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Part Manufacturer Description Datasheet BUY
LM134H-6 Linear Technology Analog Temperature Sensor, ANALOG TEMP SENSOR-CURRENT, ROUND, THROUGH HOLE MOUNT, METAL CAN, TO-46, 3 PIN visit Linear Technology - Now Part of Analog Devices
LM134H-3 Linear Technology Analog Temperature Sensor, ANALOG TEMP SENSOR-CURRENT, ROUND, THROUGH HOLE MOUNT, METAL CAN, TO-46, 3 PIN visit Linear Technology - Now Part of Analog Devices
HSYE-117RH-8 Intersil Corporation 1.2 V-37V ADJUSTABLE POSITIVE REGULATOR, CBCC3, CERAMIC, SMD-5, LCC-3 visit Intersil
ISYE-1009RH-8 Intersil Corporation 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 2.5V, BCC3, ROHS COMPLIANT, HERMETIC SEALED, SMD-3 visit Intersil
HSYE-117RH/PROTO Intersil Corporation 1.2 V-37V ADJUSTABLE POSITIVE REGULATOR, CBCC3, CERAMIC, SMD-5, LCC-3 visit Intersil
HSYE-117RH-Q Intersil Corporation 1.2 V-37V ADJUSTABLE POSITIVE REGULATOR, CBCC3, CERAMIC, SMD-5, LCC-3 visit Intersil

isoplus ixys mounting

Catalog Datasheet MFG & Type PDF Document Tags

IXAN0022

Abstract: KU4-499 IXAN0022 Capitalizing on the Advantages of ISOPLUS Products Introduction IXYS Corporation , IXYS isolated packages include ISOPLUS220TM, ISOPLUS247TM, ISOPLUS i4-PAC TM, ISOPLUS264 TM as well as the new ISOPLUS-DIL TM modules. The ISOPLUS advantages relative to the standard power packages , and quantify the ISOPLUS advantages and focus on mounting techniques and materials that optimize the , MOSFET bridges in the ISOPLUS-DIL package. Clip Assembly The ISOPLUS packages eliminate the mounting
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ISOPLUS247 KU3-392 KU3-381 KU4-430 KU4-495 KU3-393 KU4-499 KU4-498 isoplus ixys cross isoplus ixys mounting ISOPLUS220 ISOLPUS247 KU4-445

isoplus ixys mounting

Abstract: isoplus isolation ISOPLUS i4-Pak (5-Leads) (IXTF) Package Outline Drawing October 2006 Description IXYS new , proprietary ISOPLUS packaging technology, in this case the ISOPLUS i4-Pak. IXYS Trench MOSFETs provide for , , high power handling capability of IXYS discrete ISOPLUS i4-Pak. Silicon current handling has outpaced , current rating to 160A. All IXYS ISOPLUS packages are manufactured with internal direct-copper-bonded , Packages with Internal Alumina DCB Isolation* IXYS ISOPLUS packages provide high isolation capability
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IXTF280N055T IXTF250N075T IXTF230N085T IXTF200N10T IXFP14N60P IXFC14N60P E153432

IXLF19N250A

Abstract: isoplus ixys mounting combining IXYS ISOPLUS package use with clip mounting and next generation phase change interface materials , ISOPLUS i5-PACTM RTH(J-DCB) RTH(DCB-Case) Description * IXYS Patented Packages, Patent No. 6,404 , enabling load disconnect for improved systems safety. IXYS proprietary ISOPLUS discrete packaging , IXLF19N250A comes in IXYS ISOPLUS i4-PacTM, while the IXEL40N400 is offered in IXYS newly designated ISOPLUS i5-PACTM. All of IXYS ISOPLUS packages are manufactured with an internal DCB isolated substrate, are UL
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Discrete IGBTS ixys pb free VCES 4000V IXFR55N50 IXFX55N50 IGBT 1500V 40a

isoplus ixys mounting

Abstract: isoplus 150A for the two dice. All IXYS ISOPLUS packages are manufactured with internal direct-copper-bonded , . 2. All leads and tab are tin plated. IXYS ISOPLUS packages provide high isolation capability (up , the unique integration capabilities of IXYS ISOPLUS packages. Kunze high performance phase change , effective clip mounting. * IXYS Patented Packages, Patent No. 6,404,065 Example Part + Isolation Medium , capitalize on the benefits of proprietary ISOPLUS packaging technology, the ISOPLUS i5-Pak. IXYS Mid-Voltage
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copper thermal IXTL2x240N055T SIL-PAD 240N055T 220N075T 200N085T 180N10T 2000TM

xenon hid ballast

Abstract: Xenon HID Block Diagram POWER Efficiency Through Technology N E W P R O D U C T B R I E F ISOPLUS i4-PACTM Half-Bridge MOSFET Modules IXYS Introduces new isolated phase leg modules january 2010 OVERVIEW IXYS introduces new half-bridge MOSFET modules that are available in IXYS proprietary ISOPLUS i4-PACTM packaging , ; 6,534,343; 6,583,505; 6,710,463; 6,731,002; 7,005,734 * For information regarding IXYS ISoPLUS , layout space savings. The ISOPLUS i4-PACTM is a UL recognized isolated package incorporating a direct
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xenon hid ballast Xenon HID Block Diagram circuit diagram ballast xenon solar inverters circuit diagram single phase inverters circuit diagram HID lamp ballast 2500V

IGBT 4000V

Abstract: isoplus ixys mounting IXYS' ISOPLUS(TM) packaging to enable simpler mounting with improved reliability. ADVERTISEMENT IXYS , improved by combining IXYS' ISOPLUS package use with clip mounting and next generation phase change , enabling load disconnect for improved systems safety. IXYS' proprietary ISOPLUS discrete packaging , IXLF19N250A comes in IXYS' ISOPLUS i4-Pac(TM), while the IXEL40N400 is offered in IXYS' newly designated ISOPLUS i5-PAC(TM). All of IXYS' ISOPLUS packages are manufactured with an internal DCB isolated
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IGBT 4000V ixys Igbts guide 2006--IXYS

IXGF30N400

Abstract: IXGF4N400 ; 6,534,343; 6,583,505; 6,710,463; 6,731,002; 7,005,734 * For information regarding IXYS ISOPLUS , critical key for extending the lifespan and competitiveness of designs in the marketplace. IXYS' unique , 3500 IGBT Market 3000 2500 Graphic on the left illustrates IXYS' IGBT device 2000 , 4000 MOSFET Market 3500 Graphic on the right illustrates IXYS' 2500 MOSFET device , Very High Voltage IGBTs IXYS' offers a unique portfolio of discrete 2500V, 3000V, and 4000V VHV IGBTs
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IXBX64N250 IXBH20N300 IXBK55N300 IXBF55N300 IXGF30N400 IXGF4N400 IXGF25N250 pulser IXGF54N400 IXGT25N250 PLUS247 IXBF12N300 IXBF20N300 IXBH12N300 IXBT12N300

1262-33

Abstract: IXTP44N10T TrenchMVTM (55V-100V) Power MOSFETs The ISOPLUSTM Advantage All IXYS ISOPLUS packages are , capabilities of IXYS ISOPLUS packages. Kunze high performance phase change materials can be used to further , power handling capability and special lead configuration found in the IXYS discrete ISOPLUS i4-Pak , handling and integration capabilities found in the IXYS discrete ISOPLUS i5-Pak. Standard discrete , M TrenchMVTM (55V-100V) Power MOSFETs The ISOPLUSTM Advantage All IXYS ISOPLUS packages are
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IXTH220N055T IXTC220N055T 1262-33 IXTP44N10T IXTQ130N10T IXTA60N10T ixtp76n075 IXTH200N10T PLUS220SMD PLUS220

60N120

Abstract: D-68623 ISOPLUS 247TM = 95 A = 1200 V = 2.1 V ISOPLUS 247TM E153432 C G G C E Isolated Backside , switching - short tail current for optimized performance in resonant circuits · ISOPLUS 247TM package - , IXYS All rights reserved IXYS Semiconductor GmbH Edisonstr. 15, D-68623 Lampertheim Phone: +49-6206-503-0, Fax: +49-6206-503627 1-2 IXYS Corporation 3540 Bassett Street, Santa Clara CA 95054 Phone: (408) 982-0700, Fax: 408-496-0670 IXER 60N120 ISOPLUS 247 OUTLINE Component Symbol
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V9560 60n12 induction heat resonant

IXAN0025

Abstract: diode kv 1236 247 package Now IXYS is introducing a new family of internally isolated power semiconductors in the , namely ISOPLUS220TM, ISOPLUS247TM and ISOPLUS i4TM, not only provides a 2500 V(RMS) isolation voltage , construction are announced for certification. Standard Isolation Methods The standard mounting method to , creep distance between the device mounting tab and the screw. (Internal AlN DCB) (Internal AlO3 DCB , 123.6 IXAN0025 In 1998 IXYS introduced the PLUS247TM package, a ,holeless` TO-247 requiring a
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diode kv 1236 SIL-PAD 1000 TO 247 SIL-PAD to-247 IXFR170N10 26N50 IXFR150N10

IXBK55N300

Abstract: IXBH12N300 ; 6,534,343; 6,583,505; 6,710,463; 6,731,002; 7,005,734 * For information regarding IXYS ISoPLUS , BiMOSFETsTM IXYS expands its bimosfet tm porTfolio to 3kv with the introduction of its new hv bimosfetsTM september 2009 OVERVIEW IXYS High Voltage BiMOSFETsTM are a unique class of high gain devices featuring , transients from inflicting damage to the device. IXYS High Voltage BiMOSFETsTM represent excellent , 2.1 530 1.25 ISOPLUS i4-PAKTM IXBF20N300 3000 27 15 3.2 2.1 395 1.13
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radar system with circuit diagram IXBH32N300 BiMOSFET IXBH2N250 bimos high speed bridge rectifier
Abstract: 150°C; t = 10 ms t = 8.3 ms I2t TO-268 AA Version A ISOPLUS 247 TM (50 Hz), sine (60 , 20.120 Nm N TVJ TVJM Tstg Md * FC mounting torque M3 mounting force with clip VISOL , 2 (TAB) 3 2 (TAB) ISOPLUS 247 TM Version AR 1 2 TAB 3 1 = Cathode, 2 = Anode , TO-247 AD and ISOPLUS 247 TM * Verson A only; * Version AR only Symbol Test Conditions , single diode IXYS reserves the right to change limits, test conditions and dimensions © 2002 IXYS IXYS
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25-12AT 25-16AT 25-16AR DSP25

high frequency inverter for induction heating

Abstract: solar inverter circuit application. IXYS 1200V GenX3TM IGBTs are offered in various standard and ISOPLUS packages with collector , (E153432). Improves termperature and power cycling capability. Cost effective clip mounting. * IXYS Patented Packages, Patent No. 6,404,065 * For information regarding IXYS ISoPLUS packages, visit http , IGBTs next generation 1200V igbts for power conversion applications march 2009 OVERVIEW IXYS , manufactured using IXYS' state-of-the-art GenX3TM IGBT process and utilize IXYS' advanced Punch-Through (PT
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high frequency inverter for induction heating solar inverter circuit transistor Electronic ballast "INDUCTION LAMP" ixgh30n120 SMPS INVERTER FULL BRIDGE FOR WELDING induction heating circuits PB120IGBTA3B3C3

transistor 12n60c

Abstract: 12N60c equivalent ISOPLUS Summary Title Page Isolated Discrete Packages A4 - 1 ISOPLUS247TM A4 - 2 ISOPLUS i4-PACTM A4 - 3 ISOPLUS247TM ­ ISOPLUS i4-PACTM Isolated Discrete Packages ISOPLUS247TM is the DCB isolated version of the PLUS247TM-package (TO247 without a mounting hole). The design of , 0.15 1.02 0.45 1.24 1.0 2.8 © 2000 IXYS All rights reserved While the junction-to-case , power- and temperature cycling is reduced so that reliability is improved. Mounting is done with clips
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transistor 12n60c 12N60c equivalent 30N120D1 13N50 equivalent 12n60c MOSFET 1000v 30a PLUS247TM- 180N10 FBO16-08N FBE22-06N1 21-05QC 22-08N

60-02A

Abstract: ISOPLUS weight FC mounting torque mounting force with clip Weight typical 0.8.1.2 20.120 Nm N , commutating switch IXYS reserves the right to change limits, test conditions and dimensions. © 2003 IXYS All rights reserved 325 Data according to IEC 60747 and per diode unless otherwise specified 1- 2 DSEC 60-02A Dimensions TO-247 AD and ISOPLUS 247 TM TO-247 AD and ISOPLUS 247 TM , 0.185 0.016 0.209 0.031 N 1.5 2.49 0.087 0.102 325 * ISOPLUS 247 TM without
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60-02A ISOPLUS weight TO-247 AD DIODE Ifavm 30 A

60N120

Abstract: V9560 IXER 60N120 NPT3 IGBT IC25 = 95 A = 1200 V VCES VCE(sat) typ. = 2.1 V in ISOPLUS 247TM ISOPLUS 247TM E153432 C G G C E Isolated Backside* E G = Gate C = Collector E = , optimized performance in resonant circuits · ISOPLUS 247TM package - isolated back surface - low , nC 0.66 0.33 K/W K/W 331 RthJC RthJH © 2003 IXYS All rights reserved IXYS , IXYS Corporation 3540 Bassett Street, Santa Clara CA 95054 Phone: (408) 982-0700, Fax: 408-496-0670
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IXER60N120

IXFR170N10

Abstract: IXFX55N50 mounting system. Table 1 compares the thermal resistance of a 170A/100V MOSFET chip in the ISOPLUS , , Product Marketing, IXYS Semiconductor GmbH & Ralph Locher, Application Engineering, IXYS Corporation , thermal resistance R(th)cs. Now IXYS is introducing a new family of internally isolated power , cycling, compared to conventionally isolated devices. Standard Isolation Methods The standard mounting , creep distance between the device mounting tab and the screw. Table 1 (additional examples see table
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IXFX180N10

solar inverter circuit

Abstract: 600V igbt dc to dc boost converter packages as well as IXYS proprietary ISOPLUS isolated packages, offering UL recognized 2500V isolation and , regarding IXYS ISoPLUS packages, visit http://www.ixys.com/IXAN0022.pdf July 2009 ceramic substrate , POWER Efficiency Through Technology N E W P R O D U C T B R I E F IXYS expands its , discrete power components. IXYS has combined the latest Silicon Carbide diode technology with its advanced , IGBT and diode, giving way to substantial system-level performance improvements. IXYS GenX3SCTM IGBTs
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600V igbt dc to dc boost converter full bridge inverter Solar Charge Controller smps IGBT gate drive for a boost converter Solar Charge Controller PWM 30A Solar Charge Controller Circuit PWM 60IGBTSC

DIN ISO 1302

Abstract: Dow Corning 340 (A)1 Chassis thickness [mm]: Mounting force [N]: TO-247 / TO-264 ISOPLUS 247 i4-PAC 1-2 , nut M3/M3,5 nut *) Not used for non-isolated mounting © 2000 IXYS All rights reserved L , reserved L-2 Mounting instructions Modules IXYS modules are 100% tested prior to leaving the , information see our video on IXYS DATA BOOK CD. Mounting screw fastening procedures 4 3 2 1 , > 2 All mounting screws should have washers and spring washers. IXYS provides additional mounting
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DIN ISO 1302 Dow Corning 340 TO247 CASE ejot torque Dow Corning DC 11 Dow Corning

D-68623

Abstract: MOSFET and Schottky Diode in ISOPLUS i4-PACTM 3 Preliminary data 4 1 1 5 2 Features , elevated temperature · ISOPLUS i4-PACTM package - isolated back surface - low coupling capacity between , held tools - battery chargers 406 MOSFET IXYS reserves the right to change limits, test conditions and dimensions. © 2004 IXYS All rights reserved IXYS Semiconductor GmbH Edisonstr. 15, D-68623 Lampertheim Phone: +49-6206-503-0, Fax: +49-6206-503627 1-2 IXYS Corporation 3540 Bassett Street, Santa
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80-0045PS
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