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Part Manufacturer Description Datasheet BUY
BQ2052SN-A515 Texas Instruments Primary Lithium Gas Gauge W/High-Speed 1-Wire (HDQ) Interface, 3 Prgmable LED Patterns 16-SOIC -20 to 70 visit Texas Instruments
BQ2052SN-A515G4 Texas Instruments Primary Lithium Gas Gauge W/High-Speed 1-Wire (HDQ) Interface, 3 Prgmable LED Patterns 16-SOIC -20 to 70 visit Texas Instruments
THS6022IGQE Texas Instruments DUAL LINE DRIVER, PBGA80, PLASTIC, LGA-80 visit Texas Instruments
THS6022CGQE Texas Instruments DUAL LINE DRIVER, PBGA80, PLASTIC, LGA-80 visit Texas Instruments
THS6032CGQE Texas Instruments DUAL LINE DRIVER, PLGA80, PLASTIC, LGA-80 visit Texas Instruments
THS6022IGQER Texas Instruments DUAL LINE DRIVER, PBGA80, PLASTIC, LGA-80 visit Texas Instruments

land pattern for vsop 60 pins

Catalog Datasheet MFG & Type PDF Document Tags

PHD64

Abstract: land pattern for vsop 8 pins pins), and TQFP (32 through 256 pins), are readily suited for use of this technology. Thinner , = * Samples used for these stresses were preconditioned with 192 hours of 30C/60%RH soak followed , package thermal pad to the thermal land on the PCB. Figure 11. The PCB layout for a 64 pin PowerPADTM , below. The results obtained using the recommended PCB thermal land pattern on the PCB, and with the , Enhanced Package slma002.pdf Figure 12. Typical PCB thermal land and via patterns for use with
Texas Instruments
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25Q80BVAIG

Abstract: 25Q80BVA a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility , . 6 3.1 3.2 3.3 3.4 3.5 3.6 4. 4.1 4.2 4.3 4.4 4.5 5. 6. Pin Configuration SOIC / VSOP 150 / 208 , -mil. 7 Pin Description SOIC, VSOP, WSON, USON & PDIP 300-mil . , ) . 22 Write Enable for Volatile Status Register (50h , . 60 Publication Release Date: Augest 01, 2012 Revision G -3- W25Q80BV 8.1 8.2 8.3 8.4 8.5
Winbond Electronics
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25Q80BVAIG 25Q80BVA WINBOND 25Q80BVSIG 25q80bv USON-8 winbond 25Q80BVAIG
Abstract: (200mil) - 8-pin VSOP (200mil) - 8-land WSON (8x6mm) - 8-land WSON (6x5mm) - 24-ball TFBGA , it is in Dual Output read mode, the SI and SO pins become SIO0 and SIO1 pins for data output. The , ). 40 Figure 21. Chip Erase (CE) Sequence (Command 60 or C7 , FLASH 1. FEATURES GENERAL â'¢ Single Power Supply Operation - 2.7 to 3.6 volt for read, erase, and , protection against program and erase instructions - Additional 512 bit secured OTP for unique identifier Macronix International
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MX25L6406E PM1577

mxic mx25l6406e

Abstract: (200mil) - 8-pin VSOP (200mil) - 8-land WSON (8x6mm) - 8-land WSON (6x5mm) - 24-ball TFBGA , it is in Dual Output read mode, the SI and SO pins become SIO0 and SIO1 pins for data output. The , ). 40 Figure 21. Chip Erase (CE) Sequence (Command 60 or C7 , FLASH 1. FEATURES GENERAL â'¢ Single Power Supply Operation - 2.7 to 3.6 volt for read, erase, and , software protection against program and erase instructions - Additional 512 bit secured OTP for unique
Macronix International
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mxic mx25l6406e

25Q80BVA

Abstract: 25q80bv a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility , . 6 3.1 3.2 3.3 3.4 3.5 3.6 4. 4.1 4.2 4.3 4.4 4.5 5. 6. Pin Configuration SOIC / VSOP 150 / 208 , -mil . 7 Pin Description SOIC, VSOP, WSON, USON & PDIP 300 , ) . 22 Write Enable for Volatile Status Register (50h , . 60 8.1 Absolute Maximum Ratings
Winbond Electronics
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25q80 25Q80bvs 25q80bvsig land pattern for vsop 8 pins winbond* W25Q W25Q80b

25Q16DVSIG

Abstract: 25Q16DVS provides a storage solution for systems with limited space, pins and power. The 25Q series offers , . 6 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 4. 4.1 4.2 4.3 4.4 4.5 5. 6. Pin Configuration SOIC / VSOP 150 , -mil . 7 Pin Description SOIC / VSOP 150/208-mil, WSON 6x5-mm & PDIP 300-mil. 7 Pin , ) . 23 Write Enable for Volatile Status Register (50h , ) . 60 Enable Reset (66h) and Reset (99h
Winbond Electronics
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W25Q16DV 25Q16DVSIG 25Q16DVS W25Q16DVS W25Q16DVSFIG W25Q16DVSNIG 16M-BIT
Abstract: a storage solution for systems with limited space, pins and power. The 25Q series offers , -mil. 7 3.4 Pin Description SOIC / VSOP 150/208-mil, WSON 6x5-mm & PDIP 300 , -mm . 9 3.8 4. Pin Configuration SOIC / VSOP 150 / 208 , ) . 23 7.2.6 Write Enable for Volatile Status Register (50h , ) . 60 ELECTRICAL CHARACTERISTICS Winbond Electronics
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W25Q16CV

25Q16CVSIG

Abstract: w25q16cvssig provides a storage solution for systems with limited space, pins and power. The 25Q series offers , . 6 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 4. 4.1 4.2 4.3 4.4 4.5 5. 6. Pin Configuration SOIC / VSOP 150 , -mil . 7 Pin Description SOIC / VSOP 150/208-mil, WSON 6x5-mm & PDIP 300-mil. 7 Pin , ) . 23 Write Enable for Volatile Status Register (50h , ) . 60 8. ELECTRICAL CHARACTERISTICS
Winbond Electronics
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25Q16CVSIG w25q16cvssig

25q64fvsig

Abstract: WINBOND 25Q64FVSIG provides a storage solution for systems with limited space, pins and power. The 25Q series offers , bidirectional IO0 and IO1, and the /WP and /HOLD pins become IO2 and IO3 respectively. See Figure 3 for the , . 6 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 4. 4.1 4.2 4.3 4.4 4.5 5. 6. Pin Configuration SOIC / VSOP 208 , -mil . 7 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm and PDIP 300-mil . 7 Pin , ) . 25 Write Enable for Volatile Status Register (50h
Winbond Electronics
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W25Q64FV 25q64fvsig WINBOND 25Q64FVSIG 25Q64FVAIG 25q64fv 25Q64FVFIG 64M-BIT
Abstract: a storage solution for systems with limited space, pins and power. The 25Q series offers , -mil. 7 3.4 Pin Description SOIC / VSOP 150/208-mil, WSON 6x5-mm & PDIP 300 , -mm . 9 3.8 4. Pin Configuration SOIC / VSOP 150 / 208 , ) . 23 7.2.6 Write Enable for Volatile Status Register (50h , ) . 60 ELECTRICAL CHARACTERISTICS Winbond Electronics
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W25Q64FV

Abstract: WINBOND 25Q64FVSIG a storage solution for systems with limited space, pins and power. The 25Q series offers , the /WP and /HOLD pins become IO2 and IO3 respectively. See Figure 3 for the device operation modes , . 6 3.1 Pin Configuration SOIC / VSOP 208 , -mil. 7 3.4 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm and PDIP 300-mil . , ) . 25 6.2.7 Write Enable for Volatile Status Register (50h
Winbond Electronics
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W25Q64FV

Abstract: 25q64fvsig provides a storage solution for systems with limited space, pins and power. The 25Q series offers , W25Q64FV default for Quad Enabled part numbers with ordering option "IQ"), the Quad IO2 and IO3 pins are , / VSOP 208-mil . 6 Pad , -mil. 7 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm and PDIP 300-mil . 7 Pin , ) . 26 Write Enable for Volatile Status Register (50h
Winbond Electronics
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winbond w25q64fv 25q64f W25Q64FVSSIG W 25Q64FVSIG 25Q64FVS 25q64fva

25q64fvsig

Abstract: 25q64fv provides a storage solution for systems with limited space, pins and power. The 25Q series offers , . 6 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 4. 4.1 4.2 4.3 4.4 4.5 5. 6. Pin Configuration SOIC / VSOP 208 , -mil . 7 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm and PDIP 300-mil . 7 Pin , ) . 25 Write Enable for Volatile Status Register (50h , ). 60 Read JEDEC ID (9Fh
Winbond Electronics
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25q64 W25Q64FVSSIQ W25Q64 W25Q64f 0030f w25q64fvs

MX25L6406E

Abstract: MX25L6406 -pin VSOP (200mil) - 8-land WSON (8x6mm) - 24-ball TFBGA (6x8mm, 4x6 ball array) - 24-ball TFBGA (6x8mm , SIO0 and SIO1 pins for data output. The device provides sequential read operation on whole chip. After , ). 40 Figure 20. Chip Erase (CE) Sequence (Command 60 or C7 , FLASH FEATURES GENERAL · Single Power Supply Operation - 2.7 to 3.6 volt for read, erase, and program , be software protection against program and erase instructions - Additional 512 bit secured OTP for
Macronix International
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MX25L6406 25l6406e MX25L6406EM2I-12G MX25L6406EM MX25L6406EM2 data mx25L6406E

W25Q128FV

Abstract: 25Q128fv IO1, and the /WP and /HOLD pins become IO2 and IO3 respectively. See Figure 3 for the device operation , / VSOP 208-mil . 6 Pad , Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm . 6 Pin , ) . 29 Write Enable for Volatile Status Register (50h , ) . 60 Read Manufacturer / Device ID (90h
Winbond Electronics
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W25Q128FV 25Q128fv winbond 25q128fvsg 25q128fvsg 25Q128 25Q128FVFG 128M-BIT
Abstract: the /WP and /HOLD pins become IO2 and IO3 respectively. See Figure 3 for the device operation modes , one of the four data I/O pins. For the SOIC-16 package, W25Q128FV provides a dedicated /RESET pin in , . 6 3.1 Pin Configuration SOIC / VSOP 208 , -mm. 6 3.3 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6 , ) . 30 8.2.2 Write Enable for Volatile Status Register (50h Winbond Electronics
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Abstract: bidirectional IO0 and IO1, and the /WP and /HOLD pins become IO2 and IO3 respectively. See Figure 3 for the , will be disabled, the pin will become one of the four data I/O pins. For the SOIC-16 package , -mm . 6 3.3 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6 , -mil . 9 3.9 4. Pin Configuration SOIC 208-mil / VSOP 208 , ) . 29 8.2.2 Write Enable for Volatile Status Register (50h Winbond Electronics
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W25Q32FV 32M-BIT

w25q128

Abstract: winbond 25q128fvsg IO1, and the /WP and /HOLD pins become IO2 and IO3 respectively. See Figure 3 for the device operation , . 6 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4. 4.1 4.2 4.3 4.4 4.5 4.6 5. 6. Pin Configuration SOIC / VSOP , Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm . 6 Pin , ) . 28 Write Enable for Volatile Status Register (50h , ) . 86 8-Pin VSOP 208-mil (Package Code T
Winbond Electronics
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w25q128 25Q128F W25Q128F 25Q128FVSQ W25Q128FVFIG W25Q128FVSIG

winbond 25q128fvsg

Abstract: 25Q128fv be disabled, the pin will become one of the four data I/O pins. For the SOIC-16 package, W25Q128FV , . 6 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4. 4.1 4.2 4.3 4.4 4.5 4.6 5. 6. Pin Configuration SOIC / VSOP , Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm . 6 Pin , ) . 28 Write Enable for Volatile Status Register (50h , ) . 86 8-Pin VSOP 208-mil (Package Code T
Winbond Electronics
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w25q128fvs winbond 25q128fviq IO320 25q12 380KB AN816

W25Q32FV

Abstract: 25Q32FV , the pin will become one of the four data I/O pins. For the SOIC-16 package, W25Q32FV provides a , (factory default for Quad Enabled part numbers with ordering option "IQ"), the Quad IO2 and IO3 pins are , -mil / VSOP 208-mil . 6 Pad Configuration WSON , Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm . 7 Pin , ) . 30 Write Enable for Volatile Status Register (50h
Winbond Electronics
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25Q32FV 25q32fvsig WINBOND 25Q32FVSIG 25Q32F W25Q32FVSSIG W25Q32F
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