NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Samples | Ordering |
| 501195-3 | TE Connectivity / AMP | Curing Ovens, Epoxy, Hand Polishing Products and Accessories; EPOXY ( AMP ) | 
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| 501195-7 | TE Connectivity / AMP | Curing Ovens, Epoxy, Hand Polishing Products and Accessories; EPOXY ( AMP ) |
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| 501195-6 | TE Connectivity / AMP | Curing Ovens, Epoxy, Hand Polishing Products and Accessories; EPOXY ( AMP ) |
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| 501195-1 | TE Connectivity / AMP | Curing Ovens, Epoxy, Hand Polishing Products and Accessories; EPOXY ( AMP ) |
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| Part | Manufacturer | Description | Type | Ordering |
| EPOXYLITE 813 | Vishay Telefunken | Strain Gage Adhesive |
1 pages, |
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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: with date code 516M we will phase-in a new UV curable epoxy. The new epoxy is tan in color, resistant , compliant product. The traditional blue epoxy used in current product also performs well at elevated board processing temperatures. The introduction of the new UV curable "tan" epoxy also helps differentiate Bourns from our competition. Test data is available upon request. Tan Epoxy Compared to Traditional Blue Epoxy ... | Original |
1 pages, |
516M bourns trimpot 3006P trimpot trimpot 3006p datasheet abstract |
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| Abstract: max. V DRM,RRM max. 4500 Packages Packages V 2600 V V D 138 S D 170 S D 371 S Epoxy disc 41x14mm Stud, SW27,M12 D 358 S D 170 U D 291 S D 648 S D 228 S D 721 S Epoxy disc 50x14mm D 901 S D 649 S D 348 S Epoxy disc 57x26mm Epoxy disc 41x14mm D1461 D1461 S D 438 S . . . D 440 S max.5500 V Ceramic disc 56x26mm max.1400 V . D 675 S D 56 S . . D 188 S D 509 S D 56 U Epoxy disc 57x26mm D 238 S D 689 S Epoxy disc 41x14mm D1201 D1201 S D 368 S . D 690 S Ceramic disc 56x26mm ... | Original |
1 pages, |
SW27- D1201 D1461 D1461 abstract |
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| Abstract: PLATING) SOFT SOLDER (Pb/Sn) STRUCTURE OF PLASTIC MOLDED DIP SILVER SPOT PLATING EPOXY RESIN , SOFT SOLDER OR ADHESIVE (Pb/Sn) EPOXY RESIN SILVER SPOT PLATING Au WIRE LEAD (Pb/Sn , PLASTIC MOLDED QFP CHIP SILVER SPOT PLATING EPOXY RESIN Au WIRE LEAD (Pb/Sn PLATING) SOFT SOLDER OR ADHESIVE (Pb/Sn) STRUCTURE OF PLASTIC MOLDED QFJ EPOXY RESIN CHIP Au WIRE SILVER , CIRCUIT PACKAGES PACKAGE STRUCTURE STRUCTURE OF QTP EPOXY RESIN CHIP HEAT SPREADER LEAD(Pb/Sn ... | Original |
7 pages, |
Integrated Circuit hssop EPOXY RESIN datasheet abstract |
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| Abstract: thickness is 1/16"(.062") except as noted. Vectorbord® is available in FR4 epoxy glass, FR2 phenolic, CEM-1 epoxy glass composite and P96 GPY Hi-Temp laminate (NEW). Vectorbord® listed below is copper clad or , 0.042" 0.042" 0.042" 0.042" 0.042" 0.042" FR4 Epoxy Glass FR4 Epoxy Glass FR4 Epoxy Glass FR2 Phenolic CEM-1 Epoxy Glass Composite FR4 Epoxy Glass CEM-1 Epoxy Glass Composite, 1oz. unplated copper, 1 side CEM-1 Epoxy Glass Composite FR2 Phenolic FR4 Epoxy Glass, 1oz. unplated copper, 1 side ... | Original |
1 pages, |
vectorbord 169P79 Epoxy, glass laminate CEM-1 "epoxy glass composite" CEM-1 glass epoxy material FR4 epoxy datasheet abstract |
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| Abstract: performed on inductors assembled with a reduced amount of epoxy. All inductor samples have successfully , June 7, 2010 Shielded Power Inductor Models SRR1205 SRR1205, SRR1206 SRR1206 and SRR1208 SRR1208 Epoxy Application Method Change Effective immediately, the amount of epoxy applied in between the inductor core and shield has , shield are being held together with epoxy applied completely around the core (Fig. 1). Bourns has discovered that applying epoxy with this method may put the core and shield at risk of cracking during the ... | Original |
1 pages, |
SRR1208 SRR1206 SRR1205 inductor SRR1205 abstract |
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| Abstract: Heat-Shrink Boots Series 77 Shrink Boots Adhesives How to Order About User-Installed Epoxy Epoxy adhesive provides superior bond strength, higher temperature range and better chemical resistance compared to hot melt adhesive. Although boots are available with type R one-part epoxy pre-coating, user-installed two part epoxy can provide a better alternative. Boot installation time is reduced and the , heated sufficiently to activate the epoxy, at the risk of overheating the assembly. User-installed epoxy ... | Original |
1 pages, |
syringe datasheet abstract |
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| Abstract: Thermistor Probe Assemblies Epoxy/ Vinyl « Return Electrical specifications as well as Dimensions "L1", "L2" and "D" are user selectable. Contact U.S. Sensor's application engineering department to design a probe assembly to best suit your requirements. H0927 H0927 Vinyl U.S. Sensor 1832 W. Collins Ave Orange, CA 92867 Tel: 800-777-6467 Tel: 714-639-1000 Fax: 714-639-1220 Email: sales@ussensor.com H0934 H0934 Epoxy H1817 H1817 Epoxy H2933 H2933 Epoxy H3241 H3241 Epoxy H3336 H3336 Plastic H3686 H3686 Vinyl ... | Original |
3 pages, |
H3241 H3686 H0927 H0927 abstract |
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| Abstract: Light med med mA V mA A TIL209 TIL209 Red 0.5 1.0 20 20 20 6500 0.120-inch-dia body Red diffused epoxy TIL211 TIL211 Green 0.8 1.5 25 4.0 25 5640 0.120-inch-dia body Green diffused epoxy TIL212 TIL212 Yellow 1.0 2.0 1P 2.75 10 5830 0.120-inch-dia body Yellow diffused epoxy TIL216 TIL216 Red 1.5 3.0 10 2.75 10 6350 0.120-inch-dia body Red diffused epoxy TIL220 TIL220 Red 0.8 1.5 20 2.0 20 6500 0.200-inch-dia body Red diffused epoxy TIL221 TIL221 Red 1.0 1.8 20 2.0 20 6500 0.200-inch-dia body Red diffused epoxy TIL222 TIL222 Green 1.0 1.5 25 25 ... | OCR Scan |
1 pages, |
TIL23 SDA20 Texas Instruments, epoxy TIL212 TIL216 LS600 TIL-220 sda 5640 TIL222 TIL211 TIL209 TIL220 TIL224 TIL221 LS600 abstract |
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| Abstract: , 2007 with date code 730C we will begin phasing in a new epoxy. The new epoxy is tan in color, meets , the flame retardant in the blue epoxy. Level B material is: a) a significant environmental, health or , blue epoxy may be shipped. New samples and test data are available upon request. We will be releasing additional models with the tan epoxy and notice will be made prior to their release. Tan Epoxy Compared to Traditional Blue Epoxy T0744 T0744 ... | Original |
1 pages, |
t0744 datasheet abstract |
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| Abstract: product. SC1022 SC1022 Model 3590 Update March, 2010 Page 2 of 2 In addition, the epoxy used to seal the terminals is changing from blue to clear UV cured epoxy. This change will reduce the cure time and processing for the epoxy. The implementation date code will be 1015M 1015M. Blue epoxy Clear UV , cover design has been upgraded to a molded-in terminal design. This will eliminate the insert and epoxy , and epoxy Molded-in terminal on rear cover With the change to an insert molded terminal cover ... | Original |
2 pages, |
0934M 0934M abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| partially brominated epoxy 26 mg bond wire Au 0.36 mg epoxy 97 mg plating SnPb15 2 mg Total amount (approx.) 145.36 mg Composition of partially brominated epoxy Br 1 % epoxy 15 % Sb 4 % SiO2 80 % Composition of partially brominated epoxy Br 1 % epoxy 15 % Sb 4 % SiO2 80 % General package www.datasheetarchive.com/files/philips/packages/sot337-1.html |
Philips | 15/04/2003 | 3.86 Kb | HTML | sot337-1.html |
| mg die attach epoxy, Ag filled 39 mg active device Si 23 mg plastic/encapsulation partially brominated epoxy 1490 mg .7 % Composition of epoxy, Ag filled epoxy 18 % Ag 82 % Composition of partially brominated epoxy Br 1 % epoxy 15 % Sb 4 % SiO2 80 % General package information Soldering Information Handling www.datasheetarchive.com/files/philips/packages/0306b-v3.html |
Philips | 16/06/2005 | 4.31 Kb | HTML | 0306b-v3.html |
| Search Criteria: Package = H(EPOXY), PartType = Signal or Computer Diode Part No Type Package IO (Amps) VBR (Volts) IR (uAmps) IFSM (Amps) trr (nsec) 1N3069M 1N3069M 1N3069M 1N3069M SA SIG H(EPOXY) STD 0.05 65 0.1 50 1N3064M 1N3064M 1N3064M 1N3064M SA SIG H(EPOXY) STD 0.075 75 0.1 0.01 4 www.datasheetarchive.com/files/microsemi/products/sig/h(epoxy).htm |
Microsemi | 04/01/1999 | 2.68 Kb | HTM | h(epoxy).htm |
| -01-23 Chemical content Part Material Weight (mg) leadframe epoxy plastic/encapsulation partially brominated epoxy 1683 mg die attach Epoxy 72 mg solder balls SnPb37 768 mg Total amount (approx.) 3975 mg Composition of partially brominated epoxy Br 1 % epoxy 15 % Sb 4 www.datasheetarchive.com/files/philips/packages/sot532-1.html |
Philips | 15/04/2003 | 3.65 Kb | HTML | sot532-1.html |
| -01-23 Chemical content Part Material Weight (mg) leadframe epoxy plastic/encapsulation partially brominated epoxy 1788 mg die attach Epoxy 72 mg solder balls SnPb37 766 mg Total amount (approx.) 4891 mg Composition of partially brominated epoxy Br 1 % epoxy 15 % Sb 4 www.datasheetarchive.com/files/philips/packages/sot584-1.html |
Philips | 15/04/2003 | 3.65 Kb | HTML | sot584-1.html |
| -01-22 Chemical content Part Material Weight (mg) leadframe epoxy plastic/encapsulation partially brominated epoxy 1449 mg die attach Epoxy 72 mg solder balls SnPb37 945 mg Total amount (approx.) 4540 mg Composition of partially brominated epoxy Br 1 % epoxy 15 % Sb 4 www.datasheetarchive.com/files/philips/packages/sot514-1.html |
Philips | 15/04/2003 | 3.65 Kb | HTML | sot514-1.html |
| 2391 mg leadframe epoxy, glass fibre filled 2398 mg epoxy 2370 mg die attach Epoxy 13 mg solder balls partially brominated epoxy Br 1 % epoxy 15 % Sb 4 % SiO2 80 % Composition of SnPb37 Pb 37 % Sn www.datasheetarchive.com/files/philips/packages/sot623-1.html |
Philips | 15/04/2003 | 3.77 Kb | HTML | sot623-1.html |
| Pb37 550.7 mg substrate epoxy, glass fibre filled 1042.5 mg die attach epoxy, Ag filled 32.4 mg active device Si 50.6 mg plastic/encapsulation partially brominated epoxy 889.8 mg Total amount (approx.) 3738.5 mg Composition of SnPb37 Pb 37 % Sn 63 % Composition of epoxy, Ag filled epoxy 18 % Ag 82 % Composition of partially brominated epoxy Br 1 % epoxy 15 % Sb 4 % SiO2 www.datasheetarchive.com/files/philips/packages/sot553-1-v3.html |
Philips | 16/06/2005 | 4.49 Kb | HTML | sot553-1-v3.html |
| solder balls SnPb37 7.59 mg substrate epoxy, glass fibre filled 5.11 mg glue epoxy, Ag filled 0.11 mg active device SiO2 0.66 mg plastic/encapsulation partially brominated epoxy 33 % Sn 63 % Composition of epoxy, Ag filled epoxy 18 % Ag 82 % Composition of partially brominated epoxy Br 1 % epoxy 15 % Sb 4 % SiO2 80 % General package information Soldering www.datasheetarchive.com/files/philips/packages/sot702-1-v3.html |
Philips | 16/06/2005 | 4.35 Kb | HTML | sot702-1-v3.html |
| leadframe epoxy, glass fibre filled 1437 mg die attach Epoxy 72 mg epoxy 1683 mg Total amount (approx.) 3975 mg Composition of SnPb37 Pb 37 % Sn 63 % Composition of Epoxy epoxy 18 % SiO2 82 % Composition of partially brominated epoxy Br 1 % epoxy 15 % Sb 4 % SiO2 80 % General package information www.datasheetarchive.com/files/philips/packages/sot532-1-v3.html |
Philips | 16/06/2005 | 4.15 Kb | HTML | sot532-1-v3.html |