NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Samples | Ordering |
| 1364990-5 | TE Connectivity / AMP | PGA Sockets; MPGA478B SKT,.38AU,JEDEC,TAPE ( AMP ) | 
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| 1364990-4 | TE Connectivity / AMP | PGA Sockets; MPGA478B SKT,.76AU,JEDEC,TAPE ( AMP ) |
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| 1-1364990-5 | TE Connectivity / AMP | PGA Sockets; MPGA478B SKT,FL AU,JEDEC,P&PCV ( AMP ) |
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| 1-1364990-4 | TE Connectivity / AMP | PGA Sockets; MPGA478B SKT,.38AU,JEDEC,P&PCV ( AMP ) |
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| 1-1364990-3 | TE Connectivity / AMP | PGA Sockets; MPGA478B SKT,.76AU,JEDEC,P&PCV ( AMP ) |
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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: OUTLINE DRAWING Measure Mass (g) Unit 20/1 (NTS) 0. 013 mm IFor reference * 1 :Lot indication 2: SANYO Package Code JEDEC Package Code JE ITA Package Code Type Number CP4 Drawing No. Enact No. Drawn Checked Date SANYO Semiconductor CO. , Ltd. ... | OCR Scan |
1 pages, |
datasheet abstract |
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| Abstract: OUTLINE DRAWING Measure Mass (g) Unit 20/1 (NTS) 0. 013 mm IFor reference -H m / \ 1 I 1 2 * 1 : Lo t indication 3 SANYO Package Code JEDEC Package Code JE ITA Package Code Type Number CP Drawing No. Enact No. Drawn Checked Date TC-0 0000733 SANYO Semiconductor Co. , Ltd. ... | OCR Scan |
1 pages, |
datasheet abstract |
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| Abstract: OUTLINE DRAWING Measure Mass (g) Unit 50/1 (NTS) 0.001 SFor Reference mm 2 * 1 : Lo t indication 3 SANYO Package Code JEDEC Package Code JE ITA Package Code Type Number ECSP1006-3 ECSP1006-3 Drawing No. Enact No. Dr awn Checked Date TC-0 000 1 766 SANYO Semiconductor Co., Ltd ... | OCR Scan |
1 pages, |
ECSP1006-3 datasheet abstract |
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| Abstract: T-C000 OUTLINE DRAWING Measure Mass (g) Unit 20/1 (NTS) 0. 013 mm IFor reference * 1 : Lo t iidication I: SANYO Package Code JEDEC Package Code JE ITA Package Code Type Number CPH4 Drawing No. Enact No. Drawn Checked Date TC-0 0 0 0 0 7 B 3 SANYO Semiconductor CO:LTD ... | OCR Scan |
1 pages, |
datasheet abstract |
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| Abstract: OUTLINE DRAWING Measure Mass (g) Unit 20/1 (NTS) 0. 015 mm IFor reference ì * 1 : Lo t iidicaiion 3 SANYO Package Code JEDEC Package Code JE ITA Package Code Type Number CPH6 Drawing No. Enact No. Dr awn Checked Date TC-0 0000733 SANYO Semiconductor Co., Ltd. ... | OCR Scan |
1 pages, |
datasheet abstract |
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| Abstract: OUTLINE DRAWING Measure Mass (g) Unit 50/1 (NTS) (0. 0005) mm 2 * 1 : Lo 1 indication 3 SANYO Package Code JEDEC Package Code JE ITA Package Code Type Number USFP Drawing No. Enact No. Drawn Checked Date SANYO SEMICONDUCTOR CO:LTD ... | OCR Scan |
1 pages, |
datasheet abstract |
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| Abstract: OUTLINE DRAWING Measure Mass (g) Unit 20/1 (NTS) 0. 015 mm XFot reference 0 l^0,1 u- ' J-0.05 0-0.02 SANYO Package Code JEDEC Package Code JE ITA Package Code Type Number VEC8 Drawing No. Enact No. Dr awn Checked Date SANYO Semiconductor Co., Ltd. ... | OCR Scan |
1 pages, |
datasheet abstract |
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| Abstract: OUTLINE DRAWING Measur e Mass (g) Unit 5/1 (NTS) 1. 9 mm IFor reference #3.2±0.2 2 3 4.5*0.3 2.8* 3 0.7*0.3 SANYO Package Code JEDEC Package Code JEITA Package Code Type Number TO-2 2QML Drawing No. Enact No. Drawn Checked Date SANYO Semiconductor Co., Ltd. ... | OCR Scan |
1 pages, |
datasheet abstract |
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| Abstract: OUTLINE DRAWING Measure Mass (g) Unit 50/1 (NTS) 0. 0006 mm XFor reference 0. BIO. 05 Pin 1 Marking SANYO Package Code JEDEC Package Code JEITA Package Code Type Number TSLP-3-1 Drawing No. Enact No. Dr awn Checked Date TC-0 000 1 588 SANYO Semiconductor Co., Ltd. ... | OCR Scan |
1 pages, |
marking date code Sanyo date code Sanyo semiconductor marking date code Sanyo semiconductor datasheet abstract |
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| Abstract: OUTLINE DRAWING Measure Mass (g) Unit 20/1 (NTS) 0. 007 mm IF or reference I * 1 :Lot indication 3 SANYO Package Code JEDEC Package Code JE ITA Package Code Type Number MCP6 Drawing No. Enact No. Dr awn Checked Date SANYO Semiconductor Co., Ltd. ... | OCR Scan |
1 pages, |
datasheet abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| (Phillips) and Tektronix PQFP Test Clips Available to Test Surface Mounted JEDEC Packages All Description: Adapt-A-Pod* emulator adapters convert the emulator pod package type to that of the Product Listing Supported Device Detail Matrix: Part & Package Availability www.datasheetarchive.com/files/intel/design/i960/devtools/676aa1ae.htm |
Intel | 02/08/1998 | 4.58 Kb | HTM | 676aa1ae.htm |
| (Phillips) and Tektronix PQFP Test Clips Available to Test Surface Mounted JEDEC Packages All Description: Adapt-A-Pod* emulator adapters convert the emulator pod package type to that of the Product Listing Supported Device Detail Matrix: Part & Package Availability www.datasheetarchive.com/files/intel/design/i960/devtools/4a73e1ae.htm |
Intel | 10/02/1998 | 4.33 Kb | HTM | 4a73e1ae.htm |
| (Phillips) and Tektronix PQFP Test Clips Available to Test Surface Mounted JEDEC Packages All Description: Adapt-A-Pod* emulator adapters convert the emulator pod package type to that of the Product Listing Supported Device Detail Matrix: Part & Package Availability www.datasheetarchive.com/files/intel/design/i960/devtools/4f4ba_1a.htm |
Intel | 09/05/1998 | 4.58 Kb | HTM | 4f4ba_1a.htm |
| (Phillips) and Tektronix PQFP Test Clips Available to Test Surface Mounted JEDEC Packages All Description: Adapt-A-Pod* emulator adapters convert the emulator pod package type to that of the Product Listing Supported Device Detail Matrix: Part & Package Availability www.datasheetarchive.com/files/intel/design/i960/devtools/4244e1ae.htm |
Intel | 08/11/1997 | 4.28 Kb | HTM | 4244e1ae.htm |
| (Phillips) and Tektronix PQFP Test Clips Available to Test Surface Mounted JEDEC Packages All Description: Adapt-A-Pod* emulator adapters convert the emulator pod package type to that of the Product Listing Supported Device Detail Matrix: Part & Package Availability www.datasheetarchive.com/files/intel/design/i960/devtools/6d8161ae.htm |
Intel | 05/11/1998 | 4.91 Kb | HTM | 6d8161ae.htm |
| Configuration Solder Plate Lead Finish Molded Package EIAJ and JEDEC Package Styles Plastic Package Please enable Javascript in your browser. National Semiconductor Plastic Packages National Semiconductor Plastic Packages Plastic Small Outline Transistor (SOT) Small Outline Package (SOP, SSOP, TSOP, TSSOP) Molded Dual-In-Line Package (MDIP Quad Flatpack (PQFP) TO Packages (TO-92, TO-202, TO-220, TO-226, TO-237 www.datasheetarchive.com/files/national/htm/nsc04914.htm |
National | 18/12/1998 | 7.68 Kb | HTM | nsc04914.htm |
| Gull Wing Lead Configuration Solder Plate Lead Finish Molded Package EIAJ and JEDEC Package Please enable Javascript in your browser. National Semiconductor Plastic Packages Plastic Packages Plastic Small Outline Transistor (SOT) Small Outline Package (SOP, SSOP, TSOP, TSSOP) Molded Dual-In-Line Package (MDIP Quad Flatpack (PQFP) TO Packages (TO-92, TO-202, TO-220, TO-226, TO-237 www.datasheetarchive.com/files/national/htm/nsc01716-v6.htm |
National | 13/08/1999 | 9.31 Kb | HTM | nsc01716-v6.htm |
| Configuration Solder Plate Lead Finish Molded Package EIAJ and JEDEC Package Styles Plastic Package National Semiconductor Plastic Packages Please enable Javascript in your browser. National Semiconductor Plastic Packages Plastic Small Outline Transistor (SOT) Small Outline Package (SOP, SSOP, TSOP, TSSOP) Molded Dual-In-Line Package (MDIP Quad Flatpack (PQFP) TO Packages (TO-92, TO-202, TO-220, TO-226, TO-237 www.datasheetarchive.com/files/national/htm/nsc01793-v4.htm |
National | 16/09/1998 | 7.68 Kb | HTM | nsc01793-v4.htm |
| Package EIAJ and JEDEC Package Styles Plastic Package Dimensional/Thermal Data for Surface National Semiconductor Plastic Packages National Semiconductor Plastic Packages Plastic Small Outline Transistor (SOT) Small Outline Package (SOP, SSOP, TSOP, TSSOP) Molded Dual-In-Line Package (MDIP) Plastic Pin Grid Array (PPGA) Plastic Leaded Chip Carrier www.datasheetarchive.com/files/national/docs/wcd0003a/wcd03a61.htm |
National | 03/04/1998 | 7.02 Kb | HTM | wcd03a61.htm |
| package land-pad pattern, or "target". Many "stacking adaptor" and ribbon cable interconnects have been available for older package "targets" such as DIP and, more recently, PLCC. However, prior to the creation of ALPTEX FlexProbes, none were available to support the newer packages.TSOP, SSOP, PSOP and the uBGA* package. The target end of the streamlined FlexProbe connects either to a socket or by reflow attached to your memory emulator or test/trace apparatus. Because FlexProbes are designed around JEDEC www.datasheetarchive.com/files/intel/design/flcomp/devtools/7820a1a6.htm |
Intel | 10/02/1999 | 5.42 Kb | HTM | 7820a1a6.htm |