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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: MEMS Gauge Pressure Sensor 2SMPP MEMS Gauge Pressure Sensor Featuring Small Size and Low Power , characteristics that are superior to capacitive type pressure sensors. · 0 to 37 kPa pressure range. · Low , Conneted Nsub · Leak detection · Pressure controller GND Vout (-) MEMS Gauge Pressure , Package Material PPS (Polyphenylenesulfide) 36 2SMPP MEMS Gauge Pressure Sensor , mounting board. Be sure to check operation including durability in actual equipment before use. MEMS ... | Original |
8 pages, |
ultrasonic piezo 2SMPP02 gauge pressure sensor medical sensor mems pressure sensor structure ultrasonic movement sensor resistive humidity sensor negative PRESSURE SENSOR MEMS humidity sensor Pressure sensor air pressure sensor tube temperature gauge sensor datasheet abstract |
| Abstract: MEMS Gauge Pressure Sensor 2SMPP MEMS Gauge Pressure Sensor Featuring Small Size and Low Power , characteristics that are superior to capacitive type pressure sensors. · 0 to 37 kPa pressure range. · Low Power , controller GND MEMS Gauge Pressure Sensor 2SMPP 35 Specifications Ratings Item Pressure , body model) 0.17 g PPS (Polyphenylenesulfide) 36 MEMS Gauge Pressure Sensor 2SMPP , use. MEMS Gauge Pressure Sensor 2SMPP 37 Pressure cycle range (0 to 40 kPa) 1 1 Offset ... | Original |
8 pages, |
temperature gauge sensor "piezo element" level sensor datasheet abstract |
| Abstract: of iSensorTM products simplifies integration and opens up the myriad benefits of MEMS sensors to , AUX_AUX ADC_DAC TEMPERATURE SENSORS TRI-AXIS MEMS SIGNAL CONDITIONING AND CONVERSION ANGULAR , laptop computers, and portable handheld devices, ADI's MEMS motion sensors are finding their way into , addition to gaming consoles, ADI's MEMS motion sensors can be found in a growing number of other consumer-based products such as cell phones, where MEMS motion sensors control features like location tracking ... | Original |
8 pages, |
AD7942 ad7793 example code AD7685 AD7150 AD7142 for humidity AD7142 ADXL78 ultrasonic motion detector sensor ultrasonic liquid level sensor circuit mems ultrasonic sensors MEMS radiation sensor Infrared proximity Sensor robotics ADIS16255 datasheet abstract |
| Abstract: specific MEMS concern, especially when it comes to high-end capacitive sensors. In order to obtain good , free soldering process and SMD mounting The VS9000 VS9000 vibration sensor is a single axis MEMS capacitive , Reliability Shock resistance Recovery time Vibration ESD sensitivity Ultrasonic cleaning VS9010 VS9010 VS9030 VS9030 VS9050 VS9050 , product can't be cleaned with ultrasonic bath. Such a cleaning process will largely affect the sensor , supply and corresponds to the output voltage at zero g. All sensors are calibrated to match the ideal ... | Original |
5 pages, |
VS9000 VS9000 abstract |
| Abstract: soldering process and SMD mounting The MS9000 MS9000 product is a single axis MEMS capacitive accelerometer , range Reliability Shock resistance Recovery time Vibration ESD sensitivity Ultrasonic cleaning MS9002 MS9002 , ), Human Body Model 2kV The product can't be cleaned with ultrasonic bath. Such a cleaning process will , stress induced by the soldering of the LCC package is a specific MEMS concern, especially when it comes to high-end capacitive sensors. In order to obtain good stress homogeneity and the best long term ... | Original |
5 pages, |
ms9001 MS9002 MS9000 MS9000 abstract |
| Abstract: market of Micro Electro Mechanical System (MEMS) sensors is growing rapidly, with many applications being , sensors Shock sensors Ultrasonic sensors Pyroelectric sensors Infrared sensors Resistor-bridge , Sensors DA Analog values AMP LPF Calibrated digital signals Main MCU AD MPX , capture analog data from various sensor devices. Analog Board Various Sensors New solution , Toshiba is planning to develop mixed-signal controllers for a wide variety of sensors, including products ... | Original |
4 pages, |
TMP89FH00DUG mems ultrasonic sensors cpu 226 laser Gyro missile mems Gyro missile types of sensor datasheet abstract |
| Abstract: .24 THREE-AXIS MEMS GYROSCOPE WITH 16-BIT 16-BIT ADCS AND SIGNAL CONDITIONING.25 THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT 16-BIT ADCS AND SIGNAL CONDITIONING .25 , consumers. The MPU-60X0 MPU-60X0 is also designed to interface with multiple non2 inertial digital sensors, such as pressure sensors, on its auxiliary I C port. The MPU-60X0 MPU-60X0 is footprint compatible with the MPU-30X0 MPU-30X0 family. , volume-proven Nasiri-Fabrication platform, which integrates MEMS wafers with companion CMOS electronics through ... | Original |
54 pages, |
bias stability gyro mems digital gyro SPI Invensense MEMS Gyroscope mems accelerometer sensor accelerometer compass gyro MPU 6000 mpu6000 PS-MPU-6000A-00 mpu6050 mpu 6050 MPU-6000 MPU-6050 PS-MPU-6000A-00 abstract |
| Abstract: Acceleration sensors GS2 Sensor (AGS2) High-precision MEMS 2-axis acceleration sensor GS2 , 60 Temperature, °C 80 100 Acceleration sensors ELECTRICAL CHARACTERISTICS GS2 , Direction of picking Acceleration sensors 5. Frequency characteristics 2.0±0.5 .079±.020 +2.0 , 3.150±.039 dia. High-precision MEMS 1-axis acceleration sensor GS1 SENSOR FEATURES TYPICAL , Remarks Ta=25°C 77°F Acceleration sensors GS1 Sensor (AGS1) GS1 Sensor (AGS1) ELECTRICAL ... | Original |
7 pages, |
"Acceleration Sensors" acceleration sensor AGS11151 AGS21151 AGS21351 AGS21631 AGS21831 CAR SECURITY SYSTEMS AGS2 AGS11351 ultrasonic water level sensor c1220nf datasheet abstract |
| Abstract: manufacturing the MEMS devices and ASICs on separate wafers. For this Chip-on-MEMS concept, ASIC chips are flip-chipped onto the MEMS wafer in known good locations. Redistribution and isolation layers are applied to the MEMS wafer, solder spheres are provided for external connection before the ASICs are added and the MEMS and ASIC chips are then isolated using a passivation layer. The concept is illustrated in , Technologies' acceleration sensors can be soldered on commonly used substrates, e.g. FR-4, ceramic, flex-print ... | Original |
18 pages, |
J-STD-020D CMA3000-D0X CMA3000 CMA3000 abstract |
| Abstract: maintain the benefits of manufacturing the MEMS devices and ASICs on separate wafers. For this Chip-on-MEMS concept, ASIC chips are flip-chipped onto the MEMS wafer in known good locations. Redistribution and isolation layers are applied to the MEMS wafer, solder spheres are provided for external connection before the ASICs are added and the MEMS and ASIC chips are then isolated using a passivation , 9/18 Rev.09 CMA3000 CMA3000 Assembly Instructions VTI Technologies' acceleration sensors can be ... | Original |
18 pages, |
pin in paste J-STD-020D CMA3000-D0X CMA3000-D0X rev 0.4 CMA3000 CMA3000 abstract |
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| # 055 DS1820 DS1820 DS1820 DS1820 Temp Sensor # 056 Air muscle hexapod robot # 057 Lights # 058 Caller Measurement with GP2D02 GP2D02 GP2D02 GP2D02 SHARP Sensor # 127 TI82 Interface # 128 Operator Interface for Multiple Stamps dog module # 201 Air Data Sensor (Test Set) # 202 Using the BS-2 to send MIDI note on ) one to sweep it's "sensors" form left to right, and one to "stear" the robot. You can see ' (switches) and/or analog (temp, airflow, current, etc using commercial sensors). All stamps www.datasheetarchive.com/files/elektronikladen/files/parallax/losa.txt |
Elektronikladen | 22/01/2001 | 268 Kb | TXT | losa.txt |