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ic 812

Catalog Datasheet MFG & Type PDF Document Tags

LPC 836 red laser diode

Abstract: LPC 826 red laser diode signalfrom a 4 m A -to-20 m A tran sd u ce r can b e interfaced to th e AD |iC 812, a 12-bitA D C w ith an em , ÆJ627 F U N C T IO N A L B L O C K D IA G R A M 8 - Lead Plastic M in i-D IP (N ) and S O IC (R ) FEATURES M ic ro p o w e r, 85 (jiA M a x S u p p ly C urrent W id e P o w e r S u p p ly Range (+2.2 V to , pow ezed applications. Its z a ilto -z a ilo u tp u t stage m axin izes dynam ic zange w hen operating , e m e n ts of p a te n ts o r o th e r rig h ts o f th ird pa rtie s w h ic h m ay re sult fro m its
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LPC 836 red laser diode LPC 826 red laser diode CN802 PWB 826 service manual transistor N14 193 K2EEYB000001 CPD0603050C1 CF-74 CF-74CCBAXBM EN60825

ic 812

Abstract: 627AN Power Management IC RD5T532x Product Specifications Rev. 1.3 2012.06.08 RICOH COMPANY, LTD , .29 8.9 8.10 8.11 8.12 9. 9.1 9.2 9.3 10. 10.1 10.2 10.3 10.4 10.5 10.6 10.7 10.8 10.9 10.10 10.11 10.12 , . 98 RD5T532X Power Management IC 1. Outline RD5T532 is the power management IC. It , process ©2010-2012 Rev. 1.3 Page 6 RD5T532X Power Management IC Version List Initial , ©2010-2012 Rev. 1.3 Page 7 RD5T532X Power Management IC 3. Pin Configuration 3.22mm×3.22mm
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ic 812 627AN ON44

JMK107BBJ226MA-T

Abstract: grm155b31a105ke15 GT3200 (64-PIN TQFP PACKAGES) USB3250 (56-PIN QFN PACKAGE) USB2.0 PHY IC PRODUCT , temperature range from -40oC to +85oC (ambient) DATASHEET Revision 1.3 (10-05-04) USB2.0 PHY IC , DATASHEET SMSC GT3200, SMSC USB3250 USB2.0 PHY IC Table of Contents Chapter 1 General Description , . . . . . . . . . . . 27 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 8.10 8.11 8.12 8.13 8.14 , iii DATASHEET Revision 1.3 (10-05-04) USB2.0 PHY IC List of Figures Figure 2.1 Figure
Ricoh
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JMK107BBJ226MA-T grm155b31a105ke15 GRM155R11C104K

ic 812

Abstract: 56-PIN GT3200 (64-PIN TQFP PACKAGES) USB3250 (56-PIN QFN PACKAGE) USB2.0 PHY IC PRODUCT , USB3250 DATASHEET Revision 1.3 (08-18-04) USB2.0 PHY IC ORDER NUMBER(S): GT3200 - JD FOR 64 , 1.3 (08-18-04) DATASHEET ii SMSC GT3200, SMSC USB3250 USB2.0 PHY IC Table of Contents , 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 8.10 8.11 8.12 8.13 8.14 Linestate . . . . . . . . . . . . . . . . , .0 PHY IC List of Figures Figure 2.1 Figure 3.1 Figure 3.2 Figure 6.1 Figure 6.2 Figure 6.3 Figure
Standard MicroSystems
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USB3250-ABZJ CRC-16 GT3200-JD GT3200-JN

875u

Abstract: abzj eram ic disc capacitors C lass X 1 / Y 2 , 250 V (AC) safety . . , ' . . * (kinked or straight , eram ic disc capacitors C lass X 1 / Y 2 , 250 V (AC) safety . . , ' . . * (kinked or straight , 36 36 37 37 37 37 37 37 2252 812 .016 2252 812 .116 2252 812 .216 2252 812 .316 2252 812 .416 2252 812 .616 Class X1/Y2 Z5U 1000 1500 2200 3300 3900 4700 10000 Notes 1. 2. 3. 4. Maximum , 35 35 35 35 36 36 36 36 36 37 37 37 37 37 37 48 2252 812 .027 2252 812 .127 2252 812 .227 2252 812
Standard MicroSystems
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875u abzj

IC Marking 812

Abstract: marking S101 LT1173C N 8-12 LT117 3C S 8-12 LT1300C N 8 LT1300C S8 LT1301C N 8 LT1301C S8 Selection Guides M ic , Package S elf-C ontained 100kH z PW M and 1.2A S w itch in 20-Lead SOIC M ic ro p o w e r 1A S te p -D o w , g R egulator A chieves 9 0 % E fficiency M ic ro p o w e r 1A S tep-D ow n S w itch in g R e g u la , w itch in g LT1005C K LT1Û05CT LT1Û73CN8 LT1073CS8 LT1Q73CN8-5 LT1073C S 8-5 L T 1073C N 8-12 LT1073C S 8-12 LT1082C N 8 LT1082C T LT1107C N 8 LT1107C S8 LT1107C N 8-5 LT1107C S 8-5 LT 1107C N 8-12
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IC Marking 812 marking S101
Abstract: Maximum 30mQ Peak temperature of 245°C 300°C within 5 seconds FAX 812/945-0804 â'¢ Phone 812 , in vinyl bags â¡ T a No 15h- PC board X 1 = Body 2 = Frame 3 = SO Package IC , 17.57 19.31 13.97 8 24 A 812/945-0211 812/945-0805 FAX C 9.15 P ositions , Frame 3 = SO Package IC PC Do a r d p a t t e r n ± 0.3 General Tolerance ALL DIMENSIONS IN , n Ao e t tgn 812/945-0211 812/945-0805 FAX SOP-XXBXX-SMT-XX 4.25 SMT SOP Socket -
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LT1072H LT1072C LT1072CS8 LT1172C LT1172H LT1172CQ

tgn 600

Abstract: . Bonding pad. Ic 20 X 20 mils ± 2 mils 8-12 mils nominal Yceo Aluminum 25,000A minimum, 30,000A , . B = 19 X 8 mils, E = 35 X 8 mils ft 2075 PNP Ic 60 X 60 mils ± 2 mils 8-12 mils nominal , . Chip thickness. Top metal. Back metal. Ic 75 X 75 mils ± 2 mils 8-12 , Adc max Ic 10 Adc max Ic 20 Adc max Ic 12 Adc max 170X 170 mils ± 2 mils 8-12 , 15-120 2 - 40 MHz Ic 230 X 230 mils ± 2 mils 8-12 mils nominal ' ceo Aluminum 25,000A minimum
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tgn 600 FPT-80-M01 P-S008 P14GM-50-300B-2 FP-14D EP-14-DA 14P2W

1040B

Abstract: 2N3910 Alloy 1.27 pm (50 pinch) Nickel underplate. E E T IC L L CR A Current Rating: 0.5 Ampere per , Contact Resistance: Maximum 30mn SOCKETS M C A IC L EHN A 980m/S2 (100G) (3 axis) (No , perature: Therm al Shock Resistance: Contact resistance: Insulation resistance: A P IC B EIC PL AL , Body 2 = Frame 3 = SO Package IC pattern A B 8 9.15 3.81 9.95 14 12.98 , ALL DIMENSIONS IN MILLIMETERS 20.11 r TL R bn o o i s n Nugent 812/945-0211 812
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1040B 2N3910 svt6062 1020B 15X19 1270B 2N6674 2N6675 2N6676

Robinson Nugent s2

Abstract: ACTIVE FREQUENCY DOUBLERS AND TRIPLERS r â'˜I H A R M O N IC IN P U T IN P U T O , FILTERS MAX2M097103 MAX2M132152 4.88-5.13 6.6-7.63 8-12 8-12 9.76-10.26 13.21-15.26 11-15 11-15 3 3 r H A R M O N IC IN P U T IN P U T O UTPUT O UTPUT C O N V E R S IO N , 1.5-1.67 1.5-1.67 1.5-1.67 3-8 8-12 12-16 MAX3J050055 MAX3M050055 MAX3H050055 1.67-1.83 1.67-1.83 1.67-1.83 3 -8 8-12 12-16 MAX3J055060 MAX3M055060 MAX3H055060 1.83-2 1.83-2 1.83-2
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Robinson Nugent s2 1000MQ 100MO FPT-14P-M04 14-P-30 S13M30S

MAX16S013015-20P

Abstract: : Glass-filled PPS Contacts: Copper alloy Holder: Copper alloy Flam m ability: U L 9 4 V -0 M E C H A N IC A L Shock Resistance: 980m /s2 (100G ) SOCKETS E LE C TR IC A L Current Rating: 0.2 Am pere , O N M E N T A L A P P L IC A B L E 1C 64 contacts: Therm al Shock Resistance: Contact , 4 20A Q F P 80-P -1420B Q F P 8 0-P -14 20C Sanyo: 3044B 300°C within 5 seconds FAX 812/945-0804 â'¢ Phone 812/948-0564 99 SOCKETS Q F P â'" 64 8 â'" S M J R â'" IT
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MAX16S013015-20P MAX3J045050 MAX3M045050 MAX3H045050 MAX3J060065 MAX3M060065 MAX3H060065
Abstract: -16 TSSOP-16 Tape Reel Tube Tape Reel Tube 1 of 6 QW-R502-812.A U74HC157 CMOS IC PIN , www.unisonic.com.tw 2 of 6 QW-R502-812.A U74HC157 CMOS IC ABSOLUTE MAXIMUM RATING (TA =25°C , unless , ±100 8 10 V nA μA pF 3 of 6 QW-R502-812.A U74HC157 CMOS IC SWITCHING , pF 4 of 6 QW-R502-812.A U74HC157 CMOS IC TEST CIRCUIT AND WAVEFORMS Fig. 1 Load , ., LTD www.unisonic.com.tw 5 of 6 QW-R502-812.A U74HC157 CMOS IC UTC assumes no -
OCR Scan
FP-80-B
Abstract: S G S -T H O M S O N TXDV 4 1 2 - > 812 ALTERNISTORS FEATURES . VERY HIGH COMMUTATION : > 42.5 , DESCRIPTION The TXDV 412 -> 812 use a high performance passivated glass alternistor technology. Featuring , Parameter 412 Repetitive peak off-state voltage Tj = 125 °C 400 TXDV 612 600 812 800 Unit VDRM v , + 150 - 40 to + 125 o o TXDV 412 - > 812 THERMAL RESISTANCES Symbol Rth (j-a) Junction to , tro d e A 1 . - 3^ * T j= 110°C MIN 10 42.5 A/ms TXDV 412 - > 812 Fig Unisonic Technologies
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U74HC157L-S16-R U74HC157G-S16-R U74HC157L-S16-T U74HC157G-S16-T U74HC157L-P16-R U74HC157G-P16-R
Abstract: â"¢ / SEmHEQ EEJ SECTION A -A 812/945-0211 812/945-0805 FAX CUSTOMER DRAWING , pam kc y 812/945-0211 812/945-0805 FAX * Note: Reference JEDEC MO-161 CUSTOMER DRAWING , ) 812/945-0211 812/945-0805 FAX 8-Byte DIMM Socket, Un-Buffered or Buffered DRAM - 3.3v or 5.5v , ceram ic is utilized as board m aterial. The leading edge must have a .010 (.25) x 30° chamfer. 8 , : Reference JEDEC MO-161 Nugent CUSTOMER DRAWING Dim ensions Shown as Inch (mm) 812/945-0211 812 -
OCR Scan
E81734
Abstract: DOOR CHIME WIRELESS DOOR CHIME IC M1D-BL GENERAL DESCRIPTION The M1D-BL is a CMOS ASIC , DOOR CHIME IC M1D-BL ABSOLUTE MAXIMUM RATING (TA=25) Parameter Supply Voltage Rating , CHIME WIRELESS DOOR CHIME IC M1D-BL PAD ASSIGNMENT & POSITION 4 3 2 No. 1 2 3 , 635 635 635 635 635 UNIT : um Y 812 812 812 812 534 178 -55 -265 -505 -810 -810 -810 -810 -810 -600 -367 -157 76 * CHIP SIZE ~ 1.7 x 2.2 mm2 * IC substrate should be -
OCR Scan
MO-172 MIL-STD-1344

door bell encoder

Abstract: circuit diagram of wireless door BELL ic a l S h o c k R e sista n c e: 981 m/s2 (10 0 G) V ib ra tio n R e sista n c e: 2 0 to 55H z, 98m , Q Maximum APPLICABLE IC ENVIRONMENTAL O p e ra tin g T e m p e ra tu re : -5 5 â'C to + 65 , ? \ ( S= 1 0 : 1 ) 1. 5 0 h 2 >0 f f l u (13. 0 ± 0.3 General Tolerance 812/945-0211 812/945-0805 FAX ALL DIMENSIONS IN MILLIMETERS TSOP-2855XX-SMT-TT 28 Position, SM T TSO P , parts/pack) TP = Tape ft Reel (body only) 'Fram es are packaged In vinyl bags 812/945-0211 812
Shenzhen Tiro Semiconductor
Original
door bell encoder circuit diagram of wireless door BELL ic 810 pin diagram chime m1e encoder 16 PIN ic 810
Abstract: D ESCRIPTIO N T he D A C 812 is an ultra-fast-settling 12-bit currento u tp u t D /A converter w , ., C grade; 80nsec, m ax., B grade). T he D A C 812 utilizes a m onolithic 12-bit sw itch chip w ith , voltage w ithout using an external o u tp u t am plifier. T he D A C 812 com es in tw o d rift grades. T , - Cable: B8RC0RP · Telex: 66-6491 PDS-509C Burr-Brown IC D ata B ook 6 .2-146 Vol. 33 , . S ee Figure 5 and Figure 6. Burr-Brown IC D ata Book 6 .2-147 Vol. 33 AUDIO -
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TSOP-3250XX-SMT-TT TSOP-3212XX-SMT-TT S13NOOS TSOP-4050XX-SMT-TT

C812

Abstract: ic AD 812 AN , whichever is less, units shall meet the minimum values below. Tamp. I'C ) MEGxMFDS 100V 200V MEG , .0 5 " .235 235 .235 .235 235 .235 .235 .235 .235 .312 .312 .312 .312 L + .0 5 " .812 .812 .812 .812 .812 .812 .812 .812 .812 .937 .937 .937 LEAD SIZE (AWG) 22 DIMENSIONS D + .0 5 " .235 .235 .235 .235 , .750 .750 .750 1.00 1.00 L + .0 5 " .812 .812 .812 .937 .937 .937 .937 .937 .937 1.062 1.062 .937 .937 , 2.625 2.625 2.125 2.125 20 LEAD SIZE (AWG) 22 PART NUMBER 102 122 152 182 L + .0 5 " .812 .812 .812
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C812 ic AD 812 AN C812G 12-BIT DAC812

mylar capacitor 154

Abstract: 104 mylar capacitor the proprietor. Property of ©BERG ELECTRONICS CD I H -C T R O N I iC e i BIRG 1 , 2.88 [0.113 2.88 [0.113 DIM F . DIM J 32 .11 ± .1 3 ± 005 [1 . 2 6 4 ] REMARKS 84 812-X 0 2Y a 8 4 812-X 0 3Y 84812-X 0 4Y 13.97 [0 .5 5 0 ] 27.94 [1 .0 1 0 ] 41.91 [1 .6 5 0 ] 55.88 [2 , .8 6 [5 . 6 6 4 ] 1 5 7 .8 4 [6 . 2 1 4 ] 171.81 [6 . 7 6 4 ] i §I ! 1 1 84 812-X 0 5Y 84 812-X 0 6Y 84 812-X 0 7Y 84 812-X 0 8Y 8 4 812-X 0 9Y 8 4 812-X 1 0Y 10 11 12 143.44 [5 .6 4 7
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mylar capacitor 154 104 mylar capacitor MIL-C-14157B
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