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Part Manufacturer Description PDF Samples Ordering
FDJ1027P Fairchild Semiconductor Corporation -20V P-Channel 1.8V Specified PowerTrench® MOSFET, 6LD, FLMP, SC75 FOOTPRINT, 1.65MM WIDE, DUAL DIE, 3000/TAPE REEL pdf Buy
FDJ1028N Fairchild Semiconductor Corporation 20V N-Channel 2.5Vgs Specified PowerTrench® MOSFET, 6LD, FLMP, SC75 FOOTPRINT, 1.65MM WIDE, DUAL DIE, 3000/TAPE REEL pdf Buy
FDJ1032C Fairchild Semiconductor Corporation 20V Complementary PowerTrench® MOSFET, 6LD, FLMP, SC75 FOOTPRINT, 1.65MM WIDE, DUAL DIE, 3000/TAPE REEL pdf Buy

footprint cqfp 280

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: www.supertex.com HV3418 HV3418 Ordering Information Package Options 80-Lead CQFP Ceramic Device 80-Lead PQFP , Output voltage, VPP 1 80-Lead CQFP Ceramic (DG) VDD to +200V Logic input levels -0.5V to , Number YY = Year Sealed WW = Week Sealed C = Country of Origin A = Assembler ID 80-Lead CQFP , -Lead CQFP (Ceramic) Package Outline (DG) 20.00x14.00mm body, 3.40mm height (max), 0.80mm pitch, 3.90mm footprint D D1 1 E Note 1 (Index Area D1/4 x E1/4) E1 Gauge Plane L2 80 1 e ... Supertex
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8 pages,
510.51 Kb

mo-112 HV3418PG HV3418DG HV3418 footprint cqfp 280 TEXT
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Abstract: Information Package Options Device 80-Lead CQFP Ceramic 20.00x14.00mm body 3.40mm height (max) 0.80mm pitch , HV3418PG-G HV3418PG-G 80 -G indicates package is RoHS compliant (`Green') 80-Lead CQFP Ceramic (DG) (top view , -Lead CQFP Ceramic (DG) HV3418PG HV3418PG L = Lot Number YY = Year Sealed WW = Week Sealed C = Country of Origin A = , , CA 94089 Tel: 408-222-8888 www.supertex.com 6 HV3418 HV3418 80-Lead CQFP (Ceramic) Package Outline (DG) D D1 20.00x14.00mm body, 3.40mm height (max), 0.80mm pitch, 3.90mm footprint E E1 Note ... Supertex
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datasheet

8 pages,
544.25 Kb

footprint cqfp 280 HV3418 TEXT
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Abstract: CQFP(F1), 1.56"SQ x .140"max 68­Lead, Dual-Cavity CQFP(F2), 0.88"SQ x .20"max (.18 max thickness available, contact factory for details) (Drops into the 68 Lead JEDEC .99"SQ CQFJ footprint) 68­Lead, Single-Cavity CQFP (F18), .94"SQ x .140"max (Drops into the 68 Lead JEDEC .99"SQ CQFJ footprint) 66 Pin, 1.38 , ,P1,P7) Block Diagram ­ PGA Type Package (P1,P7) & CQFP (F2,F18) Pin Description WE1 CE1 WE2 CE2 , Not Connected Block Diagram ­ CQFP(F1) Pin Description CE1 CE2 CE4 I/O0-31 I/O0-31 CE3 WE OE ... Aeroflex Circuit Technology
Original
datasheet

9 pages,
197.14 Kb

footprint cqfp 280 CQFP 80 5962-9461110 ACT-S512K32N-017P7Q 5962-9461110HTC smd code F18 act-s512k32n S512K32 TEXT
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Abstract: Footprint Compatible with Aeroflex's original ACT-4431SC ACT-4431SC 1MB Secondary Cache MCM in the 280 lead Ceramic , 280 Lead CQFP JTDI JTDO JTMS JTCK JTAG Interface ModeClock ModeIn VccOk ColdReset , 9 ACT5271SC ACT5271SC REV A 2/2/01 Plainview NY (516) 694-6700 Package Information ­ "F10" ­ CQFP 280 , Screening Speed (MHz) Package ACT-5271SC-150F10C ACT-5271SC-150F10C Commercial Temperature 150 280 Lead CQFP , 2.525" x 1.768" x 280 Lead CQFP 150 = 150MHz * Screened to the individual test methods of MIL-STD ... Aeroflex Circuit Technology
Original
datasheet

11 pages,
112.29 Kb

RM5271 R4400 military mcm cpu CQFP 240 Aeroflex cpu aeroflex ACT-5271SC TEXT
datasheet frame
Abstract: www.aeroflex.com/Avionics May 5, 2005 FEATURES Footprint Compatible with Aeroflex-Plainview original ACT4431SC ACT4431SC 1MB Secondary Cache MCM in a 280 lead Ceramic Quad Flat Pack (CQFP) QED RM5271 RM5271 Dual Issue , * 64 CPUInt(5:0)* NMI* 2 8 ACT-5271SC ACT-5271SC Multichip Module 280 Lead CQFP JTDI JTDO , SysAD12 Vss SysAD44 Vcc NC Vss PACKAGE INFORMATION ­ "F10" ­ CQFP 280 LEADS 2.525 MAX 2.125 , SPEED (MHZ) PACKAGE ACT-5271SC-150F10C ACT-5271SC-150F10C Commercial Temperature 150 280 Lead CQFP ACT ... Aeroflex Microelectronic Solutions
Original
datasheet

12 pages,
133.54 Kb

RM5271 R4400 military mcm cpu military mcm 1553 ACT5271SC TEXT
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Abstract: Mount Packages, and two PGA Type Package G 68­Lead, Low Profile CQFP(F1), 1.56"SQ x .140"max G 68­Lead, Dual-Cavity CQFP(F2), 0.88"SQ x .20"max (.18 max thickness available, contact factory for details) (Drops into the 68 Lead JEDEC .99"SQ CQFJ footprint) G 66 Pin, 1.38" x 1.38" x .245" PGA Type, Aeroflex code , ,P7) & CQFP (F2) Pin Description WE1 CE1 WE2 CE2 WE3 CE3 WE4 CE4 I/O0-31 I/O0-31 Data I/O A0 , Inputs WE1­4 A0 ­ A18 OE Ground NC Not Connected Block Diagram ­ CQFP(F1) Pin ... Aeroflex Circuit Technology
Original
datasheet

8 pages,
168.12 Kb

F1 Package ACT-S512K32N-017P7Q 5962-9461110HTC S512K32 TEXT
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Abstract: increments) Footprint Compatible with Aerofiex's original R4400 R4400 1MB Secondary Cache MCM MIPS 5XXX Dual , integrated FPGA 280 lead Ceramic Quad Flat Pack package BLOCK DIAGRAM Interface Interface , processor CQFP Pinouts - "F10" Pin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 , Technology 5 ACT5XXX REV 1 9/26/97 Plainview NY (516) 694-6700 ACT5XXXSC Micro processor CQFP , 278 279 280 Function Vss Sys C m d 3 Vcc Sys AD 7 Vss Sys AD 39 Vcc Sys C m d 4 Vss Sys ADC 0 Vcc Sys ... OCR Scan
datasheet

7 pages,
402.59 Kb

ars 185 TEXT
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Abstract: PCB footprints with lead-forming guidelines for the 208-CQFP/208PQFP and 288-CQFP. We are also offering socket adapters for 280 BPGA and 484 PBGA to match the socket for a plastic package to the corresponding ceramic footprint (i.e. 280 PBGA/288 PBGA/288 CQFP, 484 PBGA/484 PBGA/484 CLGA). Question 4) What type of ... Aeroflex
Original
datasheet

9 pages,
33.49 Kb

UT6325 5962-04229 8051 microcontroller user manual clock distribution "space qualified" microcontroller radiation tolerance 5962-0422 RAM EDAC SEU SDRAM edac socket CCGA 484 transistor smd qe PBGA484 CLGA484 PBGA280 PQFP208 CCGA 484 socket TEXT
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Abstract: deliver higher lead counts reduced pitch minimum footprint area and significant overall volume reduction , Max Footprint (inches) UV Eraseable Shipping Media Tubes Tape Reel Trays X X Desiccant , Note X X X X X Weight (gm) Max Footprint (inches) UV Eraseable Shipping Media , 208 S S S S S S S S S 240 ­ 280 272 ­ 320 S S Pitch (inches) 0 , 69 8 69 10 43 10 43 10 43 16 07 Max Footprint (inches) 1 15 1 15 1 15 1 35 1 ... Intel
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19 pages,
220.72 Kb

240817 50 mil pitch ceramic package CERAMIC CHIP CARRIER LCC 68 socket CERAMIC LEADLESS CHIP CARRIER ic packages intel packaging QFP 64 Cavity dip QFP 64 Cavity package 64 CERAMIC LEADLESS CHIP CARRIER LCC TSOP 56 socket TEXT
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Abstract: ., C-Com. Temp. PACKAGES Surface Mount F10=2.50" x 1.75" 280-lead CQFP F17=1.12" x 1.12" 208-lead CQFP F19=1.28" X 1.28" 240-lead CQFP F21=1.09" X 1.09" 208-lead MQUAD F22=1.10" X 1.10" 128 , shoulders CQFP 68-lead (Fits in standard .99"sq. 68-lead JEDEC footprint) F1 ~ 1.56"sq. x .14" ht , . 5962-93187(10 to 06)H4C ACT-S128K32N- ACT-S128K32N-(017 to 045)F1X 68 CQFP 1.56" sq. 5962-95595(10 to 06)HYC ACT-S128K32N- ACT-S128K32N-(017 to 045)F1X 68 CQFP 1.56" sq. 5962-95595(10 to 06)HXC ACT-S128K32N- ACT-S128K32N-(017 to 045)F2X ... Aeroflex
Original
datasheet

12 pages,
156.82 Kb

ARINC-629 ACT-F2M32A CQFP 240 Aeroflex arinc 429 serial transmitter ARINC629 military relay ACT-SF128K16N-3570F18X UT69151 ACT8502 ACT8600 CERAMIC PIN GRID ARRAY CPGA lead frame P2X smd arinc 629 controller arinc 629 CQFP 240 smd cmos 4435 AMP ARINC-629 SIM m38510/55501 ARINC 629 sim TEXT
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Archived Files

Abstract Saved from Date Saved File Size Type Download
No abstract text available
/download/90212243-999460ZC/dbookold.zip ()
Xilinx 07/09/1996 10340.01 Kb ZIP dbookold.zip