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land pattern 0805

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: ,6.3V,20%,0805 C2 (output C) TDK C1608X5R0J475M C1608X5R0J475M 4.7 uF,6.3V,20%,0603 C3 (optional, input , and output terminals, are DC current, therefore pattern width (current capability) and DCR drop , . SW to L1 path should be routed between C2(+) and C2(-) land patterns. If vias are used in these , circuit pattern design of these two loops are key factors for reducing noise radiation and achieving Connect C1(-), C2(-) and PGND with wide GND pattern. This pattern should be short, so C1(-), C2(-), and ... National Semiconductor
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datasheet

4 pages,
635.96 Kb

NR3015T3R3M NR3015 LM3202 CRCW04020R00F AN-1419 TEXT
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Abstract: . 4. REFERENCE JEDEC STD MO-187 MO-187, VARIATION BA. Land Pattern - MSOP-10 MSOP-10 X DIM (C) G Z C G P X Y , Y P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP , _1206 SM/C_0805 SM/C_1210_GRM SM/C_2220 SM/C_0805 SM/C_1210_GRM SM/C_1206 SM/C_1206 SM/C_1210_GRM SM/C_0805 SM/C_1206 SM/C_0805 SM/C_0805 SM/C_0805 SM/C_0805 SM/C_0805 SM/C_0805 SM/C_0805 SM/C_0805 DIODE_D2PAK , /R_0805 SM/R_1206 SM/R_1206 SM/R_1210_MCR SM/R_0805 SM/R_1206 SM/R_0805 SM/R_1206 SM/R_0805 SM/R_0805 ... Semtech
Original
datasheet

24 pages,
400.81 Kb

R27 transistor MOCD207 application note high frequency transformer push pull bottom GRM32RR71H105K push pull converter SC4808C TEXT
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Abstract: . 3300 0.6 0.6 0.7 0.7 0.8 0.9 Unit MHz Outline Drawing PCB Land Pattern Insertion Loss (Avg , in a miniature EIA-0805 form factor. The outstanding phase and amplitude unbalance make this , Feature Advantages Offered in the EIA-0805 package size, the QCS-332 QCS-332+ offers an industry leading ... Mini-Circuits
Original
datasheet

3 pages,
353.41 Kb

TB-489-332 QCS-332 TEXT
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Abstract: , V8V) (EXBS8V) ■ Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautions , Chip Resistor Array Chip Resistor Array EXB1 : 0201 Array EXB2 : 0402 Array EXB3 : 0603 Array EXBN : 0402 Array EXBV : 0603 Array EXBS : 0805 Array Type: ■ Features ● High density 2 resistors in 0.8 mm × 0.6 mm size 4 resistors in 1.4 mm × 0.6 mm size 2 resistors in 1.0 mm × 1.0 mm , 0603 Array 0402 Array 0603 Array 0805 Array Convex Terminal 4 No. of Terminal 4 4 ... Panasonic
Original
datasheet

3 pages,
112.39 Kb

TEXT
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Abstract: ) Frequency Outline Drawing PCB Land Pattern 3100-3300 3300-3600 3600-3900 3900-5100 5100-5700 , in a miniature EIA-0805 form factor. The outstanding phase and amplitude unbalance make this , Features Feature Advantages Small Size Offered in the EIA-0805 package size, the QCS-592 QCS-592+ offers ... Mini-Circuits
Original
datasheet

3 pages,
305.41 Kb

QCS-592 TEXT
datasheet frame
Abstract: , V8V) (EXBS8V) ■ Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautions , Chip Resistor Array Chip Resistor Array EXB1 : 0201 Array EXB2 : 0402 Array EXB3 : 0603 Array EXBN : 0402 Array EXBV : 0603 Array EXBS : 0805 Array Type: ■ Features ● High density 2 resistors in 0.8 mm × 0.6 mm size 4 resistors in 1.4 mm × 0.6 mm size 2 resistors in 1.0 mm × 1.0 mm , 0603 Array 0402 Array 0603 Array 0805 Array Convex Terminal 4 No. of Terminal 4 4 ... Panasonic
Original
datasheet

3 pages,
112.32 Kb

TEXT
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Abstract: important to maintain a temperaturecontrolled environment. 2. Design of Solder Land Pattern When designing , GMC31 GMC31 GMC32 GMC32 GMC40 GMC40 GMC43 GMC43 GMC45 GMC45 GMC55 GMC55 0805 Ultra Stable Dielectric 1206 1210 , GMC21 GMC21 GMC31 GMC31 GMC32 GMC32 GMC40 GMC40 GMC43 GMC43 GMC45 GMC45 GMC55 GMC55 0805 Ultra Stable Dielectric 1206 , Ceramic Capacitors- 6.3, 10, 16, 25V GMC21 GMC21 GMC31 GMC31 GMC32 GMC32 GMC40 GMC40 GMC43 GMC43 GMC45 GMC45 GMC55 GMC55 0805 , GMC21 GMC21 GMC31 GMC31 GMC32 GMC32 GMC40 GMC40 GMC43 GMC43 GMC45 GMC45 GMC55 GMC55 0805 1206 1210 1808 1812 ... Cal-Chip Electronics
Original
datasheet

20 pages,
2050.45 Kb

TEXT
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Abstract: life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance. Land pattern design 1.Please refer to a recommended land pattern. Adjustment of mounting machine 1.Excessive impact , BR SMD 3 W×L : mm inch 1608 0603 1.6×0.8 mm 2012 0805 2.0×1. 2 mm 2016 0806 2.0×1.6 mm 2518 1007 , 3 4 5 5 6 6 7 W×L : mm inch 1608 0603 1.6×0.8 mm 2012 0805 2.0×1. 2 mm 2016 0806 , C2016 C2016 BR L 2518 BR L3225 L3225 5 FERRITE PRODUCTS Recommended Land Patterns Surface Mounting ... Taiyo Yuden
Original
datasheet

12 pages,
536.88 Kb

TEXT
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Abstract: Solder Land Pattern When designing printed circuit boards, the shape and size of the solder lands must , 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 Electronics, Incorporated GMC 21 0805 GMC 31 1206 , GMC 21 0805 GMC31 GMC31 1206 GMC32 GMC32 1210 GMC43 GMC43 1812 GMC45 GMC45 1825 GMC SERIES X7R/X5R GMC55 GMC55 2220 GMC57 GMC57 2225 , 1.0uF 1.5 2.2 3.3 4.7 5.6 6.8 Electronics, Incorporated GMC 21 0805 GMC31 GMC31 1206 GMC32 GMC32 1210 GMC43 GMC43 1812 , , Incorporated GMC 21 0805 GMC31 GMC31 1206 GMC32 GMC32 1210 GMC43 GMC43 1812 GMC55 GMC55 2220 GMC SERIES 16 & 25V GMC57 GMC57 2225 ... Cal-Chip Electronics
Original
datasheet

19 pages,
1173.8 Kb

gmc31 TEXT
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Abstract: does not different the characteristics of the Capacitors. 2-2-2. Design of Land pattern Recommended Dimensions of lands; As shown in Table 1 and Fig.1. (1) If the land area is too large, the amount of solder , solder shall be applied correctly when soldering. The land size c shall not exceed the Capacitors width , component. Fig. 1 :Recommended land dimensions (Ex.) Chip Capacitor Solder resist C Land Unit:mm) Table.1 Recommended Land Dimension in mm Size Code (EIA) Component Dimensions a ... Matsushita Electronic Components
Original
datasheet

25 pages,
489.07 Kb

single phase ac motor speed control capacitor manufacture ECDGZER208 ECDGZER308 ECDGZER408 ECDGZER508 ECDGZER609 ECDGZER709 ECDGZER809 Engineered Components Company General Instrument matsushita capacitor sec c 2335 1 pf Capacitor dimensions TEXT
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