTICAL-ELECTRICAL
American OPTO Plus LED
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LC-1500 SMD LED 5680 MAX PLUS II free X362 nitto tape, 500 3M reflective tape

japan servo co

Abstract: "japan servo" of Hitachi, Ltd. and 20 affiliated companies (identified on the contents page of the Hitachi , FY1998 Levels 60 FY1998 Results 50 40 30 Management of Chemical Substances 20 , *Includes affiliates other than the 20 covered in the scope of the Hitachi Environmental Report. 1996 , Displays 1997. 3.25 8 Nitto Denko Corporation Tohoku Plant 1998.10.28 37 Power & , Components & Equipment Narashino Division 1997. 9.30 20 Semiconductor & Integrated Circuits Kofu
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japan servo co Air COnditioner toyama sagami transformer koganei Denko 14001-C

PCN0801

Abstract: hitachi epoxy en4900 1.0 mil Wire 1.0 mil Hitachi EN4900 Hitachi EN4900 Ablestik 8290 Nitto MP8000CH4-2 Nitto , Air 150°C, 8 hrs 0/75 0/75 0/240 0/240 0/240 0/240 0/240 0/240 0/240 0/240 3 0/20
Altera
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PCN0801 hitachi epoxy en4900 Ablestik 8290 EN-4900 hitachi en4900 epcs1n JESD46-C

Adwill D-175

Abstract: UE-111AJ AN106920 Handling and processing of sawn wafers on UV dicing tape Rev. 2.0 - 13 January 2009 , Description 2.0 2009-01-13 · Section 2.3.1: recommendation regarding LASER diced wafers added · , . Application note Rev. 2.0 - 13 January 2009 2 of 9 AN106920 NXP Semiconductors Sawn wafers on , ". © NXP B.V. 2006. All rights reserved. Application note Rev. 2.0 - 13 January 2009 3 of 9 , . © NXP B.V. 2006. All rights reserved. Application note Rev. 2.0 - 13 January 2009 4 of 9
NXP Semiconductors
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Adwill D-175 lintec adwill UV tape D-175 UV tape D-175 adwill Lintec UV tape Lintec

PMC-90

Abstract: PMC-90 leadframe material Changes Material Au Wire Vendor Leadframe Material Source Mold Compound Type From 2.0 mil AFW TAMAC2, PMC-90 Japan Nitto MP150SG To 2.0 mil CCC TAMAC2, PMC-90, Poongsan, Korea Plaskon 7060 , Sherman Bipolar JI Bipolar N/A TiW/AlCu2% None 10KA CN PSI Plaskon 7060 Abl 71-1 TS-2.0 Au PSI Plaskon 7060 Abl 71-1 TS-2.0 Au PSI MP150SG - Nitto Abl 71-1 TS-2.0 Au KC 3 Solder
Texas Instruments
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UA7808CKC PMC-90 leadframe material pmc90 MP150s poongsan pmc 26 mold compound

EME-6300

Abstract: Nitto MP8000 DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 (972) 371-4000 Date: June 29, 2000 Subject: PRODUCT CHANGE NOTICE ­ F001601 Description: SOIC Mold Compound Change to MP8000 Description of Change: The mold compound will be changed on all SOIC packages from Sumitomo EME6300 to Nitto MP8000. Packages Affected: SOIC 150 mil: 8, 14, 16p SOIC 300 mil: 16, 18, 20, 24, 28p SSOP: 5.3 mm: 16, 24p
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EME-6300 MP-8000 On semiconductor SOIC Traceability DALLAS SOIC PRODUCT CHANGE

intersil LOT TRACEABILITY

Abstract: flyback samsung V62/08605-01XE 2.7 5.5 5 70 General Purpose Analog 10 14 Ld TSSOP 20 Ld TSSOP , ) Max IOUT (A) VBIAS (V) ISL6420BMAEP V62/07640-01XB 4.5 28 0.6 VIN-0.5 20 5 POL Buck Converters 20 Ld QSOP ISL6406MREP V62/08610-01XB 3.3 5 0.8 5 20 3.3 to 5 POL Buck Converters 16 LD QFN ISL6406MVEP V62/08610-01YB 3.3 5 0.8 5 20 3.3 to 5 POL Buck Converters 16 LD TSSOP Device Number Target
Intersil
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ISL22316WMUEP ISL22346WMVEP ISL22326WMVEP intersil LOT TRACEABILITY flyback samsung 31136 zvs flyback driver 31.136 343 flyback V62/08604-01XE V62/08603-01XB A1901
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