NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: Serial No 8. Version A~F *1st Version X 9~10. Mask Option 11. " - " 12. Package Type (AG01000 AG01000 is , " 12. Package Type A : SDIP C : CHIP BIZ E : LQFP G : BGA J : ETQFP L : ELP N : COB R , 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 - ELP2 H : 16 U : 40 O : 32 V : 30 - QFPH , (Reverse) W : WF Biz Draft Wafer X : WF Biz Full Cutting 3 : Tape & Reel (Halogen-Free PKG) 4 : Tray , 8 : 115 K : 20 9 10 11 12 13 14 15 16 17 18 19 20 21 22 N : 28 - SBGA A : 432 - SSOP ... | Original |
8 pages, |
uLGA a003 ARM10 BGA package tray 64 HT80C51 kga0a000am 64k c001 KGA0E000BA a001 KGA0H000BM fBGA package tray 12 19 lsi SoC fBGA package tray 12 x 19 kgd0h000dm datasheet abstract |
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| Abstract: " 12. Package Type A : SDIP C : CHIP BIZ E : LQFP G : BGA J : ETQFP L : ELP N : COB R , 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 - ELP2 H : 16 U : 40 O : 32 V : 30 - QFPH , (Reverse) W : WF Biz Draft Wafer X : WF Biz Full Cutting 3 : Tape & Reel (Halogen-Free PKG) 4 : Tray , 8 : 115 K : 20 9 10 11 12 13 14 15 16 17 18 19 20 21 22 N : 28 - SBGA A : 432 - SSOP , : Spacer / Interposer 9 10 11 12 13 14 15 E : EVA-CHIP P : OTP 2 : 32-bit ARM9 4 : 32 32-bit 6 ... | Original |
3 pages, |
uLGA fBGA package tray 12 x 19 cortex my ARM10 FCCSP HT80C51 datasheet abstract |
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| Abstract: " 12. Package Type A : SDIP C : CHIP BIZ E : LQFP G : BGA J : ETQFP L : ELP N : COB R , C : 83 H : 16 N : 28 Q : 32 D : 160 G : 256 R : 48 X : 100 6 7 8 9 10 11 12 , Wafer X : WF Biz Full Cutting 3 : Tape & Reel (Halogen-Free PKG) 4 : Tray (Halogen-Free PKG) 5 , byte C : 316 - WAFER 0 : None 9 10 11 12 13 14 15 16 17 18 19 20 21 22 1 : 1K byte 3 , (1Z) 8 9 10 11 12 13 14 15 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte 6 : 6K byte 8 ... | Original |
3 pages, |
HT80C51 ARM10 FCCSP datasheet abstract |
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| Abstract: " 12. Package Type A : SDIP C : CHIP BIZ E : LQFP G : BGA J : ETQFP L : ELP N : COB R , 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 - ELP2 H : 16 U : 40 O : 32 V : 30 - QFPH , : WF Biz Draft Wafer X : WF Biz Full Cutting 3 : Tape & Reel (Halogen-Free PKG) 4 : Tray , R:R V : 192K byte C : 316 - WAFER 0 : None 9 10 11 12 13 14 15 16 17 18 19 20 21 22 1 , : Spacer / Interposer 9 10 11 12 13 14 15 E : EVA-CHIP P : OTP 2 : 32-bit ARM9 4 : 32 32-bit 6 ... | Original |
3 pages, |
HT80C51 ARM10 datasheet abstract |
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| Abstract: CSP-128 CSP-128 (TFQFN) 10 x 10 x 1.0 3.68 x 3.45 72 (Note 2) Package FBGA-48 7 x 7 x 1.4 2.54 x 2.54 85 FBGA-64 8 x 8x 1.4 3.00 x 1.80 61 FBGA-100 10 x 10 x 1.4 10 x 10 , MSL3 TABLE 3. Package Offerring - FBGA Pin Count Body Size (mm) Pitch (mm) Max. Die , FIGURE 2. Comparison of NSMD and SMD pads (FBGA) 6 between pads in the area array package). For , FBGA surface mount assembly operations include screen printing solder paste on the PCB, package ... | Original |
22 pages, |
taiyo PSR4000 aus5 CSP-16 CSP-28 CSP-48 EPAK AN-1125 HC-100 JESD51-3 SLB128B PSR4000 package fbga100 MO-205 Kostat fbga Substrate design guidelines datasheet abstract |
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| Abstract: CSP-128 CSP-128 (TFQFN) 10 x 10 x 1.0 3.68 x 3.45 72 (Note 2) Package FBGA-48 7 x 7 x 1.4 2.54 x 2.54 85 FBGA-64 8 x 8x 1.4 3.00 x 1.80 61 FBGA-100 10 x 10 x 1.4 10 x 10 , TABLE 3. Package Offerring - FBGA Pin Count Body Size (mm) Pitch (mm) Max. Die Size (mm , ) PACKAGE TO BOARD ASSEMBLY Surface Mount Considerations TheLaminate CSP and FBGA surface mount assembly , translates to a 0.45mm x 0.30mm copper pad on the PCB. For package with thermal pads, the PCB board design ... | Original |
22 pages, |
HC-100 HC100 JESD51-3 Kostat kostat bga 6mm x 6mm MO-205 Nitto HC solder joint reliability fbga Substrate design guidelines EPAK EPAK TRAY PSR4000 aus5 aus5 JEDEC Kostat datasheet abstract |
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| Abstract: CSP-48 CSP-48 FBGA 7 x 7 x 1.4 2.54 x 2.54 85 CSP-64 CSP-64 FBGA 8 x 8x 1.4 3.00 x 1.80 62 CSP-100 CSP-100 FBGA 10 x 10 x 1.4 7.9 x 7.9 35 Package Note 1: with thermal pads Note 2 , are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA). The , for Dual Inline Package, P-TSSON Low profile (1.0 mm for CSP's, 1.4 mm for FBGA's) Light weight , 48 CSP 12.5 x 8.1 x 1.0 0.5 56 CSP 8.0 x 8.0 x 1.0 0.5 49 FBGA 7.0 x 7.0 x 1.4 ... | Original |
20 pages, |
aus5 gsm 100l HL832 HL832 pcb material datasheet CSP-64 solder joint reliability SMT pitch roadmap CSP-81 kostat bga 6mm x 6mm Ablebond 8360 esec 3018 operation CCL-HL832 PSR4000 aus5 EIA/JESD51-3 CSP-16 EIA/JESD51-3 abstract |
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| Abstract: are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA). The , for Dual Inline Package, P-TSSON Low profile (1.0 mm for CSP's, 1.4 mm for FBGA's) Light weight , x 12.5 x 1.0 5.18 x 3.72 39 (Note 1) Package CSP-96 CSP-96 Lead 8 x 8 x 1.0 3.05 x 3.05 89 CSP-48 CSP-48 FBGA 7 x 7 x 1.4 2.54 x 2.54 85 CSP-64 CSP-64 FBGA 8 x 8x 1.4 3.00 x 1.80 62 CSP-100 CSP-100 FBGA 10 x 10 x 1.4 7.9 x 7.9 35 Note 1: with thermal pads Note 2 ... | Original |
20 pages, |
fbga Substrate design guidelines CSP-28 CSP-48 CSP-64 CSP-96 CCL-HL832 AN-1125 JESD51-3 laptop MOTHERBOARD Chip Level MANUAL PSR4000 PSR4000-AUS5 SMT process roadmap SMT roadmap JESD51-3 abstract |
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| Abstract: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1(8*12),256M DDR 5G 60WMBG 60WMBG Package 8*12 130 MAX 60M/54WBGA-8 60M/54WBGA-8.10X15 10X15.10-8X12-A 10-8X12-A TR_MARKING LA69-00635A LA69-00635A , ADS13539 ADS13539 ADS10948 ADS10948 315PBGA 315PBGA,23X23 23X23,mPSU,ADS13539 ADS13539,5X12 5*12 125 BAKE FC-BGA 23 X 23 , 52-WBGA-6 52-WBGA-6.60X11 60X11.00-8X14-B 00-8X14-B LA69-00278A LA69-00278A WDS12215 WDS12215 54TBGA 54TBGA,9.5*15.5 8*12 130 MAX 54/90-T/FBGA , TQFP-12MM TQFP-12MM X 12MM 1.0T LA69-00303A LA69-00303A ADS03961 ADS03961 32TSOP1 32TSOP1,(12*12) 0820 12*12 130 MAX TSOP1-0820 TSOP1-0820 ... | Original |
7 pages, |
TQFP-12MM ADS13539 ADS12408-00 peak tray 15X15 BGA Kostat 14X18 121-FBGA 8X14 tray cabga 9x9 153FBGA ADS131 tray datasheet cabga 9x9 240-FBGA 1f1-1717-a19 JEDEC Kostat FBGA 60WMBG 48TBGA 60WMBG abstract |
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| Abstract: request. . Product Carriers per Package Type Package Type Fine-Pitch Ball Grid Array (FBGA , Package (USON) Standard: Tray Dry pack & tray box 7" Tape & Reel Dry pack & reel box 13" Tape , pack & 2k/4k box Very Very Thin Small Outline No Lead Package (WSON) Note: 1 For SOIC, the tray , 17 Oct 2008 1-2 Chapter 1 Codes and Carrier Options PACKAGE CODES To utilize this handbook , pitch; 11.00 mm x 8.00 mm body size, 1.2 mm maximum height ASD Thin profile fine pitch ball grid ... | Original |
11 pages, |
spansion solder profile datasheet abstract |
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