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Part Manufacturer Description Datasheet BUY
EL5825ILZ Intersil Corporation SPECIALTY ANALOG CIRCUIT, PQCC24, ROHS COMPLIANT, MO-220, QFN-24 visit Intersil
EL9111IL-T7 Intersil Corporation TRIPLE LINE RECEIVER, PQCC28, MO-220, QFN-28 visit Intersil
EL9202IL-T7 Intersil Corporation 1 CHANNEL, VIDEO AMPLIFIER, QCC24, MO-220, QFN-24 visit Intersil
EL5825ILZ-T13 Intersil Corporation SPECIALTY ANALOG CIRCUIT, PQCC24, ROHS COMPLIANT, MO-220, QFN-24 visit Intersil
EL9202ILZ Intersil Corporation 1 CHANNEL, VIDEO AMPLIFIER, QCC24, ROHS COMPLIANT, MO-220, QFN-24 visit Intersil
EL1517ILZ-T7 Intersil Corporation DUAL LINE DRIVER, QCC16, MO-220, QFN-16 visit Intersil

jedec package MO-220

Catalog Datasheet MFG & Type PDF Document Tags

IPC-7525

Abstract: jedec package MO-220 -Lead Molded Leadless Package (MLP), JEDEC MO-220, 4mm Square FIGURE 4. Typical MLP Quad Package Marketing , compliant to JEDEC Outline MO-220 and JEDEC Outline MO-226, respectively. FIGURE 1. Exposed Pad MLP , MLP08H 8LD, MLP, DUAL, NON-JEDEC, 3mm X 1.9mm, SINGLE TIED DAP MLP08I 10LD, MLP, JEDEC MO-220 , , JEDEC MO-229, 4mm X 3mm MLP12A 12LD, MLP, QUAD, JEDEC MO-220, 4mm SQUARE DUAL DIE MLP12B 12LD, MLP, QUAD, JEDEC MO-220, 4mm SQUARE MLP12C 14LD, DQFN, JEDEC MO-241, 2.mm X 3.0mm MLP14A
Fairchild Semiconductor
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IPC-7525 jedec package MO-220 MO-229 footprint MLP06J JEDEC Drawing MO-220 7mm IPC-9701 MLP56A MO-220 MLP64A MLP64B AN-5067

SAA7136E

Abstract: saa7136 flat package; no leads; 20 terminals; body 5 x 5 x 0.85 mm MO-220 (JEDEC) M3D700 SOT617 , flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm M3D738 SOT663 MO-220 (JEDEC , quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm MO-220 (JEDEC) M3D823 M3D754 , package; no leads; 64 terminals; body 9 x 9 x 0.85 mm MO-220 (JEDEC) SOT96-1 SO8 plastic small , -1 DIP24 plastic dual in-line package; 24 leads (600 mil) SC-509-24 (EIAJ) MO-015 (JEDEC) 051G02
Philips Semiconductors
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SAA7131E SAA7136E SAA7134 SAA7133 SAA7135 saa7136 TO-220F JEDEC hso16 SAA7130H SAA7134H SAA7133H SAA7135H

SmD TRANSISTOR a42

Abstract: TRANSISTOR BC 136 Data (Continued) Body Size Package Type Shrink Small Outline Package (SSOP) Mkt Dwg JEDEC , Package Dimensional Data (Continued) Body Size Package Type Transistor Outline (TO-220) Mkt Dwg T02D JEDEC Spec Wide Nom. (mils) TO-220-AA 420 Long Nom. (mils) 185 Lead Frame , distributor. TABLE 3. Plastic Package Thermal Data Typical Thermal Data Package Type Mkt Dwg JEDEC , ) 405 900 M14B Shrink Small Outline Package, JEDEC (SSOP) 900 TO-236-AB M14A Small
National Semiconductor
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SmD TRANSISTOR a42 TRANSISTOR BC 136 TRANSISTOR BC 157 transistor BC 945 TRANSISTOR BC 187 TRANSISTOR BC 413 MA04A MA05C MA05A MA05B MO-178-AA MA08C

transistor RJp 30

Abstract: mo-229 pad layout device. To locate package variants, use the jedec Package Outline column to locate the corresponding , (Common Package Designator) JEDEC Package Outline Quantity and Type of Terminals RJA High K , ) RJC RJP RJT (°C/W) MO-220 VJJD Allegro Package Code Plastic Leadless Package with , mm 48-Contact 24 ­ 2 [p] Quantity and Type of Terminals MO-220 WGGC Package Type (Common Package Designator) JEDEC Package Outline RJA EW Plastic Leadless Package with
Allegro MicroSystems
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JESD51-7 JESD51-9 JESD51-10 JESD51-5 transistor RJp 30 mo-229 pad layout transistor RJp RJP PRODUCT jedec package MO-220 QFN 20 MO-220-wgge TS-001

cu50

Abstract: jedec MS-012-Ab 4 Body Size Package Type TO-220 (Continued) Mkt Dwg JEDEC Spec Wide Nom. (mils , Package Type SSOP (Continued) Mkt Dwg JEDEC Spec Wide Nom. (mils) Long Nom. (mils , (Continued) Body Size Package Type MDIP (Continued) Mkt Dwg JEDEC Spec Wide Nom. (mils , Plastic Quad Flat Package (PQFP) Mkt Dwg JEDEC Spec Wide Nom. (mils) Long Nom. (mils , 6 Body Size Package Type PQFP (Continued) Mkt Dwg JEDEC Spec Wide Nom. (mils
National Semiconductor
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cu50 jedec MS-012-Ab MS-026-bcd transistor BC 185 TA11B TF11B MS011798

T03A

Abstract: TO-202 transistor Package Type Transistor Outline (TO-220) Mkt Dwg JEDEC Spec Wide Nom. (mils) Long Nom , Package Type Small Outline Transistor (SOT-223) Mkt Dwg JEDEC Spec Wide Nom. (mils) Long , Package (SSOP) Mkt Dwg JEDEC Spec Wide Nom. (mils) Long Nom. (mils) Lead Frame Mt'l , 199 122 www.national.com 2 Body Size Package Type Mkt Dwg JEDEC Spec Wide Nom , ) www.national.com 4 Body Size Package Type Plastic Leaded Chip Carrier (PLCC) Mkt Dwg JEDEC Spec
National Semiconductor
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T03A TO-202 transistor mkt 344 MTL 728 V84A TRANSISTOR BC 530

jedec package MO-220

Abstract: MO-220 VERSION NOT TO SCALE TITLE: THERMALLY ENHANCED QUAD FLAT NON-LEADED PACKAGE (QFN) 44 TERMINAL, 0.5 PITCH (7X7X1) DOCUMENT NO: 98ARH99037A REV: C 10 MAR 2006 CASE NUMBER: 1313-03 STANDARD: JEDEC MO-220 , : 98ARH99037A REV: C 10 MAR 2006 CASE NUMBER: 1313-03 STANDARD: JEDEC MO-220 VKKD-1 â'¢DETAIL T DETAIL , : C 10 MAR 2006 CASE NUMBER: 1313-03 STANDARD: JEDEC MO-220 VKKD-1 NOTES: 1. ALL DIMENSIONS , : C 10 MAR 2006 CASE NUMBER: 1313-03 STANDARD: JEDEC MO-220 VKKD-1
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jedec package MO-220 for qfn JEDEC MO-220 jedec package MO-220 vkkd1 jedec package MO-220 QFN-44 jedec package MO-220 vkkd jedec package MO-220 QFN 44 5M-1994

transistor BC 458

Abstract: transistor a42 Package Dimensional Data Body Size Package Type Metal Leaded Chip Carrier (MLDCC) Mkt Dwg JEDEC , KOVAR 100 1323 1323 4 Body Size Package Type CPGA (Continued) Mkt Dwg JEDEC Spec , Data Typical Thermal Data Package Type Mkt Dwg JEDEC Spec Die Size (Sq mils) JA(°C/W , Package Type Mkt Dwg JEDEC Spec Die Size (Sq mils) JA(°C/W) (Note 1) Air Flow - LFM , (Continued) Typical Thermal Data Package Type Mkt Dwg JEDEC Spec Die Size (Sq mils) JA(°C/W
National Semiconductor
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transistor BC 458 transistor a42 MO-003 transistor Bc 540 ua109a UA65A AA84A AA84B ALE128A AUA128A AFB13

transistor BC 458

Abstract: transistor BC 945 Package Dimensional Data (Continued) Body Size Package Type CPGA (Continued) Mkt Dwg JEDEC , Dual-In-Line Package (SB) Mkt Dwg JEDEC Spec Die Size (Sq mils) JA(°C/W) (Note 1) Air Flow - , Data Package Type Mkt Dwg JEDEC Spec Die Size (Sq mils) JA(°C/W) (Note 1) Air Flow - , 8 Typical Thermal Data Package Type Mkt Dwg JEDEC Spec Die Size (Sq mils) JA(°C , 6 10 Typical Thermal Data Package Type Cerquad, EIAJ Mkt Dwg JEDEC Spec JA(°C/W
National Semiconductor
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ac 1084 transistor bc 577 MS-015-AB Transistor BC 585 DA36A DA32C MS011795 AA44A AA68A MS-015-AA

jedec footprint MO-220 VHHD-2

Abstract: qfn 44 PACKAGE footprint , these are as follows. WOLFSON TYPE A The Wolfson Type A package is based on the JEDEC MO-220 , A QFN Package WOLFSON TYPE C The Type C package is based on the JEDEC MO-220 specification with , VISIBLE ON PACKAGE SIDE WALL DUE TO HALF ETCHING OF LEADFRAME. 2. FALLS WITHIN JEDEC, MO-220 WITH THE , VISIBLE ON PACKAGE SIDE WALL DUE TO HALF ETCHING OF LEADFRAME. 2. FALLS WITHIN JEDEC, MO-220 WITH THE , 0.10 JEDEC, MO-220, VARIATION VGGD-2. NOTES: 1. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS
Wolfson Microelectronics
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jedec footprint MO-220 VHHD-2 qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN_0118

jedec package MO-220

Abstract: jedec package MO-220 VKKD-4 : JEDEC MO-220 VKKD-4 DETAIL M PREFERED PIN 1 BACKSIDE IDENTIFIER A DETAIL G VIEW ROTATED 90- CW Â , : 98ARE10740D REV: 0 15 MAY 2008 CASE NUMBER: 2030-01 STANDARD: JEDEC MO-220 VKKD-4 NOTES: 1 , JEDEC DESIGNATOR FOR THIS PACKAGE IS: HF-PQFN. 4-\ COPLANARITY APPLIES TO LEADS, CORNER LEADS, AND DIE , STANDARD: JEDEC MO-220 VKKD-4 , PRINT VERSION NOT TO SCALE TITLE: THERMALLY ENHANCED QUAD ELAT NON-LEADED PACKAGE (QFN) 48 TERMINAL
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jedec package MO-220 VKKD-4 jedec package MO-220 vkkd4 QFN-48 qfn48 jedec package MO-220-VKKD-4 vkkd

jedec package MO-220

Abstract: jedec package MO-220 VGGD-1 QFN : JEDEC MO-220 VGGD-1 20X O.IOOJ 0.015 0.217 0.137 (0.25) 0.217 0.137 DETAIL N CORNER CONFIGURATION , : 1308-03 STANDARD: JEDEC MO-220 VGGD-1 NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 3. THE COMPLETE JEDEC DESIGNATOR FOR THIS PACKAGE IS: HF-PQFN , : E 17 APR 2006 CASE NUMBER: 1308-03 STANDARD: JEDEC MO-220 VGGD-1 , PRINT VERSION NOT TO SCALE TITLE: THERMALLY ENHANCED QUAD FLAT NON-LEADED PACKAGE (QFN) 20 TERMINAL
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98ARH98438A jedec package MO-220 VGGD-1 QFN

jedec package MO-220 QFN-32

Abstract: jedec package MO-220 ELAT NON-LEADED PACKAGE (QFN) 32 TERMINAL, 0.5 PITCH (5X5X1) DOCUMENT NO: 98ARE10739D REV: 0 15 MAY 2008 CASE NUMBER: 2029-01 STANDARD: JEDEC MO-220 VHHD-5 ù 0.60 0.24 I 0.60 0.24 (0.25) DETAIL , : THERMALLY ENHANCED QUAD FLAT NON-LEADED PACKAGE (QFN) 32 TERMINAL, 0.5 PITCH (5X5X1) DOCUMENT NO: 98ARE10739D REV: 0 15 MAY 2008 CASE NUMBER: 2029-01 STANDARD: JEDEC MO-220 VHHD-5 NOTES: 1. ALL , MAY 2008 CASE NUMBER: 2029-01 STANDARD: JEDEC MO-220 VHHD-5
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jedec package MO-220 QFN-32 jedec package MO-220-vhhd-5

jedec package MO-220 QFN-32

Abstract: jedec package MO-220 ELAT NON-LEADED PACKAGE (QFN), 32 TERMINAL, 0.5 PITCH (5 X 5 X 1), 3.6 X 3.6 EP, CASE OUTLINE DOCUMENT NO: 98ASA10846D REV: 0 26 JUN 2008 CASE NUMBER: 2041-01 STANDARD: JEDEC MO-220 VHHD-4 32X , CASE NUMBER: 2041-01 STANDARD: JEDEC MO-220 VHHD-4 NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 3. THE COMPLETE JEDEC DESIGNATOR FOR THIS PACKAGE IS , OUTLINE PRINT VERSION NOT TO SCALE TITLE: THERMALLY ENHANCED QUAD FLAT NON-LEADED PACKAGE (QFN), 32
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jedec package MO-220 16 pin jedec package MO-220 vhhd4 24 terminal jedec package MO-220 jedec MO-220 QFN 16 JEDEC QFN case outline

jedec package MO-220

Abstract: jedec package MO-220-VKKD-2 PACKAGE (QFN), 48 TERMINAL, 0.5 PITCH (7X7X1), PUNCH SINGULATION DOCUMENT NO: 98ARE10709D REV: 0 09 MAY 2007 CASE NUMBER: 1958-01 STANDARD: JEDEC MO-220 VKKD-2 L._12' 0' //|0-1|C 1.0 1.00 0.8 0.75 I , STANDARD: JEDEC MO-220 VKKD-2 NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 3. THE COMPLETE JEDEC DESIGNATOR FOR THIS PACKAGE IS: HF-PQFN. 4. MOLD , : 98ARE10709D REV: 0 09 MAY 2007 CASE NUMBER: 1958-01 STANDARD: JEDEC MO-220 VKKD-2
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jedec package MO-220-VKKD-2 QFN "100 pin" PACKAGE jedec package MO-220 vkkd2 qfn 48 MO-220 qfn 24

JEDEC Drawing MO-220 qfn

Abstract: 32 pins qfn 5x5 footprint Type A package is based on the JEDEC MO-220 specification with a slight modification on the pad design , based on the JEDEC MO-220 specification with pads that are extended up the side of the package. After , VISIBLE ON PACKAGE SIDE WALL DUE TO HALF ETCHING OF LEADFRAME. 2. FALLS WITHIN JEDEC, MO-220 WITH THE , JEDEC, MO-220, VARIATION VKKD-2 NOTES: 1. DIMENSION b APPLIED TO METALLIZED TERMINAL AND IS MEASURED , 0.15 0.10 0.10 JEDEC, MO-220, VARIATION VKKD-2 NOTES: 1. DIMENSION b APPLIED TO METALLIZED
Wolfson Microelectronics
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JEDEC Drawing MO-220 qfn QFN footprint QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint MO-220 7x7 0.4 pitch

jedec package MO-220 QFN-40

Abstract: jedec package MO-220 0.4 pitch FLAT NON-LEADED PACKAGE (QFN) 40 TERMINAL, 0.4 PITCH (5X5X1) 3.6 X 3.6 EP, CASE OUTLINE DOCUMENT NO: 98ASA10776D REV: 0 18 OCT 2006 CASE NUMBER: 1926-01 STANDARD: JEDEC MO-220 VHHE-1 G G G G G 40X 0.100 , DOCUMENT NO: 98ASA10776D REV: 0 18 OCT 2006 CASE NUMBER: 1926-01 STANDARD: JEDEC MO-220 VHHE , . THE COMPLETE JEDEC DESIGNATOR FOR THIS PACKAGE IS: HF-PQFN. 4. RADIUS ON TERMINAL IS OPTIONAL /5 , STANDARD: JEDEC M0-220 VHHE-1 18 OCT 2006
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jedec package MO-220 QFN-40 jedec package MO-220 0.4 pitch jedec MO-220 qfn-40 jedec package MO-220 40 PIN jedec MO-220 vhhe-1 QFN-40 M0-220

jedec package MO-220 VKKD-2

Abstract: JEDEC MO-220 NUMBER: 2008-01 STANDARD: JEDEC MO-220 VKKD-2 0.1 c 0.9 0.8 0.7 0.6 T 0.05 J 0.00 io.2) 0.08 I C /4 , 15 FER 2008 CASE NUMBER: 2008-01 STANDARD: JEDEC MO-220 VERD-2 NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 3. THE COMPLETE JEDEC DESIGNATOR EOR THIS PACKAGE IS: HE-RQRN. HX COPLANARITY APPLIES TO LEADS AND DIE ATTACH PAD. S\ THE PIN #1 , DOCUMENT NO: 98ASA10825D REM: 0 13 FEB 2008 CASE NUMBER: 2008-01 STANDARD: JEDEC M0-220 VRRD-2
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jedec package MO-220 VKKD-2 HO-25

jedec package MO-220

Abstract: MO-220 BOTTOM VIEW THERMALLY ENCHANCED, VERY THIN, FINE PITCH QUAD FLAT / NO LEAD PLASTIC PACKAGE (SPECIAL JEDEC MO-220, VNND-3, MODIFIED) Reference Doc.: Integrated Circuit Systems, Inc. TITLE: PACKAGE DIMENSIONS - Thermally JEDEC Publication 95, Modified MO-220 Prepared by: Approved: Enhanced Very Thin, Fine Pitch, Quad Flat / No Lead Plastic Package W. Anderson A.Silfies Doc. #
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Thin Quad flat package mo-220

PD-1503

Abstract: pd1503 PLASTIC IC PACKAGING - Reference Pericom IC Plastic Package Mechanicals and *Thermal Characteristics (for SaRonix-eCera, see datasheet) Pericom Package Pin Code Type Count JEDEC PUB 95 Pin , SaRonix-eCera, see datasheet) Pericom Package Pin Code Type Count JEDEC PUB 95 Pin Pitch MILS MM , datasheet) Pericom Package Pin Code Type Count JEDEC PUB 95 Pin Pitch Length Width , Package Specifications & Thermal Data See Pages 6-8. PLASTIC IC PACKAGING - Reference BQSOP LQFP
SaRonix
Original
PD-2078 PD-1503 pd1503 PD-2028 pd 2028 PD-2026 MA128 MA208 FD100 FD128 MA160 NJ160
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