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Part Manufacturer Description Datasheet BUY
TPSM84824MOLR Texas Instruments 4.5V to 17V Input, 0.6V-10V Output, 8A Power Module in Compact 7.5x7.5mm Footprint 24-QFM -40 to 105 visit Texas Instruments
PTPSM84824MOLR Texas Instruments 4.5V to 17V Input, 0.6V-10V Output, 8A Power Module in Compact 7.5x7.5mm Footprint 24-QFM -40 to 105 visit Texas Instruments Buy
ISO7142CCQDBQQ1 Texas Instruments Automotive, Small Footprint, Low Power, Quad-Channel 2/2 Digital Isolator 16-SSOP -40 to 125 visit Texas Instruments
ISO7142CCQDBQRQ1 Texas Instruments Automotive, Small Footprint, Low Power, Quad-Channel 2/2 Digital Isolator 16-SSOP -40 to 125 visit Texas Instruments Buy
REF3425IDBVR Texas Instruments Low-Drift Low-Power Small-Footprint Series Voltage Reference 6-SOT-23 -40 to 125 visit Texas Instruments
REF2125IDBVR Texas Instruments Low-Drift Low-Power Small-Footprint Series Voltage Reference With Clean Start 5-SOT-23 -40 to 125 visit Texas Instruments

footprint cqfp 280

Catalog Datasheet MFG & Type PDF Document Tags

footprint cqfp 280

Abstract: HV3418 www.supertex.com HV3418 Ordering Information Package Options 80-Lead CQFP Ceramic Device 80-Lead PQFP , Output voltage, VPP 1 80-Lead CQFP Ceramic (DG) VDD to +200V Logic input levels -0.5V to , Number YY = Year Sealed WW = Week Sealed C = Country of Origin A = Assembler ID 80-Lead CQFP , -Lead CQFP (Ceramic) Package Outline (DG) 20.00x14.00mm body, 3.40mm height (max), 0.80mm pitch, 3.90mm footprint D D1 1 E Note 1 (Index Area D1/4 x E1/4) E1 Gauge Plane L2 80 1 e
Supertex
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footprint cqfp 280 HV3418DG HV3418PG mo-112 HVOUT64 MO-112 DSPD-80PQFPPG B101708 DSFP-HV3418 A120308

footprint cqfp 280

Abstract: Information Package Options Device 80-Lead CQFP Ceramic 20.00x14.00mm body 3.40mm height (max) 0.80mm pitch , HV3418PG-G 80 -G indicates package is RoHS compliant (`Green') 80-Lead CQFP Ceramic (DG) (top view , -Lead CQFP Ceramic (DG) HV3418PG L = Lot Number YY = Year Sealed WW = Week Sealed C = Country of Origin A = , , CA 94089 Tel: 408-222-8888 www.supertex.com 6 HV3418 80-Lead CQFP (Ceramic) Package Outline (DG) D D1 20.00x14.00mm body, 3.40mm height (max), 0.80mm pitch, 3.90mm footprint E E1 Note
Supertex
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C041309 A021711

smd code F18

Abstract: act-s512k32n CQFP(F1), 1.56"SQ x .140"max 68­Lead, Dual-Cavity CQFP(F2), 0.88"SQ x .20"max (.18 max thickness available, contact factory for details) (Drops into the 68 Lead JEDEC .99"SQ CQFJ footprint) 68­Lead, Single-Cavity CQFP (F18), .94"SQ x .140"max (Drops into the 68 Lead JEDEC .99"SQ CQFJ footprint) 66 Pin, 1.38 , ,P1,P7) Block Diagram ­ PGA Type Package (P1,P7) & CQFP (F2,F18) Pin Description WE1 CE1 WE2 CE2 , Not Connected Block Diagram ­ CQFP(F1) Pin Description CE1 CE2 CE4 I/O0-31 CE3 WE OE
Aeroflex Circuit Technology
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smd code F18 act-s512k32n ACT-S512K32N-017P7Q 5962-9461110HTC 5962-9461110 CQFP 80 S512K32 MIL-PRF-38534 I/O8-15 I/O24-31 2K32N 020F2Q

cpu aeroflex

Abstract: CQFP 240 Aeroflex Footprint Compatible with Aeroflex's original ACT-4431SC 1MB Secondary Cache MCM in the 280 lead Ceramic , 280 Lead CQFP JTDI JTDO JTMS JTCK JTAG Interface ModeClock ModeIn VccOk ColdReset , 9 ACT5271SC REV A 2/2/01 Plainview NY (516) 694-6700 Package Information ­ "F10" ­ CQFP 280 , Screening Speed (MHz) Package ACT-5271SC-150F10C Commercial Temperature 150 280 Lead CQFP , 2.525" x 1.768" x 280 Lead CQFP 150 = 150MHz * Screened to the individual test methods of MIL-STD
Aeroflex Circuit Technology
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RM5271 R4400 cpu aeroflex CQFP 240 Aeroflex military mcm cpu ACT-5271SC 150MH 4-128K 1-64K

5271SC

Abstract: military mcm 1553 www.aeroflex.com/Avionics May 5, 2005 FEATURES Footprint Compatible with Aeroflex-Plainview original ACT4431SC 1MB Secondary Cache MCM in a 280 lead Ceramic Quad Flat Pack (CQFP) QED RM5271 Dual Issue , * 64 CPUInt(5:0)* NMI* 2 8 ACT-5271SC Multichip Module 280 Lead CQFP JTDI JTDO , SysAD12 Vss SysAD44 Vcc NC Vss PACKAGE INFORMATION ­ "F10" ­ CQFP 280 LEADS 2.525 MAX 2.125 , SPEED (MHZ) PACKAGE ACT-5271SC-150F10C Commercial Temperature 150 280 Lead CQFP ACT
Aeroflex Microelectronic Solutions
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5271SC military mcm 1553 MIL-STD-883 800-THE-1553 SCD5271SC

5962-9461110HTC

Abstract: ACT-S512K32N-017P7Q Mount Packages, and two PGA Type Package G 68­Lead, Low Profile CQFP(F1), 1.56"SQ x .140"max G 68­Lead, Dual-Cavity CQFP(F2), 0.88"SQ x .20"max (.18 max thickness available, contact factory for details) (Drops into the 68 Lead JEDEC .99"SQ CQFJ footprint) G 66 Pin, 1.38" x 1.38" x .245" PGA Type, Aeroflex code , ,P7) & CQFP (F2) Pin Description WE1 CE1 WE2 CE2 WE3 CE3 WE4 CE4 I/O0-31 Data I/O A0 , Inputs WE1­4 A0 ­ A18 OE Ground NC Not Connected Block Diagram ­ CQFP(F1) Pin
Aeroflex Circuit Technology
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F1 Package I/O16-23 S512K32N 017F1Q 020F1Q 025F1Q 034F1Q

r5xx

Abstract: ars 185 increments) Footprint Compatible with Aerofiex's original R4400 1MB Secondary Cache MCM MIPS 5XXX Dual , integrated FPGA 280 lead Ceramic Quad Flat Pack package BLOCK DIAGRAM Interface Interface , processor CQFP Pinouts - "F10" Pin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 , Technology 5 ACT5XXX REV 1 9/26/97 Plainview NY (516) 694-6700 ACT5XXXSC Micro processor CQFP , 278 279 280 Function Vss Sys C m d 3 Vcc Sys AD 7 Vss Sys AD 39 Vcc Sys C m d 4 Vss Sys ADC 0 Vcc Sys
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OCR Scan
r5xx ars 185 R4600 R4700 R5000 X-----85

CCGA 484 socket

Abstract: PQFP208 PCB footprints with lead-forming guidelines for the 208-CQFP/208PQFP and 288-CQFP. We are also offering socket adapters for 280 BPGA and 484 PBGA to match the socket for a plastic package to the corresponding ceramic footprint (i.e. 280 PBGA/288 CQFP, 484 PBGA/484 CLGA). Question 4) What type of
Aeroflex
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UT6325 PQFP208 PBGA280 PBGA484 CCGA 484 socket CLGA484 RAM EDAC SEU CQFP208 CQFP288 CCGA/CLGA484

TSOP 56 socket

Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC deliver higher lead counts reduced pitch minimum footprint area and significant overall volume reduction , Max Footprint (inches) UV Eraseable Shipping Media Tubes Tape Reel Trays X X Desiccant , Note X X X X X Weight (gm) Max Footprint (inches) UV Eraseable Shipping Media , 208 S S S S S S S S S 240 ­ 280 272 ­ 320 S S Pitch (inches) 0 , 69 8 69 10 43 10 43 10 43 16 07 Max Footprint (inches) 1 15 1 15 1 15 1 35 1
Intel
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TSOP 56 socket 64 CERAMIC LEADLESS CHIP CARRIER LCC Package characteristics and in-depth data for electrical 50 mil pitch ceramic package covers assembly manufacturing technology. CERAMIC CHIP CARRIER LCC 68 socket MC00XFLKA NC110XX

ARINC 629 sim

Abstract: m38510/55501 ., C-Com. Temp. PACKAGES Surface Mount F10=2.50" x 1.75" 280-lead CQFP F17=1.12" x 1.12" 208-lead CQFP F19=1.28" X 1.28" 240-lead CQFP F21=1.09" X 1.09" 208-lead MQUAD F22=1.10" X 1.10" 128 , shoulders CQFP 68-lead (Fits in standard .99"sq. 68-lead JEDEC footprint) F1 ~ 1.56"sq. x .14" ht , . 5962-93187(10 to 06)H4C ACT-S128K32N-(017 to 045)F1X 68 CQFP 1.56" sq. 5962-95595(10 to 06)HYC ACT-S128K32N-(017 to 045)F1X 68 CQFP 1.56" sq. 5962-95595(10 to 06)HXC ACT-S128K32N-(017 to 045)F2X
Aeroflex
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UT69151 ACT8600 ARINC 629 sim m38510/55501 AMP ARINC-629 SIM MT72038 CQFP 240 smd cmos 4435 UT1553B UT1553 UT1760A ARX5009 ARX5010

9835M

Abstract: EDI8C32128LP35E JLCC, No. 304 · 68 Lead CQFP, No. 405 · Multiple Ground Pins for Maximum Noise Immunity Single +5 V , to upgrade to 16Mb, 512Kx32, in the same footprint. The device may be screened in accordance with , O CQFP & JLCC Pinout 1 12 23 O O O 000 000 O O O O o O 00 ` Address Lines for 612K , 280 240 90 60 45 +10 +10 0.45 Unis mA mA mA mA mA mA mA mA mA HA MA V V 50 40 _ _ _ 24
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OCR Scan
9835M EDI8C32128LP35E SPF 775 EDI8C32128C EDI8C32128LP MIL-PRF38535 2128LP35EQ EDI8C32128LP45EQ EDI8C32128LP55EQ

PGA175

Abstract: XC3000L performance-optimized relative of the XC3000L and XC3100A families. While all families are footprint compatible, the , 15 pF pF 15 20 0.17 2.80 pF pF mA mA 0.40 0.2 2.30 -10 0.02 0.20 Notes , TOPBRAZED CQFP CB100 Adv. PINS 132 PLAST. CERAM. PLAST. PGA PGA TQFP TYPE CODE XC3142L , . PLAST. CERAM. PLAST. BRAZED PQFP PGA PGA TQFP CQFP PQ160 CB164 PP175 PG175 TQ176 208 223
Xilinx
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XC3100L XC4000 XC3000A XC3000 XC3190L PGA175 gate drive calculator X5425 X3029

EM-553 motor

Abstract: UT16AD40P 300 300 55 1 20 1 20 1 20 1 20 ±5V 1.8/3.3V 1.8/3.3V 1.8/3.3V 1.8/3.3V 28 FP 100 CQFP 100 CQFP 100 CQFP 100 CQFP S Q,V* Q,V* Q,V* Q,V* TBD TBD TBD TBD 16-bit, 40-MSps pipeline , interfacing many sensor voltage readings to the digital processor data bus. 48 CQFP 5962-1 220301KXC , 1 20 1 20 90 1 20 1 20 90 100 16 SOIC 56 CQFP 56 CQFP 56 CQFP 24 SOIC 24 SOIC 24 SOIC 56 CQFP 56 CQFP 56 CQFP 56 CQFP 56 CQFP 56 CQFP 56 CQFP 56 CQFP 56 CQFP 96 CQFP 96 CQFP 96 CQFP 96 CQFP 96 CQFP 96
Aeroflex Colorado Springs
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EM-553 motor UT16AD40P BUS-8553 CD4583 spw 068 power supply spw 068 RS485

RTAX2000S

Abstract: RTAX1000S-CQ352 CQFP RTAX250S 250,000 30,000 1,408 2,816 2,816 12 54 K 4 4 8 248 744 ­ 208, 352 RTAX1000S 1,000,000 125 , 198 ­ ­ RTAX1000S ­ ­ 198 402 402 RTAX2000S ­ 138 198 418 684 Note: CQFP = Ceramic Quad Flat Pack , . . . . . . . . . . . . 2-80 Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-82 Package Pin Assignments 208-Pin CQFP . . . , . . . 3-1 256-Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Actel
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RTAX1000S-CQ352 RTAX2000S-CQ352 TM1019 TM3015 608-B

RTAX2000

Abstract: mb 8739 input 316 I/O, 25 input 208 CQFP 288 CQFP 484 CCGA Q 5962-04229 UT6325 Rapid Prototyping , 99 I/O, 25 input 163 I/O, 25 input 310 I/O, 25 input 208 PQFP 280 PBGA 484 PBGA N/A I /O , performance and an optimised hardware resource footprint. SnapGear Embedded LINUX for LEON LINUX is , -lead (CQFP) 5962-0050201KXC 20 1 1.320" SQ 96-lead (CQFP) 5962-0050202KXC 1 3 300 20 1 1.320" SQ 96-lead (CQFP) 5962-0323401KXC 1 3 300 20 1 1.320" SQ 96
Aeroflex Colorado Springs
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RTAX2000 mb 8739 Xilinx VIRTEX-5 xc5vlx50 UT63M143 5962R99B0106V4C UT229FCMV4 UT691 UT63M1

RTAX2000

Abstract: RTAX2000S RAM Bits (K = 1,024) I/Os I/O Banks User I/Os (maximum) I/O Registers Package CCGA/LGA* CQFP , pin compatible. 3. CQFP = Ceramic Quad Flat Pack, CCGA = Ceramic Column Grid Array, and LGA = Land , . . . . . . 2-135 Package Pin Assignments 208-Pin CQFP . . . . . . . . . . . . . . . . . . . . . , . . . . . . . 3-1 256-Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , -Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Actel
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RTAX1000SL rtax250 RTAX250SL RTAX4000SL RTAX1000 rtax2000sl MIL-STD-883B

RTAX2000S

Abstract: MIL-PRF-38535 appendix a Registers Package CCGA/LGA CQFP May 2009 © 2009 Actel Corporation RTAX250S/SL RTAX1000S/SL , Note: CQFP = Ceramic Quad Flat Pack and CCGA = Ceramic Column Grid Array, LGA = Land Grid Array I/Os , 208-Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 256-Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4 352-Pin CQFP . . . . . . . . . . . . . . .
Actel
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MIL-PRF-38535 appendix a diode smd f6 sl cga 624 TDC 1809 624-CCGA ACTEL CCGA to FBGA Adapter

624 CCGA

Abstract: ACTEL CCGA 624 mechanical CQFP RTAX250S 250,000 30,000 1,408 2,816 2,816 12 54K 4 4 8 248 744 ­ 208, 352 RTAX1000S 1,000,000 125 , 198 402 402 RTAX2000S ­ 138 198 418 684 Note: CQFP = Ceramic Quad Flat Pack and CCGA = Ceramic , -Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 256-Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4 352-Pin CQFP . . . . . . . . . . . . . . . . . . . . .
Actel
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624 CCGA ACTEL CCGA 624 mechanical CCGA
Abstract: CCGA CQFP May 2004 © 2004 Actel Corporation RTAX250S RTAX1000S RTAX2000S 250,000 30 , â'" 418 418 Note: CQFP = Ceramic Quad Flat Pack and CCGA = Ceramic Column Grid Array ii , -Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 352-Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , the appropriate RTAX-S package footprint This methodology provides the user with a cost-effective Actel
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RTAX2000

Abstract: RTAX1000S I/Os I/O Banks User I/Os (Maximum) I/O Registers Package CCGA CQFP RTAX250S 250,000 30,000 1,408 2 , RTAX1000S ­ 198 418 RTAX2000S ­ 198 418 Note: CQFP = Ceramic Quad Flat Pack and CCGA = Ceramic Column , . . . . . 2-77 Package Pin Assignments 208-Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 352-Pin CQFP . . . . . . . . , device package to the appropriate RTAX-S package footprint · This methodology provides the user
Actel
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actel cqfp 84
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