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LT1017MJ8/883 Linear Technology LT1017 - Micropower Dual Comparator; Package: CERDIP; Pins: 8; Temperature: Military visit Linear Technology - Now Part of Analog Devices
LM108AJ8 Linear Technology LM108A - Operational Amplifiers; Package: CERDIP; Pins: 8; Temperature: Military visit Linear Technology - Now Part of Analog Devices
LT1018MJ8/883 Linear Technology LT1018 - Micropower Dual Comparator; Package: CERDIP; Pins: 8; Temperature: Military visit Linear Technology - Now Part of Analog Devices
LTC1041MJ8/883 Linear Technology LTC1041 - BANG-BANG Controller; Package: CERDIP; Pins: 8; Temperature: Military visit Linear Technology - Now Part of Analog Devices
RH137KDICE Linear Technology IC VREG ADJUSTABLE NEGATIVE REGULATOR, UUC3, DIE-3, Adjustable Negative Single Output Standard Regulator visit Linear Technology - Now Part of Analog Devices
RH137HDICE Linear Technology IC VREG ADJUSTABLE NEGATIVE REGULATOR, UUC3, DIE-3, Adjustable Negative Single Output Standard Regulator visit Linear Technology - Now Part of Analog Devices

mil-std-202 213

Catalog Datasheet MFG & Type PDF Document Tags

mil-std-202 IEC 68-2-17

Abstract: mil-std-202 204 502 MIL-STD 202 204/D MIL-STD 202 214 MIL-STD 202 213 MIL-STD 202 105 100 g 5 mn 100 g 5 mn MIL-STD , MIL-STD 202 213 J MIL-STD 202 105 A 100 g 6 ms Half-time 5 shocks 6 axis 8.88 inch.Hg 10.000 g 1mn 3 , IEC 66-2-14 Na test 20-714 Nc test 68-2-17 Ea test METHOD MIL-STD 202 107 MIL-STD 750 1056 MIL-STD 202 213 Temperature -55°C +100°C -55°C +100°C cycling 5 cycles 5 cycles Thermal shock Mechanical shock , 66-2-7 Ga test 66-2-17 Q test 66-2-3 Ca test 66-3-2 Ba test MIL-STD 202 204 MIL-STD 202 212 MIL-STD
Tekelec Temex Components
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mil-std-202 IEC 68-2-17 mil-std-202 204 MIL-STD-883 1014 MIL-STD-883 1010 mil-std-202 213 2000H 1014/A 1014/C

TT6P3-0836F-2520

Abstract: listed below. Packaging Designation Quality Environmental Performance Vibration MIL-STD-202,204,A Shock MIL-STD-202,213,A Humidity MIL-STD-202,103.B Heat Shock MIL-STD-202,107
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TT6P3-0836F-2520

MIL-STD pcb connector

Abstract: mil-std-202 106 : : 11msec. : X, Y, Z 3 18 MIL-STD-202 213 A 3.5.9 Physical Shock No electrical discontinuity , directions of X, Y and Z axes, totally 18 drops. MIL-STD-202 Method 213 Condition A 95% : 230±5 , Standards and Specifications A. MIL-STD-202 A. MIL-STD-202 Test Method for Electronic and Electric , 100M 500VDC 1 MIL-STD-202 302 B 3.5.4 Insulation Resistance 1000M Min. Initial Impressed voltage 500VDC for 1 minute. 100M Min. Final Test between adjacent circuits. MIL-STD-202
Tyco Electronics
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MIL-STD pcb connector mil-std-202 106 T-flash 21FEB05

gigafil

Abstract: DFY2R902 MIL-STD-202, 204, A MIL-STD-202, 213, A MIL-STD-202, 103, B M IL-STD-202,107, A STANDARD DUPLEXER
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gigafil DFY2R902 DFY2R902CR947 DFY2R RX881 DFY2R836CR881BH IL-STD-202 DFY2R836CR881BFJA 894MH 849MH 728MH DFY2R836CR881BFJ

RLR RESISTORS

Abstract: 0 .0 5 0 ) MIL-STD-202 213 ± ( 0 .5 % + 0 .0 5 0 ) 1 0 -2 0 0 0 Hz 20g ±2% 70:i5â , MIL-STD-202 106 Shock Fungus ^ 32,42,1000 V 260 ± 5 °C 1 0 ± 2 *H B D Life u 5e
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RLR RESISTORS C2000 M1L-STD-810 100V3Z

NON ZIF CONNECTOR

Abstract: c002-2 No Damage 50 milliohm MAX. (JIS C0041 / MIL-STD-202 213) 2 490 m/s { 50G }, 3 strokes in each X.Y.Z. axes. (JIS C0041/MIL-STD-202 Method 213) FPC/FFC 85 2 96 ( JIS C0021/MIL-STD-202 108) 85 2 , 96 , Resistance 30 milliohm MAX. 4-1-2 Insulation Resistance DC 500V (JIS C5402 5.2/MIL-STD-202 302) Mate applicable FPC/FFC, apply 500V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD-202 , 500V 6 hG 1 6 No Breakdown 301) Dielectric Strength (JIS C5402 5.1/MIL-STD-202 Mate
Molex
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NON ZIF CONNECTOR c002-2 JIS-C-5402 J2004-4007 PS52806003 EN-37 PS-52806-003 2/MIL-STD-202 EN-37-1

micro SD Card connector

Abstract: 108-78337 MIL-STD-202 213 A 2 Accelerated Velocity : 490 m/s 50 G Waveform : Semi-Sine Shall occur , . MIL-STD-202 Method 213 Condition A 90% : 245±3°C : 3±0.5 : Sn-3Ag-0.5Cu 3.5.11 , . 501-5756 : Test Report 2.2 2.2 Commercial Standards and Specifications A. MIL-STD-202 A. MIL-STD-202 Test Method for Electronic and Electric Parts Tel: - Tel:- Fax:-Fax:- , 1000M 500VDC 1 100M MIL-STD-202 302 B Insulation Resistance 1000M Min. Initial
Tyco Electronics
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micro SD Card connector 108-78337 micro sd card micro sd 1871602-2 micro sd drawing 12JUL06

mil-std-202 213

Abstract: conn sd 7h F DC 1mA 6 2 490 m/s (50G) 3 (JIS C0041/MIL-STD-202 213) 4-3-4 Shock Mate dummy , Peak value: 490 m/s (50 G) Duration: 11 ms (JIS C0041/MIL-STD-202 Method 213) 7h F 9&É É , (JIS C5402 5.2 / MIL-STD-202 W 3 Dielectric Strength DC 500V 1000 mega ohms minimum. 302) Apply 500V DC between adjacent pins or pin and ground. (JIS C5402 5.2 / MIL-STD-202 Method 302) W Ç 0 500V 1 (JIS C5402 5.1 / MIL-STD-202 4-1-3 80 milliohms maximum. AC (rms
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conn sd mil-std-202 method 108 MIL-STD-202-106 sd card conn J2002-1066 PS-54965-004

JIS D 2001

Abstract: C5402 Shock Appearance 3 (JIS C0041/MIL-STD-202 213) Contact Resistance No Damage 490m/s {50G}, 3 strokes in each X.Y.Z. axes. (JIS C0041/MIL-STD-202 Method 213) 70 , ) 4-1-2 Insulation Resistance - DC 500V (JIS C5402 5.2/MIL-STD-202 302) 100 Megohms MIN. Mate connectors, apply 500V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD-202 , (JIS C5402 5.1/MIL-STD-202 301) No Breakdown Mate connectors, apply 500V AC(rms) for 1 minute
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JIS D 2001 aaei PS-54167-002 PS54167002 ES-40000-3996 95/MAR/10 U5-0926 DCBRD03

C0023

Abstract: mil-std-202 201 (JIS C0041/MIL-STD-202 213) 490m/s {50 },3 strokes in each X.Y.Z. axes. (JIS C0041/MIL-STD-202 Method , /MIL-STD-202 302) Connectors shall be mated and apply 500V DC between adjacent terminals or ground. (JIS C5402 5.2/MIL-STD-202 Method 302) $P 6 6 hG 6 hG Ç 0 AC 500V (JIS C5402 5.1/MIL-STD-202 301) Connectors , /MIL-STD-202 Method 301) 6 hG 20mV 10mA Crimped the applicable wire on to the terminal, measure by dry , Test Conditions 3 10 55 10 Hz/ 1.5mm 2 (MIL-STD-202 201) Amplitude : 1.5mm P-P Sweep time: 10-55-10 Hz
Molex
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C0023 mil-std-202 201 J2002-2334 PS-51090-005

EN-37

Abstract: c5402 /MIL-STD-202 213) Mechanical Shock 490m/s { 50G } , 3 strokes in each X.Y.Z. axes. (JIS C0041/MIL-STD-202 Method 213) 85±2°C 96 1 Heat Resistance (JIS C0021/MIL-STD-202 $P 6 Cold , 500V (JIS C5402 5.2/MIL-STD-202 302) 4-1-2 Insulation Resistance 100 Megohms MIN. Mate connectors and apply 500V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD-202 Method 302) $P 6 6 hG Ç 0 4-1-3 Dielectric Strength 6 hG AC(rms) 250V ( 1 (JIS C5402 5.1/MIL-STD-202
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J2005-2880 PS-501571-001 PS501571001 J2005-2165
Abstract: 4-3-6 No Damage (JIS C0041/MIL-STD-202 213) 490m/s { 50G } , 3 strokes in each X.Y.Z. axes. (JIS C0041/MIL-STD-202 Method 213) Shock 4-3-5 30 °C MAX. Contact Resistance (UL 498 , 6 hGÂ' 4-2-2 100 Megohm MIN. 6 hGÂ' AC(rms) 500V ( ) 1 (JIS C5402 5.1/MIL-STD-202 , C5402 5.1/MIL-STD-202 Method 301) Item 4-2-1 6 hGÂ' 40 milliohm MAX. 6 hGÂ' DC 500V (JIS C5402 5.2/MIL-STD-202 302) Mate connectors, apply 500V DC between adjacent terminal or ground Molex
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J2004-3963 PS-54722-005 PS54722005 JC2000-0839 JC2001-0402 JC2002-0650

EIA-364-8

Abstract: EIA-364-98 . 3.4m/s X,Y,Z 3 18 MIL-STD-202 213 A Accelerated Velocity :490m/s2 No electrical discontinuity , X, Y and Z axes, totally 18 drops MIL-STD-202 Method 213, condition A Fig. 2 () Fig. 2 (CONT , Specifications: A.MIL-STD-202: Test methods for Electronic And Electrical Component Parts B.EIA364: Electrical , .114-5206 B.501-5188 2.2 A.MIL-STD-202: B.EIA364: / 213-8535 3-5-8 Tyco Electronics Japan G.K , open circuit at 50mA. Refer to Fig. 4 EIA364-23 3VAC 1 0.5A MIL-STD-202 301 No creeping
Tyco Electronics
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EIA-364-8 EIA-364-98 17NOV2010 D-5000 UL94V-0

C0023

Abstract: MAX. No Damage Appearance Contact Resistance 4-3-4 Shock 3 (JIS C0041/MIL-STD-202 213) 490m/s {50G}, 3 strokes in each X.Y.Z. axes. (JIS C0041/MIL-STD-202 Method 213) 40 milliohms , Insulation Resistance -DC 500V (JIS C5402 5.2/MIL-STD-202 302) Mate connectors, apply 500V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD-202 Method 302) - -AC(rms) 4-1-3 1000V 1 (JIS C5402 5.1/MIL-STD-202 301) Mate connectors, apply 1000V AC(rms) for 1 minute between adjacent terminal or
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J2002-1997 PS000074 PS-5244-003

mil-std-202 201

Abstract: 20n20 : : 11msec. : X, Y, Z 3 18 MIL-STD-202 213 A 3.5.11 Physical Shock 2 No electrical , , Y and Z axes, totally 18 drops. MIL-STD-202 Method 213 Condition A Fig. 1 Fig. 1 CONT. 6 of , INTERFACE CONNECTOR 14Pos. 14Pos. 108108-5887 Rev.A Rev.A A. MIL-STD-202 A. MIL-STD-202 , leakage : 0.5mA Max. connectors. 500M 500VDC 50M 3.5.3 MIL-STD-202 302 B , Test between adjacent circuits of mated connectors. MIL-STD-202, Method 302, Condition B Fig. 1
Tyco Electronics
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20n20 sn 357 1717169-2 29FEB08 FJB0-0838-03

D5200

Abstract: D-5200 A MIL-STD-202,213, A Accelerated Velocity :490 m/s2 Waveform : Sinwave Shall occur , Commercial Standards and Specifications : 2 MIL-STD-202 Test Methods for Electronic and MIL-STD-202 , 0.5 mA AMP 109-5301 MIL-STD-202 301 3kVAC 1 minute. No creeping discharge nor flashover , Spec. 109-5301 MIL-STD-202 Method 301 1000 M 500 V DC AMP 109-5302 MIL-STD-202 302 B 1000 , . 109-5302 MIL-STD-202 Method 302 Condition B 30 °C Fig. 3 AMP 109-5310 30 °C Max. under loaded
AMP
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D-5200 D-5200S D5200

axis sd card

Abstract: SD Card Package tray 490 m/s (50G) 3 (JIS C0041/MIL-STD-202 213) 4-3-4 Appearance Discontinuity 1.0 , . (JIS C5402 5.4) W 4-1-2 Insulation Resistance W Ç 0 (JIS C5402 5.2 / MIL-STD-202 4-1-3 , ground. (JIS C5402 5.2 / MIL-STD-202 Method 302) W 3 JAPANESE ENGLISH W Ç 0 AC (rms)500V 1 (JIS C5402 5.1 / MIL-STD-202 301) Apply 500V AC (rms) for 1 minute between adjacent pins or pin and ground. (JIS C5402 5.1 / MIL-STD-202 Method 301) 7h F No Breakdown F The
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PS54965005 axis sd card SD Card Package tray 54965-0971 J2004-2505 PS-54965-005
Abstract: /MIL-STD-202 213) Mate connectors and subject to the following shock conditions. 3 shocks shall be applied , pulse : Half Sine Peak value : 490 m/s2 (50 G) Duration : 11 ms (JIS C0041/MIL-STD-202 Method 213 , 250V (JIS C5402 5.2/MIL-STD-202 302) 100 Megohms MIN. 4-1-3 Dielectric Strength AC(rms) 500V () 1 2 (JIS C5402 5.1/MIL-STD-202 301) Mate connectors and apply 250V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD-202 Method 302) No Breakdown Mate connectors Molex
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PS-502382-001 SD-502380-001 SD-502380-002 PS502382001 J2007-1471 J2007-3489

PS-513

Abstract: MIL-STD-454 requirement 9 Appearance (JIS C0041/MIL-STD-202 213) 490m/s {50G}, 3 strokes in each X.Y.Z. axes. (JIS C0041MIL-STD-202 , Insulation Resistance 4-1-2 (JIS C5402 5.2/MIL-STD-202 302) MIN. Mate connectors, apply 500V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD-202 Method 302) - -AC(rms) 4-1-3 , 4-1-4 (JIS C5402 5.1/MIL-STD-202 301) 20mV 10mA Mate connectors, apply 1000V AC(rms) for 1 minute between adjacent terminal or ground.(JIS C5402 5.1/MIL-STD-202 Method 301) Crimp the
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PS-513 MIL-STD-454 requirement 9 J2003-3127 PS-51382-004 ES-4000-3996 PS51382004 J2002-2279 J2002-2720

sd card

Abstract: SD Card connector 18 MIL-STD-202 213 A 3.5.10 Physical Shock 2 No electrical discontinuity Accelerated , , totally 18 drops. MIL-STD-202 Method 213 Condition A Fig.1 Fig.1. 6 of 14 SD Card CONNECTOR , 2.2 Commercial Standards and Specifications A. MIL-STD-202 A. MIL-STD-202 Test Method for , 100M MIL-STD-202 302 B Insulation Resistance 1000M Min. Initial Impressed voltage 500VDC for 1 minute. 100M Min. Final Test between adjacent circuits. MIL-STD-202, Method 302
Tyco Electronics
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sd card SD Card connector 78220 MIL-STD-202 METHOD 302 15FEB06
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