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PC-SOIC/DIP20-04 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SO20A_SO20B_SO20D; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 20; Bottom Pin Count: 20; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.275 - 0.475; Adapter Size Length X Width (in.): 1 x 0.4; Part Description: SOIC to DIP Converter; ri Buy
PC-SOIC/DIP24-01 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SOJ24A_SOJ24B_SOJ24C_SOJ24D; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 24; Bottom Pin Count: 24; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.167 - 0.367; Adapter Size Length X Width (in.): 1.2 x 0.4; Part Description: SOIC to DIP Converter; ri Buy
PC-SOIC/DIP8-01 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SO8A_S08B_SO8E; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 8; Bottom Pin Count: 8; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.15 - 0.375; Adapter Size Length X Width (in.): 0.4 x 0.4; Part Description: SOIC to DIP Converter; ri Buy

jedec package MO-220 VGGD-1 QFN

Catalog Datasheet Results Type PDF Document Tags
Abstract: : JEDEC MO-220 VGGD-1 20X O.IOOJ 0.015 0.217 0.137 (0.25) 0.217 0.137 DETAIL N CORNER CONFIGURATION , PACKAGE (QFN) 20 TERMINAL, 0.5 PITCH (4X4X1) DOCUMENT NO: 98ARH98438A 98ARH98438A REV: E 17 APR 2006 CASE NUMBER: 1308-03 STANDARD: JEDEC MO-220 VGGD-1 NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING , : E 17 APR 2006 CASE NUMBER: 1308-03 STANDARD: JEDEC MO-220 VGGD-1 , PRINT VERSION NOT TO SCALE TITLE: THERMALLY ENHANCED QUAD FLAT NON-LEADED PACKAGE (QFN) 20 TERMINAL ... OCR Scan
datasheet

3 pages,
57.96 Kb

98ARH98438A jedec package MO-220 for qfn JEDEC MO-220 MO-220 jedec package MO-220 QFN 20 jedec package MO-220 VGGD-1 QFN jedec package MO-220 datasheet abstract
datasheet frame
Abstract: outline MO-220, variation VGGD-1. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C J-STD-020C , Part Number Package Voltage Pb-Free Temperature Si5010-X-GM Si5010-X-GM 20-lead QFN 2.5 Yes , "7. Top Mark" on page 16. Updated "8. Package Outline" on page 17. Updated "9. 4x4 mm 20L QFN , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 8. Package Outline , . . . . . . . 17 9. 4x4 mm 20L QFN Recommended PCB Layout . . . . . . . . . . . . . . . . . . . . . ... Original
datasheet

20 pages,
214.52 Kb

Si5020 Si5010 regenerator in optical GR-253-CORE AN42 100 20L A1 diode QFN 4x4 mm 20L jedec package MO-220 VGGD-1 QFN OC-12/3 OC-12/3 abstract
datasheet frame
Abstract: outline MO-220, variation VGGD-1. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C J-STD-020C , Part Number Package Voltage Pb-Free Temperature Si5010-X-GM Si5010-X-GM 20-lead QFN 2.5 Yes , "7. Top Mark" on page 16. Updated "8. Package Outline" on page 17. Updated "9. 4x4 mm 20L QFN , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 8. Package Outline , . . . . . . . 17 9. 4x4 mm 20L QFN Recommended PCB Layout . . . . . . . . . . . . . . . . . . . . . ... Original
datasheet

20 pages,
128.29 Kb

Si5020 Si5010 GR-253-CORE AN42 jedec package MO-220 VGGD-1 QFN OC-12/3 OC-12/3 abstract
datasheet frame
Abstract: Tolerancing per ANSI Y14.5M-1994 5M-1994. 3. This drawing conforms to JEDEC outline MO-220, variation VGGD-1. 4. , Guide Part Number Package Voltage Pb-Free Temperature Si5018-X-GM Si5018-X-GM 20-Lead QFN 2.5 Yes , dimensions shown in the illustration. Figure 11. 20-pin Quad Flat No-Lead (QFN) Table 9. Package , on page 17. Updated "Package Outline," on page 18. Added "4x4 mm 20L QFN Recommended PCB Layout," on , . . . . . . . . . 17 Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ... Original
datasheet

22 pages,
125.43 Kb

OC-48/STM-16 OC-48/STM-16 abstract
datasheet frame
Abstract: Dimensioning and Tolerancing per ANSI Y14.5M-1994 5M-1994. 3. This drawing conforms to JEDEC outline MO-220, variation VGGD-1. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C J-STD-020C specification for Small Body , page 17. Updated "Package Outline," on page 18. Added "4x4 mm 20L QFN Recommended PCB Layout," on page , Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4x4 mm 20L QFN Recommended PCB Layout . . . . . . . . . . . . . . . . ... Original
datasheet

22 pages,
211.39 Kb

jedec package MO-220 VGGD-1 QFN OC-48/STM-16 OC-48 /STM-16 OC-48/STM-16 abstract
datasheet frame
Abstract: to JEDEC outline MO-220, variation VGGD-1. 4. Recommended card reflow profile is per the JEDEC/IPC , Part Number Package Voltage Pb-Free Temperature Si5020-X-GM Si5020-X-GM 20-Lead QFN 2.5 Yes , . . . . . . .16 8. Package Outline: Si5010-BM/GM Si5010-BM/GM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 9. 4x4 mm 20L QFN Recommended PCB Layout . . . . . . . . . . , the bottom of the 20pin micro leaded package (MLP) for device ground. This pad should be connected ... Original
datasheet

22 pages,
132.84 Kb

Si5020 Si5010 GR-253-CORE QFN 4x4 mm 20L datasheet abstract
datasheet frame
Abstract: outline MO-220, variation VGGD-1. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C J-STD-020C , Flat No-Lead (QFN) Table 10. Package Dimensions Symbol Min Millimeters Nom Max Symbol Min Millimeters , Revision 1.3 Added "Top Mark" on page 18. Updated "Package Outline" on page 19. Added "4x4 mm 20L QFN , . . . . . . . . . . . . . . . . . .16 8. Package Outline: Si5010-BM/GM Si5010-BM/GM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 9. 4x4 mm 20L QFN Recommended PCB Layout ... Original
datasheet

22 pages,
219.3 Kb

datasheet abstract
datasheet frame
Abstract: JEDEC STANDARDS MO-220-VGGD-1 071808-B 071808-B TOP VIEW 11 Figure 28. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 4 mm - 4 mm Body, Very Thin Quad (CP-20-4 CP-20-4) Dimensions shown in millimeters , kHz, 44.1 kHz, 48 kHz, 88.2 kHz, and 96 kHz 20-lead, 4 mm - 4 mm LFCSP (QFN) package The SSM2604 SSM2604 , +85°C. It is available in a 20-lead, 4 mm - 4 mm lead frame chip scale package (LFCSP). APPLICATIONS , Table 8. Thermal Resistance Package Type 20-Lead, 4 mm - 4 mm LFCSP ESD CAUTION Stresses above ... Original
datasheet

28 pages,
321.07 Kb

SSM2604 47uH 1011 specifications of DAC 1408 SSM2604 abstract
datasheet frame
Abstract: JEDEC STANDARDS MO-220-VGGD-1 Figure 28. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 4 mm - 4 mm , mm LFCSP (QFN) package Low Power Audio Codec SSM2604 SSM2604 GENERAL DESCRIPTION The SSM2604 SSM2604 is a low , , 4 mm - 4 mm lead frame chip scale package (LFCSP). APPLICATIONS Mobile phones MP3 players , board for surface-mount packages. Table 8. Thermal Resistance Package Type 28-Lead, 5 mm - 5 mm LFCSP , SSM2604CPZ-REEL SSM2604CPZ-REEL SSM2604CPZ-REEL7 SSM2604CPZ-REEL7 SSM2604-EVALZ SSM2604-EVALZ 1 Temperature Range -40°C to +85°C -40°C to +85°C Package ... Original
datasheet

28 pages,
453.14 Kb

SSM2604 SSM2604 abstract
datasheet frame
Abstract: Tolerancing per ANSI Y14.5M-1994 5M-1994. 3. This drawing conforms to JEDEC outline MO-220, variation VGGD-1. 4. , illustration. Figure 12. 20-pin Quad Flat No-Lead (QFN) Table 12. Package Dimensions Symbol Millimeters , . . . . . . .21 8. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 9. 4x4 mm 20L QFN Recommended PCB Layout . . . , The Si5310 uses the GND pad on the bottom of the 20pin micro leaded package (MLP) for device ground. ... Original
datasheet

26 pages,
274.97 Kb

Si5310 MO-220 AN42 datasheet abstract
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