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Part Manufacturer Description Datasheet BUY
ISL6271ACR Intersil Corporation 0.8A SWITCHING REGULATOR, PQCC20, 4 X 4 MM, PLASTIC, MO-220-VGGD, QFN-20 visit Intersil
ISL6420IRZ Intersil Corporation 0.7A SWITCHING CONTROLLER, 1400kHz SWITCHING FREQ-MAX, PQCC20, 4 X 4 MM, ROHS COMPLIANT, PLASTIC, MO-220-VGGD, QFN-20 visit Intersil
ISL6420IR Intersil Corporation 0.7A SWITCHING CONTROLLER, 1400kHz SWITCHING FREQ-MAX, PQCC20, 4 X 4 MM, PLASTIC, MO-220-VGGD, QFN-20 visit Intersil
ISL6563IRZ Intersil Corporation SWITCHING CONTROLLER, 255 kHz SWITCHING FREQ-MAX, PQCC24, 4 X 4 MM, ROHS COMPLIANT, PLASTIC, MO-220-VGGD-2, QFN-24 visit Intersil
ISL6420IR-T Intersil Corporation 0.7A SWITCHING CONTROLLER, 1400kHz SWITCHING FREQ-MAX, PQCC20, 4 X 4 MM, PLASTIC, MO-220-VGGD, QFN-20 visit Intersil
ISL6563IRZ-T Intersil Corporation SWITCHING CONTROLLER, 255 kHz SWITCHING FREQ-MAX, PQCC24, 4 X 4 MM, ROHS COMPLIANT, PLASTIC, MO-220-VGGD-2, QFN-24 visit Intersil

jedec package MO-220 VGGD-1 QFN

Catalog Datasheet MFG & Type PDF Document Tags

jedec package MO-220

Abstract: jedec package MO-220 VGGD-1 QFN : JEDEC MO-220 VGGD-1 20X O.IOOJ 0.015 0.217 0.137 (0.25) 0.217 0.137 DETAIL N CORNER CONFIGURATION , PACKAGE (QFN) 20 TERMINAL, 0.5 PITCH (4X4X1) DOCUMENT NO: 98ARH98438A REV: E 17 APR 2006 CASE NUMBER: 1308-03 STANDARD: JEDEC MO-220 VGGD-1 NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING , : E 17 APR 2006 CASE NUMBER: 1308-03 STANDARD: JEDEC MO-220 VGGD-1 , PRINT VERSION NOT TO SCALE TITLE: THERMALLY ENHANCED QUAD FLAT NON-LEADED PACKAGE (QFN) 20 TERMINAL
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MO-220 jedec package MO-220 jedec package MO-220 VGGD-1 QFN jedec package MO-220 QFN 20 jedec package MO-220 for qfn JEDEC MO-220 5M-1994

jedec footprint MO-220 VHHD-2

Abstract: qfn 44 PACKAGE footprint A QFN Package WOLFSON TYPE C The Type C package is based on the JEDEC MO-220 specification with , 64 C Figure 1 QFN Package Range WOLFSON MICROELECTRONICS plc To receive regular email , , these are as follows. WOLFSON TYPE A The Wolfson Type A package is based on the JEDEC MO-220 , 0.10 JEDEC, MO-220, VARIATION VGGD-2. NOTES: 1. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS , JEDEC, MO-220, VARIATION VHHD-1 NOTES: 1. DIMENSION b APPLIED TO METALLIZED TERMINAL AND IS MEASURED
Wolfson Microelectronics
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jedec footprint MO-220 VHHD-2 qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN_0118
Abstract: : 1307-01 STANDARD: JEDEC M0-220 VGGD-2 NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET , ENHANCED QUAD FLAT NON-LEADED PACKAGE (QFN) 24 TERMINAL, 0.5 PITCH (4X4X1) DOCUMENT NO: 98ARH99033A REV: C 06 SEP 2005 CASE NUMBER: 1307-01 STANDARD: JEDEC M0-220 VGGD-2 24X 0.0653 0.015 DETAIL N , : THERMALLY ENHANCED QUAD FLAT NON-LEADED PACKAGE (QFN) 24 TERMINAL, 0.5 PITCH (4X4X1) DOCUMENT NO: 98ARH99033A REV: C 06 SEP 2005 CASE NUMBER: 1307-01 STANDARD: JEDEC M0-220 VGGD-2 DETAIL T DETAIL S -
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13-B- M0-220 98ARH99033
Abstract: ) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHA3801-QDG L-Band Low Noise Amplifier Package outline (1) Units : mm From the standard : JEDEC MO-220 [VGGD] Matt tin, Lead free (Green) Matt tin, Lead Free Units : From the standard : (Green) mm JEDEC MO-220 (VGGD) 25- GND 12345678 , and handling recommendations for the UMS package products. Ordering Information QFN 4x4 RoHS , leadless package Description The CHA3801-QDG is an L-Band LNA monolithic circuit including an active United Monolithic Semiconductors
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A3801 24L-QFN4 DSCHA3801-QDG3119 AN0019 AN0020 CHA3801-QDG/XY
Abstract: STANDARD: JEDEC M0-220 VGGD-6 DETAIL M PIN 1 BACKSIDE IDENTIFIER ©FREESCALE SEMICONDUCTOR, INC. ALL , NON-LEADED PACKAGE (QFN) 24 TERMINAL, 0.5 PITCH (4X4X1) DOCUMENT NO: 98ARE10714D REV: 0 23 JUL 2007 CASE NUMBER: 1969-01 STANDARD: JEDEC M0-220 VGGD-6 NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 3. THE COMPLETE JEDEC DESIGNATOR FOR THIS PACKAGE IS , OUTLINE PRINT VERSION NOT TO SCALE TITLE: THERMALLY ENHANCED QUAD FLAT NON-LEADED PACKAGE (QFN) 24 -
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qfn24

Abstract: QFN-24 STANDARD: JEDEC M0-220 VGGD-8 0.3 0.2 DETAIL M PIN 1 BACKSIDE IDENTIFIER © FREESCALE SEMICONDUCTOR, INC , FLAT NON-LEADED PACKAGE (QFN) 24 TERMINAL, 0.5 PITCH (4X4X1) DOCUMENT NO: 98ARL10605D REV: 0 08 SEP 2006 CASE NUMBER: 1897-01 STANDARD: JEDEC M0-220 VGGD-8 NOTES: 1. ALL DIMENSIONS ARE IN , OUTLINE PRINT VERSION NOT TO SCALE TITLE: THERMALLY ENHANCED QUAD FLAT NON-LEADED PACKAGE (QFN) 24 , TITLE: THERMALLY ENHANCED QUAD FLAT NON-LEADED PACKAGE (QFN) 24 TERMINAL, 0.5 PITCH (4X4X1) DOCUMENT NO
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qfn24 QFN-24
Abstract: a compact 4 x 4 x 0.85 mm 24pin Quad Flat No-Lead (QFN) package. The Si4749 is feature-rich , clock AECQ-100 qualified - â'"40 to 85 ºC operation 24-pin 4 x 4 mm QFN package Pb-free/RoHS , /INT 24 23 22 21 20 Package Information GPO3 Pin Assignments 19 FMI 1 , Solid State Outline MO-220, Variation VGGD-8. Recommended card reflow profile is per the JEDEC/IPC , 0.18 0.25 0.30 c 0.19 0.24 0.29 D D2 2.10 2.20 Min Nom Max 2.00 Silicon Laboratories
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J-STD-020C

jedec mo-220-vggd-10

Abstract: jedec package MO-220 Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package (QFN) Micro Lead Frame Plastic Package (MLFP) L16.4x4A 16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220 , 4 3 P - - 0.60 9 - - 12 9 Rev. 2 3/06 NOTES: 1. Dimensioning , the terminal tip. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Dimensions D2
Intersil
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TB389 jedec mo-220-vggd-10 jedec package MO-220-VGGD-10 MO-220-VGGD-10

Si4749

Abstract: SI474 -pin 4 x 4 mm QFN package - Pb-free/RoHS compliant Application OEM car audio systems After-market car , Assignments GPO2/INT Package Information GPO1 24 FMI 1 RFGND 2 NC 3 CTUNE 4 GND 5 NC 6 7 RST 23 , status and group data. The Si4749 is offered in a compact 4 x 4 x 0.85 mm 24-pin Quad Flat No-Lead (QFN) package. *Note: The term "RDS" will be used to mean "RDS/ RDBS" throughout this document. Features - , SCLK GND PAD 10 SDIO 11 RCLK Symbol Min A A1 b c D D2 e f E Notes: 1. 2. 3. 4. 5. 2.00 0.80
Silicon Laboratories
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Si4749 SI474 tmc rds receiver GPIO23

Si4313

Abstract: applications of blocking oscillator XIN Pin Package 16 NC 2 RX 4 7 8 9 10 NC GPIO_0 GPIO_1 GPIO_2 VDR , Y14.5M-1994. 3. This drawing conforms to JEDEC Solid State Outline MO-220, variation VGGD-8. 4 , range Integrated voltage regulators Frequency hopping capability On-chip crystal tuning 20-pin QFN package Low BOM Single capacitor matching network Power-On-Reset (POR) Single-ended antenna , Regulator ON (Register values retained) and Main Digital Regulator OFF - 1 - µA - 18.5
Silicon Laboratories
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Si4313 applications of blocking oscillator blocking oscillator applications 4313-B1 J-STD020C
Abstract: Package outline (1) Matt tin, Lead Free Units : From the standard : (Green) mm JEDEC MO-220 , lithography. The chip is delivered in a 24 Leads RoHS compliant QFN 4x4 package. Functional Block Diagram , QFN Pin-out description Note that itâ'™s specified for each Pi, with i =1, 2, 3, 4. By design the , obtained with the chip in QFN package attached on the recommended boards (ref. 97298) described in the , Frequency in QFN package plans (RF - OUT1 path) S21 dB 0 -5 -10 insertion loss OUT1 ON -15 -20 United Monolithic Semiconductors
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CHS2411-QDG 23-26GH CHS2412-QDG S2411 0525G 24L-QFN
Abstract: supplied in RoHS compliant SMD package. UMS A4105 YYWW11 1 Main Features 1 Broadband , . Max. (W) 0,2 Pdiss. Max. (W) 1,2 Example of QFN 16L 3x3 back-side view, temperature , CHA4105-QDG 2-4GHz Driver Package outline (1) Matt tin. Lead Free Units : From the standard : (Green) mm JEDEC MO-220 (VGGD) 25- GND 12345678910- Nc Nc Nc RF in Nc Nc Nc Nc Gnd(2 , VNc (1) The package outline drawing included to this data-sheet is given for indication. Refer United Monolithic Semiconductors
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DSCH4105-QDG0329 AN0017 CHA4105-QDG/XY

CHA4105-QDG

Abstract: QFN PACKAGE Junction to PCB thermal resistance . Max. (W) 1,2 Example of QFN 16L 3x3 back-side view, temperature reference point (Tcase , 2-4GHz Driver Package outline (1) Matt tin. Lead Free Units : From the standard : (Green) mm JEDEC MO-220 (VGGD) 25- GND 12345678910- Nc Nc Nc RF in Nc Nc Nc Nc Gnd(2) Nc , Information QFN 4x4 RoHS compliant package: CHA4105-QDG/XY Stick: XY = 20 Tape & reel: XY = 21 , CHA4105-QDG RoHS COMPLIANT 2-4GHz Driver GaAs Monolithic Microwave IC in SMD leadless package
United Monolithic Semiconductors
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QFN PACKAGE Junction to PCB thermal resistance 9140-1

JEDEC Drawing MO-220 qfn 40

Abstract: AN0017 are obtained assuming that the QFN device is cooled down only by conduction through the package , 0,6 0,4 0,3 0,2 Pdiss. Max. (W) 0,1 Pdiss. Max. (W) 0,5 Example of QFN 16L 3x3 , CHR3694-QDG 37-40GHz Down Converter Package outline CHR3694-QDG (1) R3694 Matt tin, Lead Free (Green) 1- Nc 13- Gnd Units mm 2- Gnd 14- Gnd From the standard JEDEC , CHR3694-QDG 37-40GHz Down Converter Package outline CHR3794-QDG (1) R3794 Matt tin, Lead Free
United Monolithic Semiconductors
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JEDEC Drawing MO-220 qfn 40 QFN 4X4 37-40GH DSCHR3694-QDG CHR3694-QDG/XY CHR3794-QDG/XY DSCHA3694-QDG9077
Abstract: CHR3694-QDG 37-40GHz Down Converter Package outline CHR3694-QDG (1) R3694 Matt Free tin, Lead (Green) 1- Nc 13- Gnd Units mm 2- Gnd 14- Gnd From the standard JEDEC , CHR3694-QDG 37-40GHz Down Converter Package outline CHR3794-QDG (1) R3794 Matt tin, Lead Free Units Nc 13- Gnd mm 2- Gnd 14- Gnd JEDEC MO-220 3- Gnd 15- LO , (1) The package outline drawing included to this data-sheet is given for indication. Refer to the United Monolithic Semiconductors
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DSCHR3694-QDG1192

AN0017

Abstract: MO-220 Converter Package outline CHR3694-QDG (1) R3694 Matt tin, Lead Free (Green) 1- Nc 13- Gnd Units mm 2- Gnd 14- Gnd From the standard JEDEC MO-220 3- Gnd 15 , Converter Package outline CHR3794-QDG (1) R3794 Matt tin, Lead Free (Green) 1- Nc 13- Gnd Units mm 2- Gnd 14- Gnd From the standard JEDEC MO-220 3- Gnd 15 , - Q 11- VGX 23- Nc 12- Nc 24- Nc 25- (1) The package outline drawing
United Monolithic Semiconductors
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Abstract: performance has been obtained with the chip in QFN package mounted on the recommended boards (ref. 95541 & , section are obtained assuming that the QFN device is cooled down only by conduction through the package , : +33 (0) 1 69 86 34 34 CHR2411-QDG 22-24.5GHz RX Multifunction Package outline (1) Matt tin, Lead Free Units : From the standard : (Green) mm JEDEC MO-220 (VGGD) 25- GND 12345678 , Multifunction External Components and bias configuration (recommended) (1) The package outline drawing United Monolithic Semiconductors
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R2411 CHR2411-QDG3116 CHR2411-QDG/XY

RO-4003

Abstract: AN0017 are obtained assuming that the QFN device is cooled down only by conduction through the package , Tcase 1.2 1 0.6 0.4 0.2 Pdiss. Max. (W) Pdiss. Max. (W) 0.8 Example of QFN 16L 3x3 , 2- NC 14- JEDEC MO-220 3- GND 15- (VGGD) 4- RF IN 16- GND RF OUT , (Green) NC 24- NC 25- GND (1) The package outline drawing included to this data-sheet , application note AN0017 for details). Ordering Information QFN 4x4 RoHS compliant package: PART-CHX3068
United Monolithic Semiconductors
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CHX3068-QDG RO-4003 RO4003 15-30GH 24L-QFN4X4 DSCHX3068-QDG8144 PART-CHX3068/XY

V2411A

Abstract: v2411 ) Temperature of the back side of the QFN package Ref. DSCHV2411aQDG0266- 23 Sept 10 2/12 Route , ) Note: The temperature mentioned below is taken at the back side of thr QFN package Sensitivity versus , Specifications subject to change without notice K-band VCO CHV2411aQDG Package outline (1) V2411A , the standard JEDEC MO-220 3- Nc 15- Gnd (VGGD) 4- VT 16- RF 5- VB , (1) The package outline drawing included to this data-sheet is given for indication. Refer to the
United Monolithic Semiconductors
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v2411 vco smd 24GHZ CHV2411 DSCHV2411 QDG0266-
Abstract: Low input power: 0 to 5dBm DC bias 270mA @ 4V 24L-QFN4X4 SMD package MSL 1 Pout (dBm) Pout_H2 , Example: QFN 16L 3x3 Location of temeprature reference point (Tcase) on package's bottom side Tcase , subject to change without notice 15-30GHz Frequency Multiplier CHX3068-QDG Package outline (1 , 14- JEDEC MO-220 3- GND 15- (VGGD) 4- RF IN 16- GND RF OUT GND GND , (Green) NC 24- NC (1) The package outline drawing included to this data-sheet is given for United Monolithic Semiconductors
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X3068 DSCHX3068-QDG1061 CHX3068-QDG/XY
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