NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: , Micro FineLine BGA, and thin quad flat pack (TQFP) packages (refer to Table 13 and Table 14). MAX II , 144-Pin TQFP 144-Pin Micro FineLine BGA (1) 256-Pin Micro FineLine BGA (1) 256-Pin , - - - 116 160 - - 256-Pin Micro FineLine BGA 256-Pin FineLine BGA 324-Pin FineLine BGA 68-Pin Micro FineLine BGA (1) 100-Pin FineLine BGA 100-Pin TQFP - 80 80 - 76 - Device 100-Pin Micro FineLine BGA (1) EPM240 EPM240 EPM240G EPM240G ... | Original |
6 pages, |
EPM570 EPM240Z EPM240G EPM240 EPM2210 EPM1270 bga-100 0.5 micro fineline BGA MII51001-1 MII51001-1 abstract |
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| Abstract: Micro Fineline BGA (MBGA) packages. Table 71. MAX II Devices in TQFP, FineLine BGA, and Micro FineLine , Thermal Resistance Table 71. MAX II Devices in TQFP, FineLine BGA, and Micro FineLine BGA Packages , barrier bag b 0.25 0.30 e 0.35 0.50 BSC Figure 71. 68-Pin Micro FineLine BGA , 713 Figure 76. 144-Pin Micro FineLine BGA Package Outline BOTTOM VIEW TOP VIEW D 13 12 , Micro FineLine BGA Package Outline BOTTOM VIEW TOP VIEW D Pin A1 Corner Pin A1 ID e ... | Original |
18 pages, |
MO-192 bsc part 2 date sheet EPM1270 EPM2210 EPM240 EPM240G EPM240Z EPM570 fbga Substrate design guidelines altera TQFP 32 PACKAGE micro fineline BGA MII51007-2 MII51007-2 abstract |
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| Abstract: temperature (TJ = -40° C to 125° C) Package Type T: Thin quad flat pack (TQFP) F: FineLine BGA M: Micro FineLine BGA Pin Count Number of pins for a particular package © August 2009 Altera Corporation ... | Original |
2 pages, |
MII51006-1 XP/2000/NT MII51006-1 abstract |
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| Abstract: T: Thin quad flat pack (TQFP) F: FineLine BGA® M: Micro FineLine BGA Pin Count Number of pins ... | Original |
3 pages, |
marking code nt MII51006-1 XP/2000/NT MII51006-1 abstract |
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| Abstract: quad flat pack (TQFP), FineLine BGA (FBGA), and Micro Fineline BGA (MBGA) packages. Table 71. MAX II Devices in TQFP, FineLine BGA, and Micro FineLine BGA Packages (Part 1 of 2) Device Package Pin , , FineLine BGA, and Micro FineLine BGA Packages (Part 2 of 2) Device Package Pin FBGA (1) 100 , 71. 68-Pin Micro FineLine BGA Package Outline BOTTOM VIEW TOP VIEW D 9 8 7 6 5 , Outlines Figure 73. 100-Pin Micro FineLine BGA Package Outline BOTTOM VIEW TOP VIEW D 11 10 ... | Original |
30 pages, |
fbga Substrate design guidelines BGA PACKAGE OUTLINE EPM1270 EPM2210 EPM240 EPM240G EPM240Z EPM570 error 41 barrier 78 ball fbga thermal resistance CMOS handbook datasheet abstract |
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| Abstract: 27.00 x 27.00 1.00 484 23.00 x 23.00 1.00 21.00 x 21.00 1.00 Micro FineLine BGA (MBGA , Package dimensions selector guide FineLine BGA (FBGA); Hybrid FineLine BGA (HFBGA) as noted 1,932 1,760 45.00 x 45.00 1.00 1,517 43.00 x 43.00 1.00 1,020 40.00 x 40.00 1.00 , x 11.00 1.00 256 11.00 x 11.00 0.50 Ultra FineLine BGA (UFBGA) 484 19.00 x 19.00 , 23.20 0.65 208 (PQFP or RQFP) 44 (PQFP) 13.20 x 13.20 0.80 Ball-Grid Array (BGA) 600 ... | Original |
2 pages, |
TQFP 144 PACKAGE altera EPC16 EQFP 144 PACKAGE micro fineline BGA BGA and eQFP Package datasheet abstract |
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| Abstract: Revision: 1.0.0 CUSTOMER ADVISORY ADV0907 ADV0907 ADDITIONAL ASSEMBLY PLANT FOR MBGA PACKAGES Change Description Altera will be introducing Amkor, Philippines as an additional assembly source for Altera® Micro FineLine BGA (MBGA) packages. This change does not affect the form, fit, or function of the device. The current package-dimension specifications and bill of materials will not change. , FineLine BGA (FBGA) packages. The addition of Amkor, Philippines, as an assembly source for MBGA packages ... | Original |
4 pages, |
EP3C10 ALTERA PART MARKING altera marking Code Formats Cyclone ii EPM1270M256C5N EPM240 EPM570ZM100C7N EPM240GM100C5N EPM240M100I5N EPM570 EPM240Z EPM240ZM100C6N EPM240ZM100I8N EP3C16M164C8N ADV0907 ADV0907 abstract |
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| Abstract: various packages, suitable for different board requirements. The MAX II Micro FineLine BGA® packages are , Design Guidelines Table 1. MAX II Packages & User I/O Pins Device 100-Pin Micro FineLine BGA 100-Pin TQFP EPM240 EPM240 80 80 76 76 76 256-Pin Micro FineLine BGA 256-Pin FineLine BGA 116 160 160 212 212 324-Pin FineLine BGA 80 EPM570 EPM570 144-pin TQFP 116 100-Pin FineLine BGA EPM1270 EPM1270 EPM2210 EPM2210 204 272 Logic Density MAX II CPLDs have ... | Original |
20 pages, |
EPM570 EPM2210 EPM1270 BYTEBLASTER altera 10 k series cpld EPM240 epm1270f256 ALTERA EPM1270F256 datasheet abstract |
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| Abstract: significantly. For the smallest 100-pin Micro Fineline BGA, the rise time is less than 50ps. It is near the , ) Peak Current (A) HMFW Pulse Width (ps) 100-pin Micro Fineline BGA 42 4.2 232 256 , stress voltages with a 1GHz bandwidth oscilloscope. Chips in packages ranging from 100-pin Micro ... | Original |
7 pages, |
CP-01056-1 CDM 07 1517FBGA CP-01056-1 abstract |
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| Abstract: flat pack 5 Plastic quad flat pack 6 Ball-grid array (1.27 mm) 7 FineLine BGA (1.0 mm) 8 Ultra FineLine BGA (0.8 mm) 9 Micro FineLine BGA (0.5 mm) 10 MAX IIZ devices are available only in commercial temperatures 212 Package Statistics PLCC TQFP PQFP BGA FBGA UBGA 44 84 44 100 , 120 100-Pin 84 160-Pin PQFP (Q or R)5 100 208-Pin BGA (B)6 158 172 164 , BGA Packages1 Core Voltage (V) MultiVolt Core (V) 1.8 3.3, 2.5, 1.8 ... | Original |
2 pages, |
micro fineline BGA altera EPM7032S EPM240 EPM7032AE EPM7064AE EPM7128AE epm7192 EPM7256AE 256-pin Plastic BGA 17 x 17 EPM3032A application datasheet abstract |
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