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Part Manufacturer Description Datasheet BUY
LTC1706EMS-85#TR Linear Technology LTC1706-85 - VID Voltage Programmer for Intel VRM 8.5; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC1706EMS-85#TRPBF Linear Technology LTC1706-85 - VID Voltage Programmer for Intel VRM 8.5; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC1706EMS-85 Linear Technology LTC1706-85 - VID Voltage Programmer for Intel VRM 8.5; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC1706EMS-85#PBF Linear Technology LTC1706-85 - VID Voltage Programmer for Intel VRM 8.5; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC1706EMS-82#TR Linear Technology LTC1706-82 - VID Voltage Programmer for Intel VRM9.0/9.1; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC1706EMS-82#TRPBF Linear Technology LTC1706-82 - VID Voltage Programmer for Intel VRM9.0/9.1; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy

heat pipes intel

Catalog Datasheet MFG & Type PDF Document Tags

050074

Abstract: heat pipes Xeon 5500 Series 2U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL , mainstream PCs. Their unique design removes heat using heat pipes, copper, and aluminum construction. Each , construction focusses on rapid heat removal from the chip using heat pipes, copper, and aluminum geometries , Zipper Fin w/ Advanced Hi-ContactTM Heat Pipes 050076 Backing Plate FOR MORE INFORMATION, VISIT , , E5506, E5504, E5502 Socket Type LGA 1366 Construction Base Aluminum Base w/ Heat Pipes
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LGA1366 050074 heat pipes X5570 heat pipes intel E5520 E5530 14F-4

050235

Abstract: heat pipes INTEL® XEON 5500 SERIES PROCESSORS Aavid's line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper, and aluminum construction , heat pipes, copper, and aluminum geometries CRITICAL APPLICATION NEEDS: · Remove heat from the , Aluminum w/ Heat Pipes 050076 Backing Plate FOR MORE INFORMATION, VISIT OUR WEB SITE , Base Fins Aluminum Fin with Heat Pipes 36.0 1 Thermal Interface Material Shin-Etsu
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050235 shinetsu

050233

Abstract: heat pipes intel Xeon 5500 Series Active 2U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL® XEON 5500 SERIES PROCESSORS Aavid's line of 5500 series processor heat sinks are suitable for mainstream desktop PCs. Their unique design removes heat using heat pipes, copper, and aluminum , chip using heat pipes, copper, and aluminum geometries CRITICAL APPLICATION NEEDS: · Remove heat , Description 050233 Aluminum heat sink w/ Fan & Heat Pipes 050076 Backing Plate FOR MORE
Aavid Thermalloy
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050233 Aavid thermalloy 9000 x.25 intel aavid

050075

Abstract: E5540 Xeon 5500 Series 4U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL® XEON 5500 SERIES PROCESSORS Aavid's line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper, and aluminum construction , heat pipes, copper, and aluminum geometries CRITICAL APPLICATION NEEDS: · Remove heat from the , Aluminum Base, Copper Plate Fins Aluminum Zipper Fin w/ Heat Pipes Thermal Interface Material1
Aavid Thermalloy
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050075 E5540 Intel Xeon 5500 l5520 W5580 l5506

050234

Abstract: LGA1257 Xeon 7500 Series 4U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL® XEON 7500 SERIES PROCESSORS Aavid's line of 7500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper, and aluminum construction , heat pipes, copper, and aluminum geometries CRITICAL APPLICATION NEEDS: · Remove heat from the , Aluminum Zipper Fin with Advanced Hi-ContactTM Heat Pipes 322145 Backing Plate FOR MORE
Aavid Thermalloy
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LGA1257 050234

050232

Abstract: heat pipes Xeon 5500 Series 1U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL® XEON 5500 SERIES PROCESSORS Aavid's line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper, and aluminum construction , heat pipes, copper, and aluminum geometries CRITICAL APPLICATION NEEDS: · Remove heat from the , Aluminum Zipper Fin with Advanced Hi-ContactTM Heat Pipes 050076 Backing Plate FOR MORE
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050232 AAvid 050232 Xeon 5500 X557

E5520

Abstract: LGA1366 Xeon 5500 Series 1U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL® XEON 5500 SERIES PROCESSORS Aavid's line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper, and aluminum construction. Each heat sink comes with the necessary hardware and thermal interface for quick and easy assembly , heat pipes, copper, and aluminum geometries CRITICAL APPLICATION NEEDS: · Remove heat from the
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32-1055

Abstract: heat pipes well as Intel's component specifications. Three Modes of Heat Transfer Conduction Thermal , remove the heat from component, these include: · 14 Heat pipes. A heat pipe is a device with , wick structure (in capillary action) at the inner wall of the heat pipes. This cycle will continue to occur as long as the temperature differential exists. Heat pipes are generally used to transfer the , exchanger. See an example of heat pipe in an active heatsink in Figure 12. In this case the heat pipes aid
Intel
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32-1055 MULTIPLE EFFECT EVAPORATOR intel liquid cooling EP80579 loop heat pipes Sicc EP805799 L5408

prestonia

Abstract: pentium m 790 intel std retention module Test performed with heat pipes in horozontal position Typical case-sink , Robust Design Uses Multiple Heat Pipes = High Performance Grease Interface Standard = Two , P R E L I M I N A R Y ® Pentium 4 1-U High Performance Heat Sink Part Number 037704 HIGH PERFORMANCE HEAT SINK DESIGNED FOR 1-U SERVER APPLICATIONS USING THE PENTIUM® 4 PROCESSOR (423 pin, XeonTM, Foster, Prestonia, Gallatin) Rely on Aavid Thermalloy's high performance heat pipe heat sink where
Aavid Thermalloy
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prestonia pentium m 790 heat sink

agp card

Abstract: keepout on the backside of the AGP card was to allow the addition of a passive or active heat sink to the secondary side of the AGP card. Thermal vias or heat pipes would conduct heat through the card from the , heat sink is mounted to the secondary side of the card and is thermally linked to the thermal vias or heat pipes through the use of thermal grease or similar conducting material. Airflow on the secondary , figure referring to Note 3. Intel
Intel
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agp card

X23776

Abstract: thermal test vehicle -intel Heat Sink for Intel® Nocona TM 3.2GHz in 1U Servers Preliminary PASSIVE HEAT SINK FOR INTEL , ) 224-9988 Heat Sink for Intel® NoconaTM 3.2GHz in 1U Servers Preliminary MECHANICAL DRAWING , Material1 Weight 603 pin and 604 pin Base plate Copper base with embedded heat pipes Fins Aluminum , thermal engineers who require high performance solution for single processor 1U servers. The heat sink exceeds Intel's® performance requirements for both thermal performance and weight. FEATURES AND
Aavid Thermalloy
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X23776 thermal test vehicle -intel G751

aavid

Abstract: heat pipes ) 2.5 (.10) Robust Design Uses Multiple Heat Pipes High Performance Grease Interface Standard = , : Test performed with heat pipes in vertical position Typical case-sink interface resistance = 0.02 to , Pentium® 4 2-U High Performance Heat Sink Part Number 037863 HIGH PERFORMANCE HEAT SINK , , Gallatin) Rely on Aavid Thermalloy's high performance heat pipe heat sink where design flexibility is required in a 2-U form factor. This style of heat sink can be customized to optimize fin spacing (even or
Aavid Thermalloy
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thermalloy 250

Abstract: thermal resistance case heat sink = Robust Design Uses Multiple Heat Pipes = High Performance Grease Interface Standard = , : Test performed with heat pipes in vertical position Typical case-sink interface resistance = 0.02 to , Pentium® 4 4-U High Performance Heat Sink Part Number 037862 HIGH PERFORMANCE HEAT SINK , , Gallatin) Rely on Aavid Thermalloy's high performance heat pipe heat sink where maximum thermal performance is required in a 4-U form factor. This style of heat sink can be customized to optimize fin
Aavid Thermalloy
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thermalloy 250 thermal resistance case heat sink AAVID/- 315G 444X

honeywell pcm45

Abstract: G751 Heat Sink for Intel ® XeonTM Potomac MP and Nocona DP Processors in 4U Servers PASSIVE HEAT , solution for multi processor 4U servers. The heat sink is based on Intel's® recommended design and meets , requirements for the Intel® CEK retention system · Easy to attach · Hardware is captive to the heat sink , : WWW.AAVIDTHERMALLOY.COM TEL: (603) 224-9988 Heat Sink for Intel ® XeonTM Potomac MP and Nocona DP in 4U Servers , Aluminum frame with copper slug and embedded heat pipes Fins Stamped aluminum fins Shin Etsu G751
Aavid Thermalloy
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honeywell pcm45 CEK 550 PCM45F
Abstract: find the widest applicability. Loop Heat Pipes for Cooling Computer Processors Heat pipes are , acquire, transport and reject heat from a source to a sink. The fact that heat pipes do not use , than heat pipes offer. Performance advantages include: â'¢ Higher maximum heat load â'¢ Longer , , et al [1] reported on the development and testing of various miniaturized loop heat pipes using , the CPU fan Fig. 7. Loop heat pipes installed in 1U server. heat sinks are about 72 °C, slightly Aavid Thermalloy
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N00024-04-C-4189

intel packaging handbook 240800

Abstract: CompactPCI specification of heat through the board to the opposite side where thermal enhancements (heat sinks, fans, pipes , the address listed in Appendix A. AP-759 7.1 Extruded Heat Sink Solution The Intel , lowers the performance of the heat pipe. Heat pipes can have a long life of 100,000 hours or more , Precaution The heat sink temperature should not rise above 95 °C at worst case power conditions. Intel , A AP-759 APPLICATION NOTE Intel Embedded Processor Module (EMBMOD133) Thermal Design
Intel
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intel packaging handbook 240800 CompactPCI specification 273143 TXC 82439HX 82439HX EMBMOD166

5TC-TTK-36-36

Abstract: 5tc-tt-k-36-36 ., heat sinks, pipes) are attached. Solder-side heat sinking, compared to TCP com ponent-side heat sinking , therm ocouples. Intel's laboratory testing was done using a therm ocouple m ade by Om ega (part number , using highly therm ally conductive cem ents. Intel's laboratory testing was done by using O m ega Bond , prim ary heat transfer path from the die of the TC P is through the back side of the die and into the , spread of heat w ithin the board and the dissipation of heat by the board to the am bient air. T he other
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5TC-TTK-36-36 5tc-tt-k-36-36 243292B

intel packaging handbook 240800

Abstract: hot wire mass airflow sensor of heat through the board to the opposite side where thermal enhancements (heat sinks, fans, pipes , requirements. Intel only offers the Embedded Processor Module with a heat sink. The three available solutions , " Max Figure 4. Extruded Heat Sink Application Note 11 Intel Embedded Processor Module , Application Note Intel Embedded Processor Module Thermal Design Guide Figure 6. Corrugated Heat Sink , Note 15 Intel Embedded Processor Module Thermal Design Guide 7.7 Heat Sink Handling Safety
Intel
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hot wire mass airflow sensor tuflok 75307 intel 82439hx 43537 data sheet IC 7408 C0180-018-0250 IASK9801 NP970255

embedded rtos for voice over ip

Abstract: Nortel OC192 there are several passive thermal control Controller methods, like heat plates/pipes and finned heat , Engineer, Intel Corporation C ommunication-it makes the world go 'round. Yet today , : Intel Corporation 5000 West Chandler Blvd. Chandler, AZ 85226 Internet WEB address: http , D E D R E V I E W 2 INTEL CORPORATION Building Embedded Systems for an IP World A wide , enable companies Processor ASIC MAC to derive benefit from the huge investment in Intel® Architecture (IA
Intel
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embedded rtos for voice over ip Nortel OC192

Intel reflow soldering profile BGA

Abstract: socket s1 REFLOW PROFILE active or passive thermal management devices such as heat sinks or heat pipes. The electrical , CH14WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 14 AN INTRODUCTION TO PLASTIC , with heatsinks 14-1 1/17/97 9:57 AM CH14WIP.DOC INTEL CONFIDENTIAL (until publication , Solder Balls Figure 14-1. PBGA Die Up Cross-Section 14-2 1/17/97 9:57 AM CH14WIP.DOC INTEL , /17/97 9:57 AM CH14WIP.DOC INTEL CONFIDENTIAL (until publication date) AN INTRODUCTION TO
Intel
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Intel reflow soldering profile BGA socket s1 REFLOW PROFILE intel topside mark outline of the heat slug for JEDEC pbga package weight BGA OUTLINE DRAWING
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