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STELLARIS-3P-CMXSI-MICRONET-STACK Texas Instruments CMX-MicroNet
BEMICRONIO-2-PROCSDK-REF Texas Instruments Altera/Arrow BeMicro Nios II Processor SDK with DP83848 in USB Stick Format
TCAN1042HD Texas Instruments Fault Protected CAN Transceiver With Flexible Data-Rate 8-SOIC -55 to 125
TMS320C6211GFN180H Texas Instruments Fixed-Point Digital Signal Processor 256-BGA
TPS51624RSMT Texas Instruments 4.5V to 28V, 1/2-Phase Step-Down Driverless Controller for Intel VR12.6 CPUs 32-VQFN -40 to 105
TM4C1233E6PMI7R Texas Instruments High performance 32-bit ARM® Cortex®-M4F based MCU 64-LQFP -40 to 85

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micro fineline BGA

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: are available in space-saving FineLine BGA, Micro FineLine BGA, and thin quad flat pack (TQFP , Packages and User I/O Pins 68-Pin Micro FineLine BGA (1) - - - - 54 - 100-Pin Micro FineLine BGA (1) 80 76 - - 80 76 100-Pin FineLine BGA (1) 80 76 - - - - 144-Pin Micro FineLine BGA (1) - - - - - 116 256-Pin Micro FineLine BGA (1) - 160 212 - - 160 256-Pin FineLine BGA - 160 212 204 - , , FineLine BGA, and Micro FineLine BGA Package Sizes 68-Pin Micro FineLine BGA 0.5 25 5×5 100-Pin Micro Altera
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MII51001-1
Abstract: Features 1­3 MAX II devices are available in space-saving FineLine BGA, Micro FineLine BGA, and thin , BGA (1) 256-Pin Micro FineLine BGA (1) 256-Pin FineLine BGA 324-Pin FineLine BGA 80 , - 256-Pin Micro FineLine BGA 256-Pin FineLine BGA 324-Pin FineLine BGA 68-Pin Micro FineLine BGA (1) 100-Pin FineLine BGA 100-Pin TQFP - 80 80 - 76 - Device 100-Pin Micro FineLine BGA (1) EPM240 EPM240G EPM570 EPM570G EPM1270 EPM1270G Altera
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bga-100 0.5 EPM2210 EPM240Z
Abstract: available in space-saving FineLine BGA, Micro FineLine BGA, and thin quad flat pack (TQFP) packages (refer , -Pin Micro FineLine FineLine FineLine BGA BGA BGA (1) - 160 212 - - 160 - 160 212 204 - - - - - 272 , , and Micro FineLine BGA Package Sizes 68-Pin 100-Pin 144-Pin 256-Pin 100-Pin 256-Pin 324-Pin Micro , pin-compatible with MAX IIG devices in the 100-pin Micro FineLine BGA and 256-pin Micro FineLine BGA packages , example, you can migrate between the EPM570, EPM1270, and EPM2210 devices in the 256-pin FineLine BGA Altera
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EPM2210G EPM570Z
Abstract: Micro Fineline BGA (MBGA) packages. Table 7­1. MAX II Devices in TQFP, FineLine BGA, and Micro FineLine , Thermal Resistance Table 7­1. MAX II Devices in TQFP, FineLine BGA, and Micro FineLine BGA Packages , barrier bag b 0.25 0.30 e 0.35 0.50 BSC Figure 7­1. 68-Pin Micro FineLine BGA , . 144-Pin Micro FineLine BGA Package Outline BOTTOM VIEW TOP VIEW D 13 12 11 10 9 8 , bag b 0.25 e 0.30 0.35 0.50 BSC Figure 7­7. 256-Pin Micro FineLine BGA Package Altera
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EPM570-144TQFP altera TQFP 32 PACKAGE JEDEC Package Code MS-026-AED JEDEC OUTLINE JEDEC bga case outline fbga Substrate design guidelines MII51007-2 324-P 144-P
Abstract: (TQFP), FineLine BGA (FBGA), and Micro Fineline BGA (MBGA) packages. Table 7­1. MAX II Devices in TQFP, FineLine BGA, and Micro FineLine BGA Packages (Part 1 of 2) Device Package Pin EPM240Z MBGA (1 , Micro FineLine BGA Packages (Part 2 of 2) Device Package Pin FBGA (1) 100 MBGA (1 , . 68-Pin Micro FineLine BGA Package Outline BOTTOM VIEW TOP VIEW D 9 8 7 6 5 4 , . 144-Pin Micro FineLine BGA Package Outline BOTTOM VIEW TOP VIEW D 13 12 11 10 9 8 Altera
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CMOS handbook 78 ball fbga thermal resistance error 41 barrier BGA PACKAGE OUTLINE
Abstract: T: Thin quad flat pack (TQFP) F: FineLine BGA® M: Micro FineLine BGA Pin Count Number of pins Altera
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marking code nt MII51006-1 XP/2000/NT
Abstract: temperature (TJ = -40° C to 125° C) Package Type T: Thin quad flat pack (TQFP) F: FineLine BGA M: Micro FineLine BGA Pin Count Number of pins for a particular package © August 2009 Altera Corporation Altera
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MAX II
Abstract: 27.00 x 27.00 1.00 484 23.00 x 23.00 1.00 21.00 x 21.00 1.00 Micro FineLine BGA (MBGA , Package dimensions selector guide FineLine BGA (FBGA); Hybrid FineLine BGA (HFBGA) as noted 1,932 1,760 45.00 x 45.00 1.00 1,517 43.00 x 43.00 1.00 1,020 40.00 x 40.00 1.00 , x 11.00 1.00 256 11.00 x 11.00 0.50 Ultra FineLine BGA (UFBGA) 484 19.00 x 19.00 , 23.20 0.65 208 (PQFP or RQFP) 44 (PQFP) 13.20 x 13.20 0.80 Ball-Grid Array (BGA) 600 Altera
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EPC16 EQFP 144 PACKAGE BGA and eQFP Package TQFP 144 PACKAGE altera eQFP
Abstract: significantly. For the smallest 100-pin Micro Fineline BGA, the rise time is less than 50ps. It is near the , ) Peak Current (A) HMFW Pulse Width (ps) 100-pin Micro Fineline BGA 42 4.2 232 256 , voltages with a 1GHz bandwidth oscilloscope. Chips in packages ranging from 100-pin Micro FinelineBGA to Altera
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Barth Electronics 1517FBGA CDM 07 CP-01056-1 FBGA1152
Abstract: Revision: 1.0.0 CUSTOMER ADVISORY ADV0907 ADDITIONAL ASSEMBLY PLANT FOR MBGA PACKAGES Change Description Altera will be introducing Amkor, Philippines as an additional assembly source for Altera® Micro FineLine BGA (MBGA) packages. This change does not affect the form, fit, or function of the device. The current package-dimension specifications and bill of materials will not change , FineLine BGA (FBGA) packages. The addition of Amkor, Philippines, as an assembly source for MBGA packages Altera
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EPM240ZM100C7NHT EPM240ZM100I8N EPM240ZM68I8N EPM570ZM100C7N EPM570ZM100I8N ALTERA PART MARKING EP3C16M164C7N EP3C16M164I7N altera epm570 Date Code Formats EP3C10 EP3C16 EPM240ZM100C7 EPM240ZM100C7N
Abstract: various packages, suitable for different board requirements. The MAX II Micro FineLine BGA® packages are , Design Guidelines Table 1. MAX II Packages & User I/O Pins Device 100-Pin Micro FineLine BGA 100-Pin TQFP EPM240 80 80 76 76 76 256-Pin Micro FineLine BGA 256-Pin FineLine BGA 116 160 160 212 212 324-Pin FineLine BGA 80 EPM570 144-pin TQFP 116 100-Pin FineLine BGA EPM1270 EPM2210 204 272 Logic Density MAX II CPLDs have Altera
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ALTERA EPM1270F256 epm1270f256 altera 10 k series cpld PCI_T32 MegaCore BYTEBLASTER Altera CPLD cross reference
Abstract: Plastic quad flat pack 6 Ball-grid array (1.27 mm) 7 FineLine BGA (1.0 mm) 8 Ultra FineLine BGA (0.8 mm) 9 Micro FineLine BGA (0.5 mm) 10 MAX IIZ devices are available only in commercial temperatures 212 Package Statistics PLCC TQFP PQFP BGA FBGA UBGA 44 84 44 100 144 100 , -Pin 84 160-Pin PQFP (Q or R)5 100 208-Pin BGA (B)6 158 172 164 256-Pin 100 , -mm BGA Packages1 ­ ­ ­ ­ Core Voltage (V) MultiVolt Core (V) 1.8 3.3, 2.5, 1.8 Altera
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EPM3512A EPM7032AE EPM7064AE EPM7128AE EPM7256AE 256-pin Plastic BGA 17 x 17 EPM3032A application epm7192 7000AE 7000B 7000S EPM3064A EPM3128A EPM3256A
Abstract: space-saving FineLine BGA, Micro FineLine BGA, and thin quad flat pack (TQFP) packages (refer to Table 1­3 and , User I/O Pins 68-Pin Micro FineLine BGA (1) 144-Pin TQFP 144-Pin Micro FineLine BGA (1) 256-Pin Micro FineLine BGA (1) 256-Pin FineLine BGA 324-Pin FineLine BGA 100 , FineLine BGA 256-Pin FineLine BGA 324-Pin FineLine BGA Device 100-Pin Micro FineLine , : (1) Packages available in lead-free versions only. Table 1­4. MAX II TQFP, FineLine BGA, and Micro Altera
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HP LED handbook linear handbook
Abstract: Features 1­3 MAX II devices are available in space-saving FineLine BGA, Micro FineLine BGA, and thin , BGA (1) 256-Pin Micro FineLine BGA (1) 256-Pin FineLine BGA 324-Pin FineLine BGA 80 , - 256-Pin Micro FineLine BGA 256-Pin FineLine BGA 324-Pin FineLine BGA 68-Pin Micro FineLine BGA (1) 100-Pin FineLine BGA 100-Pin TQFP - 80 80 - 76 - Device 100-Pin Micro FineLine BGA (1) EPM240 EPM240G EPM570 EPM570G EPM1270 EPM1270G Altera
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45This
Abstract: space-saving FineLine BGA, Micro FineLine BGA, and thin quad flat pack (TQFP) packages (refer to Table 1­3 and , User I/O Pins 68-Pin Micro FineLine BGA (1) 144-Pin TQFP 144-Pin Micro FineLine BGA (1) 256-Pin Micro FineLine BGA (1) 256-Pin FineLine BGA 324-Pin FineLine BGA 100 , FineLine BGA 256-Pin FineLine BGA 324-Pin FineLine BGA Device 100-Pin Micro FineLine , : (1) Packages available in lead-free versions only. Table 1­4. MAX II TQFP, FineLine BGA, and Micro Altera
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ALTERA BGA packages PART MARKING ieee 1532
Abstract: . push-buttons Key board features The demo board is based on the MAX IIZ EPM240Z device in a 100-pin Micro FineLine BGA (MBGA) package. This device features 240 logic elements (LEs) and 80 user I/O pins. Other Altera
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seven segment interface kit altera jtag ii SS-01033-1
Abstract: (EQFP) 164-pin Micro FineLine BGA (MBGA) 256-pin FineLine BGA (FBGA) 256-pin Ultra FineLine BGA (UBGA Altera
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CYCLONE 3 ep3c25f324* FPGA FBGA-484 datasheet EP3C16F484I7N EPM570T144I5 EP3C25F324I7N EPM1270T144I5
Abstract: devices available in Ball-Grid Array (BGA), FineLine® BGA (FBGA), Micro FineLine BGA® (MBGA), Ultra FineLine BGA (UBGA), Pin-Grid Array (PGA), Plastic J-Lead Chip Carrier (PLCC), Plastic Enhanced Quad Flat Altera
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EP3C25 pin information ep3c10 u256 E144 EP2C35-F484 F256 EP1C20
Abstract: resistance) values for Altera® Cyclone® series devices available in Ball-Grid Array (BGA), FineLine® BGA (FBGA), Micro FineLine BGA® (MBGA), Ultra FineLine BGA (UBGA), Pin-Grid Array (PGA), Plastic J-Lead Altera
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EP3C40F484 100 PIN PQFP ALTERA DIMENSION EP3c55 EP3C40 EP3C16F484 PIN INFORMATION FOR EP3C55 EP1C12
Abstract: Code and Available Options for Cyclone V E Devicesâ'"Preliminary Package Type F : FineLine BGA (FBGA) U : Ultra FineLine BGA (UBGA) M : Micro FineLine BGA (MBGA) Operating Temperature C : Commercial , controllers Family Signature 5C : Cyclone V 5C GX Package Type F : FineLine BGA (FBGA) U : Ultra FineLine BGA (UBGA) M : Micro FineLine BGA (MBGA) Transceiver Count B : 3 F : 4 A : 5 C : 6 D : 9 , (FBGA) U : Ultra FineLine BGA (UBGA) M : Micro FineLine BGA (MBGA) 35 C Package Code FBGA Altera
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CV-51001
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