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Part Manufacturer Description Datasheet BUY
LTM4600DCM#PBF Linear Technology IC DC/DC UMODULE 10A 104-LGA visit Linear Technology - Now Part of Analog Devices
LTM4601IV-1#2DMPBF Linear Technology IC DC/DC UMODULE 12A 118-LGA visit Linear Technology - Now Part of Analog Devices
LTM4605EV#3CNPBF Linear Technology IC DC/DC UMODULE 5A 141-LGA visit Linear Technology - Now Part of Analog Devices
LTM9004CV-AA#PBF Linear Technology LTM9004 - 14-Bit Direct Conversion Receiver Subsystem; Package: LGA; Pins: 204; Temperature Range: 0°C to 70°C visit Linear Technology - Now Part of Analog Devices Buy
LTM9004IV-AB#PBF Linear Technology LTM9004 - 14-Bit Direct Conversion Receiver Subsystem; Package: LGA; Pins: 204; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTM9004IV-AD#PBF Linear Technology LTM9004 - 14-Bit Direct Conversion Receiver Subsystem; Package: LGA; Pins: 204; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy

lga components

Catalog Datasheet MFG & Type PDF Document Tags

Heat Sink Overview

Abstract: Fans requirements. STAR LED LGA Cooling L: 21-62 mm W: 32-52 mm H: 9-16 mm High performance cooling solutions for high power LGA components. maxiFLOWTM custom designs for flip-chip components such as , minimal space around components perimeter making it ideal for densely populated PCBs. Straight Fin , performance. Requires minimal space around components perimeter making it ideal for densely populated PCBs
Advanced Thermal Solutions
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dscc 07016

Abstract: human radar detection , temperature extremes), highly reliable, able to power-up after periods of dormancy and based on components , / 6v device. Figure 1 In order to minimize current loop, a new series of Land Grid Array (LGA) components has been developed having extremely tightly controlled termination dimensions. Using a vertical , for a small 0306 4.7uF / 6v device. Figure 2 Image 3, LGA Series For many avionics or
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Abstract: components with minimal obsolescence. AVX can improve power distribution quality, over a wide spectrum of , ¼F / 6v device. Figure 1 In order to minimize current loop, a new series of Land Grid Array (LGA) components has been developed having extremely tightly controlled termination dimensions. Using a vertical , for a small 0306 4.7μF / 6v device. Figure 2 Image 3, LGA Series For many avionics or AVX
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LGA rework

Abstract: AN2920 ) assembly solder pasted used. · LGA eliminates risk that customers receive components with missing or , properly disposed of so that they will not mix in with new LGA components. 4.2 Site Preparation , Grid Array (LGA) Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules such as the MC1320x and MC1321x in LGA packages as an alternative package to ball grid array
Freescale Semiconductor
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metcal apr 5000

Abstract: NZA-555-555-CGA Array (LGA) components. This is an ideal process for small components and situations where traditional , peak reflow temperature without thermal damage to sensitive components unsuitable for heating above , up to 24.5" x 24.5" (622mm x 622mm) to components down to 0.020" x 0.010" APR-5000-XLS Array , components, with the necessary magnification to make its placement and registration fast and accurate. 5 , flexibility of custom manufactured nozzles for unusual or odd shaped components. Please contact your local
OK International
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APR-5000 metcal apr 5000 NZA-555-555-CGA reflow temperature bga laptop APR-5000-XL NZA-270-270 BRO-APR-US-05

IPC-7527

Abstract: PCB design for 0.2mm pitch csp package , BGA, and LGA Components. (Photo of VPI-1000 courtesy of METCAL) April 2002 Page 18 MLP , Profile The solder reflow profile will be dependent on PCB design, PCB thickness, type of components , use a stencil thickness of 125mm (5mils) for MLP components. 4.3 Lead finger stencil design The , components of 0.5mm and below it may be necessary to reduce the stencil aperture length by 20%. This is , necessary when reflowing MLP components. As with all SMT components, it is important that profiles be
Carsem
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IPC-7527 PCB design for 0.2mm pitch csp package tssop 16 exposed pad stencil IPC7527 QFN 16 CARSEM package outline metcal VPI-1000

hand movement based fan speed control

Abstract: solutions for high power LGA components. maxiFLOWTM custom designs for flip-chip components such as , domain, including components, circuit boards (PCBs), shelves, chassis, and system packaging. The , ; and wind tunnel testing of components, PCBs, chassis and enclosures. Prototyping Services ATS , temperature measurement and mapping of ICs and components. The measurement resolutions span from small , facility for components and boards » Sensor Calibration Services #7; For temperature, velocity
Advanced Thermal Solutions
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hand movement based fan speed control CWT-108 CWT-109 WTC-100 CWT-110 CWT-112 CWT-125
Abstract: solutions for high power LGA components. maxiFLOWTM custom designs for flip-chip components such as , domain, including components, circuit boards (PCBs), shelves, chassis, and system packaging. The , ; and wind tunnel testing of components, PCBs, chassis and enclosures. Prototyping Services ATS , temperature measurement and mapping of ICs and components. The measurement resolutions span from small , facility for components and boards » Sensor Calibration Services #7; For temperature, velocity Advanced Thermal Solutions
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CLWTC-1000 HP-97TM

pcb design of zigbee

Abstract: FBGA 17X17 DRAWING technology (SMT) assembly solder paste used. LGA eliminates the risk that customers receive components with , house used and the other components on the board. 3.1 71-Pin LGA Component Copper Layer 1.55mm , top metal layer and is the layer to which the components are soldered. The footprint for the LGA , , intended, or authorized for use as components in systems intended for surgical implant into the body, or , Grid Array (LGA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Freescale Semiconductor
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pcb design of zigbee FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 CH370

AN3281

Abstract: LGA voiding components with missing or damaged spheres due to shipping or handling. · LGA devices have a lower mounted , Considerations for the Application of Land Grid Array (LGA) Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style packages. Freescale has introduced radio frequency (RF) modules such as the MC1320x and MC1321x in LGA packages as an alternative package to ball grid array (BGA). The LGA packages reduce the amounts of lead
Freescale Semiconductor
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AN3311 AN3281 LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS BGA PACKAGE thermal resistance Freescale AN1902 MC1320 MC1321

LGA voiding

Abstract: AN3281 components with missing or damaged spheres due to shipping or handling. · LGA devices have a lower mounted , Considerations for the Application of Land Grid Array (LGA) Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style packages. Freescale has introduced radio frequency (RF) modules such as the MC1320x and MC1321x in LGA packages as an alternative package to ball grid array (BGA). The LGA packages reduce the amounts of lead
Freescale Semiconductor
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Lead Free reflow soldering profile BGA bga PCB footprint fr-5 laminate

LGA voiding

Abstract: NC-SMQ230 ) assembly solder pasted used. · LGA eliminates risk that customers receive components with missing or , Land Grid Array (LGA) to reduce the amounts of lead in finished products and to become Reduction of Hazardous Substances (RoHS) compliant. This application note describes this HCTE Ceramic LGA and , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 What is LGA? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Benefits of LGA . . . . . . . . . . . . . . . . . . . . . .
Freescale Semiconductor
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AN2920 NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 freescale ltcc 7313 28 pin

picor

Abstract: LGA rework external components. The smaller pads along the right half of the LGA are the input and output connections , to reflow the LGA, then components mounted on smaller areas of copper could be thermally damaged , ® Recommended PCB Design & Surface Mount Guidelines for Picor Corporation's LGA Packages , . . . Page 2 IPC/JEDEC Reflow Guidelines . . . . . . . . . . . . . . . . . . Page 2 LGA SIP Rework , . . . . . . . . . Page 4 ­ 5 Introduction Picor's LGA (Land Grid Array) products are high
Picor
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picor LGA rework JEDEC Drawing LGA MLCC rework PI2121 LGA Application Notes PI2122

LTM 4606 EVALUATION BOARD

Abstract: LTM4602 design from 32 components to one. The small and thin plastic LGA (land grid array) package features , challenge even for an expert analog designer. Besides calculating values and selecting components, there , controllers, power FETs, inductors (except for buck-boost) and additional components, all in single low profile packages. The only external components required are bulk input and output capacitors and a , . The result is a high performance DC/DC system with a very low thermal impedance land grid array (LGA
Linear Technology
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LTM 4606 EVALUATION BOARD LTM4602 LTM4607 24v 2A regulator LTM4608 LTM4612

C25704-002

Abstract: LGA 775 SOCKET PIN LAYOUT relaxation in retention components. 10 Intel® Celeron® D Processor in the 775-Land LGA Package Thermal , Intel® Celeron® D Processor in the 775-Land LGA Package for Embedded Applications Thermal Design , changes to them. The Intel® Celeron® D Processor in the 775-Land LGA Package for Embedded Applications , Processor in the 775-Land LGA Package Thermal Design Guide Order #303730 Contents Contents 1.0 , . 26 Intel® Celeron® D Processor in the 775-Land LGA Package Thermal Design Guide Order #303730
Intel
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C25704 C25704-002 LGA 775 SOCKET PIN LAYOUT Nidec fan C25704-002 intel fan socket 775 air output lga 775 motherboard drawings lga 775 socket details 775-L C25697 C69175 PSC-2U001

LGA PACKAGE thermal resistance

Abstract: Approved by Intel and supporting its top-of-the-line Core i7 series processors, the compact LGA , solutions and replacing the LGA 1366, the Intel-approved LGA 2011-0 socket (Socket R) offers the electrical , performance levels of Intelâ'™s Core* i7 series of 32nm-Sandy Bridge-E microprocessors. Molexâ'™s LGA 2011-0 , '™). Compared with the LGA 1366 socket, the increase in the LGA 2011-0â'™s contact density of 12 , socket base help establish minimum socket height after solder reflow. The LGA 2011-0 socket assembly
Molex
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LGA PACKAGE thermal resistance USA/KC/2012
Abstract: Approved by Intel and supporting its top-of-the-line Core i7 series processors, the compact LGA , solutions and replacing the LGA 1366, the Intel-approved LGA 2011-0 socket (Socket R) offers the electrical , performance levels of Intelâ'™s Core* i7 series of 32nm-Sandy Bridge-E microprocessors. Molexâ'™s LGA 2011-0 , '™). Compared with the LGA 1366 socket, the increase in the LGA 2011-0â'™s contact density of 12 , socket base help establish minimum socket height after solder reflow. The LGA 2011-0 socket assembly Molex
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9202076

Abstract: TH1M156ER (MCGA-349) - 349 Columns Multilayer Column Grid Array (MCGA-472) - 472 Columns Land Grid Array (LGA-349) - 349 Pads Land Grid Array (LGA-472) - 472 Pads Functional Diagram Pin Assignment Instruction , Electrical Measurements for Components Specified at Single Supply Voltage VDD = 2.5V Room Temperature Electrical Measurements for Components Specified at Single Supply Voltage VDD = 3V Room Temperature Electrical Measurements for Components Specified at Single Supply Voltage VDD = 3.3V Room Temperature
European SPace COmponents Coordination
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9202076 TH1M156ER LGA-349 LGA-472 324A1 988000

variable phase shifter 100 Mhz

Abstract: voltage variable phase shifters Control Components HIP3TM Voltage Variable Attenuators Frequency (GHz) 0.80-1.00 1.70-2.00 0.80-1.00 1.70-2.00 2.10-2.30 Insertion Loss Range (dB) Typ. 1 1 1 1 1 Attenuation Range (dB) Typ. 30 30 30 30 21 IP3 > 0.5 GHz (dBm) Typ. 50 50 40 40 30 Part Number AV101-12 AV102-12 AV111-12 AV112 , Range(V) 0-12 0-12 0-12 Package LGA LGA LGA Part Number 1AV131 -315 1AV132-315 1AV133-315 , Package LGA LGA LGA LGA LGA o 3 (D I A vailable through distribution. P referred for new
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variable phase shifter 100 Mhz voltage variable phase shifters AV112-12 AV113-12 IPS088-315 PS094-315 PS184-315 IPS196-315

LGA16 footprint

Abstract: TN0018 TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Abstract This document is a general guidelines about soldering accelerometer products packaged in LGA surface , resistance and environmental specification . . . . . . . . . . . 7 Appendix A LGA packages outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 A.1 A.2 LGA 4.4x7.5x1 mm , LGA 5x5x1.6 mm, 16 lead. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
STMicroelectronics
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LGA16 footprint lga16 land pattern LGA16 L footprint TN-00-18 788755 LGA16
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