500 MILLION PARTS FROM 12000 MANUFACTURERS

DATASHEET SEARCH ENGINE

Top Results

Part Manufacturer Description Datasheet BUY
TPSM84824MOLR Texas Instruments 4.5V to 17V Input, 0.6V-10V Output, 8A Power Module in Compact 7.5x7.5mm Footprint 24-QFM -40 to 105 visit Texas Instruments
PTPSM84824MOLR Texas Instruments 4.5V to 17V Input, 0.6V-10V Output, 8A Power Module in Compact 7.5x7.5mm Footprint 24-QFM -40 to 105 visit Texas Instruments Buy
ISO7142CCQDBQQ1 Texas Instruments Automotive, Small Footprint, Low Power, Quad-Channel 2/2 Digital Isolator 16-SSOP -40 to 125 visit Texas Instruments
REF3425IDBVR Texas Instruments Low-Drift Low-Power Small-Footprint Series Voltage Reference 6-SOT-23 -40 to 125 visit Texas Instruments Buy
REF2125IDBVR Texas Instruments Low-Drift Low-Power Small-Footprint Series Voltage Reference With Clean Start 5-SOT-23 -40 to 125 visit Texas Instruments Buy
ISO7142CCQDBQRQ1 Texas Instruments Automotive, Small Footprint, Low Power, Quad-Channel 2/2 Digital Isolator 16-SSOP -40 to 125 visit Texas Instruments Buy

footprint mlf

Catalog Datasheet MFG & Type PDF Document Tags

LM317 SOT223

Abstract: lm317 datasheet for 5v to 3.3v regulators are offered in small footprint MLF-10 packages, and offer a variety of configurations. The
Xilinx
Original

soic8 footprint

Abstract: soic8 SA25F040 in leadless MLF packages). The devices' small footprint saves board space and reduces system , , the SA25F System cost is affected by both footprint and package cost. Saifun's 512Kb to 16Mb SPI Serial Flash devices have the same small footprint as the industry standard's 8-pin narrow SOIC , with Saifun NROM technology and the devices' small footprint, gives a clear migration path from , MY CY CMY K Saifun's SA25F Family of SPI Serial Flash Memory Devices Small Footprint · 8
Saifun Semiconductors
Original
soic8 footprint soic8 SA25F040 SA25F080 SA25F160 16x512 footprint soic8 150 SA25F-

SA25C020

Abstract: SA25C1024 Key Features Small Footprint · 8-pin narrow SOIC package and lowprofile MLF leadless package The , footprint and package cost. Saifun's 512Kb to 2Mb SPI Serial EEPROM devices have the same small footprint as the industry standard's 8-pin narrow SOIC packages, or leadless MLF packages. The devices' small footprint saves board space and reduces system overhead cost. Enables new features and , Saifun NROM technology and the devices' small footprint, gives a clear migration path from low-density
Saifun Semiconductors
Original
SA25C020 SA25C1024 SA25C512 2Mb SPI flash Saifun SAIFUN SEMICONDUCTORS LTD SA25C- SA25C

SU-25

Abstract: AT45DB041B-RU -pad MLF. The 8-pad CASON has been replaced with the footprint compatible 8-lead SOIC, or for height restricted applications the narrow body MLF. 0.25mm Device 0.13mm Replacement Note AT45DB041B-CC , Note 1: Atmel recommends the 8-pad MLF package as a leadless small form factor alternative. A Board , change is required, or SU for footprint compatibility. Note 3: Atmel recommends the 8-pin SSU or SU for long term footprint migration path. Board change is required.recommends the 8-pin SOIC, either narrow
Atmel
Original
AT45DB041B-CI AT45DB041B-CU AT45DB041B-CNC AT45DB041B-CNI AT45DB041B-CNU SU-25 AT45DB041B-RU SU25 footprint mlf 8 soic pcb footprint SC061901 AT45DB041D-MU AT45DB041B-CC-2 AT45DB041D- AT45DB041B-CI-2

footprint mlf

Abstract: Security Cards cost is affected by both footprint and package cost. Saifun's 512Kb and 1Mb IIC Serial EEPROM devices have the same small footprint as the industry standard's 8-pin SOIC packages, and leadless MLF packages. The devices' small footprint saves board space and reduces system overhead cost. This enables , Devices Key Features Small Footprint · 8-pin SOIC package and low-profile MLF leadless package , , taken together with Saifun NROM technology and the devices' small footprint, gives a clear migration
Saifun Semiconductors
Original
SA24C Security Cards SA24C1024 SA24C512 400KH

marking AGW

Abstract: MIC5335 offered in the ultra small 1.6mm x ® 1.6mm 6-ld Thin MLF package which is only 2.56mm2 in area of the SOT-23, TSOP and the 3mm x ® 3mm MLF package. The MIC5335 delivers exceptional thermal , voltage range Ultra-low dropout voltage: 75mV at 300mA Ultra Thin 1.6mm x 1.6mm 6 lead MLF® package , : www.micrel.com. Typical Application MicroLead Frame and MLF are registered trademarks of Amkor Technologies , MIC5335-GFYMT AGF 1.8V/1.5V ­40°C to +125°C 6-Pin 1.6x1.6 Thin MLF® MIC5335-1.8/1.6YMT
Micrel Semiconductor
Original
marking AGW ASG sot-23 MIC5335-MGYMT M9999-010407

regulator 6pin

Abstract: MIC5335 . The MIC5335 is offered in the ultra small 1.6mm x ® 1.6mm x 0.55mm 6-ld Thin MLF package, which is , voltage: 75mV at 300mA · Ultra Small 1.6mm x 1.6mm x 0.55mm 6 lead MLF® package · Independent enable , trademark of Micrel, Inc. MLF and MicroLead Frame are registered trademarks of Amkor Technologies. Micrel , MIC5335-GFYMT GPF 1.8V/1.5V ­40°C to +125°C 6-Pin 1.6x1.6 Thin MLF® MIC5335-1.8/1.6YMT MIC5335-GWYMT GPW 1.8V/1.6V ­40°C to +125°C 6-Pin 1.6x1.6 Thin MLF® MIC5335-1.8/1.8YMT
Micrel Semiconductor
Original
regulator 6pin M9999-051508

footprint mlf

Abstract: MIC5335 . The MIC5335 is offered in the ultra small 1.6mm x ® 1.6mm x 0.55mm 6-ld Thin MLF package, which is , : 75mV at 300mA · Ultra Small 1.6mm x 1.6mm x 0.55mm 6 lead MLF® package · Independent enable pins · , and MLF are registered trademarks of Amkor Technologies. ULDO is a trademark of Micrel, Inc. Micrel , -Pin 1.6x1.6 Thin MLF® MIC5335-1.8/1.6YMT MIC5335-GWYMT GPW 1.8V/1.6V ­40°C to +125°C 6-Pin 1.6x1.6 Thin MLF® MIC5335-1.8/1.8YMT MIC5335-GGYMT GPG 1.8V/1.8V ­40°C to +125°C 6
Micrel Semiconductor
Original
M9999-121206

MIC5302

Abstract: MIC5302 150mA ULDOTM in Ultra Small 1.2mm x 1.6mm Thin MLF® General Description Features , -pin 1.2mm x 1.6mm Thin MLF® package, occupying only 1.92mm2 of PCB area, a 50% reduction in board area compared to SC-70 and 2mm x 2mm MLF® packages. It's operating junction temperature range is ­40°C to +125°C and is available in fixed output voltages in lead-free (RoHS compliant) Thin MLF® package. Data , · · · · Ultra Small 1.2mm x 1.6mm Thin MLF® package Low Dropout Voltage: 50mV at 150mA
Micrel Semiconductor
Original
M9999-052107-C

footprint mlf

Abstract: MIC5302 MIC5302 150mA ULDOTM in Ultra-Small 1.2mm x 1.6mm Thin MLF® General Description Features , ultra small 4-pin 1.2mm x ® 2 1.6mm Thin MLF package, occupying only 1.92mm of PCB area, a 50% reduction in board area compared to SC-70 and 2mm x 2mm MLF® packages. Its operating junction temperature , MLF® package. Data sheets and support documentation can be found on Micrel's web site at www.micrel.com. · · · · · · · · · Ultra-small 1.2mm x 1.6mm Thin MLF® package Low dropout voltage
Micrel Semiconductor
Original
M9999-080510-F

SG-BGA-6046

Abstract: SG-MLF-7004 Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent , BGA High Density Sockets . . . . . . . . . . . . . . . . . . . . . . . . . page SG.5 Ghz MLF High , backing plate. Alternative adapter bases are available that emulate the chip's BGA footprint and convert , .1 www.ironwoodelectronics.com Catalog XVII Ironwood Electronics GHz BGA and MLF Sockets SG.2 PART SELECTOR TABLE , SG.3 GHz BGA and MLF Sockets PART SELECTOR TABLE SG-BGA_Table-1mm IC Package Size Part
Ironwood Electronics
Original
SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 BGA Solder Ball compressive force 1mm pitch BGA socket SF-BGA256E-B-05 SF-BGA256G-B-05 SF-BGA256J-B-05 SF-BGA289A-B-05 SF-BGA289B-B-05 SF-BGA289D-B-05

MIC5303

Abstract: temperature range. Package JA Recommended Minimum Footprint 4-Pin 1.2x1.6 MLF® 173°C/W , MLF® package, occupying only 1.92mm2 of PCB area, a 50% reduction in board area compared to SC-70 and 2mm x 2mm MLF® packages. It's operating junction temperature range is ­40°C to +125°C and is available in fixed output voltages in lead-free (RoHS compliant) Thin MLF® package. Data sheets and , Ultra Small 1.2mm x 1.6mm Thin MLF® package Low Dropout Voltage: 100mV at 300mA Output noise 120µVrms
Micrel Semiconductor
Original
MIC5303 M9999-102506-B
Abstract: ® package. Package 4-Pin 1.2x1.6 MLF® JA Recommended Minimum Footprint 173°C/W Thermal Resistance , MIC5302 150mA ULDOTM in Ultra Small 1.2mm x 1.6mm Thin MLF® General Description The MIC5302 is , , drawing no current when disabled. The MIC5302 is available in the ultra small 4-pin 1.2mm x 1.6mm Thin MLF , MLF® packages. It's operating junction temperature range is ­40°C to +125°C and is available in fixed output voltages in lead-free (RoHS compliant) Thin MLF® package. Data sheets and support documentation Micrel Semiconductor
Original
M9999-0041408-D

MIC5302

Abstract: MIC5302 150mA ULDOTM in Ultra Small 1.2mm x 1.6mm Thin MLF® General Description Features , -pin 1.2mm x 1.6mm Thin MLF® package, occupying only 1.92mm2 of PCB area, a 50% reduction in board area compared to SC-70 and 2mm x 2mm MLF® packages. It's operating junction temperature range is ­40°C to +125°C and is available in fixed output voltages in lead-free (RoHS compliant) Thin MLF® package. Data , · · · · Ultra Small 1.2mm x 1.6mm Thin MLF® package Low Dropout Voltage: 50mV at 150mA
Micrel Semiconductor
Original
M9999-051508-E

12X16

Abstract: MIC5303 temperature range. Package JA Recommended Minimum Footprint 4-Pin 1.2x1.6 MLF® 173°C/W , MLF® package, occupying only 1.92mm2 of PCB area, a 50% reduction in board area compared to SC-70 and 2mm x 2mm MLF® packages. It's operating junction temperature range is ­40°C to +125°C and is available in fixed output voltages in lead-free (RoHS compliant) Thin MLF® package. Data sheets and , Ultra Small 1.2mm x 1.6mm Thin MLF® package Low Dropout Voltage: 100mV at 300mA Output noise 120µVrms
Micrel Semiconductor
Original
12X16 M9999-051508-D

MIC5302

Abstract: MIC5302 150mA ULDOTM in Ultra Small 1.2mm x 1.6mm Thin MLF® General Description Features , -pin 1.2mm x 1.6mm Thin MLF® package, occupying only 1.92mm2 of PCB area, a 50% reduction in board area compared to SC-70 and 2mm x 2mm MLF® packages. It's operating junction temperature range is ­40°C to +125°C and is available in fixed output voltages in lead-free (RoHS compliant) Thin MLF® package. Data , · · · · Ultra Small 1.2mm x 1.6mm Thin MLF® package Low Dropout Voltage: 50mV at 150mA
Micrel Semiconductor
Original

MIC5320

Abstract: marking AGW packages. JA Recommended Minimum Footprint Package 6-Pin 1.6x1.6 Thin MLF ® JC 100°C/W 2 , 1.6mm leadless Thin MLF® package, which provides exceptional thermal package characteristics. The , 1.6mm leadless Thin MLF® package which is only 2.56mm2 in area, less than 30% the area of the SOT-23, TSOP and MLF® 3x3 packages. It's also available in the thin SOT-23-6 lead package and the standard 6 , Ultra-low dropout voltage ULDOTM 35mV @ 150mA Tiny 6-pin 1.6mm x 1.6mm Thin MLF® leadless package Low
Micrel Semiconductor
Original
MIC5320 marking apg F MARKING 6PIN MIC5320-MMYML M9999-061407-E TSOT-23

MIC5322

Abstract: MIC5322-MFYMT very compact 1.6mm x 1.6mm leadless Thin MLF® package with exceptional thermal package , fixed-output voltages in a tiny 6-pin 1.6mm x 1.6mm leadless Thin MLF® package which is only 2.56mm2 in area, - 30% less area than the SOT-23, TSOP and MLF® 3x3 packages. Additional voltage options are , Ultra-low dropout voltage ULDOTM 35mV @ 150mA · Tiny 6-pin 1.6mm x 1.6mm Thin MLF® leadless package · , ULDO is a trademark of Micrel, Inc. MLF and MicroLeadFrame are registered trademarks of Amkor
Micrel Semiconductor
Original
MIC5322 MIC5322-MFYMT MIC5322-MGYMT MIC5322-NNYMT M9999-030608-A

ZE12Y

Abstract: footprint mlf thermal resistance for the MIC47100 in the MLF® package. Package JA Recommended Minimum Footprint 90 , with only a 1µF ceramic output capacitor and is available in a thermally enhanced 2mm × 2mm MLF , MLF® package with an operating junction temperature range of -40°C to +125°C. Data sheets and support , ePad MSOP-8 ­ small form factor power package · Thermally enhanced 2mm × 2mm MLF® ­ smallest solution , Typical Application MicroLead Frame and MLF are registered trademark of Amkor Technology
Micrel Semiconductor
Original
ZE12Y M9999-070808-A

AN2222

Abstract: footprint mlf . a. Line up the Flex-Pod with the PCB footprint. 3. Solder the Flex-Pod to the PCB by touching the , Window Picture 7. MLF Flex-Pod (Does not Require Pre-Tinning) AN2222 2. Line up the Flex-Pod with the PCB footprint: a. Put a drop of flux on the PCB footprint (Picture 8 shows how it is , the top of the head of the Flex-Pod is at the bottom of the PCB footprint so that the vias of the Flex-Pod are parallel to the pads on the PCB. (For MLF Flex-Pods, use the window to line up the pads as
Cypress MicroSystems
Original
FOOTPRINT PCB Kester metcal AN-2222 CY8C21 CY8C29 LF218 STTC-036 2331-Z
Showing first 20 results.